CN104812163A - HDI (high density interconnect) PCB (printed circuit board) laminated structure - Google Patents

HDI (high density interconnect) PCB (printed circuit board) laminated structure Download PDF

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Publication number
CN104812163A
CN104812163A CN201510164753.0A CN201510164753A CN104812163A CN 104812163 A CN104812163 A CN 104812163A CN 201510164753 A CN201510164753 A CN 201510164753A CN 104812163 A CN104812163 A CN 104812163A
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CN
China
Prior art keywords
copper
copper foil
via hole
foil layer
clad plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510164753.0A
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Chinese (zh)
Inventor
黄占肯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201510164753.0A priority Critical patent/CN104812163A/en
Publication of CN104812163A publication Critical patent/CN104812163A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses an HDI (high density interconnect) PCB (printed circuit board) laminated structure, and relates to the technical field of electronic devices. The HDI PCB laminated structure comprises copper-clad plates, copper foil layers, insulating plates and through holes. When one copper-clad plate is arranged, the insulating plates and the copper foil layers are symmetrically and cyclically overlapped by taking the copper-clad plate as a center, first through holes are formed upwards and downwards between the copper-clad plate and the second copper foil layer, and second through holes are formed in all the adjacent copper foil layers except for two middle copper foil layers. When at least two copper-clad plates are arranged, the insulating plates and the copper foil layers are overlapped between two adjacent copper-clad plates and on the outer sides of the two copper-clad plates at two outermost ends, the first through holes are formed between the second copper foil layer above the copper-clad plate at the upper end and the second copper foil layer below the copper-clad plate at the lower end, and the second through holes are formed in all the adjacent copper foil layers except for the copper foil layers between the first copper foil layer above the copper-clad plate at the upper end and the first copper foil layer below the copper-clad plate at the lower end. Machining procedures are simplified, production cost is reduced, the production cycle of products is shortened, and production efficiency is improved.

