CN106525114A - Method for testing production line hole making capability in positive process - Google Patents
Method for testing production line hole making capability in positive process Download PDFInfo
- Publication number
- CN106525114A CN106525114A CN201610982374.7A CN201610982374A CN106525114A CN 106525114 A CN106525114 A CN 106525114A CN 201610982374 A CN201610982374 A CN 201610982374A CN 106525114 A CN106525114 A CN 106525114A
- Authority
- CN
- China
- Prior art keywords
- hole
- detection
- test board
- production line
- detection hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
Abstract
The invention relates to the technical field of circuit board production, specifically to a method for testing a production line hole making capability in a positive process. Detection holes are arranged in a test board, the detection holes are subjected to a process of manufacturing an outer layer circuit by the positive process, after detection of an outer layer pattern, the damage situations of dry films at portholes of the detection holes is detected and whether residual copper exists in the detection holes after tin stripping is detected, and whether manufacturing plated-through hole grooves in a PCB with hole groove sizes which are the same as the detection holes is in a manufacturing process capability range of the positive process of the production line is judged, thereby enabling engineers to clearly know the manufacturing process capability and state of the production line, providing effective data support for the manufacturing capability and normative design of the PCB, providing an optimal scheme for flow selection, effectively solving the problem that scrapping is caused by poor hole sealing in a PCB production process, enabling a production process to run smoothly, and guaranteeing product quality.
Description
Technical field
The present invention relates in board production technical field, more particularly to a kind of positive blade technolgy production line drilling ability survey
Method for testing.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed substrate.In order that
The interlayer line conduction of PCB and meet certain electrical performance demands, metallization hole slot, such as metallization circle need to be made on PCB
Hole, metallization slotted eye, plated through-hole and/or other metallization irregularly-shaped holes etc..The production of PCB includes circuit design and manufacture two
Individual link, the manufacture of PCB are designed as foundation with the circuit of early stage, and manufacturing process is typically as follows：Pass sequentially through sawing sheet, inner figure
The core material with required internal layer circuit → by each core material is obtained by the pressing that necessarily puts in order for one with internal layer etching
Body formed multi-layer sheet → on multilayer boards make with the outer-layer circuit → making solder mask → surface treatment → shaping of internal layer conducting,
The rear operations such as detection.The wherein making of outer-layer circuit can be carried out using negative film technique or positive blade technolgy according to actual needs, positive
Technique includes drilling, heavy copper successively, electric plating of whole board, outer graphics, graphic plating, takes off film, etch, take off tin；Negative film technique then according to
It is secondary including drilling, heavy copper, electric plating of whole board, outer graphics, etch, take off film.The manufacturing process of PCB is extremely tediously long, the circuit of early stage
Each step of design and manufacturing process affects production efficiency and yield rate, and especially the drilling ability of production line is directly affected
The circuit design of early stage and decision produce the situation of scrapping of plate, but prior art does not test the drilling ability of production line
Method, it is impossible to which the circuit design for early stage provides data and supports can only occur sealing of hole in actual production process bad and cause
When production plate is scrapped, by again circuit design and associated production parameter are optimized after plate is analyzed to scrapping.This nothing
Method knows the process capability of production line in advance, can only work as be analyzed when problem occurs again adjustment the mode of production be unfavorable for improve
Production efficiency and saving production cost.
The content of the invention
The present invention cannot know asking for the drilling ability of production line before circuit design in being directed to existing PCB production technologies
A kind of topic, there is provided the method for testing of production line drilling ability in positive blade technolgy.
For achieving the above object, the present invention is employed the following technical solutions.
The method of testing of production line drilling ability in a kind of positive blade technolgy, the method for testing are carried out on test board, institute
It is multi-layer sheet core material being integrated with outer copper foil pressing by prepreg to state test board；Comprise the following steps：
S1 drills：Detection hole is bored on test board.
Preferably, the detection hole on the test board includes test hole, detection hole and detection slotted eye.It is furthermore preferred that
The test hole that detection hole on the test board includes that aperture is incremented by and is arranged in order；Detection hole on the test board includes
The detection hole that hole length is incremented by and is arranged in order；Detection hole on the test board includes that flute length and groove width are incremented by and are arranged in order
Detection slotted eye.
Multigroup detection hole can be set on test board, and per group of detection hole is by test hole, detection hole and detection slotted eye structure
Into.
