CN103716999A

CN103716999A - Printed circuit board and processing method for the same

Info

Publication number: CN103716999A
Application number: CN201210379405.1A
Authority: CN
Inventors: 谢占昊; 彭勤卫; 孔令文
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2012-09-29
Filing date: 2012-09-29
Publication date: 2014-04-09

Abstract

This invention discloses a printed circuit board and a processing method for the same. The embodiment of the invention forms an inductive winding through a circuit graph and is conducive to the improvement of the mechanization and automation rate of inductor processing in the printed circuit board, the reduction of the scrap rate of products and the promotion of miniaturization and integration of the printed circuit board.

Description

Printed circuit board (PCB) processing method and printed circuit board (PCB)

Technical field

The present invention relates to printed circuit board (PCB) processing and manufacturing technical field, be specifically related to printed circuit board (PCB) processing method and printed circuit board (PCB).

Background technology

Current, the coil-winding of printed circuit board (PCB) (PCB, Printed Circuit Board) neutral body inductance is all to complete by manual operation conventionally, because the demand of wire-wound inductor coil is huge, thereby need a large amount of manpowers to carry out manual this work that completes, relative enterprise, investment in human resources is huge.And the scrappage of manual operation coil-winding is higher and efficiency is lower, and is unfavorable for that the miniaturization of PCB is integrated.

Summary of the invention

The embodiment of the present invention provides printed circuit board (PCB) processing method and printed circuit board (PCB), to improving the automatic and mechanical rate of PCB neutral body inductance processing, reduces the scrappage of product, and promotes that the miniaturization of PCB is integrated.

First aspect present invention provides a kind of printed circuit board (PCB) processing method, can comprise:

On the first sheet material collection, process the cannelure that holds inductance core, wherein, described cannelure at least comprises blind slot part, and the first sheet material collection comprises at least one sheet material; Inductance core is arranged in the described cannelure processing on the first sheet material collection; Corresponding plate face or plate face corresponding to described cannelure opening of opening in the above blind slot part of this first sheet material collection arranges insulating barrier, to form the cavity that holds described inductance core, between wherein said inductance core and the body wall of described cavity, has space; On described insulating barrier, conductive layer is set; In the ring of the described cannelure on the first sheet material collection and outside ring, process several blind holes and/or the through hole that is provided with conductive materials, and process line pattern on described conductive layer, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around described inductance core.

Optionally, described cannelure also comprises groove part.

Optionally, the described cannelure that holds inductance core that processes on the first sheet material collection is specially: the region processing that needs to process the cannelure that holds inductance core on the first sheet material collection goes out several through holes; On the first sheet material collection, process the cannelure that the groove depth of holding inductance core is less than the first sheet material collection, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure;

Or, the described cannelure that holds inductance core that processes on the first sheet material collection is specially: on the first sheet material collection, process the annular blind slot of holding inductance core, and process several through holes in this annular blind slot processing, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure.

Optionally, the described cannelure that holds inductance core that processes on the first sheet material collection is specially: on the first sheet material collection, process the annular blind slot of holding inductance core.

Optionally, described inductance core and the sidewall of described cannelure are, have space between the bottom surface of described cannelure and/or described insulating barrier.

Optionally, described the first sheet material collection comprises at least one central layer.

Second aspect present invention provides a kind of printed circuit board (PCB), comprising:

The first sheet material collection and inductance core;

Wherein, on the first sheet material collection, be processed with the cannelure that holds inductance core, wherein, described cannelure at least comprises blind slot part, and the first sheet material collection comprises at least one sheet material; Described inductance core is arranged in the described cannelure processing on the first sheet material collection; On plate face corresponding to the opening of the above blind slot of the first sheet material collection part or on plate face corresponding to described cannelure opening, be also provided with insulating barrier, formed the cavity that holds described inductance core, wherein, between described inductance core and the body wall of described cavity, there is space; On described insulating barrier, be also provided with on conductive layer; In the ring of the described cannelure on the first sheet material collection and outside ring, be also processed with several blind holes and/or the through hole that is provided with conductive materials, and, on described conductive layer, be also processed with line pattern, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around described inductance core.

Third aspect present invention provides a kind of printed circuit board (PCB) processing method, comprising:

On the first sheet material collection, process N the groove that holds respectively N inductance core, wherein, the first sheet material collection region that the non-closed hoop of described N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with described N groove surrounds, a described N groove comprises blind slot and/or groove, described N is positive integer, and described the first sheet material collection comprises at least one sheet material; N inductance core is arranged at respectively in described N the groove processing on the first sheet material collection; At plate face corresponding to first the above channel opening of sheet material collection, insulating barrier is set, to form the cavity that holds respectively a described N inductance core, at least one inductance core in a wherein said N inductance core, and hold between the body wall of cavity of this inductance core and there is space; On described insulating barrier, conductive layer is set; In the ring of first the above N of sheet material collection formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole; And process line pattern on described conductive layer, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around a described N inductance core.

Optionally, at least one inductance core in a described N inductance core, and hold between sidewall, bottom surface and/or the end face of the cavity of this inductance core and there is space.

Fourth aspect present invention provides a kind of printed circuit board (PCB), comprising:

The first sheet material collection and N inductance core;

Wherein, on the first sheet material collection, be provided with N the groove that holds respectively a described N inductance core, the first sheet material collection region that the non-closed hoop of described N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with described N groove surrounds, described N is positive integer; At plate face corresponding to first the above channel opening of sheet material collection, be also provided with insulating barrier, to form the cavity that holds respectively a described N inductance core, wherein, at least one inductance core in a described N inductance core, and hold between the body wall of cavity of this inductance core and there is space; On described insulating barrier, be also provided with conductive layer; In the ring of first the above N of sheet material collection formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole; And on described conductive layer, be also processed with line pattern, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around a described N inductance core.

Therefore, in a kind of PCB processing scheme providing in the embodiment of the present invention, on the first sheet material collection, process the cannelure that holds inductance core and at least comprise blind slot part; Inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection; On at least one plate face of the first sheet material collection, conductive layer is set; In the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside ring, process several blind holes and/or through hole; On this conductive layer, process line pattern, and conductive materials is set in these several blind holes that process and/or through hole to form on space the inductor winding around above-mentioned inductance core.Owing to being by conductive materials being set to form on space the inductor winding around above-mentioned inductance core in several blind holes processing and/or through hole, this is just without coiling manually, and can realize by plant equipment, the automatic and mechanical rate that is conducive to improve the processing of PCB neutral body inductance, is also conducive to reduce product rejection rate, and due to this structure can by inductance core hidden put with PCB within, can effectively utilize space in plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction, and, because the cannelure that holds inductance core processing at least comprises blind slot part, the first sheet material collection region that this surrounds cannelure, can surround the first sheet material collection joint area outside the first sheet material collection region with cannelure, the first sheet material collection region that cannelure surrounds is retained, so just can avoid filling the operation of cannelure institute enclosing region after inductance core is arranged to cannelure, can in the ring of cannelure and outside ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency, and, due at inductance core and hold between body wall sidewall, bottom surface and/or the end face of the cavity of inductance core (as hold) of the cavity of this inductance core and there is space, therefore, when PCB is squeezed, the situation that inductance core is extruded can obtain buffering and alleviate, and practice finds to make like this inductance performance to become relatively stable reliable, and then the electric property of inductance is greatly improved.