Description

A kind of HDI PCB laminated construction
Technical field
The present invention relates to technical field of electronic devices, particularly relate to a kind of HDI PCB laminated construction.
Background technology
Along with electronic product develop rapidly and electronic product progressively turns to lightening development trend, the control overflow of people to product cost is also more and more higher, simultaneously in order to comply with the development speed in market, the production cycle of product also should shorten as far as possible, thus improves the competitiveness of product.
For existing 8 layer of 2 rank HDI PCB laminated construction, this laminated construction generally adopts copper-clad plate 1 ˊ (as shown in Figure 1), top and bottom symmetrical superposition insulation board 2 ˊ and copper foil layer 3 ˊ again of this copper-clad plate 1 ˊ, copper-clad plate 1 ˊ is the sheet material of a kind of dielectric in two-layer copper foil layer 3 ˊ interval, and via hole 4 ˊ is provided with between all adjacent copper foil layer 3 ˊ of middle copper-clad plate 1 ˊ upwards and downwards between second layer copper foil layer 3 ˊ and except middle four layers, concrete, copper-clad plate 1 ˊ upwards and downwards arranges the first via hole 41 ˊ between second layer copper foil layer 3 ˊ, except middle four layers of copper foil layer 3 ˊ, the second via hole 42 ˊ is set between all adjacent copper foil layer 3 ˊ of top, and except middle four layers of copper foil layer 3 ˊ, the second via hole 42 ˊ is set between all adjacent copper foil layer 3 ˊ of below, wherein, the second via hole 42 ˊ arranged between all adjacent copper foil layer 3 ˊ of top (or below) that is positioned at except middle four layers of copper foil layer 3 ˊ is coaxial overlapping.
In the course of processing of above-mentioned whole PCB version, first time lamination is carried out when the copper foil layer 3 ˊ number of plies is superimposed to four layers, and get out the first via hole 41 ˊ, often superpose two-layer copper foil layer 3 ˊ afterwards and carry out a lamination, the second via hole 42 ˊ is got out after each lamination, first via hole 41 ˊ and the second via hole 42 ˊ all carries out heavy copper and electroplating processes, therefore, the making completing above-mentioned PCB needs to carry out three laminations altogether, three boring, three heavy copper, three plating, manufacturing procedure is more complicated, cost of manufacture is high, production cycle is longer, thus have impact on the development progress of product, and then affect the competitiveness of product.In like manner, other similar above-mentioned employings copper-clad plate makes and the laminated construction of the multi-layer H DI PCB of symmetrical superposition insulation board and copper foil layer all exists above-mentioned weak point.
Based on the above, need a kind of new HDI PCB laminated construction badly, complicated to solve the manufacturing procedure that existing HDI PCB laminated construction exists, the problems such as production cycle long and cost of manufacture is high.
Summary of the invention
The object of the invention is to propose a kind of HDI PCB laminated construction, this HDI PCB laminated construction can simplify manufacturing procedure, reduces production cost, shortens the production cycle of product.
For reaching this object, the present invention by the following technical solutions:
The invention provides a kind of HDI PCB laminated construction, comprise at least one copper-clad plate, even level and be more than or equal to the copper foil layer of six layers, be arranged on the via hole between insulation board between copper foil layer and copper foil layer, when described copper-clad plate is one, the top and bottom symmetry superposition insulation board of described copper-clad plate and copper foil layer, the face symmetrical cycle superposition centered by copper-clad plate as required of insulation board and copper foil layer, copper-clad plate upwards and downwards arranges the first via hole between second layer copper foil layer, the second via hole is provided with between all adjacent copper foil layer except the two-layer copper foil layer in centre, described second via hole is the coaxial aperture that pore size is identical,
When described copper-clad plate is at least two, insulation board and copper foil layer is all superposed between adjacent two copper-clad plates, be positioned at the equal symmetrical cycle superposition insulation board in outside and the copper foil layer of two copper-clad plates at outermost two ends, upper end copper-clad plate at outermost two ends upwards second layer copper foil layer and the first via hole is set between the downward second layer copper foil layer of the lower end copper-clad plate at outermost two ends, except the upper end copper-clad plate at outermost two ends is upwards provided with the second via hole between ground floor copper foil layer and all adjacent copper foil layer between the lower end copper-clad plate downward ground floor copper foil layer at outermost two ends except all copper foil layers, described second via hole is the coaxial aperture that pore size is identical.
As a kind of preferred version, when described copper-clad plate is at least two, be superimposed with two-layer copper foil layer and an insulation board between adjacent two copper-clad plates, described insulation board both sides are respectively superimposed with one deck copper foil layer.
As a kind of preferred version, described first via hole is shaping by machine drilling.
As a kind of preferred version, described second via hole is shaping by laser drill.