Can need the detection hole of different type and size is bored on test board according to test, such as except above-mentioned test hole,
Outside detection hole and detection slotted eye, counter sink and some special irregularly-shaped holes are can also be.
S2 hole metallizations：Detection hole metallization on test board is made by heavy copper and electric plating of whole board operation.
S3 outer graphics：Patch dry film, exposed and developed operation are carried out successively on test board according to prior art, in test
Outer graphics are formed by dry film on plate；The aperture in the detection hole is covered by outer graphics.
S4 primary detections：Detect whether the dry film at the aperture of hole has breakage on detection test board；If at detection hole aperture
Without breakage, then the primary detection in the detection hole is qualified for dry film；If the dry film at detection hole aperture has breakage, at the beginning of the detection hole
Secondary detection is unqualified.
S5 electroplates copper and tin：According to prior art successively copper electroplating layer and plating tin layers on test board.
S6 takes off film：Dry film on test board is removed according to prior art.
S7 is etched：The top layer copper not covered by tin layers on test board is removed according to prior art.
S8 takes off tin：The tin layers of test plate surface are removed according to prior art.
S9 is detected again：Whether residual copper is had in the hole that hole is detected on detection test board；If without residual copper in the hole in detection hole,
The detection again in the detection hole is qualified；If having residual copper in the hole in detection hole, the detection again in the detection hole is unqualified.
When the primary detection for detecting hole and when detecting qualified again, then judge with the detection hole identical hole slot size
The metallization hole slot of making is in the positive manufacturing process limit of power of the production line；If the primary detection in metallization detection hole
And/or again when detecting unqualified, then judge with the metallization hole slot made with the detection hole identical hole slot size not at this
In the positive manufacturing process limit of power of production line.
Compared with prior art, the invention has the beneficial effects as follows：The present invention makes inspection by detection hole is arranged on test board
Gaging hole through with positive blade technolgy make outer-layer circuit operation and respectively detect outer graphics after detect hole aperture at dry film break
Damage situation and detect in the hole in hole whether there is residual copper after taking off tin, with this judge with the detection hole identical hole slot size in PCB
Upper making metallizes hole slot whether in the positive manufacturing process limit of power of the production line, so as to engineering staff can be allowed to specify that
The process capability and state of solution production line, the making ability and Specification Design for PCB provide valid data and support, so as to for stream
The selection of journey provides optimal scheme, and the problem for causing to scrap in effectively solving PCB production process because sealing of hole is bad makes to produce
Cheng Shunchang runs, and ensures product quality.
Description of the drawings
Fig. 1 is the arrangement schematic diagram that hole is detected on test board.
Specific embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of method of testing of production line drilling ability in positive blade technolgy, many used by the method for testing
Laminate is referred to as test board.The thickness of slab of test board is 1.2mm, completes copper thick for 1.5OZ.
Comprise the following steps that：
(1) make test board
According to sawing sheet of the prior art and pressing working procedure, core material is cut into and requires size, it is then solid by half
Changing piece and high-temperature laminating makes core material be integrated with outer copper foil pressing, forms multi-layer sheet, and the multi-layer sheet is used to test production
The drilling ability of line, referred to as test board.
(2) drill
According to existing bore process, on test board bore detection hole, the detection hole include diameter it is incremented by successively and according to
The test hole of secondary arrangement, hole length is incremented by successively and the detection hole that is arranged in order and flute length and groove width are incremented by successively and successively
The detection slotted eye of arrangement.(" put in order " in table and refer to shown in the following Tables 1 and 2 of size in each detection hole bored on test board
The putting in order of hole is respectively detected in one group of detection hole from top to bottom), each detection arrangement mode of the hole on test board such as Fig. 1 institutes
Show.On test board, each row detection hole includes test hole, detection hole and detection slotted eye from top to bottom, and each row detection hole is
One group of detection hole, each test board are provided with 18 groups of detection holes, and the arrangement mode in each group of detection hole is：Diameter is incremented by successively
Test hole → hole length detection hole → flute length incremented by successively detection slotted eye incremented by successively.(in other embodiments, survey
Depending on the type for detecting hole, size and the arrangement mode arranged on test plate (panel) can be also needed according to the size of test board and test, such as
Counter sink and some special irregularly-shaped holes etc. can also be set.)
