CN106102352B - A method of solving non-symmetrical line slab warping - Google Patents
A method of solving non-symmetrical line slab warping Download PDFInfo
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- CN106102352B CN106102352B CN201610524779.6A CN201610524779A CN106102352B CN 106102352 B CN106102352 B CN 106102352B CN 201610524779 A CN201610524779 A CN 201610524779A CN 106102352 B CN106102352 B CN 106102352B
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- copper foil
- foil layer
- blind hole
- daughter board
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of methods for solving non-symmetrical line slab warping, it is made for n-layer wiring board (n >=3), include the following steps: A, introduce pseudobed L1 ': L1 copper foil layer being divided into the first copper foil layer and the second copper foil layer, the second copper foil layer is pseudobed L1 '；B, it makes blind hole daughter board: L1 '~Ln-1 copper foil layer correspondence being subjected to pressing, blind hole daughter board is made；Blind hole daughter board upper surface after pressing drills along L1 ' copper foil layer to Ln-1 copper foil layer；C, the first copper foil layer and Ln copper foil layer are pressed on to the two sides of blind hole daughter board respectively；D, it is drilled using laser to the first copper foil layer, so that the first copper foil layer electrically conducts with L1 ' copper foil layer；By introducing pseudobed L1 ', so that the first copper foil layer and Ln copper foil layer are symmetrical set, symmetrical in the stress for pressing blind hole daughter board with generating during Ln copper foil layer, warpage will not occur for wiring board.
Description
Technical field
The present invention relates to wiring board manufacturing field more particularly to a kind of methods for solving non-symmetrical line slab warping.
Background technique
Multilayer circuit board usually has mechanical blind hole design requirement, and mechanical blind hole refers to route inner cord cabling and wiring board table
The connected via hole type of layer cabling, does not penetrate entire wiring board.
By taking n-layer wiring board as an example, the design requirement of mechanical blind hole are as follows: as shown in Figure 1, L1~Ln-1 is via layer, L1
~Ln layers is blind hole layer, the in the prior art substantially production process of the n-layer wiring board are as follows: it is first corresponding to L1~Ln-1 copper foil layer into
Blind hole daughter board is made in row pressing, and then the blind hole daughter board upper surface after pressing drills along L1 copper foil layer to Ln-1 copper foil layer, and
The drilling penetrates Ln-1 copper foil layer, and the multilayer circuit board with blind hole 10 finally is made in blind hole daughter board and the pressing of Ln copper foil layer.
It is using the defect of aforesaid way: since blind hole daughter board is different from the thickness of Ln copper foil layer and thermal expansion speed,
And blind hole daughter board and the physical parameter of Ln copper foil layer have differences, and cause blind hole daughter board and Ln copper foil layer asymmetric, to lead
Cause the stress generated during pressing blind hole daughter board and Ln copper foil layer asymmetric, so that wiring board pole during pressing
Warpage easily occurs, and the angularity of wiring board has been more than 0.75% requirement of IPC, and in SMT and PCB production technology, line
Slab warping degree in road is more than 0.75% position inaccurate that will cause component, and plate is curved in SMT, THT, and component pin can not
Neatly, extreme difficulties are brought to assembling and installment work, so that the use for influencing monolith wiring board is even directly resulted in and scrapped.
Cause wiring board that warpage occurs to overcome blind hole daughter board and Ln copper foil layer asymmetry, also passes through in the prior art
Following manner makes wiring board, and detailed process is substantially are as follows: L2~Ln-1 copper foil layer is first carried out pressing, blind hole daughter board is made, then
Blind hole daughter board upper surface after pressing drills along L2 copper foil layer to Ln-1 copper foil layer, and the drilling penetrates Ln-1 copper foil layer, shape
At via layer, next L1 copper foil layer and Ln copper foil layer are pressed on to the two sides of blind hole daughter board respectively, finally using laser to L1
Copper foil layer carries out drilling connection L1 copper foil layer and L2 copper foil layer, reaches the design requirement of mechanical blind hole with this, but this mode
When being drilled using laser to L1 copper foil layer, due to design when, the thickness of dielectric layers > 0.1mm of L1 copper foil layer lower part,
It is difficult to drill L1 copper foil layer using laser, therefore, is still difficult to reach the design requirement of mechanical blind hole.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of solution non-symmetrical line slab warpings
Method solves blind hole daughter board in the prior art and sticks up during pressing with Ln copper foil layer asymmetry so as to cause wiring board
Bent problem.
The purpose of the present invention is implemented with the following technical solutions:
A method of non-symmetrical line slab warping is solved, is made for n-layer wiring board (n >=3), which is characterized in that packet
Include following steps:
A, it introduces pseudobed L1 ': L1 copper foil layer being divided into the first copper foil layer and the second copper foil layer, the second copper foil layer is pseudobed
L1 ', the first copper foil layer are configured to the thickness drilled by laser；
B, it makes blind hole daughter board: L1 '~Ln-1 copper foil layer correspondence being subjected to pressing, blind hole daughter board is made；It is blind after pressing
Hole daughter board upper surface drills along L1 ' copper foil layer to Ln-1 copper foil layer, and the drilling penetrates Ln-1 copper foil layer and forms through-hole；
C, the first copper foil layer and Ln copper foil layer are pressed on to the two sides of blind hole daughter board respectively；
D, it is drilled using laser to the first copper foil layer, so that the first copper foil layer electrically conducts with L1 ' copper foil layer.
