CN107770974B - Manufacturing method of interlayer alignment detection module - Google Patents
Manufacturing method of interlayer alignment detection module Download PDFInfo
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- CN107770974B CN107770974B CN201710851707.7A CN201710851707A CN107770974B CN 107770974 B CN107770974 B CN 107770974B CN 201710851707 A CN201710851707 A CN 201710851707A CN 107770974 B CN107770974 B CN 107770974B
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Abstract
The invention discloses a manufacturing method of an interlayer alignment detection module, which comprises the following steps: s1, manufacturing a detection copper block: when an inner layer circuit is manufactured on the inner layer plate, a detection copper block is manufactured on the inner layer plate, and the middle of the detection copper block is empty; s2, pressing: the inner layer board is pressed into a multilayer board according to the requirement of the layer number; s3, drilling: when outer drilling, corresponding detection copper billet center department in the lump drills the inspection hole in the lump, the aperture of inspection hole is less than the internal diameter that detects the copper billet, and the periphery of inspection hole does not contact with the detection copper billet. S4, copper deposition, plate electric: carrying out copper deposition and full-board electroplating treatment on the multilayer board to metalize holes on the multilayer board; s5, manufacturing a copper disc: and when the outer layer circuit is manufactured on the multilayer board, manufacturing a copper disc corresponding to the inner layer detection copper block around the detection hole. The detection module is simple and easy to realize, occupies small space and can improve the judgment efficiency.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of an interlayer alignment detection module.
Background
In the process of manufacturing the printed circuit board, the interlayer alignment degree is detected by arranging a harmomegathus PAD between layers, measuring the harmomegathus value of an inner core plate by an X-RAY target shooter when an X-RAY target is drilled, giving the drilling band coefficient of an outer layer drill hole and feeding back the rationality of an inner layer compensation coefficient through data, and determining whether adjustment is needed.
The detection method for the interlayer alignment degree has the following defects: (1) the measurement is only for sampling measurement, and the expansion and contraction conditions of the whole batch of production plates are not necessarily reflected; (2) the functional internal short (internal short circuit) of the finished board is not convenient for distinguishing expansion and shrinkage compensation coefficients or interlayer sliding plate offset, line tracing and point finding analysis are needed, the cost such as labor time is consumed more, and the efficiency is low.
Disclosure of Invention
The invention provides a manufacturing method of an interlayer alignment detection module aiming at the problems that the existing interlayer alignment detection method of a circuit board cannot well judge the functional internal short reason and the judgment efficiency is low.
In order to solve the above technical problem, the present invention provides a method for manufacturing an interlayer alignment detection module, comprising the following steps:
s1, manufacturing a detection copper block: when the inner layer circuit is manufactured on the inner layer plate, a detection copper block is manufactured on the inner layer plate, and the middle of the detection copper block is empty.
Preferably, the detection copper block is manufactured on the plate edge of the inner plate.
Preferably, the detection copper block is a copper ring or a hollow square copper block.
Preferably, the edge width of the detection copper block is 0.15-0.25 mm.
S2, pressing: the inner layer board is laminated into a multilayer board according to the layer number requirement.
S3, drilling: when outer drilling, corresponding detection copper billet center department in the lump drills the inspection hole in the lump, the aperture of inspection hole is less than the internal diameter that detects the copper billet, and the periphery of inspection hole does not contact with the detection copper billet.
Preferably, the distance between the outer periphery of the detection hole and the inner periphery of the detection copper block is equal to the distance between the minimum hole and the line in the multi-layer board unit.
S4, copper deposition, plate electric: and carrying out copper deposition and full-board electroplating treatment on the multilayer board to metalize the holes on the multilayer board.
S5, manufacturing a copper disc: and when the outer layer circuit is manufactured on the multilayer board, manufacturing a copper disc corresponding to the inner layer detection copper block around the detection hole.