On 1 test board of table, in one group of detection hole, the hole in the aperture of test hole and detection hole is long
| Put in order | 1 | 2 | 3 | 4 | 5 | 6 |
| Pass | Circular hole | Circular hole | Circular hole | Circular hole | Circular hole | Circular hole |
| Diameter/hole length (mm) | 3 | 3.5 | 4 | 4.5 | 5 | 5.5 |
| Put in order | 7 | 8 | 9 | 10 | 11 | 12 |
| Pass | Circular hole | Hole | Hole | Hole | Hole | Hole |
| Diameter/hole length (mm) | 6 | 3 | 3.5 | 4 | 4.5 | 5 |
The groove width and flute length of slotted eye are detected on 2 test board of table in one group of detection hole
| Put in order | 13 | 14 | 15 | 16 | 17 | 18 | 19 | 20 | 21 |
| Groove width (mm) | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 22 | 23 | 24 | 25 | 26 | 27 | 28 | 29 | 30 |
| Groove width (mm) | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 31 | 32 | 33 | 34 | 35 | 36 | 37 | 38 | 39 |
| Groove width (mm) | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 40 | 41 | 42 | 43 | 44 | 45 | 46 | 47 | 48 |
| Groove width (mm) | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 | 3.5 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 49 | 50 | 51 | 52 | 53 | 54 | 55 | 56 | 57 |
| Groove width (mm) | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 58 | 59 | 60 | 61 | 62 | 63 | 64 | 65 | 66 |
| Groove width (mm) | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
| Put in order | 67 | 68 | 69 | 70 | 71 | 72 | 73 | 74 | 75 |
| Groove width (mm) | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Flute length (mm) | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 |
(3) hole metallization：According to prior art, the detection mesoporous metal on test board is made by heavy copper and electric plating of whole board operation
Change.After hole metallization, it is 1.5OZ that the table copper copper of test board is thick.
(4) outer graphics
According to prior art, outer graphics are made on test board using positive blade technolgy.Carry out on test board successively
Patch dry film, exposed and developed operation, form outer graphics by dry film on test board, make the outer graphics to be formed cover detection hole
Aperture, the monolateral big 0.125mm in aperture than detection hole of dry film.
(5) primary detection
Whether the dry film on detection test board at each detection hole aperture has breakage；If all inspections of a certain specification on test board
Without breakage, then the primary detection in the detection hole of the specification is qualified for dry film at gaging hole aperture；If a certain specification on test board
Dry film at detection hole aperture has breakage, then the primary detection in the detection hole of the specification is unqualified (as long as there is the specification
Dry film at detection hole aperture has breakage to think that primary detection is unqualified).
(6) electroplate copper and tin
According to prior art successively copper electroplating layer and plating tin layers on test board.
(7) take off film
According to prior art, the dry film on test board is removed by taking off membrane process.
(8) etch
The top layer copper not covered by tin layers on test board is removed according to prior art.
(9) take off tin
The tin layers of test plate surface are removed according to prior art.
(10) detect again
Whether residual copper (hole in whether remain copper) is had in the hole in the detection hole on detection test board；If the institute of a certain specification
Have in the hole in detection hole without residual copper, then the detection again in the detection hole is qualified；If having residual copper in the hole in the detection hole of a certain specification,
Then the detection again in the detection hole of the specification is unqualified (as long as having in the hole in the detection hole of the specification has residual copper to think again
Secondary detection is unqualified).
When the primary detection for detecting hole and when detecting qualified again, then judge with the detection hole identical hole slot size
The metallization hole slot of making is in the positive manufacturing process limit of power of the production line；If the primary detection in metallization detection hole
And/or again when detecting unqualified, then judge with the metallization hole slot made with the detection hole identical hole slot size not at this
In the positive manufacturing process limit of power of production line.
The test case of the present embodiment is as follows：The first inspection in all of test hole and all of detection hole on test board
Survey and detect qualified again, then judge the metallization to make with these test holes and detection hole identical hole slot size
Hole slot is in the positive manufacturing process limit of power of the production line；The detection of part detection slotted eye is unqualified (such as table 3 below institute
Show), then judge with the metallization slotted eye made with these detection slotted eye identical slot sizes not in the positive work of the production line
In the range of skill process capability.
