CN104363695B - A kind of rivet hole position on PCB core plate and preparation method thereof - Google Patents
A kind of rivet hole position on PCB core plate and preparation method thereof Download PDFInfo
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- CN104363695B CN104363695B CN201410558061.XA CN201410558061A CN104363695B CN 104363695 B CN104363695 B CN 104363695B CN 201410558061 A CN201410558061 A CN 201410558061A CN 104363695 B CN104363695 B CN 104363695B
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- rivet hole
- core plate
- base material
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- hole
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Abstract
The present invention relates to board production technical field, specially a kind of rivet hole position on PCB core plate and preparation method thereof on the multilayer inner plating after drilling blind hole and through hole, then carries out the heavy copper of internal layer and whole plate filling perforation plating, makes blind hole and through hole while being metallized.The present invention is by the heavy copper plating line of use level when internal layer sinks Copper treatment, and vertical continuous plating lines are used in whole plate filling perforation electroplating processes, both coordinate make blind hole and through hole can while metallized so that can breviaty technological process, improve production efficiency simultaneously reduces production cost.Whole plate filling perforation uses disclosed specific electroplate liquid when electroplating, it is remarkably improved the quality of metalized blind vias and plated-through hole, metalized blind vias are without cavity, fracture, the defect such as filling perforation is bad, and the thickness of the hole wall layers of copper of plated-through hole more than 25 μm and the electro-coppering of multilayer internal layer plate surface thickness between 35 45 μm, fully meet the requirement of client and the making of rear operation circuit.
Description
Technical field
The present invention relates to board production technical field, more particularly to a kind of rivet hole position on PCB core plate and its
Preparation method.
Background technology
PCB is the supporter of electronic component, and the carrier of electrical connection is one of important component of electronics industry, application
It is small to electronic watch, calculator in almost every kind of electronic equipment, greatly to computer, communication electronic device, military issue weapons system
Deng.
Manufacturing for PCB mainly includes below scheme：Sawing sheet → inner figure → internal layer etching → internal layer AOI detections →
Pressing → drilling → heavy copper → electric plating of whole board → positive/negative film technique makes outer-layer circuit → outer layer AOI detection → silk-screen welding resistances
→ surface treatment → shaping.
In order in flow is pressed, control interlayer alignment precision, and there is asking for skew in reduction pressing back plate interlayer as far as possible
Topic, generally need to bore rivet hole, the side followed closely by riveter during pre- contraposition after internal layer AOI detections and before lamination in the edges of boards of core plate
Formula, each layer core plate and prepreg are riveted together carries out laminates.The preparation method of existing rivet hole is typically：
Rivet hole pattern is made on the edges of boards of core plate in the lump when inner line figure is made on core plate, is etched rivet hole by internal layer
Figure is transformed into rivet hole position, and described rivet hole position includes the copper target mark for being located at center and the base material for being centered around copper target mark periphery
Annulus, the diameter of overall diameter rivet hole of making less than needed for of base material annulus, as depicted in figs. 1 and 2.This rivet hole position without
Hole skew checks position, cannot be checked after OPE punchings, the situation of measured hole skew, it is impossible to which it is abnormal to determine whether there is hole skew, makes
Cannot monitor the manufacturing process of product, it is bad to easily cause many qualities of rear operation, such as layer skew, internal layer short circuit, leak electricity.One
Kind of improved method is, the larger rivet hole position of design size, makes the overall diameter of base material annulus more than rivet bore dia, such as Fig. 3 and
Shown in Fig. 4.This kind of rivet hole position checks position using the substrate regions outside rivet hole as hole skew, although this kind design can monitor riveting
Nail deviation problem, but for multi-layer PCB product high, its core plate overwhelming majority thickness ＜ 0.1mm, thin core plate product substrate regions
Support force it is extremely weak, easily there is holes during riveted before lamination, so as to cause interlayer deviation problem.
The content of the invention
The present invention for it is existing on PCB core plate make rivet hole during, rivet hole position it is non-porous skew inspection set
Meter or by substrate regions as hole skew check position can easily cause the problem of holes, there is provided one kind can inspection hole drift condition,
The rivet hole position of drilling quality, and this kind of preparation method of rivet hole position can be monitored.
To achieve the above object, the present invention uses following technical scheme,
A kind of rivet hole position on PCB core plate, including copper target mark and the base material annulus positioned at copper target mark periphery, it is described
The diameter of the rivet hole that the outer annular diameter of base material annulus makes less than needed for, the periphery of the base material annulus is provided with base material detection circle
Arc, the diameter of the rivet hole with diameter greater than required making of the base material detection circular arc.