Compared with the prior art, the invention has the following beneficial effects:
when an inner layer circuit is manufactured on an inner layer plate, a hollow detection copper block is manufactured at the same time, after a multilayer plate is laminated, a detection hole is drilled at the position corresponding to the center of the detection copper block when an outer layer is drilled, the aperture of the detection hole is smaller than the inner diameter of the detection copper block, then the detection hole is metalized through copper deposition and plate electric treatment, detection and analysis are carried out through a universal meter, whether the copper layer in the detection hole is connected with the detection copper block on the inner layer circuit or not is judged, when a short circuit occurs between two different networks formed by the detection through hole and the detection hole, the copper layer in the detection hole is aligned with the detection copper block in the inner layer circuit, and then the interlayer degree failure can be judged; when an open circuit exists between two different networks formed by the detection through hole and the detection hole, the fact that the copper layer in the detection hole is not connected with the detection copper block in the inner layer circuit is indicated, and it can be judged that the interlayer alignment degree is not failed; in order to facilitate the detection of the finished product, copper plates are manufactured around the detection holes when the outer layer circuit is manufactured; according to the judgment result of the interlayer alignment degree, the reason that the functional inner layer short circuit failure of the finished board is caused by the expansion and shrinkage compensation coefficient or the interlayer sliding plate offset can be judged; the detection module is simple and easy to realize, occupies small space, can improve the judgment efficiency, and can be suitable for all types of circuit boards, such as HDI boards, rigid-flex boards and high-density multilayer boards.
Drawings
FIG. 1 is a schematic diagram of a module for detecting alignment between layers in embodiment 1;
FIG. 2 is a schematic diagram of the inner layers of each single-layer alignment detection module in example 2, which are spaced apart from each other;
FIG. 3 is a schematic diagram of a blind hole alignment detection module design.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and explained with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1, the method for manufacturing a circuit board according to this embodiment includes a method for manufacturing a module for detecting overall interlayer alignment of a multilayer circuit board, which includes the following steps:
(1) cutting: the core board is cut according to the size of the jointed board of 320mm multiplied by 420mm, the thickness of the core board is 0.5mm, and the thickness of the outer copper surface of the core board is 0.5 OZ.
(2) And manufacturing an inner layer circuit (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of an inner layer circuit and a plate edge copper ring (a detection copper block) by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit pattern 1 and a copper ring, wherein the inner layer line width is measured to be 3 mil; and then, detecting defects of the inner layer circuit, such as open short circuit, circuit gap, circuit pin hole and the like, discarding the defects, and discharging the defect-free product to the next flow.
The positions of the copper rings can be distributed on the SET process edge, so that the copper rings can be conveniently cut off in the later molding process; the method can also be arranged at the peripheral tool pattern of the plate edge, such as the electroplating FA slice pattern, so that the condition of the alignment between semi-finished product layers can be analyzed and confirmed together with the copper on the surface of the electroplated hole after electroplating.
(3) And pressing: and (3) brown-oxidizing at a speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the outer copper foil, the PP sheet and the three core plates according to requirements, and then pressing the laminated plates under proper laminating conditions according to the characteristics of the plates to form the eight-layer multilayer plate.
And copper rings are arranged at corresponding positions in the inner layer circuit of each layer of the multilayer board.
(4) Drilling a through hole by using drilling data, and drilling a detection hole 3 at the center of the plate edge corresponding to the copper ring, wherein the aperture of the detection hole 3 is smaller than the inner diameter of the copper ring; the distance from the outer periphery of the sensing hole 3 to the inner periphery of the copper ring is set according to the minimum hole-to-wire distance in the multi-layer board unit, for example, to 0.1mm, 0.125mm, 0.15mm, or 0.175 mm.
(5) And copper deposition, namely metallizing the through holes and the detection holes on the multilayer board, and testing the through holes in a backlight mode to 10 levels, wherein the thickness of the copper deposition in the holes is 0.5 mu m.
(6) And performing full-plate electroplating, namely performing full-plate electroplating for 20min at the current density of 1.8 ASD.
(7) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing the exposure of an outer layer circuit and a copper plate at the edge of the plate by using a full-automatic exposure machine and a positive circuit film and using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit pattern on the multilayer plate and forming a copper plate 4 around the detection hole by developing; and (3) outer layer pattern electroplating, then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min by using a current density of 1.8ASD, the tin plating is carried out for 10min by using a current density of 1.2ASD, the tin thickness is 3-5 mu m, then film stripping, etching and tin stripping are carried out in sequence, then the defects of short circuit, circuit notch, circuit pinhole and the like of an outer layer circuit are inspected, the defective scrapping treatment is carried out, and the product without defects is discharged to the next process.
