CN202841710U

CN202841710U - Printed circuit board

Info

Publication number: CN202841710U
Application number: CN 201220396580
Authority: CN
Inventors: 谢占昊; 彭勤卫; 孔令文
Original assignee: Shennan Circuit Co Ltd
Priority date: 2012-08-10
Filing date: 2012-08-10
Publication date: 2013-03-27
Anticipated expiration: 2022-08-10

Abstract

Embodiments of the utility model disclose a printed circuit board. The printed circuit board may comprise a first board set and N inductance cores. The first board set is provided with N slots used for accommodating the N inductance cores; an insulating layer is arranged on a board surface, corresponding to a slot opening, of the first board set; a conducting layer is arranged on the insulating layer; a plurality of blind holes and/or through holes are processed in the interior and exterior of a non-closed ring formed by the N slots on the first board set; and a circuit pattern is processed on the conducting layer so as to allow a conductive substance arranged in the plurality of blind holes and/or through holes and the circuit pattern on the first board set to form a first inductive winding spatially surrounding the N inductance cores. With schemes provided in the embodiments of the utility model, rates of mechanization and automation in processing of stereo inductance in PCB are improved, the rejection rate of a product is reduced, and miniaturization and integration of PCB are promoted.

Description

Printed circuit board (PCB)

Technical field

The utility model relates to printed circuit board (PCB) processing and manufacturing technical field, is specifically related to printed circuit board (PCB).

Background technology

Current, the coil-winding of printed circuit board (PCB) (PCB, Printed Circuit Board) neutral body inductance all is to finish by manual operation usually, because the demand of wire-wound inductor coil is huge, thereby need a large amount of manpowers to come manual this work of finishing, relative enterprise, investment in human resources is huge.And the scrappage of manual operation coil-winding is higher and efficient is lower, and is unfavorable for that the miniaturization of PCB is integrated.

The utility model content

The utility model embodiment provide printed circuit board (PCB), in the hope of improving the automatic and mechanical rate of PCB neutral body inductance processing, reduces the scrappage of product, and promote that the miniaturization of PCB is integrated.

The utility model provides a kind of printed circuit board (PCB) on the one hand, comprising:

The first sheet material collection and inductance core; Wherein, be processed with the cannelure that holds inductance core at the first sheet material collection, wherein, described cannelure comprises the blind slot part at least, and the first sheet material collection comprises at least one sheet material; Described inductance core is arranged in the described cannelure that processes on the first sheet material collection; Also be provided with insulating barrier on plate face corresponding to the opening of the above blind slot of the first sheet material collection part or on plate face corresponding to described cannelure opening; Also be provided with on the conductive layer on the described insulating barrier; Also be processed with several blind holes and/or the through hole that is provided with conductive materials in the ring of the described cannelure on the first sheet material collection and outside the ring, and also be processed with line pattern on the described conductive layer, so that the line pattern on the conductive materials that arranges in described several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on described inductance core on the space.

The utility model provides also a kind of printed circuit board (PCB) on the other hand, comprising:

The first sheet material collection and N inductance core;

Wherein, be provided with N the groove that holds respectively a described N inductance core on the first sheet material collection, the first sheet material collection zone that the non-closed hoop of described N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection zone that the non-closed hoop that forms with described N groove surrounds, described N is positive integer; Also be provided with insulating barrier at plate face corresponding to first the above channel opening of sheet material collection; Also be provided with conductive layer on the described insulating barrier; In the ring of first the above N of sheet material collection formed non-closed hoop of groove and outside the ring, process several blind holes and/or through hole; And also be processed with line pattern on the described conductive layer, so that the line pattern on the conductive materials that arranges in described several blind holes and/or the through hole and the first sheet material collection forms the first inductor winding that centers on a described N inductance core on the space.

Therefore, in a kind of processing scheme that the utility model embodiment provides, process the cannelure that holds inductance core at the first sheet material collection and comprise at least the blind slot part; Inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection; At at least one plate face of the first sheet material collection conductive layer is set; Process several blind holes and/or through hole in the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside the ring; Process line pattern at this conductive layer, and conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in these several blind holes that process and/or through hole.Owing to be by conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And since this structure can with inductance core hidden put with PCB within, can effectively utilize space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because the cannelure that holds inductance core that processes comprises the blind slot part at least, this is so that the first sheet material collection zone that cannelure surrounds, can surround the first sheet material collection joint area outside the first sheet material collection zone with cannelure, the first sheet material collection zone that cannelure surrounds is kept, so just can avoid after inductance core is arranged at cannelure, filling the operation of cannelure institute enclosing region, can in the ring of cannelure and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

Description of drawings

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the schematic flow sheet of a kind of printed circuit board (PCB) processing method of providing of the utility model embodiment;

Fig. 2-a is the shape schematic diagram of a kind of annular groove of providing of the utility model embodiment;

Fig. 2-b is the shape schematic diagram of a kind of oval ring groove of providing of the utility model embodiment;

Fig. 2-c is the shape schematic diagram of a kind of irregular cannelure of providing of the utility model embodiment;

Fig. 2-d is the shape schematic diagram of a kind of square cannelure of providing of the utility model embodiment;

Fig. 2-e is the shape schematic diagram of a kind of triangular ring groove of providing of the utility model embodiment;

Fig. 2-f is the shape schematic diagram of a kind of polygon cannelure of providing of the utility model embodiment;

Fig. 2-g is the shape schematic diagram of the another kind of irregular cannelure that provides of the utility model embodiment;

Fig. 3-a is the schematic diagram that a kind of region processing that needs to process the cannelure that holds inductance core at the first sheet material collection A100 that the utility model embodiment provides goes out several through holes A1;

Fig. 3-b is a kind of schematic top plan view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core that the utility model embodiment provides;

Fig. 3-c is a kind of cross-sectional schematic that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core that the utility model embodiment provides;

Fig. 3-d is a kind of schematic diagram that inductance core A3 is set in the cannelure A2 that holds inductance core that processes that the utility model embodiment provides;