Furtherly, in the periphery of the base material annulus, four base material detection circular arcs are along the circumferential direction provided with equal intervals；Or
In the periphery of the base material annulus, two base material detection circular arcs are along the circumferential direction provided with, two base material detects the spacing of circular arc
It is 45 °.
Furtherly, the number of degrees of the base material detection circular arc are 45 °.
Furtherly, the base material detects a diameter of 3.8mm of circular arc.
Furtherly, the outer annular diameter of the base material annulus is 2.4mm.
The preparation method of the above rivet hole position on PCB core plate, comprises the following steps：
S1, inner figure is made on core plate, the inner figure includes inner line figure and rivet hole bit pattern；
S2, to core plate successively be etched treatment and move back film process, internal layer circuit is formed by inner line figure, by rivet
Hole position figure forms rivet hole position.
Specifically, making internal layer circuit and rivet hole position on core plate using negative film technique, the rivet hole position is located at core
The edges of boards of plate.
The negative film technique is：First the pad pasting on core plate, is then exposed treatment, development treatment, etching process successively
With move back film process.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention sets base material by the periphery of base material annulus
Detection circular arc, and base material is detected the diameter of the rivet hole with diameter greater than required making of circular arc, after boring rivet hole, can pass through
The edge for measuring rivet hole determines the size of hole skew with the distance of base material detection circular arc, so as to judge whether that hole offsets
It is abnormal.Four base material detection circular arcs are set at equal intervals in the periphery of base material annulus, serious rivet hole is offset for hole, can be direct
Observation judges, without finely being measured.Additionally, setting the base material that four number of degrees are 45 ° in the periphery of base material annulus detects circle
Arc, it is possible to decrease base material detects influence of the circular arc to rivet hole position support force, it is to avoid holes occur, and base material can be avoided to detect circular arc
It is stripped during drilling with the Copper Foil between base material annulus.
Brief description of the drawings
Fig. 1 is the rivet hole bit architecture schematic diagram that non-apertured skew checks position in the prior art；
Fig. 2 is the schematic diagram (hole skew) drilled in the rivet hole position shown in Fig. 1；
Fig. 3 is to set the rivet hole bit architecture schematic diagram that substrate regions are hole skew inspection position in the prior art；
Fig. 4 is the schematic diagram drilled in the rivet hole position shown in Fig. 3；
Fig. 5 is the structural representation of the rivet hole position of embodiment 1；
Fig. 6 is the schematic diagram drilled in the rivet hole position shown in Fig. 5 (hole does not offset)；
Fig. 7 is the schematic diagram (the first hole drift condition) drilled in the rivet hole position shown in Fig. 5；
Fig. 8 is the schematic diagram (second hole drift condition) drilled in the rivet hole position shown in Fig. 5
Fig. 9 is the structural representation of the rivet hole position of embodiment 2；
Figure 10 is the schematic diagram drilled in the rivet hole position shown in Fig. 9；
Figure 11 is the structural representation for setting base material detection circle week outside base material annulus.
Specific embodiment
In order to more fully understand technology contents of the invention, technical scheme is made with reference to specific embodiment
It is further described and illustrates.
Embodiment 1
Reference picture 5, a kind of rivet hole position 10 on PCB core plate that the present embodiment is provided, including copper target mark 11,
One base material annulus 12 and four base material detection circular arcs 13.Copper target mark 11 is located at the center of rivet hole position 10, a diameter of 1.2mm.
Located at the periphery of copper target mark 11, the annular diameters of base material annulus 12 are 1.2mm to base material annulus 12, outer annular diameter be 2.4mm (
In the manufacture field of PCB, 3.17mm is usually for being laminated the aperture of rivet hole of positioning).In the periphery of base material annulus 12 simultaneously
Four base material detection circular arcs 13 are along the circumferential direction provided with equal intervals, and the diameter of every base material detection circular arc 13 is 3.8mm, and base
The number of degrees of material detection circular arc 13 are 45 °.Therefore, the spacing of adjacent two base materials detection circular arc 13 is 45 °.Preferably, by base material
Detect that the line width of circular arc 13 is set to 0.1mm.I.e. the outer annular diameter of base material annulus 12 is less than the diameter of the required rivet hole for making, base
The diameter of the rivet hole with diameter greater than required making of material detection circular arc 13.
The rivet hole position of the present embodiment is made by following steps：
(1) the PCB production processes according to prior art, carry out sawing sheet and obtain core plate, then using negative film to circuit board raw material
Technique makes internal layer circuit and rivet hole position 10 on core plate.Specially：
Internal layer pre-treatment first is carried out to core plate, to remove the oxide of plate face, cleaning and roughening plate face.Flow is：Oil removing
→ washing → microetch → washing → pickling → washing → dry plate.