Accompanying drawing explanation

In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the schematic flow sheet of a kind of printed circuit board (PCB) processing method of providing of the embodiment of the present invention;

Fig. 2-a is the shape schematic diagram of a kind of annular groove of providing of the embodiment of the present invention;

Fig. 2-b is the shape schematic diagram of a kind of oval ring groove of providing of the embodiment of the present invention;

Fig. 2-c is the shape schematic diagram of a kind of irregular cannelure of providing of the embodiment of the present invention;

Fig. 2-d is the shape schematic diagram of a kind of square cannelure of providing of the embodiment of the present invention;

Fig. 2-e is the shape schematic diagram of a kind of triangular ring groove of providing of the embodiment of the present invention;

Fig. 2-f is the shape schematic diagram of a kind of polygon cannelure of providing of the embodiment of the present invention;

Fig. 2-g is the shape schematic diagram of the irregular cannelure of another kind that provides of the embodiment of the present invention;

Fig. 3-a is the schematic diagram that a kind of region processing that needs to process the cannelure that holds inductance core on the first sheet material collection A100 that the embodiment of the present invention provides goes out several through holes A1;

Fig. 3-b is a kind of schematic top plan view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core that the embodiment of the present invention provides;

Fig. 3-c is a kind of cross-sectional schematic that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core that the embodiment of the present invention provides;

Fig. 3-d is a kind of schematic diagram that inductance core A3 is set in the cannelure A2 that holds inductance core processing that the embodiment of the present invention provides;

Fig. 3-e is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two plate faces of the first sheet material collection A100 that the embodiment of the present invention provides;

Fig. 3-f is a kind of schematic diagram of machining hole in annular grooved ring and outside ring that the embodiment of the present invention provides;

Fig. 3-g is the schematic diagram of the another kind that provides of embodiment of the present invention machining hole in the ring of cannelure A2 and outside ring;

Fig. 3-h is another schematic diagram of machining hole in the ring of cannelure A2 and outside ring that the embodiment of the present invention provides;

Fig. 3-i is a kind of schematic top plan view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core that the embodiment of the present invention provides;

Fig. 3-j is a kind of cross-sectional schematic that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core that the embodiment of the present invention provides;

Fig. 3-k is a kind of schematic top plan view that inductance core A3 is set in the annular blind slot A7 that holds inductance core processing that the embodiment of the present invention provides;

Fig. 3-1st, a kind of cross-sectional schematic that inductance core A3 is set in the annular blind slot A7 that holds inductance core processing that the embodiment of the present invention provides;

Fig. 3-m is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two plate faces of the first sheet material collection A100 that the embodiment of the present invention provides;

Fig. 3-n is a kind of schematic diagram of machining hole in the ring of annular blind slot A7 and outside ring that the embodiment of the present invention provides;

Fig. 3-o is the schematic diagram of the another kind that provides of embodiment of the present invention machining hole in the ring of annular blind slot A7 and outside ring;

Fig. 3-p is another schematic diagram of machining hole in the ring of annular blind slot A7 and outside ring that the embodiment of the present invention provides;

Fig. 3-q is that the another kind that the embodiment of the present invention provides arranges the schematic diagram of inductance core A3 in the cannelure A2 that holds inductance core processing;

Fig. 3-r be the embodiment of the present invention provide another the schematic diagram of inductance core A3 is set in the cannelure A2 that holds inductance core processing;

Fig. 3-s is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two the plate faces of the first sheet material collection A100 as shown in Fig. 3-q that the embodiment of the present invention provides;

Fig. 3-t is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two the plate faces of the first sheet material collection A100 as shown in Fig. 3-r that the embodiment of the present invention provides;

Fig. 3-u is that the another kind that the embodiment of the present invention provides arranges the cross-sectional schematic of inductance core A3 in the annular blind slot A7 that holds inductance core processing;

Fig. 3-v be the embodiment of the present invention provide another the cross-sectional schematic of inductance core A3 is set in the annular blind slot A7 that holds inductance core processing;

Fig. 3-w is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two the plate faces of the first sheet material collection A100 as shown in Fig. 3-u that the embodiment of the present invention provides;

Fig. 3-x is a kind of schematic diagram that conductive layer A200 and conductive layer A300 are set on two the plate faces of the first sheet material collection A100 as shown in Fig. 3-v that the embodiment of the present invention provides;

Fig. 4 is the schematic flow sheet of the another kind of printed circuit board (PCB) processing method that provides of the embodiment of the present invention;

Fig. 5-a is the schematic diagram of the non-closed circle ring that forms of a kind of 2 grooves that the embodiment of the present invention provides;

Fig. 5-b is the schematic diagram of the non-closed circle ring that forms of a kind of 1 groove that the embodiment of the present invention provides;

Fig. 5-c is the schematic diagram of the non-closed vesica piscis that forms of a kind of 2 grooves that the embodiment of the present invention provides;

Fig. 5-d is the schematic diagram of the non-closed polygon ring that forms of a kind of 4 grooves that the embodiment of the present invention provides;

Fig. 5-e is the schematic diagram of the non-closed triangle ring that forms of a kind of 2 grooves that the embodiment of the present invention provides;

Fig. 5-f is the schematic diagram of the irregular ring of non-closure that forms of a kind of 2 grooves that the embodiment of the present invention provides;

Fig. 5-g is the schematic diagram of the irregular ring of non-closure that forms of 2 grooves of the another kind that provides of the embodiment of the present invention;

Fig. 5-h is the schematic diagram of the irregular ring of non-closure that forms of a kind of 4 grooves that the embodiment of the present invention provides;

Fig. 6-a is the structural representation that the plate face vertical direction of a kind of printed circuit board (PCB) of providing of the embodiment of the present invention is carried out section;

Fig. 6-b is the structural representation that the plate face parallel direction of a kind of printed circuit board (PCB) of providing of the embodiment of the present invention is carried out section;

Fig. 6-c is the structural representation that the plate face vertical direction of the another kind of printed circuit board (PCB) that provides of the embodiment of the present invention is carried out section;

Fig. 6-d is the structural representation that the plate face vertical direction of another printed circuit board (PCB) of providing of the embodiment of the present invention is carried out section.

Embodiment

The embodiment of the present invention provides printed circuit board (PCB) processing method and printed circuit board (PCB), to improving mechanization and the percent of automatization of the processing of PCB neutral body inductance, reduces the scrappage of product, promotes that the miniaturization of PCB is integrated.

Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.

Term " first " in specification of the present invention and claims and above-mentioned accompanying drawing, " second ", " the 3rd " " 4th " etc. (if existence) are for distinguishing similar object, and needn't be for describing specific order or precedence.The data that should be appreciated that such use suitably can exchanged in situation, so as embodiments of the invention described herein for example can with except diagram here or describe those order enforcement.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, for example, those steps or unit that the process that has comprised series of steps or unit, method, system, product or equipment are not necessarily limited to clearly list, but can comprise clearly do not list or for these processes, method, product or equipment intrinsic other step or unit.