The corresponding detection slotted eye of metallization slotted eye of the table 3 not in the positive manufacturing process limit of power of the production line and
Hole count
| Groove width | 2.5 | 3 | 3 | 3 | 3.5 | 4 | 4 | 4 | 4.5 | 4.5 |
| Flute length | 7 | 8 | 10 | 12 | 11 | 7 | 11 | 12 | 10 | 12 |
| Holes number | 1 | 1 | 1 | 2 | 1 | 1 | 1 | 1 | 2 | 2 |
Embodiment 2
The present embodiment provides a kind of method of testing of production line drilling ability in positive blade technolgy, many used by the method for testing
Laminate is referred to as test board.The thickness of slab of test board is 1.2mm, completes copper thick for 2OZ.The set-up mode and number in hole are detected on test board
Amount is consistent with the test board in embodiment 1, and concrete steps are same as Example 1.
The test case of the present embodiment is as follows：The first inspection in all of test hole and all of detection hole on test board
Survey and detect qualified again, then judge the metallization to make with these test holes and detection hole identical hole slot size
Hole slot is in the positive manufacturing process limit of power of the production line；The detection of part detection slotted eye is unqualified (such as table 4 below institute
Show), then judge with the metallization slotted eye made with these detection slotted eye identical slot sizes not in the positive work of the production line
In the range of skill process capability.
The corresponding detection slotted eye of metallization slotted eye of the table 4 not in the positive manufacturing process limit of power of the production line and
Hole count
| Groove width | 3 | 3.5 | 3.5 | 3.5 | 3.5 | 4 | 4 | 4 | 4.5 | 4.5 | 4.5 | 5 |
| Flute length | 9 | 8 | 9 | 10 | 11 | 7 | 8 | 12 | 10 | 11 | 12 | 8 |
| Holes number | 1 | 1 | 5 | 2 | 1 | 1 | 1 | 1 | 1 | 1 | 3 | 1 |
Embodiment 3
The present embodiment provides a kind of method of testing of production line drilling ability in positive blade technolgy, many used by the method for testing
Laminate is referred to as test board.The thickness of slab of test board is 1.6mm, completes copper thick for 1.5OZ.On test board detect hole set-up mode and
Quantity is consistent with the test board in embodiment 1, and concrete steps are same as Example 1.
The test case of the present embodiment is as follows：The first inspection in all of test hole and all of detection hole on test board
Survey and detect qualified again, then judge the metallization to make with these test holes and detection hole identical hole slot size
Hole slot is in the positive manufacturing process limit of power of the production line；The detection of part detection slotted eye is unqualified (such as table 5 below institute
Show), then judge with the metallization slotted eye made with these detection slotted eye identical slot sizes not in the positive work of the production line
In the range of skill process capability.
The corresponding detection slotted eye of metallization slotted eye of the table 5 not in the positive manufacturing process limit of power of the production line and
Hole count
| Groove width | 2.5 | 3 | 3 | 3 | 3 | 4 | 4.5 | 4.5 |
| Flute length | 11 | 9 | 10 | 11 | 12 | 11 | 10 | 12 |
| Holes number | 1 | 1 | 1 | 2 | 2 | 1 | 2 | 1 |
The above further illustrates the technology contents of the present invention only with embodiment, is easier to understand in order to reader,
But do not represent embodiments of the present invention and be only limitted to this, it is any to extend or recreate according to the technology done by the present invention, by this
Bright protection.
Claims (5)
1. in a kind of positive blade technolgy production line drilling ability method of testing, the method for testing is carried out on test board, described
Test board is multi-layer sheet core material being integrated with outer copper foil pressing by prepreg；Characterized in that, including with
Lower step：
S1 drills：Detection hole is bored on test board；
S2 hole metallizations：Detection hole metallization on test board is made by heavy copper and electric plating of whole board operation；
S3 outer graphics：Patch dry film, exposed and developed operation are carried out successively on test board according to prior art, on test board
Outer graphics are formed by dry film；The aperture in the detection hole is covered by outer graphics；
S4 primary detections：Detect whether the dry film at the aperture of hole has breakage on detection test board；If the dry film at detection hole aperture
Without breakage, then the primary detection in the detection hole is qualified；If the dry film at detection hole aperture has breakage, the first inspection in the detection hole
Survey unqualified；
S5 electroplates copper and tin：According to prior art successively copper electroplating layer and plating tin layers on test board；
S6 takes off film：Dry film on test board is removed according to prior art；
S7 is etched：The top layer copper not covered by tin layers on test board is removed according to prior art；
S8 takes off tin：The tin layers of test plate surface are removed according to prior art；
S9 is detected again：Whether residual copper is had in the hole that hole is detected on detection test board；If without residual copper in the hole in detection hole, the inspection
The detection again of gaging hole is qualified；If having residual copper in the hole in detection hole, the detection again in the detection hole is unqualified；
When the primary detection for detecting hole and detecting qualified again, then judge to make with the detection hole identical hole slot size
Metallization hole slot in the positive manufacturing process limit of power of the production line；If metallization detection hole primary detection and/or
When detecting unqualified again, then judge with the metallization hole slot made with the detection hole identical hole slot size not in the production line
Positive manufacturing process limit of power in.