As a kind of preferred version, when described copper-clad plate is one, first time lamination is carried out when the copper foil layer number of plies is superimposed to four layers, first time molds the first via hole and the second via hole, and first time heavy copper and electroplating processes is carried out to the first via hole and the second via hole, often superpose two-layer copper foil layer afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole, and once sinks copper and electroplating processes to the second at every turn shaping via hole;
When described copper-clad plate is at least two, the copper foil layer number of plies be superimposed to upper end copper-clad plate at outermost two ends upwards second layer copper foil layer and the total number of plies between the downward second layer copper foil layer of the lower end copper-clad plate at outermost two ends time carry out first time lamination, first time molds the first via hole and the second via hole, and first time heavy copper and electroplating processes is carried out to the first via hole and the second via hole, often superpose two-layer copper foil layer afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole, and once sinks copper and electroplating processes to the second at every turn shaping via hole.
Beneficial effect of the present invention is:
The invention provides a kind of HDI PCB laminated construction, this HDI PCB laminated construction simplifies the manufacturing procedure such as lamination, boring, effectively reduces production cost, shortens the production cycle of product, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing 8 layer of 2 rank HDI PCB laminated construction;
Fig. 2 is the structural representation of the HDI PCB laminated construction that the embodiment of the present invention one provides;
Fig. 3 is the structural representation of existing 8 layer of 3 rank HDI PCB laminated construction;
Fig. 4 is the structural representation of the HDI PCB laminated construction that the embodiment of the present invention two provides.
Wherein:
1 ˊ, copper-clad plate; 2 ˊ, insulation board; 3 ˊ, copper foil layer; 4 ˊ, via hole; 41 ˊ, the first via hole; 42 ˊ, the second via hole;
1, copper-clad plate; 11, upper end copper-clad plate; 12, lower end copper-clad plate; 2, insulation board; 3, copper foil layer; 4, via hole; 41, the first via hole; 42, the second via hole.
Embodiment
The technical problem solved for making the present invention, the technical scheme of employing and the technique effect that reaches are clearly, be described in further detail below in conjunction with the technical scheme of accompanying drawing to the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those skilled in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one
The manufacturing procedure existed for existing 8 layer of 2 rank HDI PCB laminated construction is complicated, the problem such as production cycle long and cost of manufacture is high, as shown in Figure 2, present embodiments provide a kind of 8 layer of 2 rank HDI PCB laminated construction newly, this HDI PCB laminated construction comprises two copper-clad plates, 1, eight layers of copper foil layer 3, be arranged on via hole 4 between insulation board 2 between copper foil layer 3 and copper foil layer 3.In the present embodiment, preferably, be superimposed with two-layer copper foil layer 3 and an insulation board 2 between adjacent two copper-clad plates 1, these insulation board 2 both sides are respectively superimposed with the equal symmetrical cycle superposition insulation board 2 in outside and the copper foil layer 3 of 3, two copper-clad plates 1 of one deck copper foil layer.That is, the centre of this HDI PCB laminated construction is insulation board 2, superposes copper-clad plate 1, insulation board 2, copper foil layer 3, insulation board 2, copper foil layer 3 successively in the top and bottom symmetry of intermediate insulation plate.Two copper-clad plates can be divided into upper end copper-clad plate 11 and lower end copper-clad plate 12 according to upper and lower location order, upper end copper-clad plate 11 upwards second layer copper foil layer 3 (No. 2 copper foil layers namely in Fig. 2) and lower end copper-clad plate 12 arranges the first via hole 41 between second layer copper foil layer 3 (No. 7 copper foil layers namely in Fig. 2) downwards, and described first via hole 41 is shaping by machine drilling.
Except upper end copper-clad plate 11 upwards ground floor copper foil layer 3 (No. 3 copper foil layers namely in Fig. 2) and lower end copper-clad plate 12 all copper foil layer 3 (i.e. 3 in Fig. 2 between ground floor copper foil layer 3 (No. 6 copper foil layers namely in Fig. 2) downwards, 4, 5 and No. 6 copper foil layers) (No. 1 copper foil layer namely in Fig. 2 and between No. 2 copper foil layers between outer all adjacent copper foil layer 3, between No. 2 copper foil layers and No. 3 copper foil layers, between No. 6 copper foil layers and No. 7 copper foil layers, between No. 7 copper foil layers and No. 8 copper foil layers) be provided with the second via hole 42, described second via hole 42 is the coaxial aperture that pore size is identical.Described second via hole 42 is shaping by laser drill.Wherein, the aperture of the second via hole 42 is less than the aperture of the first via hole 41.
In the present embodiment, copper foil layer 3 number of plies be superimposed to upper end copper-clad plate 11 upwards total number of plies downwards between second layer copper foil layer 3 (No. 7 copper foil layers namely in Fig. 2) of second layer copper foil layer 3 (No. 2 copper foil layers namely in Fig. 2) and lower end copper-clad plate 12 time carry out first time lamination, first time molds the first via hole 41 (No. 2 copper foil layers namely in Fig. 2 and the via hole between No. 7 copper foil layers) and the second via hole 42 (No. 2 copper foil layers namely in Fig. 2 and via hole between No. 3 copper foil layers, and the via hole between No. 6 copper foil layers and No. 7 copper foil layers), and first time heavy copper and electroplating processes is carried out to the first via hole 41 and the second via hole 42, often superpose two-layer copper foil layer 3 afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole 42 (No. 1 copper foil layer namely in Fig. 2 and the via hole between No. 2 copper foil layers and the via hole between No. 7 copper foil layers and No. 8 copper foil layers), and copper and electroplating processes once sunk to the second at every turn shaping via hole 42.