Preferably, sawing sheet, the first secondary internal layer dry film, first time DES, AOI inspection are successively carried out between step A and step B
It surveys.
Preferably, step B further include:
L1 '~Ln-1 copper foil layer is corresponded to press by prepreg, blind hole daughter board is made, and carries out milling side.
Preferably, after completing step B, deburring, heavy copper, plate plating, plated hole dry film, plated hole, resin are successively carried out to through-hole
Consent successively carries out nog plate, the second secondary internal layer dry film, second of DES to blind hole daughter board again.
Preferably, pseudobed L1 ' is removed in step the second secondary internal layer dry film and second of DES.
Preferably, the mode of pseudobed L1 ' is removed are as follows: carry out photosensitive processing with dry film, L1 ' copper foil layer is set in the position of through-hole
The pad bigger than through-hole diameter is counted, rest part of the L1 ' copper foil layer in addition to pad is all etched to substrate in second of DES.
Preferably, the diameter of pad is 4-10mil bigger than the diameter of through-hole.
Preferably, step C further include:
The L1 ' copper foil layer of blind hole daughter board is pressed with the first copper foil layer by prepreg, the Ln-1 copper of blind hole daughter board
Layers of foil is pressed with Ln copper foil layer by prepreg, and brownification processing is carried out after pressing.
Compared with prior art, the beneficial effects of the present invention are: by introduce pseudobed L1 ' so that the first copper foil layer and Ln
Copper foil layer is symmetrical set, and symmetrical in the stress for pressing blind hole daughter board with generating during Ln copper foil layer, wiring board will not occur
Warpage, while pseudobed L1 ' is split to form for L1 copper foil layer, so that thickness of dielectric layers≤0.1mm of the first copper foil layer lower part, first
Copper foil layer is easy to be drilled by laser, therefore, through the above steps, in the case where not changing mechanical blind hole design requirement, makes
Warpage can not occur during processing and manufacturing for wiring board.
Detailed description of the invention
Fig. 1 is the cross-sectional view of wiring board in the prior art；
Fig. 2 is that a kind of method for solving non-symmetrical line slab warping of the present invention introduces L1 '~Ln-1 copper foil layer after pseudobed L1 '
Cross-sectional view；
Fig. 3 is route when a kind of method for solving non-symmetrical line slab warping of the present invention does not drill to the first copper foil layer
The cross-sectional view of plate；
Fig. 4 is that a kind of method for solving non-symmetrical line slab warping of the present invention carries out drilling rear board to the first copper foil layer
Cross-sectional view.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention:
As in Figure 2-4, a method of non-symmetrical line slab warping is solved, is made for n-layer wiring board (n >=3), packet
It includes:
Step A, Fig. 3 referring to fig. 2 introduces pseudobed L1 ': by L1 copper foil layer, correspondence is divided into the first copper foil layer 11 and second up and down
Copper foil layer, the second copper foil layer are pseudobed L1 ', and the first copper foil layer 11 is configured to the thickness drilled by laser；
As shown in Figures 2 and 3, step B, make blind hole daughter board: by L1 '~Ln-1 copper foil layer it is corresponding carry out pressing be made it is blind
Hole daughter board；Blind hole daughter board upper surface after pressing drills along L1 ' copper foil layer to Ln-1 copper foil layer, and the drilling penetrates Ln-1 copper
Layers of foil forms through-hole 40；
As shown in figure 3, step C, the first copper foil layer 11 and Ln copper foil layer to be pressed on to the two sides of blind hole daughter board respectively；
As shown in figure 4, step D, being drilled to the first copper foil layer 11 using laser, so that the first copper foil layer 11 and L1 '
Copper foil layer electrically conducts to form mechanical blind hole 50.
Whereby, by introducing pseudobed L1 ', so that the first copper foil layer and Ln copper foil layer are symmetrical set, in pressing blind hole
Plate and the stress generated during Ln copper foil layer are symmetrical, and warpage will not occur for wiring board, while pseudobed L1 ' is the segmentation of L1 copper foil layer
It forms, so that thickness of dielectric layers≤0.1mm of lower part, the first copper foil layer are easy to be drilled by laser, therefore, passes through above-mentioned step
Suddenly, in the case where not changing mechanical blind hole design requirement, make wiring board that warpage can not occur during processing and manufacturing.
Sawing sheet, the first secondary internal layer dry film, first time DES, AOI detection are successively carried out between step step A B.
As shown in Fig. 2, in order to which L1 '~Ln-1 copper foil layer is carried out even closer pressing, by prepreg 30 by L1 '
~Ln-1 copper foil layer, which corresponds to press, is made blind hole daughter board, and carries out milling side, it is preferable that L1 ' copper foil layer and L2 copper foil layer are logical
It crosses a prepreg 30 to be pressed, respectively corresponds between L2~Ln copper foil layer and pressed by 2 cured sheets 30.