2. according to claim 1 in a kind of positive blade technolgy production line drilling ability method of testing, it is characterised in that it is described
Detection hole on test board includes test hole, detection slotted eye and detection hole.
3. according to claim 2 in a kind of positive blade technolgy production line drilling ability method of testing, it is characterised in that it is described
The test hole that detection hole on test board includes that aperture is incremented by and is arranged in order.
4. according to claim 2 in a kind of positive blade technolgy production line drilling ability method of testing, it is characterised in that it is described
The detection hole that detection hole on test board includes that hole length is incremented by and is arranged in order.
5. according to claim 2 in a kind of positive blade technolgy production line drilling ability method of testing, it is characterised in that it is described
Detection hole on test board includes the detection slotted eye that flute length and groove width are incremented by and are arranged in order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982374.7A CN106525114B (en) | 2016-11-08 | 2016-11-08 | The test method of production line drilling ability in a kind of positive blade technolgy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982374.7A CN106525114B (en) | 2016-11-08 | 2016-11-08 | The test method of production line drilling ability in a kind of positive blade technolgy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106525114A true CN106525114A (en) | 2017-03-22 |
| CN106525114B CN106525114B (en) | 2018-12-07 |
Family
ID=58351284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610982374.7A Active CN106525114B (en) | 2016-11-08 | 2016-11-08 | The test method of production line drilling ability in a kind of positive blade technolgy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106525114B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106989711A (en) * | 2017-05-24 | 2017-07-28 | 福州瑞华印制线路板有限公司 | It is a kind of to be used to test welding resistance bridge and the detection plate and method of component hole photographic parameter |
| CN110839315A (en) * | 2019-10-22 | 2020-02-25 | 江门崇达电路技术有限公司 | Design method of immersion gold process test board |
| CN115356252A (en) * | 2022-08-09 | 2022-11-18 | 湖北龙腾电子科技股份有限公司 | Solder resist ink hole-entering process capability testing method and control method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243709A (en) * | 1992-03-02 | 1993-09-21 | Nec Toyama Ltd | Manufacture of printed wiring board |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102111961A (en) * | 2010-12-20 | 2011-06-29 | 胜宏科技（惠州）有限公司 | Method for detecting process capability of inner and outer layers of circuit board |
| CN102281721A (en) * | 2011-05-20 | 2011-12-14 | 深圳市崇达电路技术股份有限公司 | Manufacture method of printed circuit board with surface-pressure covering film |
| JP2012186377A (en) * | 2011-03-07 | 2012-09-27 | Ube Ind Ltd | Method for manufacturing polyimide metal laminate |
| CN103415165A (en) * | 2013-05-07 | 2013-11-27 | 胜宏科技（惠州）股份有限公司 | Method for testing quality of blind hole of HDI circuit board |
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
| CN104378923A (en) * | 2014-11-14 | 2015-02-25 | 江门崇达电路技术有限公司 | Printed circuit board etching method |
| CN104619133A (en) * | 2015-01-20 | 2015-05-13 | 江门崇达电路技术有限公司 | Manufacturing method of generalized silver circuit board |
| CN104819931A (en) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | Method for detecting reliability of blind via holes of circuit boards |
| CN104880162A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Method for detecting drilling hole offset degree of PCB |
-
2016
- 2016-11-08 CN CN201610982374.7A patent/CN106525114B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243709A (en) * | 1992-03-02 | 1993-09-21 | Nec Toyama Ltd | Manufacture of printed wiring board |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN102111961A (en) * | 2010-12-20 | 2011-06-29 | 胜宏科技（惠州）有限公司 | Method for detecting process capability of inner and outer layers of circuit board |