An embodiment of PCB processing method of the present invention, can comprise: on the first sheet material collection, process the cannelure that holds inductance core, wherein, this cannelure at least comprises blind slot part, and the first sheet material collection comprises at least one sheet material; Inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection; On the first sheet material collection, corresponding plate face or the plate face corresponding to cannelure opening of opening of above-mentioned blind slot part arranges insulating barrier, to form the cavity (closed cavity or non-closed cavity) that holds inductance core, wherein between this inductance core and the body wall of this cavity, there is space; On this insulating barrier, conductive layer is set; In the ring of the above-mentioned cannelure on the first sheet material collection and outside ring, process several blind holes and/or the through hole that is provided with conductive materials, and process line pattern on above-mentioned conductive layer, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around above-mentioned inductance core.

Referring to Fig. 1, Fig. 1 is the schematic flow sheet of a kind of PCB processing method provided by the invention, and a kind of PCB processing that the embodiment of the present invention provides can comprise following content:

101, on the first sheet material collection, process the cannelure that holds inductance core;

Wherein, the first sheet material collection comprises at least one sheet material, processes the cannelure that holds inductance core and at least comprise blind slot part on the first sheet material collection.

In some embodiments of the invention, on the first sheet material collection, processing the cannelure that holds inductance core can be annular blind slot (only including blind slot part), or on the first sheet material collection, process the cannelure that holds inductance core and both comprised groove part, also comprise blind slot part, so that the first sheet material collection region that cannelure surrounds, the first sheet material collection joint area outside the first sheet material collection region surrounding with cannelure.Wherein, if certain groove processing only includes blind slot part, this groove can be referred to as blind slot, if certain groove processing comprises groove part (may only include groove part, or both comprise that blind slot part also comprised groove part), this groove can be referred to as groove.

Be appreciated that the shape that processes the above-mentioned cannelure that holds inductance core on the first sheet material collection can be circular rings, vesica piscis, Q-RING, triangle ring, irregular annular or can mate with inductance core other comprise the annular of closed figure.The given an example cannelure of several shapes of Fig. 2-a ~ Fig. 2-e, the shape of cannelure also can be changed to the annular that other comprises closed figure in actual applications certainly.Wherein, Fig. 2-a shows the shape of a kind of annular groove A21 for example; Fig. 2-b shows the shape of a kind of oval ring groove A22 for example; Fig. 2-d shows the shape of a kind of square cannelure A24 for example; Fig. 2-e shows the shape of a kind of triangular ring groove A25 for example; Fig. 2-f shows the shape of a kind of polygon cannelure A26 for example; Fig. 2-g and Fig. 2-c show the shape of two kinds of irregular cannelure A23 and A27 for example.Be not limited in actual applications the cannelure of shape that above-mentioned Fig. 2-a ~ Fig. 2-e gives an example.

In some embodiments of the invention, the first sheet material collection during processing cannelure for example can comprise at least a slice of following at least one type sheet material: base material, central layer and single-side coated copper plate, wherein, if the first sheet material collection comprises multi-disc base material, central layer and/or single-side coated copper plate, on the internal layer base material of the first sheet material collection, core material and/or internal layer single-side coated copper plate, can be processed with line pattern, between each layer of base material of the first sheet material collection and/or central layer and/or single-side coated copper plate, can bond together by adhesive (as prepreg etc.).Process the cannelure that holds inductance core on the first sheet material collection before or after, if desired, also can at least one sheet surface layer face of the first sheet material collection, process line pattern.

In some embodiments of the invention, on the first sheet material collection, processing the cannelure that holds inductance core can specifically comprise: the region processing that needs to process the cannelure that holds inductance core on the first sheet material collection goes out several through holes; Then on the first sheet material collection, process the cannelure that the groove depth of holding inductance core is less than the first sheet material collection thickness, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure.One of object of processing these through holes is, avoids the cannelure that following process goes out may become closed space, and the cannelure that following process goes out can shed gas, heat and/or stress etc. by these through holes.

In other embodiment of the present invention, on the first sheet material collection, processing the cannelure that holds inductance core can be specially: on the first sheet material collection, process the annular blind slot of holding inductance core, and process several through holes in this annular blind slot, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure.Wherein, one of object of processing these through holes is, avoids the cannelure processing may become closed space, and the cannelure processing can shed gas, heat and/or stress etc. by these through holes.

In other embodiment of the present invention, on the first sheet material collection, processing the cannelure that holds inductance core can be specially: on the first sheet material collection, process the annular blind slot of holding inductance core.Wherein, for example can, by the dark milling mode of control or alternate manner, on the first sheet material collection, process the annular blind slot of holding inductance core.

102, inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection.

103, on the first sheet material collection, corresponding plate face or the plate face corresponding to above-mentioned cannelure opening of opening of above-mentioned blind slot part arranges insulating barrier, holds the cavity (closed cavity or non-closed cavity) of this inductance core to form;

Wherein, inductance core and hold between the body wall of cavity of this inductance core and there is space, for example the sidewall of inductance core and cannelure is, have space between the bottom surface of cannelure and/or insulating barrier.

104, on the above-mentioned insulating barrier of the first sheet material collection, conductive layer is set.

Wherein, because blind slot only has an end opening, the therefore plate face corresponding to opening of above-mentioned blind slot part on the first sheet material collection, refers to one of them plate face of the first sheet material collection; And groove both ends open, if therefore above-mentioned cannelure had both comprised that blind slot part also comprised groove part, plate face corresponding to above-mentioned cannelure opening on the first sheet material collection, just refer to two plate faces on the first sheet material collection, if above-mentioned cannelure comprises blind slot part but does not comprise groove part, plate face corresponding to above-mentioned cannelure opening on the first sheet material collection, also refers to one of them the plate face on the first sheet material collection.

That is to say, the plate face that above-mentioned cannelure opening is corresponding on the first sheet material collection arranges insulating barrier, may be that a wherein plate face at the first sheet material collection arranges insulating barrier, also be likely that two plate faces at the first sheet material collection arrange respectively insulating barrier, wherein, the number of plies of the insulating barrier of above-mentioned setting can be one or more layers, and insulating barrier can comprise prepreg etc.Wherein, the mode that insulating barrier and conductive layer are set on the first sheet material collection plate face can be diversified, for example, after in the above-mentioned cannelure that can process on inductance core being arranged to the first sheet material collection, at least a slice central layer or single-side coated copper plate (central layer two sides has conductive layer) bond at least one plate face of the first sheet material collection by adhesive (this adhesive also can be regarded a layer insulating as), or also can on the first sheet material collection, arrange after insulating barrier by corresponding plate face or the plate face corresponding to above-mentioned cannelure opening of opening of above-mentioned blind slot part, by plating or chemical plating or alternate manner, on the insulating barrier arranging, form conductive layer.

105, in the ring of the above-mentioned cannelure on the first sheet material collection and outside ring, process several blind holes and/or the through hole that is provided with conductive materials.

106, on above-mentioned conductive layer, process line pattern, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around above-mentioned inductance core.

Be understandable that, between step 104 and step 105, there is no inevitable sequencing, step 105 and processing on above-mentioned conductive layer does not have inevitable yet between the step of line pattern, as long as can make the conductive materials that arranges in above-mentioned several blind holes and/or through hole and the line pattern on the first sheet material collection form on space the inductor winding around above-mentioned inductance core, wherein, on the first sheet material collection, form line pattern that inductor winding uses and may comprise on above-mentioned conductive layer and process line pattern, also may also comprise the inner line figure of the first sheet material collection.For example, can first perform step 105, then perform step 104, perform step again 106 afterwards; Or can first perform step 104, and then perform step 105, perform step again 106 afterwards; Or can first perform step 104, then carry out the step that processes line pattern on above-mentioned conductive layer, perform step again 105 afterwards, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around above-mentioned inductance core; Or, also can first on the first sheet material collection, process several blind holes and/or through hole, then the mode by plating or chemical plating arranges conductive layer on the above-mentioned insulating barrier of the first sheet material collection, and when being set, conductive layer can form conductive materials in processing several blind holes and/or through hole above-mentioned, on above-mentioned conductive layer, process line pattern afterwards, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around above-mentioned inductance core.

In some embodiments of the invention, can in several blind holes that process and/or through hole, conductive materials be set in several ways, for example, can carry out metalized and/or clog conducting medium in several blind holes that process and/or through hole the hole wall of several blind holes that process and/or through hole.Wherein, one of object that conductive materials is set in hole is to make this hole have conductive capability.

For ease of better understanding and implement the such scheme of the embodiment of the present invention, shown in accompanying drawing 3-a ~ Fig. 3-k, be introduced for example.Wherein, accompanying drawing 3-a～Fig. 3-k shows the process of processing inductor winding on the first sheet material collection A100 for example.

Referring to Fig. 3-a, Fig. 3-a is illustrated in and on the first sheet material collection A100, needs to process the region processing of the cannelure that holds inductance core and go out several through holes A1, now two of the first sheet material collection A100 or one of them sheet surface layer face can have conductive layer, certainly also can not have conductive layer.Fig. 3-b and Fig. 3-c are illustrated on the first sheet material collection A100 and process the cannelure A2 that holds inductance core, Fig. 3-b is the vertical view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core, and Fig. 3-c is the cutaway view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core; Wherein, the aperture that Fig. 3-c illustrates through hole A1 is less than the groove width of cannelure A2, one of object of processing these through holes A1 is to avoid cannelure A2 may become closed space, cannelure A2 can shed gas, heat, stress etc. by these through holes, wherein, for example can, by the dark milling mode of control or alternate manner, on the first sheet material collection A100, process the cannelure A2 that holds inductance core.Fig. 3-d is illustrated in the cannelure A2 that holds inductance core processing inductance core A3 is set, wherein Fig. 3-d illustrates the height of inductance core A3 a little less than the height of cannelure A2, certainly, in practical application, the height of inductance core A3 also can equal the height of cannelure A2.The cross-sectional width that Fig. 3-q illustrates inductance core A3 is slightly less than the cross-sectional width of cannelure A2, make to there is space between inductance core A3 and the sidewall of cannelure A2, the cross-sectional width that Fig. 3-r illustrates inductance core A3 is slightly less than the cross-sectional width of cannelure A2, and the height of inductance core A3 is a little less than the height of cannelure A2.Fig. 3-e is illustrated on two plate faces of the first sheet material collection A100 conductive layer A200 and conductive layer A300 is set, wherein, Fig. 3-e illustrates and by adhesive A 402, insulating barrier A401 is bonded to a plate face of the first sheet material collection A100, conductive layer A200 is arranged on insulating barrier A401, adhesive A 403 bonds to insulating barrier A404 in another plate face of the first sheet material collection A100, conductive layer A300 is arranged on insulating barrier A401, wherein, adhesive A 402 and adhesive A 403 can be regarded respectively a layer insulating as, certainly insulating barrier A401 also can omit, in Fig. 3-e, between inductance core A3 and adhesive A 402, there is space, can find out, structure shown in Fig. 3-e is to process and obtain on the basis of structure shown in Fig. 3-d, structure shown in Fig. 3-s is to process and obtain in a similar way on the basis of structure shown in Fig. 3-q, structure shown in Fig. 3-t is to process and obtain in a similar way on the basis of structure shown in Fig. 3-q.

In accompanying drawing 3-f～Fig. 3-g, shown in main Fig. 3-e, on the basis of structure, be processed as example below and describe, other scene can be by that analogy.Fig. 3-f～Fig. 3-h shows several different modes of machining hole in the ring of cannelure A2 and outside ring, wherein, Fig. 3-f shows a plurality of through hole A5 of processing in the ring of cannelure A2 and outside ring, follow-uply in this several through hole A5, conductive materials is set, this conductive materials contacts with conductive layer A300 with conductive layer A200 respectively, makes to arrange in through hole A5 the line pattern processing on conductive materials and conductive layer A200 and conductive layer A300 and forms on space the inductor winding around inductance core A3; Fig. 3-g is illustrated in the ring of cannelure A2 and a plurality of blind hole A6 of the outer processing of ring, the conductive materials arranging in this several blind hole A6 contacts with conductive layer A200 and inner-layer conducting layer, make the conductive materials arranging in blind hole A6, the line pattern processing with conductive layer A200 and inner line figure form on space the inductor winding around inductance core A3, shown in Fig. 3-g under this scene, owing to there being the inner line figure contacting with the conductive materials arranging in blind hole A6, therefore, bonding adhesive A 403, insulating barrier A404 and conductive layer A300 all can omit.Fig. 3-h is illustrated in the ring of cannelure A2 and ring a plurality of blind hole A6 of outer processing and a plurality of through hole A5, situation shown in Fig. 3-h is the combination of situation shown in Fig. 3-f and Fig. 3-g, wherein, the conductive materials arranging in through hole A5, contact with the line pattern processing on conductive layer A200 and conductive layer A300 respectively, and the conductive materials arranging in blind hole A6, the line pattern and the inner line figure that process with conductive layer A200 respectively contact, and then form on space the inductor winding around inductance core A3.

Referring to Fig. 3-i and Fig. 3-j, Fig. 3-i and Fig. 3-j are illustrated on the first sheet material collection A100 and process the annular blind slot A7 that holds inductance core, Fig. 3-i is the vertical view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core, Fig. 3-j is the cutaway view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core, wherein, for example can be by the dark milling mode of control or alternate manner, on the first sheet material collection, A100 processes the annular blind slot A7 that holds inductance core.Fig. 3-k and Fig. 3-1 are illustrated in the annular blind slot A7 that holds inductance core processing inductance core A3 are set, and wherein, Fig. 3-k for arranging the vertical view of the first sheet material collection A100 after inductance core A3 in annular blind slot A7; Fig. 3-1 for arranging the cutaway view of the first sheet material collection A100 after inductance core A3 in annular blind slot A7, and wherein, Fig. 3-1 illustrates the height of inductance core A3 a little less than the height of annular blind slot A7.The cross-sectional width that Fig. 3-u illustrates inductance core A3 is slightly less than the cross-sectional width of cannelure A2, make to there is space between inductance core A3 and the sidewall of cannelure A2, the cross-sectional width that Fig. 3-v illustrates inductance core A3 is slightly less than the cross-sectional width of cannelure A2, and the height of inductance core A3 is a little less than the height of cannelure A2.Fig. 3-m is illustrated on two plate faces of the first sheet material collection A100 conductive layer A200 and conductive layer A300 is set, wherein, shown in Fig. 3-m, by adhesive A 402, insulating barrier A401 is bonded to a plate face (the plate face that annular blind slot A7 opening is corresponding) of the first sheet material collection A100, conductive layer A200 is arranged on insulating barrier A401, adhesive A 403 bonds to insulating barrier A404 in another plate face of the first sheet material collection A100, conductive layer A300 is arranged on insulating barrier A401, wherein, adhesive A 402 and adhesive A 403 can be regarded respectively a layer insulating as, certainly insulating barrier A401 also can omit, in addition, if another plate face of the first sheet material collection A100 (being that relative plate face of plate face that annular blind slot A7 opening is corresponding) has had conductive layer, also can omit bonding adhesive A 403, insulating barrier A404 and conductive layer A300.Can find out, structure shown in Fig. 3-m is to process and obtain on the basis of structure shown in Fig. 3-1, and structure shown in Fig. 3-w is to process and obtain in a similar way on the basis of structure shown in Fig. 3-u; Structure shown in Fig. 3-x is to process and obtain in a similar way on the basis of structure shown in Fig. 3-v.

In accompanying drawing 3-n ~ Fig. 3-p, shown in main Fig. 3-m, on the basis of structure, be processed as example below and describe, other scene can be by that analogy.Fig. 3-n ~ Fig. 3-p shows several different modes of machining hole in the ring of annular blind slot A7 and outside ring, similar with situation shown in Fig. 3-f～Fig. 3-h, wherein, Fig. 3-n shows a plurality of through hole A5 of processing in the ring of cannelure A2 and outside ring, follow-uply in this several through hole A5, conductive materials is set, this conductive materials contacts with conductive layer A300 with conductive layer A200 respectively, makes to arrange in through hole A5 the line pattern processing on conductive materials and conductive layer A200 and conductive layer A300 and forms on space the inductor winding around inductance core A3; Fig. 3-o is illustrated in the ring of cannelure A2 and a plurality of blind hole A6 of the outer processing of ring, the conductive materials arranging in this several blind hole A6 contacts with conductive layer A200 and inner-layer conducting layer, make the conductive materials arranging in blind hole A6, the line pattern processing with conductive layer A200 and inner line figure form on space the inductor winding around inductance core A3, shown in Fig. 3-o under this scene, owing to there being the inner line figure contacting with the conductive materials arranging in blind hole A6, therefore bonding adhesive A 403, insulating barrier A404 and conductive layer A300 all can omit.Fig. 3-p is illustrated in the ring of cannelure A2 and ring a plurality of blind hole A6 of outer processing and a plurality of through hole A5, situation shown in Fig. 3-p is the combination of situation shown in Fig. 3-n and Fig. 3-o, wherein, the conductive materials arranging in through hole A5, contact with the line pattern processing on conductive layer A200 and conductive layer A300 respectively, and the conductive materials arranging in blind hole A6, the line pattern and the inner line figure that process with conductive layer A200 respectively contact, and then form on space the inductor winding around inductance core A3.

Wherein, shown in Fig. 3-e ~ Fig. 3-h, Fig. 3-m ~ Fig. 3-p, Fig. 3-s, Fig. 3-t, Fig. 3-w, Fig. 3-x in structure, the sidewall of the cavity that holds inductance core A3 forming is the sidewall of cannelure A2, and the bottom surface of this cavity is the bottom surface of cannelure A2, and the end face of this cavity is insulating barrier A402.

Be appreciated that the inductor winding processing mode shown in Fig. 3-a ~ Fig. 3-x, only for for example, can carry out accommodation in actual applications according to actual needs.Fig. 3-a ~ Fig. 3-x processes a cannelure and describes as example to integrate A100 at the first sheet material, certainly also can process a plurality of cannelures to form a plurality of three-dimensional inductance at the first sheet material collection A100.

Therefore, in the present embodiment, on the first sheet material collection, process the cannelure that holds inductance core and at least comprise blind slot part; Inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection; On at least one plate face of the first sheet material collection, conductive layer is set; In the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside ring, process several blind holes and/or through hole; On this conductive layer, process line pattern, and conductive materials is set in these several blind holes that process and/or through hole to form on space the inductor winding around above-mentioned inductance core.Owing to being by conductive materials being set to form on space the inductor winding around above-mentioned inductance core in several blind holes processing and/or through hole, this is just without coiling manually, and can realize by plant equipment, the automatic and mechanical rate that is conducive to improve the processing of PCB neutral body inductance, is also conducive to reduce product rejection rate, and, due to this structure can by inductance core hidden put with PCB within, can effectively utilize space in plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction, and, because the cannelure that holds inductance core processing at least comprises blind slot part, the first sheet material collection region that this surrounds cannelure, can surround the first sheet material collection joint area outside the first sheet material collection region with cannelure, the first sheet material collection region that cannelure surrounds is retained, so just can avoid filling the operation of cannelure institute enclosing region after inductance core is arranged to cannelure, can in the ring of cannelure and outside ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency, and, due to inductance core and hold between body wall sidewall, bottom surface and/or the end face of the cavity of inductance core (as hold) of the cavity of this inductance core and there is space, therefore, when PCB is squeezed, the situation that inductance core is extruded can obtain buffering and alleviate, and practice finds to make like this inductance performance to become relatively stable reliable, and then the electric property of inductance is greatly improved.

The embodiment of the present invention also provides a kind of printed circuit board (PCB), can comprise:

The first sheet material collection and inductance core;

Wherein, on the first sheet material collection, be processed with the cannelure that holds inductance core, wherein, this cannelure at least comprises that blind slot part is (because the cannelure that holds inductance core processing at least comprises blind slot part, the first sheet material collection region that this surrounds cannelure, can surround the first sheet material collection joint area outside the first sheet material collection region with cannelure, the first sheet material collection region that cannelure surrounds is retained, identical with the medium outside ring in annular grooved ring, so just can avoid filling the operation of cannelure institute enclosing region after inductance core is arranged to cannelure), the first sheet material collection comprises at least one sheet material, this inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection,

On the plate face that the opening of above-mentioned blind slot part is corresponding on the first sheet material collection or on plate face corresponding to above-mentioned cannelure opening, be also provided with insulating barrier, the cavity (closed cavity or non-closed cavity) that holds this inductance core to have formed, wherein, inductance core and hold between the body wall of cavity of this inductance core and there is space (for example, the sidewall of inductance core and cannelure is, have space between the bottom surface of cannelure and/or insulating barrier); Wherein, on this insulating barrier, be also provided with on conductive layer; In the ring of the above-mentioned cannelure on the first sheet material collection and outside ring, be also processed with several blind holes and/or the through hole that is provided with conductive materials, and on above-mentioned conductive layer, be also processed with line pattern, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around above-mentioned inductance core.

In some embodiments of the invention, the first sheet material collection can comprise at least one central layer.

Be understandable that, the printed circuit board (PCB) in the present embodiment can make based on said method embodiment institute exemplary method, and its specific implementation process can, with reference to the associated description of said method embodiment, repeat no more herein.

An embodiment of PCB processing method of the present invention, can comprise: on the first sheet material collection, process N the groove that holds respectively N inductance core, wherein, the first sheet material collection region that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with this N groove surrounds, this N groove comprises blind slot and/or groove, and this N is positive integer, and the first sheet material collection comprises at least one sheet material; N inductance core is arranged at respectively in above-mentioned N the groove processing on the first sheet material collection; The plate face that above-mentioned channel opening is corresponding on the first sheet material collection arranges insulating barrier, to form the cavity (closed cavity or non-closed cavity) that holds respectively N inductance core, wherein, at least one inductance core in N inductance core, and hold between the body wall of cavity of this inductance core and there is space; On this insulating barrier, conductive layer is set; On the first sheet material collection, in the ring of above-mentioned N the formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole; And process line pattern on above-mentioned conductive layer, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around an above-mentioned N inductance core.

Referring to Fig. 4, Fig. 4 is the schematic flow sheet of another kind of PCB processing method provided by the invention, and the another kind of PCB processing that the embodiment of the present invention provides can comprise following content:

401, on the first sheet material collection, process N the groove that holds respectively N inductance core, wherein, the first sheet material collection region that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with this N groove surrounds, this N groove comprises blind slot and/or groove, this N is positive integer, and the first sheet material collection comprises at least one sheet material.

In some embodiments of the invention, on the first sheet material collection, processing N the groove that holds N inductance core can be all blind slot, or on the first sheet material collection, processing N the groove that holds N inductance core can be all groove, or, on the first sheet material collection, process N the groove that holds N inductance core and can both comprise that groove also comprised blind slot, and the groove processing can only include groove part, or the groove processing had both comprised that groove part also comprised blind slot part, so that the first sheet material collection region that cannelure surrounds, the first sheet material collection joint area outside the first sheet material collection region surrounding with cannelure.Wherein, if certain groove processing only includes blind slot part, this groove can be referred to as blind slot; And if certain groove processing comprises groove part (this groove may only include groove part, or also may both comprise that blind slot part also comprised groove part), this groove can be referred to as groove.

Be understandable that, the shape of above-mentioned N the formed non-closed hoop of groove can be the circular rings of non-closure, the irregular annular of the vesica piscis of non-closure, the Q-RING of non-closure, the triangle ring of non-closure, non-closure or can mate with inductance core other comprise the non-closed annular of non-closed figure.Fig. 5-a ~ Fig. 5-e non-closed hoop that several N grooves form of having given an example, also can be changed to other non-closed ring certainly in actual applications.Wherein, Fig. 5-a shows the non-closed circle ring A51 that a kind of 2 grooves form for example; Fig. 5-b shows the non-closed circle ring A52 that a kind of 1 groove forms for example; Fig. 5-b shows the non-closed circle ring A52 that a kind of 1 groove forms for example; Fig. 5-c shows the non-closed vesica piscis A53 that a kind of 2 grooves form for example; Fig. 5-d shows the non-closed polygon ring A54 that a kind of 4 grooves form for example; Fig. 5-e shows the non-closed triangle ring A55 that a kind of 2 grooves form for example; Fig. 5-f and Fig. 5-g show non-closure irregular ring A56 and the A57 that two kinds of 2 grooves form for example; Fig. 5-h shows the irregular ring of the non-closure A58 that a kind of 4 grooves form for example.

In some embodiments of the invention, on the first sheet material collection, processing N the groove that holds N inductance core can specifically comprise: the region processing that needs to process N the groove that holds N inductance core on the first sheet material collection goes out several through holes; Then on the first sheet material collection, process N the groove that the groove depth of holding N inductance core is less than the first sheet material collection thickness, wherein, the aperture of these several through holes is for example less than or equal to the groove width of N groove.Wherein, one of object of processing these through holes is, N groove avoiding following process to go out is possible becomes closed space, and the N that following process a goes out groove can shed gas, heat, stress etc. by these through holes.

In other embodiment of the present invention, on the first sheet material collection, processing N N groove that holds inductance core can be specially: on the first sheet material collection, process N blind slot holding N inductance core, and process several through holes in the part or all of blind slot in this N blind slot, wherein, the aperture of these several through holes is less than or equal to the groove width of N groove.One of object of processing these through holes is, avoids N the groove processing may become closed space, and the N a processing groove can shed gas, heat, stress etc. by these through holes.

In other embodiment of the present invention, N the groove that processes N inductance core on the first sheet material collection can be specially: on the first sheet material collection, process N blind slot holding N inductance core, wherein, for example can, by the dark milling mode of control or alternate manner, on the first sheet material collection, process N blind slot holding N inductance core.

402, N inductance core is arranged at respectively in above-mentioned N the groove processing on the first sheet material collection.

403, the plate face that above-mentioned channel opening is corresponding on the first sheet material collection arranges insulating barrier, holds the cavity (closed cavity or non-closed cavity) of this inductance core to form.

Wherein, at least one inductance core in N inductance core, and hold between the body wall of cavity of this inductance core and there is space.At least 1 inductance core in N inductance core for example, and hold between sidewall, bottom surface and/or the end face of the cavity of this inductance core and there is space.

404, on above-mentioned insulating barrier, conductive layer is set.

In some embodiments of the invention, can on two plate faces of the first sheet material collection, conductive layer be set, or also can be only on the first sheet material collection the opening surface of an above-mentioned N groove conductive layer is set, wherein, the mode that conductive layer is set can be diversified, for example, in above-mentioned N the groove that can process on inductance core being arranged to the first sheet material collection after, by one or more pieces central layers (central layer has conductive layer) by polymer adhesive at least one plate face of the first sheet material collection, or also can at least one plate face of the first sheet material collection, conductive layer be set by plating or chemical plating or alternate manner.

405, on the first sheet material collection, in the ring of above-mentioned N the formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole.

406, on above-mentioned conductive layer, process line pattern, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around an above-mentioned N inductance core.

Wherein, the winding of the first inductance refers to and that is to say the winding of some inductance, and the winding of the first inductance is spatially around forming above-mentioned whole N inductance core of non-closed hoop.If for example N equals 3, the winding that represents the first inductance is spatially around forming 3 inductance cores of non-closed hoop, if N equals 6, the winding that represents the first inductance is spatially around forming 6 inductance cores of non-closed hoop, if N equals 1, represent that the winding of the first inductance is spatially around 1 inductance core that forms non-closed hoop, other situation by that analogy.Certainly, also can be conductive materials to be set in these several blind holes that process and/or through hole to form on space around the winding of a plurality of inductance of an above-mentioned N inductance core, now, the winding that has an inductance in the winding of these a plurality of inductance at least is spatially around forming above-mentioned whole N inductance core of non-closed hoop.

Be understandable that, between step 404 and step 405, there is no inevitable sequencing, step 405 and processing on above-mentioned conductive layer does not have inevitable yet between the step of line pattern, as long as can make the conductive materials that arranges in above-mentioned several blind holes and/or through hole and the line pattern on the first sheet material collection form on space the first inductor winding around an above-mentioned N inductance core, wherein, on the first sheet material collection, forming line pattern that inductor winding uses may comprise on above-mentioned conductive layer and process line pattern, also may also comprise the inner line figure of the first sheet material collection.For example, can first perform step 405, then perform step 404, perform step afterwards 406; Or can first perform step 404, and then perform step 405, perform step again 406 afterwards; Or can first perform step 404, then carry out the step that processes line pattern on above-mentioned conductive layer, perform step again 405 afterwards, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around an above-mentioned N inductance core; Or, also can first on the first sheet material collection, process several blind holes and/or through hole, then the mode by plating or chemical plating arranges conductive layer on the above-mentioned insulating barrier of the first sheet material collection, and when being set, conductive layer can form conductive materials in processing several blind holes and/or through hole above-mentioned, on above-mentioned conductive layer, process line pattern afterwards, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around N inductance core.

Therefore, in the present embodiment scheme, on the first sheet material collection, process N the groove that holds N inductance core; N inductance core is arranged in N the groove processing on the first sheet material collection; On at least one plate face of the first sheet material collection, conductive layer is set; In the ring of above-mentioned N the formed non-closed hoop of groove on being provided with the first sheet material collection of this conductive layer and outside ring, process several blind holes and/or through hole; On this conductive layer, process line pattern, and conductive materials is set in these several blind holes that process and/or through hole to form on space around the winding of the first inductance of an above-mentioned N inductance core.Owing to being by conductive materials being set to form on space around the winding of the first inductance of an above-mentioned N inductance core in several blind holes processing and/or through hole, this is just without coiling manually, and can realize by plant equipment, the automatic and mechanical rate that is conducive to improve the processing of PCB neutral body inductance, is also conducive to reduce product rejection rate, and, due to this structure can by inductance core hidden put with PCB within, effectively utilized space in plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction, and, due to the N that holds N inductance core processing groove formation is non-closed hoop, the first sheet material collection region that this non-closed hoop is surrounded, the first sheet material collection joint area outside the first sheet material collection region surrounding with this non-closed hoop, the first sheet material collection region that non-closed hoop surrounds is retained, so just can avoid filling the operation of non-closed hoop institute enclosing region after N inductance core is arranged to N groove, can in the ring of this non-closed hoop and outside ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.And, due to inductance core and hold between body wall sidewall, bottom surface and/or the end face of the cavity of inductance core (as hold) of the cavity of this inductance core and there is space, therefore, when PCB is squeezed, the situation that inductance core is extruded can obtain buffering and alleviate, and practice finds to make like this inductance performance to become relatively stable reliable, and then the electric property of inductance is greatly improved.

A kind of printed circuit board (PCB) that the embodiment of the present invention provides, can comprise:

The first sheet material collection and N inductance core;

Wherein, on the first sheet material collection, be provided with N the groove that holds respectively an above-mentioned N inductance core, the first sheet material collection region that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with this N groove surrounds, this N is positive integer; Plate face corresponding to channel opening on the first sheet material collection is also provided with insulating barrier, to form the cavity that holds respectively N inductance core, wherein, at least one inductance core in N inductance core, and hold and between the body wall of cavity of this inductance core, there is space (at least 1 inductance core in N inductance core for example, and hold between sidewall, bottom surface and/or the end face of the cavity of this inductance core there is space); On this insulating barrier, be also provided with conductive layer; On the first sheet material collection, in the ring of above-mentioned N the formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole; And on above-mentioned conductive layer, be also processed with line pattern, so that the line pattern on the conductive materials arranging in above-mentioned several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around an above-mentioned N inductance core.

Be understandable that, the shape of above-mentioned N the formed non-closed hoop of groove can be the circular rings of non-closure, the irregular annular of the vesica piscis of non-closure, the Q-RING of non-closure, the triangle ring of non-closure, non-closure or can mate with inductance core other comprise the non-closed annular of non-closed figure.The shape of N the formed non-closed hoop of groove for example can, as shown in Fig. 5-a ~ Fig. 5-e has given an example, also can be the non-closed hoop of other shape certainly.

For ease of better understanding and implement the such scheme of the embodiment of the present invention, below in conjunction with the structure of giving an example shown in accompanying drawing 6-a ~ Fig. 6-d, be introduced.Wherein, the plate face vertical direction that Fig. 6-a shows a kind of printed circuit board (PCB) is for example carried out the structural representation of section, and the plate face parallel direction that Fig. 6-b shows a kind of printed circuit board (PCB) is for example carried out the structural representation of section; The plate face vertical direction that Fig. 6-c and Fig. 6-d show other two kinds of printed circuit board (PCB)s is for example carried out the structural representation of section.

As shown in Fig. 6-a ~ Fig. 6-b, printed circuit board (PCB) A600 comprises: the first sheet material collection A503 and 2 inductance core A501.Wherein, one of them plate face of the first sheet material collection A503 by adhesive A 507 bonding insulating barrier A508; On insulating barrier A508, be also provided with conductive layer A504; Another plate face of the first sheet material collection A503 by adhesive A 506 bonding insulating barrier A509; On insulating barrier A509, be provided with conductive layer A505, wherein, on the first sheet material collection A503, be provided with 2 grooves that hold respectively 2 inductance cores, the first sheet material collection region that the non-closed hoop that these 2 grooves form surrounds, the first sheet material collection joint area (the first sheet material collection region that non-closed hoop like this surrounds is retained) outside the first sheet material collection region that the non-closed hoop forming with these 2 grooves surrounds; In these 2 grooves, be respectively arranged with 2 inductance core A501, wherein, between 2 inductance core A501 and insulating barrier, there is space; Wherein, in the ring of upper these 2 the formed non-closed hoops of groove of printed circuit board (PCB) A600 and outside ring, be processed with the through hole A502 that several are provided with conductive materials; Line pattern on the conductive materials arranging in this through hole A502 and the first sheet material collection A503 forms on space around the winding of the first inductance of above-mentioned 2 inductance core A501.In addition,, as shown in Fig. 6-c, between 2 inductance core A501 and the sidewall of insulating barrier and groove, there is space; As shown in Fig. 6-d, between 2 inductance core A501 and the sidewall of groove, there is space.Wherein, owing to thering is space between inductance core and insulating barrier, therefore when PCB is squeezed, the situation that inductance core is extruded can obtain buffering and alleviate, and practice finds to make like this inductance performance to become relatively stable reliable, and then the electric property of inductance can be greatly improved.Wherein in structure shown in Fig. 6-a, Fig. 6-c and Fig. 6-d, the sidewall that the sidewall of the cavity that holds inductance core of formation is groove, the Wei Cao bottom surface, bottom surface of this cavity, the end face of this cavity is insulating barrier.

Be appreciated that the printed circuit board (PCB) A600 structure shown in Fig. 6-a ~ Fig. 6-d is only for giving an example, printed circuit board (PCB) may be for having other structure of the present embodiment institute Expressive Features in actual applications.

It should be noted that, for aforesaid each embodiment of the method, for simple description, therefore it is all expressed as to a series of combination of actions, but those skilled in the art should know, the present invention is not subject to the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part of detailed description, can be referring to the associated description of other embodiment.

To sum up, in a kind of processing scheme providing in the embodiment of the present invention, on the first sheet material collection, process the cannelure that holds inductance core and at least comprise blind slot part; Inductance core is arranged in the above-mentioned cannelure processing on the first sheet material collection; On at least one plate face of the first sheet material collection, conductive layer is set; In the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside ring, process several blind holes and/or through hole; On this conductive layer, process line pattern, and conductive materials is set in these several blind holes that process and/or through hole to form on space the inductor winding around above-mentioned inductance core.Owing to being by conductive materials being set to form on space the inductor winding around above-mentioned inductance core in several blind holes processing and/or through hole, this is just without coiling manually, and can realize by plant equipment, the automatic and mechanical rate that is conducive to improve the processing of PCB neutral body inductance, is also conducive to reduce product rejection rate, and due to this structure can by inductance core hidden put with PCB within, can effectively utilize space in plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction, and, because the cannelure that holds inductance core processing at least comprises blind slot part, the first sheet material collection region that this surrounds cannelure, can surround the first sheet material collection joint area outside the first sheet material collection region with cannelure, the first sheet material collection region that cannelure surrounds is retained, so just can avoid filling the operation of cannelure institute enclosing region after inductance core is arranged to cannelure, can in the ring of cannelure and outside ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

In addition,, in the another kind of scheme providing in the embodiment of the present invention, on the first sheet material collection, process N the groove that holds N inductance core; N inductance core is arranged in N the groove processing on the first sheet material collection; On at least one plate face of the first sheet material collection, conductive layer is set; In the ring of above-mentioned N the formed non-closed hoop of groove on being provided with the first sheet material collection of this conductive layer and outside ring, process several blind holes and/or through hole; On this conductive layer, process line pattern, and conductive materials is set in these several blind holes that process and/or through hole to form on space around the winding of the first inductance of an above-mentioned N inductance core.Owing to being by conductive materials being set to form on space around the winding of the first inductance of an above-mentioned N inductance core in several blind holes processing and/or through hole, this is just without coiling manually, and can realize by plant equipment, the automatic and mechanical rate that is conducive to improve the processing of PCB neutral body inductance, is also conducive to reduce product rejection rate, and, due to this structure can by inductance core hidden put with PCB within, effectively utilized space in plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction, and, due to the N that holds N inductance core processing groove formation is non-closed hoop, the first sheet material collection region that this non-closed hoop is surrounded, the first sheet material collection joint area outside the first sheet material collection region surrounding with this non-closed hoop, the first sheet material collection region that non-closed hoop surrounds is retained, so just can avoid filling the operation of non-closed hoop institute enclosing region after N inductance core is arranged to N groove, can in the ring of this non-closed hoop and outside ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

Further, due at inductance core and hold between body wall sidewall, bottom surface and/or the end face of the cavity of inductance core (as hold) of the cavity of this inductance core and there is space, therefore, when PCB is squeezed, the situation that inductance core is extruded can obtain buffering and alleviate, and practice finds to make like this inductance performance to become relatively stable reliable, and then the electric property of inductance is greatly improved.

The printed circuit board (PCB) processing method and the printed circuit board (PCB) that above the embodiment of the present invention are provided are described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, to sum up, this description should not be construed as limitation of the present invention meanwhile.

Claims

1. a printed circuit board (PCB) processing method, is characterized in that, comprising:

On the first sheet material collection, process the cannelure that holds inductance core, wherein, described cannelure at least comprises blind slot part, and the first sheet material collection comprises at least one sheet material;

Inductance core is arranged in the described cannelure processing on the first sheet material collection;

Corresponding plate face or plate face corresponding to described cannelure opening of opening in the above blind slot part of the first sheet material collection arranges insulating barrier, to form the cavity that holds described inductance core, wherein, between described inductance core and the body wall of described cavity, has space;

On described insulating barrier, conductive layer is set;

In the ring of the described cannelure on the first sheet material collection and outside ring, process several blind holes and/or the through hole that is provided with conductive materials, and process line pattern on described conductive layer, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around described inductance core.

2. method according to claim 1, is characterized in that,

Described cannelure also comprises groove part.

3. method according to claim 1, is characterized in that,

The described cannelure that holds inductance core that processes on the first sheet material collection is specially: the region processing that needs to process the cannelure that holds inductance core on the first sheet material collection goes out several through holes; On the first sheet material collection, process the cannelure that the groove depth of holding inductance core is less than the first sheet material collection, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure;

4. method according to claim 1, is characterized in that, the described cannelure that holds inductance core that processes on the first sheet material collection is specially: on the first sheet material collection, process the annular blind slot of holding inductance core.

5. according to the method described in claim 1 to 4 any one, it is characterized in that thering is space between the sidewall of described inductance core and described cannelure, the bottom surface of described cannelure and/or described insulating barrier.

6. a printed circuit board (PCB), is characterized in that, comprising:

The first sheet material collection and inductance core;

Wherein, on the first sheet material collection, be processed with the cannelure that holds inductance core, wherein, described cannelure at least comprises blind slot part, and the first sheet material collection comprises at least one sheet material; Described inductance core is arranged in the described cannelure processing on the first sheet material collection;

On plate face corresponding to the opening of the above blind slot of the first sheet material collection part or on plate face corresponding to described cannelure opening, be also provided with insulating barrier, formed the cavity that holds described inductance core, wherein, between described inductance core and the body wall of described cavity, there is space; On described insulating barrier, be also provided with on conductive layer; In the ring of the described cannelure on the first sheet material collection and outside ring, be also processed with several blind holes and/or the through hole that is provided with conductive materials, and on described conductive layer, be also processed with line pattern, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the inductor winding around described inductance core.

7. a printed circuit board (PCB) processing method, is characterized in that, comprising:

On the first sheet material collection, process N the groove that holds respectively N inductance core, wherein, the first sheet material collection region that the non-closed hoop of described N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection region that the non-closed hoop forming with described N groove surrounds, a described N groove comprises blind slot and/or groove, described N is positive integer, and described the first sheet material collection comprises at least one sheet material;

N inductance core is arranged at respectively in described N the groove processing on the first sheet material collection;

At plate face corresponding to first the above channel opening of sheet material collection, insulating barrier is set, to form the cavity that holds respectively a described N inductance core, wherein, at least one inductance core in a described N inductance core, and hold between the body wall of cavity of this inductance core and there is space;

On described insulating barrier, conductive layer is set;

In the ring of first the above N of sheet material collection formed non-closed hoop of groove and outside ring, process several blind holes and/or through hole; And process line pattern on described conductive layer, so that the line pattern on the conductive materials arranging in described several blind holes and/or through hole and the first sheet material collection forms on space the first inductor winding around a described N inductance core.

8. method according to claim 7, is characterized in that, at least one inductance core in a described N inductance core, and hold between sidewall, bottom surface and/or the end face of the cavity of this inductance core and there is space.

9. a printed circuit board (PCB), is characterized in that, comprising:

The first sheet material collection and N inductance core;

10. printed circuit board (PCB) according to claim 9, is characterized in that, at least one inductance core in a described N inductance core, and hold between sidewall, bottom surface and/or the end face of the cavity of this inductance core and there is space.