Then the patch dry film on core plate, and be exposed successively and develop, make to form inner line figure on core plate, and
Rivet hole bit pattern is formed in the edges of boards of core plate.Wherein, inner line figure and rivet hole bit pattern constitute inner figure.
Then treatment is etched to core plate, with the copper not covered by dry film on eating away core plate.Then core plate is moved back
Film process, removes to expose the dry film of polymerization, makes to be exposed by the copper that dry film is protected originally, obtains internal layer circuit and rivet hole position
10.Will inner line figure be changed into internal layer circuit, rivet hole bit pattern is changed into rivet hole position 10, obtain inner plating.
Then AOI detections are carried out to inner plating, defective PCB is detected, to improve the quality of PCB.And can be taken according to testing result
Adequate measures improve production procedure.
(2) according to rivet hole position 10, rivet hole is bored on inner plating with OPE perforating press or/and CCD target-shooting machines, such as Fig. 6 institutes
Show.It is pre-determined bit before lamination during rivet hole is pressed for next process to bore.
After boring rivet hole on inner plating, the drilling situation of rivet hole is visually observed first, whether rivet hole has serious inclined
From situation, as shown in Figure 7 and Figure 8, i.e., the base material on the bore edges on the symmetrical both sides of rivet hole and symmetrical both sides detect circular arc away from
From whether significantly different.If both are apart from significantly different, then it represents that rivet hole has serious hole skew.If Non Apparent Abnormality,
Then need to determine the concrete numerical value that hole offsets by measuring rivet bore edges with the distance of base material detection circular arc.If deviant ＞
0.075mm, then it is assumed that there is hole skew abnormal.
(3) in actual production, operation after will being transferred entrance through inner plating qualified obtained in step 1 and 2, successively
For：Pressing → drilling → heavy copper → electric plating of whole board → positive/negative film technique makes outer-layer circuit → outer layer AOI detection → silk-screens resistance
Weldering → surface treatment → shaping, thus completes the production of PCB.
Repeat to make 1000 pieces of PCB by the method for the present embodiment, sheet metal thickness is 0.05mm, bored at rivet hole position 10
During rivet hole, the Copper Foil between base material detection circular arc 13 and base material annulus 12 is still remained intact after piercing, is peeled off without Copper Foil existing
As not occurring the situation of holes during lamination riveter nail.
Embodiment 2
Reference picture 9, a kind of rivet hole position 20 on PCB core plate that this implementation is provided, including a copper target mark 21,
Individual base material annulus 22 and two base material detection circular arcs 23.Copper target mark 21 is located at the center of rivet hole position 20, a diameter of 1.2mm.Base
Located at the periphery of copper target mark 21, the annular diameters of base material annulus 22 are 1.2mm to material annulus 22, and outer annular diameter is 2.4mm (in PCB
Manufacture field in, the aperture of rivet hole for being laminated positioning is usually 3.17mm).In the periphery of base material annulus 22 and along circle
Circumferential direction is provided with two base material detection circular arcs 23, and the diameter of every base material detection circular arc 23 is 3.8mm, and base material detection circular arc
23 number of degrees are 45 °.The spacing of two base material detection circular arcs 23 is 45 °.Preferably, the line width of base material detection circular arc 23 is set to
0.1mm.I.e. the outer annular diameter of base material annulus 22 is less than the diameter of the required rivet hole for making, and the diameter of base material detection circular arc 23 is big
In the diameter of the rivet hole of required making.
The making step of the rivet hole position 20 of the present embodiment is identical with the preparation method of the rivet hole position of embodiment 1.Foundation
Rivet hole position 20, bores rivet hole, as shown in Figure 10 with OPE perforating press or/and CCD target-shooting machines on inner plating.Rivet hole is used for
Next process is the lamination positioning in pressing.Follow-up step is also identical with embodiment 1.
Repeat to make 1000 pieces of PCB by the method for the present embodiment, sheet metal thickness is 0.05mm, bored at rivet hole position 20
During rivet hole, the Copper Foil between base material detection circular arc 23 and base material annulus 22 is still remained intact after piercing, is peeled off without Copper Foil existing
As not occurring the situation of holes during lamination riveter nail.
Comparative example
Reference picture 11, a kind of rivet hole position on PCB core plate that this comparative example is provided, including a copper target mark, one
The individual base material annulus positioned at copper target mark periphery, a base material detection circle 33 for being located at base material annulus periphery.Copper target target is a diameter of
1.2mm；The annular diameters of base material annulus are 1.2mm, and outer annular diameter is 2.4mm；A diameter of 3.8mm of base material detection circle 33, base
The line width of material detection circle is set to 0.1mm.