Fig. 3-e is the schematic diagram that a kind of two plate faces at the first sheet material collection A100 that the utility model embodiment provides arrange conductive layer A200 and conductive layer A300;

Fig. 3-f is a kind of schematic diagram of machining hole in annular grooved ring and outside the ring that the utility model embodiment provides;

Fig. 3-g is the schematic diagram of the another kind that provides of the utility model embodiment machining hole in the ring of cannelure A2 and outside the ring;

Fig. 3-h is another schematic diagram of machining hole in the ring of cannelure A2 and outside the ring that the utility model embodiment provides;

Fig. 3-i is a kind of schematic top plan view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core that the utility model embodiment provides;

Fig. 3-j is a kind of cross-sectional schematic that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core that the utility model embodiment provides;

Fig. 3-k is a kind of schematic top plan view that inductance core A3 is set in the annular blind slot A7 that holds inductance core that processes that the utility model embodiment provides;

Fig. 3-l is a kind of cross-sectional schematic that inductance core A3 is set in the annular blind slot A7 that holds inductance core that processes that the utility model embodiment provides;

Fig. 3-m is the schematic diagram that a kind of two plate faces at the first sheet material collection A100 that the utility model embodiment provides arrange conductive layer A200 and conductive layer A300;

Fig. 3-n is a kind of schematic diagram of machining hole in the ring of annular blind slot A7 and outside the ring that the utility model embodiment provides;

Fig. 3-o is the schematic diagram of the another kind that provides of the utility model embodiment machining hole in the ring of annular blind slot A7 and outside the ring;

Fig. 3-p is another schematic diagram of machining hole in the ring of annular blind slot A7 and outside the ring that the utility model embodiment provides;

Fig. 4 is the schematic flow sheet of the another kind of printed circuit board (PCB) processing method that provides of the utility model embodiment;

Fig. 5-a is the schematic diagram of the non-closed circle ring that forms of a kind of 2 grooves that the utility model embodiment provides;

Fig. 5-b is the schematic diagram of the non-closed circle ring that forms of a kind of 1 groove that the utility model embodiment provides;

Fig. 5-c is the schematic diagram of the non-closed vesica piscis that forms of a kind of 2 grooves that the utility model embodiment provides;

Fig. 5-d is the schematic diagram of the non-closed polygon ring that forms of a kind of 4 grooves that the utility model embodiment provides;

Fig. 5-e is the schematic diagram of the non-closed triangle ring that forms of a kind of 2 grooves that the utility model embodiment provides;

Fig. 5-f is the schematic diagram of the irregular ring of non-closure that forms of a kind of 2 grooves that the utility model embodiment provides;

Fig. 5-g is the schematic diagram of the irregular ring of non-closure that forms of 2 grooves of the another kind that provides of the utility model embodiment;

Fig. 5-h is the schematic diagram of the irregular ring of non-closure that forms of a kind of 4 grooves that the utility model embodiment provides;

Fig. 6-a is the structural representation that the plate face vertical direction of a kind of printed circuit board (PCB) of providing of the utility model embodiment is carried out section;

Fig. 6-b is the structural representation that the plate face parallel direction of a kind of printed circuit board (PCB) of providing of the utility model embodiment is carried out section.

Embodiment

The utility model embodiment provides printed circuit board (PCB) processing method and printed circuit board (PCB), in the hope of improving mechanization and the percent of automatization of the processing of PCB neutral body inductance, reduces the scrappage of product, promotes that the miniaturization of PCB is integrated.

Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.

Term " first " in specification of the present utility model and claims and the above-mentioned accompanying drawing, " second ", " the 3rd " " 4th " etc. (if exist) are be used to distinguishing similar object, and needn't be used for describing specific order or precedence.The data that should be appreciated that such use suitably can exchanged in the situation, so as embodiment of the present utility model described herein for example can with except diagram here or describe those order enforcement.In addition, term " comprises " and " having " and their any distortion, intention is to cover not exclusive comprising, for example, comprised those steps or unit that process, method, system, product or the equipment of series of steps or unit are not necessarily limited to clearly list, but can comprise clearly do not list or for these processes, method, product or equipment intrinsic other step or unit.

An embodiment of the utility model PCB processing method can comprise: process the cannelure that holds inductance core at the first sheet material collection, wherein, this cannelure comprises the blind slot part at least, and the first sheet material collection comprises at least one sheet material; Inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection; Corresponding plate face or the plate face corresponding to cannelure opening of opening of above-mentioned blind slot part arranges insulating barrier on the first sheet material collection, and at this insulating barrier conductive layer is set; Process several blind holes and/or the through hole that is provided with conductive materials in the ring of the above-mentioned cannelure on the first sheet material collection and outside the ring, and process line pattern at above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms on the space inductor winding around above-mentioned inductance core.

Referring to Fig. 1, a kind of PCB processing that the schematic flow sheet of a kind of PCB processing method that Fig. 1 provides for the utility model, the utility model embodiment provide can comprise following content:

101, process the cannelure that holds inductance core at the first sheet material collection;

Wherein, the first sheet material collection comprises at least one sheet material, processes the cannelure that holds inductance core at the first sheet material collection and comprises at least the blind slot part.

In embodiment more of the present utility model, process the cannelure that holds inductance core at the first sheet material collection and can be annular blind slot (namely including only the blind slot part), or process the cannelure that holds inductance core at the first sheet material collection and both comprised the groove part, also comprise the blind slot part, so that the first sheet material collection that cannelure surrounds is regional, the first sheet material collection joint area outside the first sheet material collection zone that surrounds with cannelure.Wherein, if certain groove that processes includes only the blind slot part, then this groove can be referred to as blind slot, if certain groove that processes comprises groove part (may include only the groove part, both comprise perhaps that the blind slot part also comprised the groove part), then this groove can be referred to as groove.

Be appreciated that the shape that processes the above-mentioned cannelure that holds inductance core at the first sheet material collection can be circular rings, vesica piscis, Q-RING, triangle ring, irregular annular or can comprise the annular of closed figure with other of inductance core coupling.The given an example cannelure of several shapes of Fig. 2-a ~ Fig. 2-e, the shape of cannelure also can be changed to the annular that other comprises closed figure in actual applications certainly.Wherein, Fig. 2-a shows the shape of a kind of annular groove A21 for example; Fig. 2-b shows the shape of a kind of oval ring groove A22 for example; Fig. 2-d shows the shape of a kind of square cannelure A24 for example; Fig. 2-e shows the shape of a kind of triangular ring groove A21 for example; Fig. 2-f shows the shape of a kind of polygon cannelure A21 for example; Fig. 2-g and Fig. 2-c show the shape of two kinds of irregular cannelure A23 and A23 for example.Be not limited in actual applications the cannelure of above-mentioned Fig. 2-a ~ shape that Fig. 2-e gives an example.

In embodiment more of the present utility model, the first sheet material collection during the processing cannelure for example can comprise at least a slice of following at least a type sheet material: base material, central layer and single-side coated copper plate, wherein, if the first sheet material collection comprises multi-disc base material, central layer and/or single-side coated copper plate, then can be processed with line pattern on the internal layer base material of the first sheet material collection, core material and/or the internal layer single-side coated copper plate, can bond together by adhesive (such as prepreg etc.) between each layer base material of the first sheet material collection and/or central layer and/or the single-side coated copper plate.Before or after the first sheet material collection processes the cannelure that holds inductance core, if need, then also can process line pattern at least one sheet surface layer face of the first sheet material collection.

In embodiment more of the present utility model, processing the cannelure that holds inductance core at the first sheet material collection can specifically comprise: the region processing that needs to process the cannelure that holds inductance core at the first sheet material collection goes out several through holes; Then process the groove depth of holding inductance core less than the cannelure of the first sheet material collection thickness at the first sheet material collection, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure.One of purpose of processing these through holes is, the cannelure of avoiding following process to go out may become closed space, and the cannelure that following process goes out can shed gas, heat and/or stress etc. by these through holes.

In other embodiment of the present utility model, processing the cannelure that holds inductance core at the first sheet material collection can be specially: process the annular blind slot of holding inductance core at the first sheet material collection, and in this annular blind slot, process several through holes, wherein, the aperture of these several through holes is less than or equal to the groove width of cannelure.Wherein, one of purpose of processing these through holes is, the cannelure of avoiding processing may become closed space, and the cannelure that processes can shed gas, heat and/or stress etc. by these through holes.

In other embodiment of the present utility model, processing the cannelure that holds inductance core at the first sheet material collection can be specially: process the annular blind slot of holding inductance core at the first sheet material collection.Wherein, for example can by controlling the mode of deeply milling or alternate manner, process the annular blind slot of holding inductance core at the first sheet material collection.

102, inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection.

103, corresponding plate face or the plate face corresponding to above-mentioned cannelure opening of opening of above-mentioned blind slot part arranges insulating barrier on the first sheet material collection;

104, the above-mentioned insulating barrier at the first sheet material collection arranges conductive layer.

Wherein, because blind slot only has an end opening, the therefore plate face corresponding to opening of above-mentioned blind slot part on the first sheet material collection refers to one of them plate face of the first sheet material collection; And the groove both ends open, if therefore above-mentioned cannelure had both comprised that the blind slot part also comprised the groove part, plate face corresponding to above-mentioned cannelure opening on the first sheet material collection then, just refer to two plate faces on the first sheet material collection, if above-mentioned cannelure comprises the blind slot part but does not comprise the groove part, then plate face corresponding to above-mentioned cannelure opening on the first sheet material collection also refers to one of them the plate face on the first sheet material collection.

That is to say, the plate face that above-mentioned cannelure opening is corresponding on the first sheet material collection arranges insulating barrier, may be that a wherein plate face at the first sheet material collection arranges insulating barrier, also might be that two plate faces at the first sheet material collection arrange respectively insulating barrier, wherein, the number of plies of the insulating barrier of above-mentioned setting can be one or more layers, and insulating barrier can comprise prepreg etc.Wherein, the mode that insulating barrier and conductive layer are set at the first sheet material collection plate face can be diversified, for example, after can be in inductance core being arranged at the above-mentioned cannelure that the first sheet material collection processes, at least a slice central layer or single-side coated copper plate (the central layer two sides has conductive layer) bond at least one plate face of the first sheet material collection by adhesive (this adhesive also can be regarded a layer insulating as), after perhaps also can be at the opening of above-mentioned blind slot part on the first sheet material collection corresponding plate face or plate face corresponding to above-mentioned cannelure opening arrange insulating barrier, form conductive layer by plating or chemical plating or alternate manner at the insulating barrier that arranges.

105, process several blind holes and/or the through hole that is provided with conductive materials in the ring of the above-mentioned cannelure on the first sheet material collection and outside the ring.

106, process line pattern at above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on above-mentioned inductance core on the space.

Be understandable that, there is not inevitable sequencing between step 104 and the step 105, step 105 and processing at above-mentioned conductive layer does not have inevitable yet between the step of line pattern, as long as can be so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on above-mentioned inductance core on the space, wherein, form the employed line pattern of inductor winding on the first sheet material collection and may comprise on the above-mentioned conductive layer and process line pattern, also may also comprise the inner line figure of the first sheet material collection.For example, can first execution in step 105, then execution in step 104, afterwards execution in step 106 again; Or can first execution in step 104, then execution in step 105, afterwards execution in step 106 again; Or can first execution in step 104, then carry out the step that processes line pattern at above-mentioned conductive layer, execution in step 105 more afterwards is so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms on the space inductor winding around above-mentioned inductance core; Perhaps, also can process several blind holes and/or through hole at the first sheet material collection first, then the mode by plating or chemical plating arranges conductive layer at the above-mentioned insulating barrier of the first sheet material collection, and when being set, conductive layer can form conductive materials in several blind holes and/or the through hole above-mentioned processing, process line pattern at above-mentioned conductive layer afterwards, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on above-mentioned inductance core on the space.

In some embodiment of the utility model, can in several blind holes that process and/or through hole, conductive materials be set in several ways, for example can carry out metalized and/or in several blind holes that process and/or through hole, clog conducting medium several blind holes of processing and/or the hole wall of through hole.Wherein, one of purpose that conductive materials is set in the hole is so that this hole has conductive capability.

For ease of better understanding and implement the such scheme of the utility model embodiment, shown in accompanying drawing 3-a～Fig. 3-k, be introduced for example.Wherein, accompanying drawing 3-a ~ Fig. 3-k shows the process at the first sheet material collection A100 processing inductor winding for example.

Referring to Fig. 3-a, Fig. 3-a is illustrated in the region processing that needs to process the cannelure that holds inductance core on the first sheet material collection A100 and goes out several through holes A1, this moment two of the first sheet material collection A100 or one of them sheet surface layer face can have conductive layer, certainly also can not have conductive layer.Fig. 3-b and Fig. 3-c are illustrated on the first sheet material collection A100 and process the cannelure A2 that holds inductance core, Fig. 3-b is the vertical view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core, and Fig. 3-c is the cutaway view that processes the first sheet material collection A100 of the cannelure A2 that holds inductance core; Wherein, Fig. 3-c illustrates the aperture of through hole A1 less than the groove width of cannelure A2, one of purpose of processing these through holes A1 is to avoid cannelure A2 may become closed space, cannelure A2 can shed gas, heat, stress etc. by these through holes, wherein, for example can by controlling the mode of deeply milling or alternate manner, process the cannelure A2 that holds inductance core at the first sheet material collection A100.Fig. 3-d is illustrated among the cannelure A2 that holds inductance core that processes inductance core A3 is set, wherein Fig. 3-d illustrates the height of inductance core A3 a little less than the height of cannelure A2, certainly, the height of inductance core A3 also can equal the height of cannelure A2 in the practical application.Fig. 3-e is illustrated on two plate faces of the first sheet material collection A100 conductive layer A200 and conductive layer A300 is set, wherein, Fig. 3-e illustrates a plate face that insulating barrier A401 is bonded to the first sheet material collection A100 by adhesive A 402, conductive layer A200 is arranged on the insulating barrier A401, adhesive A 403 bonds to insulating barrier A404 in another plate face of the first sheet material collection A100, conductive layer A300 is arranged on the insulating barrier A401, wherein, adhesive A 402 and adhesive A 403 can be regarded respectively a layer insulating as, and insulating barrier A401 also can omit certainly.Fig. 3-f～Fig. 3-h show in the ring of cannelure A2 and ring outside several different modes of machining hole, wherein, Fig. 3-f shows in the ring of cannelure A2 and a plurality of through hole A5 of processing outside the ring, follow-uply in this several through hole A5, conductive materials is set, this conductive materials contacts with conductive layer A300 with conductive layer A200 respectively, forms the inductor winding that centers on inductance core A3 on the space so that the line pattern that processes on conductive materials and conductive layer A200 and the conductive layer A300 is set among the through hole A5; Fig. 3-g is illustrated in the interior and a plurality of blind hole A6 of the outer processing of ring of ring of cannelure A2, the conductive materials that arranges in this several blind hole A6 contacts with conductive layer A200 and inner-layer conducting layer, so that the conductive materials that arranges among the blind hole A6, the line pattern and the inner line figure that process with conductive layer A200 form the inductor winding that centers on inductance core A3 on the space, shown in Fig. 3-g under this scene, owing to the inner line figure that contact with the conductive materials that arranges among the blind hole A6 is arranged, so bonding adhesive A 403, insulating barrier A404 and conductive layer A300 can omit all.Fig. 3-h is illustrated in ring interior and the outer a plurality of blind hole A6 of processing of ring and a plurality of through hole A5 of cannelure A2, situation shown in Fig. 3-h is the combination of situation shown in Fig. 3-f and Fig. 3-g, wherein, the conductive materials that arranges among the through hole A5, contact with the line pattern that processes on conductive layer A200 and the conductive layer A300 respectively, and the conductive materials that arranges among the blind hole A6 contacts with line pattern and the inner line figure that conductive layer A200 processes respectively, and then forms the inductor winding that centers on inductance core A3 on the space.

Referring to Fig. 3-i and Fig. 3-j, Fig. 3-i and Fig. 3-j are illustrated on the first sheet material collection A100 and process the annular blind slot A7 that holds inductance core, Fig. 3-i is the vertical view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core, Fig. 3-j is the cutaway view that processes the first sheet material collection A100 of the annular blind slot A7 that holds inductance core, wherein, for example can be by controlling the mode of deeply milling or alternate manner, A100 processes the annular blind slot A7 that holds inductance core on the first sheet material collection.Fig. 3-k and Fig. 3-l are illustrated among the annular blind slot A7 that holds inductance core that processes inductance core A3 are set, and wherein, Fig. 3-k is for arranging the vertical view of the first sheet material collection A100 behind the inductance core A3 in annular blind slot A7; Fig. 3-l is for arranging the cutaway view of the first sheet material collection A100 behind the inductance core A3 in annular blind slot A7, wherein, Fig. 3-l illustrates the height of inductance core A3 a little less than the height of annular blind slot A7.Fig. 3-m is illustrated on two plate faces of the first sheet material collection A100 conductive layer A200 and conductive layer A300 is set, wherein, by adhesive A 402 insulating barrier A401 is bonded to the plate face (the plate face that annular blind slot A7 opening is corresponding) of the first sheet material collection A100 shown in Fig. 3-m, conductive layer A200 is arranged on the insulating barrier A401, adhesive A 403 bonds to insulating barrier A404 in another plate face of the first sheet material collection A100, conductive layer A300 is arranged on the insulating barrier A401, wherein, adhesive A 402 and adhesive A 403 can be regarded respectively a layer insulating as, certainly insulating barrier A401 also can omit, in addition, if another plate face of the first sheet material collection A100 (being that relative plate face of plate face corresponding to annular blind slot A7 opening) has had conductive layer, then also can omit bonding adhesive A 403, insulating barrier A404 and conductive layer A300.Fig. 3-n ~ Fig. 3-p show in the ring of annular blind slot A7 and ring outside several different modes of machining hole, similar with situation shown in Fig. 3-f～Fig. 3-h, wherein, Fig. 3-n shows in the ring of cannelure A2 and a plurality of through hole A5 of processing outside the ring, follow-uply in this several through hole A5, conductive materials is set, this conductive materials contacts with conductive layer A300 with conductive layer A200 respectively, forms the inductor winding that centers on inductance core A3 on the space so that the line pattern that processes on conductive materials and conductive layer A200 and the conductive layer A300 is set among the through hole A5; Fig. 3-o is illustrated in the interior and a plurality of blind hole A6 of the outer processing of ring of ring of cannelure A2, the conductive materials that arranges in this several blind hole A6 contacts with conductive layer A200 and inner-layer conducting layer, so that the conductive materials that arranges among the blind hole A6, the line pattern and the inner line figure that process with conductive layer A200 form the inductor winding that centers on inductance core A3 on the space, shown in Fig. 3-o under this scene, owing to the inner line figure that contact with the conductive materials that arranges among the blind hole A6 is arranged, so bonding adhesive A 403, insulating barrier A404 and conductive layer A300 can omit all.Fig. 3-p is illustrated in ring interior and the outer a plurality of blind hole A6 of processing of ring and a plurality of through hole A5 of cannelure A2, situation shown in Fig. 3-p is the combination of situation shown in Fig. 3-n and Fig. 3-o, wherein, the conductive materials that arranges among the through hole A5, contact with the line pattern that processes on conductive layer A200 and the conductive layer A300 respectively, and the conductive materials that arranges among the blind hole A6 contacts with line pattern and the inner line figure that conductive layer A200 processes respectively, and then forms the inductor winding that centers on inductance core A3 on the space.

Be appreciated that the inductor winding processing mode shown in Fig. 3-a ~ Fig. 3-p only for for example, can carry out accommodation in actual applications according to actual needs.Fig. 3-a ~ Fig. 3-p processes a cannelure and describes as example to integrate A100 at the first sheet material, certainly also can process a plurality of cannelures in order to form a plurality of three-dimensional inductance at the first sheet material collection A100.

Therefore, process the cannelure that holds inductance core at the first sheet material collection in the present embodiment and comprise at least the blind slot part; Inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection; At at least one plate face of the first sheet material collection conductive layer is set; Process several blind holes and/or through hole in the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside the ring; Process line pattern at this conductive layer, and conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in these several blind holes that process and/or through hole.Owing to be by conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And, since this structure can with inductance core hidden put with PCB within, can effectively utilize space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because the cannelure that holds inductance core that processes comprises the blind slot part at least, this is so that the first sheet material collection zone that cannelure surrounds, can surround the first sheet material collection joint area outside the first sheet material collection zone with cannelure, the first sheet material collection zone that cannelure surrounds is kept, so just can avoid after inductance core is arranged at cannelure, filling the operation of cannelure institute enclosing region, can in the ring of cannelure and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

The utility model embodiment also provides a kind of printed circuit board (PCB), can comprise:

The first sheet material collection and inductance core;

Wherein, be processed with the cannelure that holds inductance core at the first sheet material collection, wherein, this cannelure comprises that at least the blind slot part is (because the cannelure that holds inductance core that processes comprises the blind slot part at least, this is so that the first sheet material collection zone that cannelure surrounds, can surround the first sheet material collection joint area outside the first sheet material collection zone with cannelure, the first sheet material collection zone that cannelure surrounds is kept, the medium that the annular grooved ring is interior and ring is outer is identical, so just can avoid after inductance core is arranged at cannelure, filling the operation of cannelure institute enclosing region), the first sheet material collection comprises at least one sheet material; This inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection;

Also be provided with insulating barrier on plate face corresponding to the opening of above-mentioned blind slot part on the first sheet material collection or on plate face corresponding to above-mentioned cannelure opening; Wherein, also be provided with on the conductive layer on this insulating barrier; Also be processed with several blind holes and/or the through hole that is provided with conductive materials in the ring of the above-mentioned cannelure on the first sheet material collection and outside the ring, and also be processed with line pattern on the above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on above-mentioned inductance core on the space.

In embodiment more of the present utility model, the first sheet material collection can comprise at least one central layer.

Be understandable that the printed circuit board (PCB) in the present embodiment can make based on said method embodiment institute exemplary method, its specific implementation process can with reference to the associated description of said method embodiment, repeat no more herein.

An embodiment of the utility model PCB processing method, can comprise: process N the groove that holds respectively N inductance core at the first sheet material collection, wherein, the first sheet material collection zone that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection zone that the non-closed hoop that forms with this N groove surrounds, this N groove comprises blind slot and/or groove, and this N is positive integer, and the first sheet material collection comprises at least one sheet material; N inductance core is arranged at respectively in above-mentioned N the groove that processes on the first sheet material collection; The plate face that above-mentioned channel opening is corresponding on the first sheet material collection arranges insulating barrier; At this insulating barrier conductive layer is set; On the first sheet material collection, process several blind holes and/or through hole in the ring of above-mentioned N the formed non-closed hoop of groove and outside the ring; And process line pattern at above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms on the space the first inductor winding around an above-mentioned N inductance core.

Referring to Fig. 4, the another kind of PCB processing that the schematic flow sheet of the another kind of PCB processing method that Fig. 4 provides for the utility model, the utility model embodiment provide can comprise following content:

401, process N the groove that holds respectively N inductance core at the first sheet material collection, wherein, the first sheet material collection zone that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection zone that the non-closed hoop that forms with this N groove surrounds, this N groove comprises blind slot and/or groove, this N is positive integer, and the first sheet material collection comprises at least one sheet material.

In embodiment more of the present utility model, processing N the groove that holds N inductance core at the first sheet material collection can all be blind slot, perhaps processing N the groove that holds N inductance core at the first sheet material collection can all be groove, perhaps, process N the groove that holds N inductance core at the first sheet material collection and can both comprise that groove also comprised blind slot, and the groove that processes can include only the groove part, the groove that perhaps processes had both comprised that the groove part also comprised the blind slot part, so that the first sheet material collection that cannelure surrounds is regional, the first sheet material collection joint area outside the first sheet material collection zone that surrounds with cannelure.Wherein, if certain groove that processes includes only the blind slot part, then this groove can be referred to as blind slot; And if certain groove that processes comprises groove part (this groove may include only the groove part, may both comprise also perhaps that the blind slot part also comprised the groove part), then this groove can be referred to as groove.

Be understandable that, the shape of above-mentioned N the formed non-closed hoop of groove can the right and wrong closure circular rings, the irregular annular of the vesica piscis of non-closure, the Q-RING of non-closure, the triangle ring of non-closure, non-closure or can comprise the non-closed annular of non-closed figure with other of inductance core coupling.Fig. 5-a ~ Fig. 5-e non-closed hoop that several N grooves form of having given an example also can be changed to other non-closed ring certainly in actual applications.Wherein, Fig. 5-a shows the non-closed circle ring A51 that a kind of 2 grooves form for example; Fig. 5-b shows the non-closed circle ring A52 that a kind of 1 groove forms for example; Fig. 5-b shows the non-closed circle ring A52 that a kind of 1 groove forms for example; Fig. 5-c shows the non-closed vesica piscis A53 that a kind of 2 grooves form for example; Fig. 5-d shows the non-closed polygon ring A54 that a kind of 4 grooves form for example; Fig. 5-e shows the non-closed triangle ring A55 that a kind of 2 grooves form for example; Fig. 5-f and Fig. 5-g show non-closure irregular ring A56 and the A57 that two kinds of 2 grooves form for example; Fig. 5-h shows the irregular ring of the non-closure A58 that a kind of 4 grooves form for example.

In embodiment more of the present utility model, processing N the groove that holds N inductance core at the first sheet material collection can specifically comprise: the region processing that needs to process N the groove that holds N inductance core at the first sheet material collection goes out several through holes; Then process the groove depth of holding N inductance core less than N groove of the first sheet material collection thickness at the first sheet material collection, wherein, the aperture of these several through holes for example is less than or equal to the groove width of N groove.Wherein, one of purpose of processing these through holes is, N groove avoiding following process to go out is possible becomes closed space, and the N that following process a goes out groove can shed gas, heat, stress etc. by these through holes.

In other embodiment of the present utility model, processing N N groove that holds inductance core at the first sheet material collection can be specially: process N blind slot holding N inductance core at the first sheet material collection, and process several through holes in the part or all of blind slot in this N blind slot, wherein, the aperture of these several through holes is less than or equal to the groove width of N groove.One of purpose of processing these through holes is, N the groove of avoiding processing may become closed space, and the N that a processes groove can shed gas, heat, stress etc. by these through holes.

In other embodiment of the utility model, N the groove that processes N inductance core at the first sheet material collection can be specially: process N blind slot holding N inductance core at the first sheet material collection, wherein, for example can by controlling the mode of deeply milling or alternate manner, process N blind slot holding N inductance core at the first sheet material collection.

402, N inductance core is arranged at respectively in above-mentioned N the groove that processes on the first sheet material collection.

403, the plate face that above-mentioned channel opening is corresponding on the first sheet material collection arranges insulating barrier;

404, at above-mentioned insulating barrier conductive layer is set.

Among some embodiment of the utility model, can conductive layer be set at two plate faces of the first sheet material collection, perhaps also can be only on the first sheet material collection the opening surface of an above-mentioned N groove conductive layer is set, wherein, the mode that conductive layer is set can be diversified, after for example can be in inductance core being arranged at above-mentioned N the groove that the first sheet material collection processes, with one or more pieces central layers (central layer has conductive layer) by polymer adhesive at least one plate face of the first sheet material collection, perhaps also can at least one plate face of the first sheet material collection conductive layer be set by plating or chemical plating or alternate manner.

405, on the first sheet material collection, process several blind holes and/or through hole in the ring of above-mentioned N the formed non-closed hoop of groove and outside the ring.

406, process line pattern at above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the first inductor winding that centers on an above-mentioned N inductance core on the space.

Wherein, the winding of the first inductance refers to that is to say the winding of some inductance that the winding of the first inductance has spatially centered on the above-mentioned whole N inductance core that forms non-closed hoop.If for example N equals 3, the winding that then represents the first inductance has spatially centered on 3 inductance cores that form non-closed hoop, if N equals 6, the winding that then represents the first inductance has spatially centered on 6 inductance cores that form non-closed hoop, if N equals 1, then represent the winding of the first inductance spatially around 1 inductance core that forms non-closed hoop, other situation by that analogy.Certainly, also can be conductive materials to be set to form the space around the winding of a plurality of inductance of an above-mentioned N inductance core in these several blind holes that process and/or through hole, at this moment, have at least the winding of an inductance spatially to center on the above-mentioned whole N inductance core that forms non-closed hoop in the winding of these a plurality of inductance.

Be understandable that, there is not inevitable sequencing between step 404 and the step 405, step 405 and processing at above-mentioned conductive layer does not have inevitable yet between the step of line pattern, as long as can be so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the first inductor winding that centers on an above-mentioned N inductance core on the space, wherein, form the employed line pattern of inductor winding on the first sheet material collection and may comprise on the above-mentioned conductive layer and process line pattern, also may also comprise the inner line figure of the first sheet material collection.For example, can first execution in step 405, then execution in step 404, and execution in step 406 afterwards; Or can first execution in step 404, then execution in step 405, afterwards execution in step 406 again; Or can first execution in step 404, then carry out the step that processes line pattern at above-mentioned conductive layer, execution in step 405 more afterwards is so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms on the space the first inductor winding around an above-mentioned N inductance core; Perhaps, also can process several blind holes and/or through hole at the first sheet material collection first, then the mode by plating or chemical plating arranges conductive layer at the above-mentioned insulating barrier of the first sheet material collection, and when being set, conductive layer can form conductive materials in several blind holes and/or the through hole above-mentioned processing, process line pattern at above-mentioned conductive layer afterwards, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the first inductor winding that centers on N inductance core on the space.

Therefore, process N the groove that holds N inductance core at the first sheet material collection in the present embodiment scheme; N inductance core is arranged in N the groove that processes on the first sheet material collection; At at least one plate face of the first sheet material collection conductive layer is set; Process several blind holes and/or through hole in the ring of above-mentioned N the formed non-closed hoop of groove on being provided with the first sheet material collection of this conductive layer and outside the ring; Process line pattern at this conductive layer, and conductive materials is set to form the space around the winding of the first inductance of an above-mentioned N inductance core in these several blind holes that process and/or through hole.Owing to be by conductive materials is set to form the space around the winding of the first inductance of an above-mentioned N inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And, since this structure can with inductance core hidden put with PCB within, effectively utilized space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because what the N that holds N inductance core the groove that processes formed is non-closed hoop, so that the first sheet material collection that this non-closed hoop surrounds is regional, the first sheet material collection joint area outside the first sheet material collection zone that surrounds with this non-closed hoop, the first sheet material collection zone that non-closed hoop surrounds is kept, so just can avoid after N inductance core is arranged at N groove, filling the operation of non-closed hoop institute enclosing region, can in the ring of this non-closed hoop and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

A kind of printed circuit board (PCB) that the utility model embodiment provides can comprise:

The first sheet material collection and N inductance core;

Wherein, be provided with N the groove that holds respectively an above-mentioned N inductance core on the first sheet material collection, the first sheet material collection zone that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection zone that the non-closed hoop that forms with this N groove surrounds, this N is positive integer; The plate face that channel opening on the first sheet material collection is corresponding also is provided with insulating barrier; Also be provided with conductive layer on this insulating barrier; On the first sheet material collection, process several blind holes and/or through hole in the ring of above-mentioned N the formed non-closed hoop of groove and outside the ring; And also be processed with line pattern on the above-mentioned conductive layer, so that the line pattern on the conductive materials that arranges in above-mentioned several blind holes and/or the through hole and the first sheet material collection forms the first inductor winding that centers on an above-mentioned N inductance core on the space.

Be understandable that, the shape of above-mentioned N the formed non-closed hoop of groove can the right and wrong closure circular rings, the irregular annular of the vesica piscis of non-closure, the Q-RING of non-closure, the triangle ring of non-closure, non-closure or can comprise the non-closed annular of non-closed figure with other of inductance core coupling.The shape of N the formed non-closed hoop of groove for example can shown in Fig. 5-a ~ Fig. 5-e has given an example, also can be the non-closed hoop of other shape certainly.

For ease of better understanding and implement the such scheme of the utility model embodiment, be introduced below in conjunction with the structure of giving an example shown in accompanying drawing 6-a～Fig. 6-b.Wherein, the plate face vertical direction that Fig. 6-a shows a kind of printed circuit board (PCB) is for example carried out the structural representation of section, and the plate face parallel direction that Fig. 6-b shows a kind of printed circuit board (PCB) is for example carried out the structural representation of section.

Shown in Fig. 6-a ~ Fig. 6-b, printed circuit board (PCB) A600 comprises: the first sheet material collection A503 and 2 inductance core A501.Wherein, the wherein plate face of the first sheet material collection A503 by adhesive A 507 bonding insulating barrier A508; Be provided with conductive layer A504 on the insulating barrier A508; Another plate face of the first sheet material collection A503 by adhesive A 506 bonding insulating barrier A509; Be provided with conductive layer A505 on the insulating barrier A509 wherein, be provided with 2 grooves that hold respectively 2 inductance cores on the first sheet material collection A503, the first sheet material collection zone that the non-closed hoop that these 2 grooves form surrounds, the first sheet material collection joint area (the first sheet material collection zone that non-closed hoop like this surrounds is kept) outside the first sheet material collection zone that the non-closed hoop that forms with these 2 grooves surrounds; Be respectively arranged with 2 inductance core A501 in these 2 grooves; Wherein, in the ring of upper these 2 the formed non-closed hoops of groove of printed circuit board (PCB) A600 and outside the ring, be processed with the through hole A502 that several are provided with conductive materials; Line pattern on the conductive materials that arranges among this through hole A502 and the first sheet material collection A503 forms the winding that centers on the first inductance of above-mentioned 2 inductance core A501 on the space.

Be appreciated that the printed circuit board (PCB) A600 structure shown in Fig. 6-a ~ Fig. 6-b only for giving an example, printed circuit board (PCB) may be for having other structure of present embodiment institute Expressive Features in actual applications.

Therefore, processed N the groove that holds N inductance core in the present embodiment on the first sheet material collection of printed circuit board (PCB); Be provided with N the groove that holds respectively N inductance core on the first sheet material collection, the first sheet material collection zone that the non-closed hoop of this N groove formation surrounds, the first sheet material collection joint area outside the first sheet material collection zone that the non-closed hoop that forms with this N groove surrounds, this N is positive integer; Be respectively arranged with N inductance core in this N groove; Wherein, in the ring of this N the formed non-closed hoop of groove and outside the ring, be provided with several blind holes and/or through hole on the printed circuit board (PCB); Be provided with conductive materials in these several blind holes and/or the through hole to form the winding that centers on the first inductance of an above-mentioned N inductance core on the space.Owing to be by conductive materials is set to form the space around the winding of the first inductance of an above-mentioned N inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And, since this structure can with inductance core hidden put with PCB within, effectively utilized space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because what the N that holds N inductance core the groove that processes formed is non-closed hoop, so that the first sheet material collection that this non-closed hoop surrounds is regional, the first sheet material collection joint area outside the first sheet material collection zone that surrounds with this non-closed hoop, the first sheet material collection zone that non-closed hoop surrounds is kept, so just can avoid after N inductance core is arranged at N groove, filling the operation of non-closed hoop institute enclosing region, can in the ring of this non-closed hoop and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

Need to prove, for aforesaid each embodiment of the method, for simple description, so it all is expressed as a series of combination of actions, but those skilled in the art should know, the utility model is not subjected to the restriction of described sequence of movement, because according to the utility model, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification all belongs to preferred embodiment, and related action and module might not be that the utility model is necessary.In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, do not have the part that describes in detail among certain embodiment, can be referring to the associated description of other embodiment.

To sum up, in a kind of processing scheme that the utility model embodiment provides, process the cannelure that holds inductance core at the first sheet material collection and comprise at least the blind slot part; Inductance core is arranged in the above-mentioned cannelure that processes on the first sheet material collection; At at least one plate face of the first sheet material collection conductive layer is set; Process several blind holes and/or through hole in the ring of the above-mentioned cannelure on being provided with the first sheet material collection of this conductive layer and outside the ring; Process line pattern at this conductive layer, and conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in these several blind holes that process and/or through hole.Owing to be by conductive materials is set to form the space around the inductor winding of above-mentioned inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And since this structure can with inductance core hidden put with PCB within, can effectively utilize space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because the cannelure that holds inductance core that processes comprises the blind slot part at least, this is so that the first sheet material collection zone that cannelure surrounds, can surround the first sheet material collection joint area outside the first sheet material collection zone with cannelure, the first sheet material collection zone that cannelure surrounds is kept, so just can avoid after inductance core is arranged at cannelure, filling the operation of cannelure institute enclosing region, can in the ring of cannelure and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

In addition, in the another kind of scheme that the utility model embodiment provides, process N the groove that holds N inductance core at the first sheet material collection; N inductance core is arranged in N the groove that processes on the first sheet material collection; At at least one plate face of the first sheet material collection conductive layer is set; Process several blind holes and/or through hole in the ring of above-mentioned N the formed non-closed hoop of groove on being provided with the first sheet material collection of this conductive layer and outside the ring; Process line pattern at this conductive layer, and conductive materials is set to form the space around the winding of the first inductance of an above-mentioned N inductance core in these several blind holes that process and/or through hole.Owing to be by conductive materials is set to form the space around the winding of the first inductance of an above-mentioned N inductance core in several blind holes that process and/or through hole, this just need not to receive manually coiling, and can realize by plant equipment, be conducive to improve the automatic and mechanical rate of PCB neutral body inductance processing, also be conducive to reduce product rejection rate; And, since this structure can with inductance core hidden put with PCB within, effectively utilized space in the plate, thereby can vacate certain pcb board space of planes, and then can arrange more electronic devices and components at limited plate space of planes, be conducive to promote the miniaturization of PCB, integrated and multifunction; And, because what the N that holds N inductance core the groove that processes formed is non-closed hoop, so that the first sheet material collection that this non-closed hoop surrounds is regional, the first sheet material collection joint area outside the first sheet material collection zone that surrounds with this non-closed hoop, the first sheet material collection zone that non-closed hoop surrounds is kept, so just can avoid after N inductance core is arranged at N groove, filling the operation of non-closed hoop institute enclosing region, can in the ring of this non-closed hoop and outside the ring, process several blind holes and/or through hole, this is conducive to simplify PCB neutral body inductance manufacturing procedure, improving production efficiency.

More than printed circuit board (PCB) processing method and printed circuit board (PCB) that the utility model embodiment is provided be described in detail, used specific case herein principle of the present utility model and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, to sum up, this description should not be construed as restriction of the present utility model.

Claims

1. a printed circuit board (PCB) is characterized in that, comprising:

The first sheet material collection and inductance core;

Wherein, be processed with the cannelure that holds inductance core at the first sheet material collection, wherein, described cannelure comprises the blind slot part at least, and the first sheet material collection comprises at least one sheet material; Described inductance core is arranged in the described cannelure that processes on the first sheet material collection;

Also be provided with insulating barrier on plate face corresponding to the opening of the above blind slot of the first sheet material collection part or on plate face corresponding to described cannelure opening; Also be provided with on the conductive layer on the described insulating barrier; Also be processed with several blind holes and/or the through hole that is provided with conductive materials in the ring of the described cannelure on the first sheet material collection and outside the ring, and also be processed with line pattern on the described conductive layer, so that the line pattern on the conductive materials that arranges in described several blind holes and/or the through hole and the first sheet material collection forms the inductor winding that centers on described inductance core on the space.

2. printed circuit board (PCB) according to claim 1 is characterized in that,

Described cannelure also comprises the groove part, and wherein, the bore of described groove part is less than the bore of described blind slot part.

3. printed circuit board (PCB) according to claim 1 is characterized in that,

Described cannelure also is annular blind slot.

4. according to claim 1 to 3 each described printed circuit board (PCB)s, it is characterized in that described the first sheet material collection comprises at least one central layer.

5. according to claim 1 to 3 each described printed circuit board (PCB)s, it is characterized in that,

Described insulating barrier comprises adhesive phase.

6. a printed circuit board (PCB) is characterized in that, comprising:

The first sheet material collection and N inductance core;

7. printed circuit board (PCB) according to claim 6 is characterized in that,

A described N groove comprises blind slot and/or groove.

8. printed circuit board (PCB) according to claim 7 is characterized in that, described the first sheet material collection comprises at least one central layer.

9. according to claim 6 to 8 each described printed circuit board (PCB)s, it is characterized in that,

Described insulating barrier comprises adhesive phase.