After completing step B, deburring, heavy copper, plate plating, plated hole dry film, plated hole, filling holes with resin are carried out to through-hole 40, then right
Blind hole daughter board successively carries out nog plate, the second secondary internal layer dry film, second of DES.
In order to be more in line with mechanical blind hole design requirement, removed in above-mentioned steps the second secondary internal layer dry film and second of DES
Pseudobed L ' is removed, the mode of pseudobed L ' is removed are as follows: carries out photosensitive processing with dry film, L1 ' copper foil layer is logical in the Position Design ratio of through-hole
The big pad 20 of 40 diameter of hole, pad 20 can be photosensitive, and rest part of the L1 ' copper foil layer in addition to pad 20 will not be photosensitive, in DES
All it is etched to substrate, it is preferable that the diameter of pad 20 is 4-10mil bigger than the diameter of through-hole, and the effect of pad 20 is electrical property
The first copper foil layer and L2 copper foil layer is connected.
Further, the L1 ' copper foil layer of blind hole daughter board is pressed with the first copper foil layer by prepreg 30, preferably
The L1 ' copper foil layer on ground, blind hole daughter board is pressed with the first copper foil layer by a prepreg 30, the Ln-1 copper of blind hole daughter board
Layers of foil is pressed with Ln copper foil layer by prepreg 30, and brownification processing is carried out after pressing.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection scope of the claims in the present invention
Within.
Claims (5)
1. a kind of method for solving non-symmetrical line slab warping, makes for n-layer wiring board (n >=3), which is characterized in that including
Following steps:
A, it introducing pseudobed L1 ': L1 copper foil layer is divided into the first copper foil layer and the second copper foil layer, the second copper foil layer is pseudobed L1 ', the
One copper foil layer is configured to the thickness drilled by laser；
B, it makes blind hole daughter board: L1 ' ~ Ln-1 copper foil layer correspondence being subjected to pressing, blind hole daughter board is made；Blind hole after pressing
Plate upper surface drills along L1 ' copper foil layer to Ln-1 copper foil layer, and the drilling penetrates Ln-1 copper foil layer and forms through-hole；
Successively carry out deburring, heavy copper, plate plating, plated hole dry film, plated hole, filling holes with resin to through-hole, then to blind hole daughter board successively into
Row nog plate, the second secondary internal layer dry film, second of DES；Pseudobed L1 ' is removed in step the second secondary internal layer dry film and second of DES；
The L1 ' copper foil layer of blind hole daughter board is pressed with the first copper foil layer by prepreg, the Ln-1 copper foil layer and Ln of blind hole daughter board
Copper foil layer is pressed by prepreg, and brownification processing is carried out after pressing；
C, the first copper foil layer and Ln copper foil layer are pressed on to the two sides of blind hole daughter board respectively；
D, it is drilled using laser to the first copper foil layer, so that the first copper foil layer electrically conducts with L1 ' copper foil layer.
2. a kind of method for solving non-symmetrical line slab warping according to claim 1 characterized by comprising
Sawing sheet, the first secondary internal layer dry film, first time DES, AOI detection are successively carried out between step A and step B.
3. a kind of method for solving non-symmetrical line slab warping according to claim 1, which is characterized in that step B is also wrapped
It includes:
L1 ' ~ Ln-1 copper foil layer is corresponded to press by prepreg, blind hole daughter board is made, and carries out milling side.
4. a kind of method for solving non-symmetrical line slab warping according to claim 1, which is characterized in that remove pseudobed
The mode of L1 ' are as follows: photosensitive processing is carried out with dry film, the L1 ' copper foil layer pad bigger than through-hole diameter in the Position Design of through-hole,
Rest part of the L1 ' copper foil layer in addition to pad is all etched to substrate in second of DES.
5. a kind of method for solving non-symmetrical line slab warping according to claim 4, which is characterized in that
The diameter of pad is 4-10mil bigger than the diameter of through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610524779.6A CN106102352B (en) | 2016-07-04 | 2016-07-04 | A method of solving non-symmetrical line slab warping |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610524779.6A CN106102352B (en) | 2016-07-04 | 2016-07-04 | A method of solving non-symmetrical line slab warping |
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| CN106102352A CN106102352A (en) | 2016-11-09 |
| CN106102352B true CN106102352B (en) | 2019-10-15 |
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| CN201610524779.6A Active CN106102352B (en) | 2016-07-04 | 2016-07-04 | A method of solving non-symmetrical line slab warping |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN103857208A (en) * | 2012-12-06 | 2014-06-11 | 深南电路有限公司 | Machining method for circuit board drilling |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660406B2 (en) * | 2000-07-07 | 2003-12-09 | Mitsui Mining & Smelting Co., Ltd. | Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit |
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2016
- 2016-07-04 CN CN201610524779.6A patent/CN106102352B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523704A (en) * | 2011-12-15 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Production method of multi-stage HDI plate |
| CN103857208A (en) * | 2012-12-06 | 2014-06-11 | 深南电路有限公司 | Machining method for circuit board drilling |
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| CN106102352A (en) | 2016-11-09 |
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