(8) Solder resist and silk screen printing of characters: according to the prior art and according to design requirements, a solder mask is made on a production board and characters are silk-screened.
(9) And surface treatment: according to the prior art and according to the design requirements, the production plate is subjected to surface treatment.
(10) And forming: and routing the shape according to the design requirement according to the prior art to obtain a finished product of the circuit board.
(11) And electrical performance testing: detecting the electrical performance of the circuit board, and enabling the qualified circuit board to enter the next processing link;
(12) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
By the method of the embodiment, in order to analyze the overall situation of the multilayer circuit board, the copper rings are arranged at the same positions of each layer of the inner layer circuit of the multilayer board, then the detection holes with the inner diameter smaller than that of the copper rings are drilled at the positions, corresponding to the centers of the copper rings, of the outer layers, copper is deposited in the detection holes, and the interlayer alignment failure can be judged as long as one layer of copper rings is connected with the copper layers in the detection holes through detection; in order to facilitate the detection of the finished product, the periphery of the detection hole is made into a copper disc shape when the outer layer circuit is manufactured, so that the interlayer alignment degree analysis of the finished product of the multilayer circuit board is realized; the detection module designed by the method can also effectively monitor the alignment degree of the through hole and judge whether the through hole has the drilling deviation or not.
Example 2
As shown in fig. 2, the method for manufacturing a circuit board according to this embodiment includes a design of a module for separately monitoring alignment of each layer of a multilayer circuit board, and is substantially the same as that in embodiment 1, except that the steps (2) - (4) are as follows:
(2) and manufacturing an inner layer circuit (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and using a full-automatic exposure machine to complete the exposure of the plate edge copper rings (detection copper blocks) arranged at intervals and staggered in the inner layer circuit and the upper layer circuit and the lower layer circuit by using 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form a circuit pattern and a copper ring 2, wherein the inner layer line width is measured to be 3 mil; and then, detecting defects of the inner layer circuit, such as open short circuit, circuit gap, circuit pin hole and the like, discarding the defects, and discharging the defect-free product to the next flow.
The positions of the copper rings can be distributed on the SET process edge, so that the copper rings can be conveniently cut off in the later molding process; the method can also be arranged at the peripheral tool pattern of the plate edge, such as the electroplating FA slice pattern, so that the condition of the alignment between semi-finished product layers can be analyzed and confirmed together with the copper on the surface of the electroplated hole after electroplating.
(3) And pressing: and (3) brown-oxidizing at a speed of brown-oxidizing according to the thickness of the bottom copper, sequentially laminating the outer copper foil, the PP sheet and the core plate according to requirements, and then pressing the laminated plates under proper laminating conditions according to the characteristics of the plates to form the multilayer plate.
The copper rings on each layer of circuit in the inner layer circuit of the multilayer board are arranged in a staggered mode at intervals.
(4) Drilling an outer layer, namely drilling by using drilling data, and drilling a detection hole 3 at the center of each layer of copper ring corresponding to the edge of the plate, wherein the aperture of the detection hole is smaller than the inner diameter of the copper ring; the distance between the outer periphery of the sensing hole and the inner periphery of the copper ring is set according to the distance from the smallest hole to the line in the multiwall sheet unit, i.e., the distance between the outer periphery of the sensing hole and the inner periphery of the sensing copper block is equal to the distance from the smallest hole to the line in the multiwall sheet unit, e.g., set to 0.1mm, 0.125mm, 0.15mm, or 0.175 mm.
By setting the copper ring and the outer layer to be drilled with the detection hole corresponding to each copper ring by the method of embodiment 2, the interlayer alignment condition of each layer of circuit can be analyzed.
In other embodiments, as shown in fig. 3, the method for manufacturing the module for detecting the interlayer alignment degree according to the present invention can also be used for blind hole alignment degree detection, wherein a copper ring is disposed on the edge of the inner circuit board at the bottom of the blind hole 5, the detection blind hole 6 is drilled in the outer layer corresponding to the center of the copper ring, copper is deposited in the detection blind hole 6, and the copper disk 4 is formed around the detection blind hole 6 when the outer circuit is manufactured.
In other embodiments, the detection copper block may also be a hollow square, and the distance between the periphery of the detection hole drilled at the later stage and the detection copper block is equal, such as a square; but also other various shapes that can achieve the above-described effects.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (5)
1. A manufacturing method of an interlayer alignment detection module is characterized by comprising the following steps:
s1, manufacturing a detection copper block: when the inner layer circuit is manufactured on the inner layer plate, a detection copper block is uniformly manufactured in each layer of inner layer circuit on the inner layer plate, and the detection copper blocks at the upper layer circuit and the lower layer circuit are arranged at intervals in a staggered mode; detecting that the middle of the copper block is empty;
s2, pressing: the inner layer board is pressed into a multilayer board according to the requirement of the layer number;
s3, drilling: when the outer layer is drilled, a detection hole is drilled at the center corresponding to each detection copper block, the aperture of the detection hole is smaller than the inner diameter of the detection copper block, and the periphery of the detection hole is not contacted with the detection copper block;
s4, copper deposition, plate electric: carrying out copper deposition and full-board electroplating treatment on the multilayer board to metalize holes on the multilayer board;
s5, manufacturing a copper disc: and when the outer layer circuit is manufactured on the multilayer board, manufacturing a copper disc corresponding to the inner layer detection copper block around the detection hole.
2. The method of claim 1, wherein the outer perimeter of the test hole is spaced from the inner perimeter of the test copper block by a distance equal to the minimum hole-to-line distance in a multiwall sheet unit.
3. The method of claim 1, wherein the test copper block is a copper ring.
4. The method of claim 1, wherein the width of the edge of the test copper block is 0.15-0.25 mm.
5. The method of claim 1, wherein in step S1, the test copper block is formed on a board edge of the inner board.
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| CN201710851707.7A CN107770974B (en) | 2017-09-19 | 2017-09-19 | Manufacturing method of interlayer alignment detection module |
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| CN201710851707.7A CN107770974B (en) | 2017-09-19 | 2017-09-19 | Manufacturing method of interlayer alignment detection module |
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| CN108401358B (en) * | 2018-01-24 | 2020-06-23 | 广州兴森快捷电路科技有限公司 | Printed circuit board and manufacturing method thereof |
| CN110519910B (en) * | 2019-08-28 | 2020-10-16 | 生益电子股份有限公司 | PCB detection method by bonding heat dissipation medium through conductive medium and PCB |
| CN110412450B (en) * | 2019-08-28 | 2021-06-25 | 生益电子股份有限公司 | Connection detection method for heat dissipation medium and conductive medium and PCB |
| CN115988737B (en) * | 2023-03-21 | 2023-08-25 | 广州添利电子科技有限公司 | Verification board for verifying detection capability of automatic optical detector and preparation method thereof |
| CN116489873B (en) * | 2023-06-25 | 2023-10-20 | 淄博芯材集成电路有限责任公司 | Structure and method for rapidly detecting dislocation of PCB laser perforation and lower disc |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179797A (en) * | 1989-12-07 | 1991-08-05 | Sekisui Chem Co Ltd | Manufacture of multilayer printed board provided with through-hole |
| CN103796415A (en) * | 2012-10-31 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer circuit board and method for manufacturing same |
| CN205946395U (en) * | 2016-07-01 | 2017-02-08 | 深圳中富电路有限公司 | Printed circuit board |
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2017
- 2017-09-19 CN CN201710851707.7A patent/CN107770974B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03179797A (en) * | 1989-12-07 | 1991-08-05 | Sekisui Chem Co Ltd | Manufacture of multilayer printed board provided with through-hole |
| CN103796415A (en) * | 2012-10-31 | 2014-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | Multilayer circuit board and method for manufacturing same |
| CN205946395U (en) * | 2016-07-01 | 2017-02-08 | 深圳中富电路有限公司 | Printed circuit board |
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