In manufacturing process, first on four layers of copper foil layer 3 of two copper-clad plates 1, produce cabling, then carry out lamination, when being superimposed to six layers of copper foil layer 3, carry out first time lamination, get out the first via hole 41 and the second via hole 42, and heavy copper and electroplating processes are carried out to the first via hole 41 and the second via hole 42.Carry out second time lamination after superposing two-layer copper foil layer 3 afterwards again, second time lamination aftershaping goes out the second via hole 42, and carries out the heavy copper of second time and electroplating processes to the second shaping via hole 42 of second time.Compare existing 8 layer of 2 rank HDI PCB laminated construction, this embodiment 8 layer of 2 rank HDI PCB laminated construction only needs carry out twice lamination, twice boring, twice heavy copper and electroplate for twice, decrease lamination, an once boring, once heavy copper and once electroplate, simplify manufacturing procedure, effectively reduce production cost, shorten the production cycle of product, improve production efficiency.
Embodiment two
As shown in Figure 4, present embodiments provide a kind of 8 layer of 3 rank HDI PCB laminated construction, this HDI PCB laminated construction comprises a copper-clad plate 1, eight layers of copper foil layer 3, be arranged on via hole 4 between insulation board 2 between copper foil layer 3 and copper foil layer 3.In the present embodiment, preferably, the top and bottom symmetry superposition insulation board 2 of described copper-clad plate 1 and copper foil layer 3, the face symmetrical cycle superposition centered by copper-clad plate 1 as required of insulation board 2 and copper foil layer 3, copper-clad plate 1 upwards and between downward second layer copper foil layer 3 (No. 3 copper foil layers namely in Fig. 4 and No. 6 copper foil layers) arranges the first via hole 41, and described first via hole 41 is shaping by machine drilling.
(No. 1 copper foil layer namely in Fig. 4 and between No. 2 copper foil layers between all adjacent copper foil layer 3 except middle two-layer copper foil layer 3 (4, No. 5 copper foil layers namely in Fig. 4), between No. 2 copper foil layers and No. 3 copper foil layers, between No. 3 copper foil layers and No. 4 copper foil layers, between No. 5 copper foil layers and No. 6 copper foil layers, between No. 6 copper foil layers and No. 7 copper foil layers, between No. 7 copper foil layers and No. 8 copper foil layers) be provided with the second via hole 42, described second via hole 42 is the coaxial aperture that pore size is identical.Described second via hole 42 is shaping by laser drill.Wherein, the aperture of the second via hole 42 is less than the aperture of the first via hole 41.
In manufacturing process, first on the two-layer copper foil layer 3 of copper-clad plate 1, cabling is produced, then lamination is carried out, first time lamination is carried out when being superimposed to four floor copper foil layers 3 (comprising 3,4,5 and No. 6 copper foil layers in Fig. 4), get out the first via hole 41 and the second via hole 42, and heavy copper and electroplating processes are carried out to the first via hole 41 and the second via hole 42.Often superpose two-layer copper foil layer 3 afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole 42, and carries out heavy copper and electroplating processes.In this embodiment, 8 layer of 3 rank HDI PCB laminated construction needs to carry out three laminations, three borings, three heavy copper and three electroplating processes altogether.
As shown in Figure 3, the manufacturing process of existing 8 layer of 3 rank HDI PCB laminated construction is: first carry out first time lamination to the two-layer copper foil layer in the centre of copper-clad plate, and get out the first via hole, carry out heavy copper and electroplating processes to the first via hole.Often superpose two-layer copper foil layer afterwards and carry out a lamination, after each lamination, get out the second via hole, and copper and electroplating processes once sunk to the second via hole got out at every turn.That is, existing 8 layer of 3 rank HDI PCB laminated construction needs to carry out four laminations, four borings, four heavy copper and four electroplating processes.
Compare with existing 8 layer of 3 rank HDI PCB laminated construction, the present embodiment 8 layer of 3 rank HDI PCB laminated construction decreases once boring, once heavy copper equally and once electroplates, and simplifies manufacturing procedure, effectively reduces production cost, shorten the production cycle of product, improve production efficiency.
The application be also applicable to comprise at least two copper-clad plates, even level and be more than or equal to six layers copper foil layer and be arranged on insulation board between copper foil layer other be similar to embodiment one or the HDI PCB laminated construction described in embodiment two, as 6 layer of 2 rank HDI PCB laminated construction, 10 layer of 2 rank HDI PCB laminated construction, 10 layer of 3 rank HDI PCB laminated construction and 10 layer of 4 rank HDI PCB laminated construction etc.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.

Claims (5)

1. a HDI PCB laminated construction, comprise at least one copper-clad plate (1), even level and be more than or equal to the copper foil layer (3) of six layers, be arranged on the via hole (4) between insulation board (2) between copper foil layer (3) and copper foil layer (3), it is characterized in that: when described copper-clad plate (1) is one, top and bottom symmetry superposition insulation board (2) of described copper-clad plate (1) and copper foil layer (3), the face symmetrical cycle superposition centered by copper-clad plate (1) as required of insulation board (2) and copper foil layer (3), copper-clad plate (1) upwards and between downward second layer copper foil layer (3) arranges the first via hole (41), the second via hole (42) is provided with between all adjacent copper foil layer (3) except middle two-layer copper foil layer (3), described second via hole (42) is the identical coaxial aperture of pore size,
When described copper-clad plate (1) is at least two, insulation board (2) and copper foil layer (3) is all superposed between adjacent two copper-clad plates (1), be positioned at equal symmetrical cycle superposition insulation board (2) in outside and the copper foil layer (3) of two copper-clad plates (1) at outermost two ends, the upper end copper-clad plate (11) being positioned at outermost two ends upwards arranges the first via hole (41) between second layer copper foil layer (3) and the downward second layer copper foil layer (3) of lower end copper-clad plate (12) being positioned at outermost two ends, except the upper end copper-clad plate (11) being positioned at outermost two ends is upwards provided with the second via hole (42) between ground floor copper foil layer (3) and all adjacent copper foil layer (3) of lower end copper-clad plate (12) downwards between ground floor copper foil layer (3) except all copper foil layers (3) being positioned at outermost two ends, described second via hole (42) is the identical coaxial aperture of pore size.
2. HDI PCB laminated construction according to claim 1, it is characterized in that: when described copper-clad plate (1) is at least two, be superimposed with two-layer copper foil layer (3) and an insulation board (2) between adjacent two copper-clad plates (1), described insulation board (2) both sides are respectively superimposed with one deck copper foil layer (3).
3. HDI PCB laminated construction according to claim 1, is characterized in that: described first via hole (41) is shaping by machine drilling.
4. HDI PCB laminated construction according to claim 1, is characterized in that: described second via hole (42) is shaping by laser drill.
5. HDI PCB laminated construction according to claim 1, it is characterized in that: when described copper-clad plate (1) is one, first time lamination is carried out when copper foil layer (3) number of plies is superimposed to four layers, first time molds the first via hole (41) and the second via hole (42), and first time heavy copper and electroplating processes is carried out to the first via hole (41) and the second via hole (42), often superpose two-layer copper foil layer (3) afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole (42), and copper and electroplating processes once sunk at every turn shaping the second via hole (42),
When described copper-clad plate (1) is at least two, copper foil layer (3) number of plies be superimposed to be positioned at outermost two ends upper end copper-clad plate (11) upwards second layer copper foil layer (3) and be positioned at outermost two ends the total number of plies of lower end copper-clad plate (12) downwards between second layer copper foil layer (3) time carry out first time lamination, first time molds the first via hole (41) and the second via hole (42), and first time heavy copper and electroplating processes is carried out to the first via hole (41) and the second via hole (42), often superpose two-layer copper foil layer (3) afterwards and carry out a lamination, each lamination aftershaping goes out the second via hole (42), and copper and electroplating processes once sunk at every turn shaping the second via hole (42).
CN201510164753.0A 2015-04-07 2015-04-07 HDI (high density interconnect) PCB (printed circuit board) laminated structure Pending CN104812163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510164753.0A CN104812163A (en) 2015-04-07 2015-04-07 HDI (high density interconnect) PCB (printed circuit board) laminated structure

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Application Number Priority Date Filing Date Title
CN201510164753.0A CN104812163A (en) 2015-04-07 2015-04-07 HDI (high density interconnect) PCB (printed circuit board) laminated structure

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Publication Number Publication Date
CN104812163A true CN104812163A (en) 2015-07-29

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105188254A (en) * 2015-08-06 2015-12-23 柏承科技(昆山)股份有限公司 HDI ten-layer plate superposition structure
TWI561127B (en) * 2016-04-29 2016-12-01 Chunghwa Prec Test Tech Co Ltd Vertical interconnect structure and method for vertical interconnection
CN107835565A (en) * 2017-10-24 2018-03-23 广东欧珀移动通信有限公司 Printed circuit board (PCB) and mobile terminal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159559A1 (en) * 2007-12-25 2009-06-25 Fukui Precision Component (Shenzhen) Co., Ltd. Method of manufacturing multilayer printed circuit board having buried holes
CN202587601U (en) * 2012-05-30 2012-12-05 江苏伟信电子有限公司 Printed circuit board (PCB) multi-layer board with blind holes and buried holes
CN202857133U (en) * 2012-11-06 2013-04-03 广东欧珀移动通信有限公司 HDI PCB laminated structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090159559A1 (en) * 2007-12-25 2009-06-25 Fukui Precision Component (Shenzhen) Co., Ltd. Method of manufacturing multilayer printed circuit board having buried holes
CN202587601U (en) * 2012-05-30 2012-12-05 江苏伟信电子有限公司 Printed circuit board (PCB) multi-layer board with blind holes and buried holes
CN202857133U (en) * 2012-11-06 2013-04-03 广东欧珀移动通信有限公司 HDI PCB laminated structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105188254A (en) * 2015-08-06 2015-12-23 柏承科技(昆山)股份有限公司 HDI ten-layer plate superposition structure
CN105188254B (en) * 2015-08-06 2018-06-26 柏承科技(昆山)股份有限公司 Ten laminates of HDI change structure
TWI561127B (en) * 2016-04-29 2016-12-01 Chunghwa Prec Test Tech Co Ltd Vertical interconnect structure and method for vertical interconnection
CN107835565A (en) * 2017-10-24 2018-03-23 广东欧珀移动通信有限公司 Printed circuit board (PCB) and mobile terminal
CN107835565B (en) * 2017-10-24 2020-01-14 Oppo广东移动通信有限公司 Printed circuit board and mobile terminal

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