1000 pieces of PCB of the rivet hole position being provided with described in this comparative example, sheet metal thickness 0.05mm are made, at rivet hole position
Lamination riveted positioning is delivered to after boring rivet hole, the quilt in boring procedure of the copper ring between 3% base material detection circle 33 and base material annulus
Peel off, depart from base material.In riveted position fixing process, there is 5% PCB, the cracking situation of base material at its base material detection circle 33,
Aligning accuracy after product lamination cannot be ensured.
The above only further illustrates technology contents of the invention with embodiment, is easier to understand in order to reader,
But embodiments of the present invention not being represented and being only limitted to this, any technology done according to the present invention extends or recreates, and is sent out by this
Bright protection.
Claims (9)
1. a kind of rivet hole position on PCB core plate, including copper target mark and the base material annulus positioned at copper target mark periphery, the base
The diameter of the rivet hole that the outer annular diameter of material annulus makes less than needed for, it is characterised in that the periphery of the base material annulus is provided with
Base material detects circular arc, the diameter of the rivet hole with diameter greater than required making of the base material detection circular arc.
2. a kind of rivet hole position on PCB core plate according to claim 1, it is characterised in that in the base material annulus
Periphery, four base materials detection circular arcs are along the circumferential direction provided with equal intervals.
3. a kind of rivet hole position on PCB core plate according to claim 1, it is characterised in that in the base material annulus
Periphery, be along the circumferential direction provided with two base materials detection circular arcs, the spacing of this two base materials detection circular arcs is 45 °.
4. a kind of rivet hole position on PCB core plate according to Claims 2 or 3, it is characterised in that the base material detection
The number of degrees of circular arc are 45 °.
5. a kind of rivet hole position on PCB core plate according to claim 1, it is characterised in that the base material detection circle
A diameter of 3.8mm of arc.
6. a kind of rivet hole position on PCB core plate according to claim 5, it is characterised in that the base material annulus
Outer annular diameter is 2.4mm.
7. the preparation method of a kind of rivet hole position as claimed in claim 1 on the PCB core plate, it is characterised in that including with
Lower step：
S1, inner figure is made on core plate, the inner figure includes inner line figure and rivet hole bit pattern；
S2, to core plate successively be etched treatment and move back film process, internal layer circuit is formed by inner line figure, by rivet hole position
Figure forms rivet hole position.
8. the preparation method of the rivet hole position being located at according to claim 7 on PCB core plate, it is characterised in that use negative film
Technique makes internal layer circuit and rivet hole position on core plate, and the rivet hole position is located at the edges of boards of core plate.
9. the preparation method of the rivet hole position being located at according to claim 8 on PCB core plate, it is characterised in that the negative film
Technique is：First the pad pasting on core plate, is then exposed treatment, development treatment, etching process and moves back film process successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410558061.XA CN104363695B (en) | 2014-10-20 | 2014-10-20 | A kind of rivet hole position on PCB core plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410558061.XA CN104363695B (en) | 2014-10-20 | 2014-10-20 | A kind of rivet hole position on PCB core plate and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104363695A CN104363695A (en) | 2015-02-18 |
| CN104363695B true CN104363695B (en) | 2017-06-27 |
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| CN201410558061.XA Expired - Fee Related CN104363695B (en) | 2014-10-20 | 2014-10-20 | A kind of rivet hole position on PCB core plate and preparation method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110099507B (en) * | 2019-05-29 | 2022-04-05 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN115988736B (en) * | 2023-03-17 | 2023-06-02 | 广州添利电子科技有限公司 | Circuit board core board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201750632U (en) * | 2010-08-19 | 2011-02-16 | 竞陆电子(昆山)有限公司 | Each-layer rivet hole positioning structure of multilayer circuit board |
| CN104053300A (en) * | 2014-06-11 | 2014-09-17 | 深圳华麟电路技术有限公司 | Locating hole structure of soft and hard multilayer circuit board and setting method of locating hole |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327609A (en) * | 2003-04-23 | 2004-11-18 | Mitsubishi Electric Corp | Method for aligning pattern film and method for manufacturing printed circuit board |
| JP5794502B2 (en) * | 2012-01-23 | 2015-10-14 | 京セラサーキットソリューションズ株式会社 | Method for manufacturing printed wiring board |
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2014
- 2014-10-20 CN CN201410558061.XA patent/CN104363695B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201750632U (en) * | 2010-08-19 | 2011-02-16 | 竞陆电子(昆山)有限公司 | Each-layer rivet hole positioning structure of multilayer circuit board |
| CN104053300A (en) * | 2014-06-11 | 2014-09-17 | 深圳华麟电路技术有限公司 | Locating hole structure of soft and hard multilayer circuit board and setting method of locating hole |
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| CN104363695A (en) | 2015-02-18 |
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