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| JP2012186377A (en) * | 2011-03-07 | 2012-09-27 | Ube Ind Ltd | Method for manufacturing polyimide metal laminate |
| CN102281721A (en) * | 2011-05-20 | 2011-12-14 | 深圳市崇达电路技术股份有限公司 | Manufacture method of printed circuit board with surface-pressure covering film |
| CN103415165A (en) * | 2013-05-07 | 2013-11-27 | 胜宏科技（惠州）股份有限公司 | Method for testing quality of blind hole of HDI circuit board |
| CN104363704A (en) * | 2014-10-30 | 2015-02-18 | 江门崇达电路技术有限公司 | Manufacturing method of thick hole copper PCB |
| CN104378923A (en) * | 2014-11-14 | 2015-02-25 | 江门崇达电路技术有限公司 | Printed circuit board etching method |
| CN104619133A (en) * | 2015-01-20 | 2015-05-13 | 江门崇达电路技术有限公司 | Manufacturing method of generalized silver circuit board |
| CN104819931A (en) * | 2015-04-24 | 2015-08-05 | 深圳崇达多层线路板有限公司 | Method for detecting reliability of blind via holes of circuit boards |
| CN104880162A (en) * | 2015-05-15 | 2015-09-02 | 江门崇达电路技术有限公司 | Method for detecting drilling hole offset degree of PCB |
Non-Patent Citations (2)
| Title |
|---|
| 程骄 等: "PCB制程中金属化孔镀层空洞的成因及改善", 《印刷电路信息》 * |
| 陈世金 等: "印制线路板假正片孔内无铜的原因分析", 《电镀与环保》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106989711A (en) * | 2017-05-24 | 2017-07-28 | 福州瑞华印制线路板有限公司 | It is a kind of to be used to test welding resistance bridge and the detection plate and method of component hole photographic parameter |
| CN110839315A (en) * | 2019-10-22 | 2020-02-25 | 江门崇达电路技术有限公司 | Design method of immersion gold process test board |
| CN110839315B (en) * | 2019-10-22 | 2020-12-15 | 江门崇达电路技术有限公司 | Design method of immersion gold process test board |
| CN115356252A (en) * | 2022-08-09 | 2022-11-18 | 湖北龙腾电子科技股份有限公司 | Solder resist ink hole-entering process capability testing method and control method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106525114B (en) | 2018-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104363720B (en) | A kind of method for making deep blind slot in the pcb | |
| CN106973507A (en) | A kind of preparation method of filling holes with resin wiring board | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN107949190A (en) | A kind of manufacture craft of high drop ladder wiring board | |
| CN108738248B (en) | Manufacturing method of PCB with metallized half holes on board edge | |
| CN101959373A (en) | Method for improving blind hole alignment of printed circuit board | |
| CN104363704A (en) | Manufacturing method of thick hole copper PCB | |
| CN107770974B (en) | Manufacturing method of interlayer alignment detection module | |
| CN104244612A (en) | Method for forming plated-through hole in PTFE circuit board | |
| CN108990318A (en) | A kind of method for manufacturing circuit board of loophole lamination mistake proofing | |
| CN104378931B (en) | The preparation method of metallization counterbore in a kind of PCB | |
| CN106525114A (en) | Method for testing production line hole making capability in positive process | |
| CN107708316A (en) | A kind of preparation method of superfinishing fine rule road | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN108289374A (en) | A kind of production method of filling holes with resin wiring board | |
| CN109587968A (en) | One kind preventing consent or the undesirable PCB production method of plated hole | |
| CN105682363B (en) | A kind of production method of the PCB of edges of boards metallization | |
| CN110708873A (en) | Manufacturing method for realizing positioning of embedded copper block | |
| CN106793578A (en) | A kind of PCB preparation methods in electric thick gold hole | |
| CN106793574A (en) | A kind of PCB back drilling methods | |
| CN110337198A (en) | A kind of production method for the PCB reducing plate thickness | |
| CN103607845B (en) | Manufacturing method of flexible printed circuit board | |
| CN109982511A (en) | A kind of production method convenient for detecting the PCB for whether leaking brill without copper hole | |
| CN104363695B (en) | A kind of rivet hole position on PCB core plate and preparation method thereof | |
| CN112504183B (en) | Hole deviation detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |