CN109413891A - A kind of blind hole wiring board and preparation method thereof - Google Patents
A kind of blind hole wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN109413891A CN109413891A CN201811383045.6A CN201811383045A CN109413891A CN 109413891 A CN109413891 A CN 109413891A CN 201811383045 A CN201811383045 A CN 201811383045A CN 109413891 A CN109413891 A CN 109413891A
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- China
- Prior art keywords
- copper foil
- copper
- core plate
- hole
- wiring board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The invention discloses a kind of blind hole wiring boards and preparation method thereof, include the following steps, cover the processing of copper foil core plate, process respectively two be covered with different-thickness copper foil cover copper foil core plate, it is covered first and bores through hole production blind hole on copper foil core plate, and the first copper layer thickness for covering the second copper foil of copper foil core plate is thickeied by panel plating, second copper foil is processed into the second line layer, it thickeies the layers of copper on second copper-clad foil core plate two sides and produces tertiary circuit layer, then cover copper foil core plate for first and second and prepreg lamination is pressed into one piece of whole wiring board；By the whole route trigger tool holes drilled through pressed and one layer of copper is plated, whole wiring board outer copper foil is thickeied by panel plating, then make the route of extexine and cover solder mask and then be surface-treated.Copper foil core plate is covered using different-thickness copper foil, during plated-through-hole, panel plating and graphic plating, to reach hole copper thickness requirement, layers of copper will not be made to plate too thick, convenient for controlling whole plate thickness.
Description
[technical field]
The present invention relates to printed wiring board technical field, especially a kind of blind hole wiring board and preparation method thereof.
[background technique]
In the technology of existing printed wiring board, the wiring board containing mechanical blind hole design, usually first in blind hole layer
It covers and drills out through-hole on copper foil core plate, then carry out single plated hole process, then successively pressing.But plated hole process is walked, plated hole process needs
To make a plated hole film more, then plated hole, when moving back film and grinding off plated hole aperture protrusion copper, process is cumbersome and aperture copper is ground
Mill is difficult to control, so that production cost is higher；Without the use of the direct whole plate plating production blind hole copper of plated hole process, by electroplating principle
It influences, plate face copper thickness can be thicker than copper in hole slightly thicker after the completion of plating, and the copper thicker copper foil core plate that covers in use bottom makes route
Plate, it is thick for the hole wall copper that reaches specified requirement, will lead in the production process cover copper foil core plate plate face layers of copper it is blocked up, influence to press
The strip thickness control of whole production board, causes whole finished product plate thickness exceeded after conjunction, and bottom copper it is thicker be unfavorable for making line gap it is lesser
Wiring board can also make increased costs.
[summary of the invention]
It is an object of that present invention to provide a kind of production methods of blind hole wiring board, save cost, improve line gap and make ability
It avoids leading to the problem of plate thickness simultaneously exceeded.
To solve the above problems, present invention offer technical solution is as follows: a kind of production method of blind hole wiring board, including with
Lower step,
1) processing of copper foil core plate is covered
1. the copper foil core plate that covers for selecting one piece of two sides to be coated with different-thickness copper foil covers copper foil core plate as first, and described
One to cover copper foil core plate include the first copper foil, the core plate positioned at the first copper foil one side and positioned at the core plate another side
Two copper foils thicken second copper foil by panel plating process；
2. covering any one side of copper foil core plate using machine drilling described the first of the thickening for completing second copper foil
Mode bores through hole；
3. through-hole plates one layer of hole wall copper on the hole wall of the through hole, and thickeies the perforation by panel plating process
The hole wall copper in hole, first copper foil and second copper foil；
4. the potting resin and by through hole hole described in resin filling process in the through hole for completing panel plating
The resin of mouth protrusion polishes whole；
5. second copper foil that described the first of the resin for polishing whole aperture protrusion covers copper foil core plate 1 is processed shape
At the second line layer；
6. what one piece of two sides of reselection was coated with different-thickness copper foil covers copper foil core plate as second copper-clad foil core plate, described
Second copper-clad foil core plate includes third copper foil, positioned at the core plate of the third copper foil one side and positioned at the core plate another side
4th copper foil thickeies the third copper foil, the 4th copper foil by panel plating process；
7. processing the third copper foil for the second copper-clad foil core plate for completing panel plating to form tertiary circuit layer；
2) lamination presses
1. by first overlying copper core for processing second line layer, prepreg, processing the third line
The second copper-clad core plate of road floor is by sequence lamination from top to bottom and is directed at pressing behind position and is fabricated to one piece of whole route
Plate, second line layer and the tertiary circuit layer are located at the two sides of the prepreg, polish tree described in whole aperture
The through hole of rouge becomes blind hole on the whole wiring board；
3) processing of whole wiring board
1. by the whole wiring board pressed using machine drilling mode holes drilled through；
2. the whole wiring board for being drilled the through-hole is carried out through-hole plating, make to plate one layer on the hole wall of the through-hole
Hole wall copper and first copper foil and described that the hole wall copper and the whole wiring board are thickeied by panel plating process
Four copper foils；
3. outer graphics shift, one is covered on first copper foil and the 4th copper foil thickeied by panel plating
Then layer photosensitive material dry film carries out contraposition exposure by the Huang film, forms line pattern after development；
4. graphic plating thickeies route layers of copper with electro-plating method on the copper face for showing route after forming line pattern,
Protective layer of the tin as route is plated again；
5. alkali etching will not protected by the whole wiring board that graphic plating is completed by taking off film, etching, take off tin
The layers of copper of shield etches away, and forms first line layer and the 4th line layer；
6. rear process processing checks the whole wiring board for forming the first line layer and the 4th line layer
Then appearance and electric property silk-screen solder mask and will make the whole wiring board of the solder mask as needed and carry out
It is surface-treated, the whole wiring board that will then complete surface treatment passes through gong panel device gong into completion plate, and has checked
The aesthetic appearance of plate is bad and packs.
Described first number for covering copper foil core plate is one or two or three.
The number of the second copper-clad foil core plate is one or two or three.
The present invention also provides blind hole wiring board made of the production method for using the blind hole wiring board, including first covers copper
Foil core plate, second copper-clad foil core plate and semi-solid preparation among copper foil core plate and second copper-clad foil core plate is covered positioned at described first
Piece；Described first, which covers copper foil core plate, the second copper-clad foil core plate and the prepreg, is pressed into one piece of entirety by pressing plate
Wiring board；
Described first covers copper foil core plate including the first copper foil, the second copper foil and is located at first copper foil and described second
Core plate between copper foil, the second copper-clad foil core plate include third copper foil, the 4th copper foil and be located at the third copper foil and institute
State the core plate between the 4th copper foil；
First copper foil, second copper foil, the third copper foil, the 4th copper foil are made respectively by chemical etching
At the first line layer, second line layer, the tertiary circuit layer, the 4th line layer；The first line layer
One layer of solder mask is covered with on the 4th line layer；The blind hole wiring board is equipped with the blind hole and the through-hole；
First copper foil, second copper foil, the third copper foil, the thickness of the 4th copper foil is not identical, described
First copper foil, second copper foil, the third copper foil, the 4th copper foil are thickeied by panel plating, second bronze medal
Thickness control before foil pressing is within the scope of 3.0-3.6mil.
It is coated with one layer of hole wall copper on the blind hole hole wall, the hole wall copper is by the first line layer and second route
Layer is electrically connected, and the resin is filled in the blind hole.
Also it is coated with one layer of hole wall copper on the hole wall of the through-hole, the hole wall copper is by the first line layer, described second
Line layer, the tertiary circuit layer and the 4th line layer are electrically connected.
The completion plate thickness of the blind hole wiring board is 86.6+/- 11.8mil.
Minimum line gap between the outer-layer circuit of the completion plate of the blind hole wiring board is 5mil.
The average hole wall copper of the blind hole thick minimum 0.8mil, average 1mil；The average hole wall copper of the through-hole is thick minimum
0.8mil, average 1mil.
The thickness minimum 2.8mil of each line layer copper of the completion plate of the blind hole wiring board.
Compared with prior art, a kind of beneficial effect of the manufacturing method of blind hole wiring board provided by the invention is:
One, the present invention makes the specified requirement of each layer copper thickness using the copper foil core plate that covers that two sides is coated with different-thickness copper foil
Blind hole wiring board, avoid cover copper foil core plate all directly using identical copper thickness cover copper foil core plate make, using thin bottom copper
It covers copper foil core plate and layers of copper is thickeied by panel plating, it is thick convenient for control hole copper and blind hole laminate face copper, it does not need individually
Plated hole process avoids leading to the problem of plate thickness exceeded；
Two, line width line gap production ability can be improved using relatively thin bottom copper in outer layer, and superficies bottom copper thickness is smaller more to be had
Conducive to producing fine-line, the i.e. lesser route of line gap, then thickening outer graphics by graphic plating meets finished product copper thickness
It is required that improving line gap makes ability；
Three, the present invention using by two sides be coated with different-thickness copper foil to cover the method production that copper foil core plate processes respectively blind
Hole wiring board does not need individual plated hole process, simplifies process flow, also avoids directly making using thick copper foil, reduce
Thick copper foil uses, to save cost.
The beneficial effect of blind hole wiring board made of production method provided by the invention using the blind hole wiring board is:
One, the present invention makes each layer copper thickness requirement minimum using the copper foil core plate that covers that two sides is coated with different-thickness copper foil
The blind hole wiring board of 2.8mil, avoids that cover copper foil core plate all using common copper thickness be directly that 2.8mil covers copper foil core plate
Production covers copper foil core plate using thin bottom copper and thickeies layers of copper by panel plating, convenient for control hole copper and blind hole laminate face copper
Thickness does not need individual plated hole process, and it is exceeded to avoid leading to the problem of plate thickness, will complete plate thickness control 86.6+/-
11.8mil in range；
Two, line width line gap production ability can be improved using relatively thin bottom copper in outer layer of the present invention, and superficies bottom copper thickness is got over
Small to be more conducive to produce fine-line, i.e., minimum line gap is the wiring board of 5mil between outer-layer circuit, then is added by graphic plating
Thick outer figure meets the requirements finished product copper thickness, improves line gap production ability；
Three, the present invention using by two sides be coated with different-thickness copper foil to cover the method production that copper foil core plate processes respectively blind
Hole wiring board does not need individual plated hole process, simplifies process flow, also avoids directly making using thick copper foil, reduce
The use of 2.8mil thickness copper foil, to save cost.
[Detailed description of the invention]
Fig. 1 covers copper foil core plate structure figure for the first of the embodiment of the present invention
Fig. 2 covers the structure chart after copper foil core plate drilling blind hole for the first of the embodiment of the present invention.
Fig. 3 is the first of the embodiment of the present invention to cover the structure chart after copper foil core plate potting resin and nog plate.
Fig. 4 covers the second copper foil of copper foil core plate for the first of the embodiment of the present invention and processes the structure chart after route.
Fig. 5 is the second copper-clad foil core plate structure figure of the embodiment of the present invention.
Fig. 6 is that the second copper-clad foil core plate third copper foil of the embodiment of the present invention processes the structure chart after route.
Fig. 7 is that the first of the embodiment of the present invention to cover copper foil core plate, second copper-clad foil core plate and prepreg pressing be whole
The structure chart of wiring board.
Fig. 8 is the structure chart after the whole circuit-board drilling through-hole of the embodiment of the present invention.
Fig. 9 is the structure chart after the whole wiring board panel plating of the embodiment of the present invention.
Figure 10 is that the whole wiring board of the embodiment of the present invention finishes the structure chart after surface treatment.
[specific embodiment]
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description, it is clear that the described embodiments are merely a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to protection scope of the present invention.
Embodiment: the present invention is a kind of method for making blind hole wiring board, and the present embodiment is manufactured blind by this method
Hole wiring board introduces the manufacturing method of blind hole wiring board:
1) processing of copper foil core plate is covered
1. the copper foil core plate that covers for selecting one piece of two sides to be coated with different-thickness copper foil covers copper foil core plate 1 as first, described
First cover copper foil core plate 1 include the first copper foil 11, positioned at 11 one side of the first copper foil core plate 13 and be located at the core plate
Second copper foil 12 is thickeied by panel plating process, sees Fig. 1 by the second copper foil 12 of 13 another sides, specifically, described
One copper foil 11 with a thickness of 0.7mil, second copper foil 12 with a thickness of 1.4mil, one layer is made on first layer copper foil 11
The resistance erosion film, the second layer copper foil 12 is thickeied by panel plating process to 1.8-2.4mil；It is wanted to reach hole copper thickness
It asks, covers copper foil core plate during plated-through-hole, panel plating and graphic plating using lower thickness copper foil, will not allow and cover copper
The layers of copper of foil core plate internal layer plate face copper is plated too thick；
2. removing the resistance erosion film on the first layer copper foil 11, described the of the thickening of second copper foil 12 is completed
The one any one side for covering copper foil core plate 1 bores through hole 15 using machine drilling mode, sees Fig. 2；
3. through-hole plates one layer of hole wall copper 151 on the hole wall of the through hole 15, and thickeies institute by panel plating process
The hole wall copper 151, first copper foil 11 and second copper foil 12 of through hole 15 are stated, specifically, the thickening of hole wall copper 151 is arrived
Minimum 0.8mil, average copper thickness 1mil thicken the copper layer thickness of second copper foil 12 within the scope of 3.2-3.9mil, thicken institute
The copper layer thickness of the first copper foil 11 is stated within the scope of 1.4-2.2mil；
4. using aluminium flake jack process potting resin 14 and resin is filled out in the through hole 15 for completing panel plating
The resin 14 of 15 aperture of the through hole protrusion is polished whole by nog plate equipment during filling, by resin filling process mesoporous
The resin 14 of mouth protrusion and first copper foil 11, second copper foil 12 thickeied are milled to approximately the same plane, after convenient
Process production, is shown in Fig. 3, during nog plate, controls the copper layer thickness of first copper foil 11 in 1.2-2.0mil range
It is interior, the copper layer thickness of second copper foil 12 is controlled within the scope of 3.0-3.6mil, convenient for the whole plate plate thickness after control pressing.
Through hole 15 can be gorged completely using filling holes with resin technique, avoid the thicker copper foil core plate that covers and only lean on pressing plate resin stream rubber plug hole not
Completely the quality of wiring board is caused to there are problems that flaw；
5. the described first second copper foil 12 for covering copper foil core plate 1 of the resin for polishing whole aperture protrusion is processed
The second line layer 121 is formed, one layer of resistance is made on the first layer copper foil 11 and loses film dry film, in second copper foil
One layer of photosensitive dry film is made on 12 forms scheduled line pattern, the film is in the second layer copper foil through film exposure development
On the basis of the offset rule of 12 thickness 3.0mil-3.6mil to compensate 0.2mil, line width caused by preventing because of lateral erosion is not more
Then second copper foil 12 processing is formed second line layer 121 by chemical etching process, sees Fig. 4, then remove by foot
First covers the dry film on 1 two sides of copper foil core plate；
6. what one piece of two sides of reselection was coated with different-thickness copper foil covers copper foil core plate as second copper-clad foil core plate 2, institute
Stating second copper-clad foil core plate 2 includes third copper foil 21, positioned at the core plate 23 of 21 one side of third copper foil and positioned at the core
4th copper foil 22 of 23 another side of plate, is shown in Fig. 5, and the third copper foil 21, the 4th copper foil 22 are passed through panel plating process
Thicken, specifically, the third copper foil 21 with a thickness of 2.8mil, the 4th copper foil 22 with a thickness of 1.4mil；It will be described
Being thickeied by panel plating process into 3.0-3.6mil for third copper foil 21, passes through plate face for the 4th layer of copper foil 22
Process is electroplated to thicken into 1.6-2.2mil；
7. the processing of third copper foil 21 for the second copper-clad foil core plate 2 for completing panel plating is formed tertiary circuit layer
211, specifically, it is dry to thicken one layer of resistance erosion film of production on the 4th copper foil 22 to 1.6-2.2mil in completion panel plating
Film thickeies in completion panel plating and makes photosensitive dry film from level to level on the third copper foil 21 to 3.0-3.6mil, through the film
Exposure development forms scheduled line pattern, offset rule of the film in the thickness 3.0-3.6mil of the third layer copper foil 21
On core plinth to compensate 0.2mil, line width caused by preventing because of lateral erosion is insufficient more, then by chemical etching process by described the
Three copper foils 21 are processed into the tertiary circuit layer 211, see Fig. 6, remove the dry film on 2 two sides of second copper-clad foil core plate；
2) lamination presses
1. by first overlying copper core 1 for processing second line layer 121, prepreg 3, processing described
The second copper-clad core plate 2 of three line layers 211 is by sequence lamination from top to bottom and is directed at pressing behind position and is fabricated to one piece
Whole wiring board 4, second line layer 121 and the tertiary circuit layer 211 are located at the two sides of the prepreg 3,
The through hole 15 of the resin 14 of whole aperture protrusion is polished in first overlying copper core 1, prepreg 3, described
Become blind hole 16 on the whole wiring board that two overlying copper cores 2 are pressed into, sees Fig. 7；Described first covers the number of copper foil core plate 1
It is one or two or three, the described first number for covering copper foil core plate 1 can be selected according to the wiring board to be made.Described
Two numbers for covering copper foil core plate 2 are one or two or three, and the number of the second copper-clad foil core plate 2 can be according to being made
Wiring board selects.It is corresponding, first or second copper-clad foil core plate increase, the quantity of prepreg 3 is also increased by,
It is one that first and second in the present embodiment, which cover copper foil core plate,.
3) processing of whole wiring board
1. the whole wiring board 4 pressed is used machine drilling mode holes drilled through 41, Fig. 8 is seen；
2. the whole wiring board 4 for being drilled the through-hole 41 is carried out through-hole plating, make to plate on the hole wall of the through-hole 41
Upper one layer of hole wall copper 411 simultaneously thickeies described the first of the hole wall copper 411 and the whole wiring board 4 by panel plating process
Copper foil 11 and the 4th copper foil 22, are shown in Fig. 9, specifically, first copper foil 11 and the 4th copper foil 22 thickening are arrived
Within the scope of 2.8-3.9mil, the hole wall copper 411 is thickeied to minimum 0.8mil, average hole wall copper thickness 1mil；
3. outer graphics shift, covered on first copper foil 11 thickeied by panel plating and the 4th copper foil 22
Then upper one layer of photosensitive material dry film carries out contraposition exposure by the Huang film, line pattern is formed after development, and line pattern exposes
Copper face is to carry out graphic plating；
4. graphic plating thickeies route layers of copper with electro-plating method on the copper face for showing route after forming line pattern,
Reach the route copper layer thickness of reservation, i.e. minimum 2.8mil, then plate protective layer of the tin as route, prevents alkali etching process
Middle damage route copper；
5. alkali etching respectively will not by the whole wiring board that graphic plating is completed by taking off film, etching, take off tin
The tin of the film, not protected layers of copper and the protection circuit copper that need removes, and forms first line layer 111 and the 4th line layer
221, the first line layer 111 and second line layer 121 are electrically connected by the hole wall copper 151 of the blind hole 16,
The hole wall copper 411 is by the first line layer 111, second line layer 121, the tertiary circuit layer 211 and described
Four line layers 221 are electrically connected；
6. rear process processing, checks the overall wire for forming the first line layer 111 and the 4th line layer 221
The appearance and electric property of road plate 4 determine the quality of entirety wiring board, and then silk-screen solder mask 5 is to protect the first line
Layer 111 and the 4th line layer 221 is not oxidized and welding resistance, and the solder mask 5 will have been made according to specific needs
The whole wiring board 4 be surface-treated, see Figure 10, then pass through the whole wiring board 4 for completing surface treatment
Gong panel device gong checks that the aesthetic appearance for completing plate is bad and packs at completion plate.
The present embodiment by using two sides be covered with different-thickness copper foil first cover copper foil core plate and control plating thicken
First covers the copper layer thickness of copper foil core plate second layer copper foil to achieve the purpose that control plate thickness, to solve the problems, such as that plate thickness is exceeded；
First covers copper foil core plate 1 using being made with a thickness of the copper foil of 0.7mil and 1.4mil, second copper-clad foil core plate 2 using with a thickness of
The copper foil of 2.8mil and 1.4mil is made, and compared to the common thick copper foil production directly all used with a thickness of 2.8mil, can save
Copper foil cost, control is in 3.0-3.6mil range before the copper layer thickness pressing for the second line layer for covering copper foil core plate for described first
Finished product plate thickness after the interior pressing convenient for control, while line width line gap production ability, outer layer can be improved using relatively thin bottom copper in outer layer
Surface bottom copper layer thickness is smaller to be more conducive to produce fine-line, thickeies outer graphics by graphic plating again after making route
Meet the requirements finished product copper thickness, and first covers copper foil core plate and make blind hole wiring board first line layer by way of making through-hole
With the blind hole of the second route interlayer, individual plated hole process is eliminated, simplifies production process, saves cost of manufacture.
By the present invention in that making each layer copper thickness requirement most with the copper foil core plate that covers that two sides is coated with the copper foil of different-thickness
The blind hole wiring board of small 2.8mil is avoided and is directly made using the copper foil core plate that covers that common copper thickness is 2.8mil, used
Thin bottom copper overlying copper core thickeies layers of copper by panel plating, thick convenient for control hole copper and plate face copper, makes to cover copper foil core plate not
Plate face copper thickness can be caused thicker because bottom copper is too thick in plated hole, especially it is thicker that copper thickness twice can be electroplated in outer layer blind hole layer, influence
Finished plate thickness avoids leading to the problem of plate thickness exceeded；In addition, line width line gap production energy can be improved using relatively thin bottom copper in outer layer
Power, superficies bottom copper layer thickness is smaller to be more conducive to produce fine-line, then is made by graphic plating thickening outer graphics
Finished product copper thickness is met the requirements；Without using individual plated hole process can simplification of flowsheet, be 2.8mil without using copper thickness
Copper foil material can be saved by covering copper foil core plate, to save cost.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of production method of blind hole wiring board, it is characterised in that the following steps are included:
1) processing of copper foil core plate is covered
1. the copper foil core plate that covers for selecting one piece of two sides to be coated with different-thickness copper foil covers copper foil core plate (1) as first, and described
One, which covers copper foil core plate (1), includes the first copper foil (11), is located at the core plate (13) of the first copper foil (11) one side and is located at institute
The second copper foil (12) for stating core plate (13) another side thickeies second copper foil (12) by panel plating process；
2. covering any one side of copper foil core plate (1) using power auger described the first of the thickening for completing second copper foil (12)
Hole mode bores through hole (15)；
3. through-hole plates one layer of hole wall copper (151) on the hole wall of the through hole (15), and thickeies institute by panel plating process
State the hole wall copper (151), first copper foil (11) and second copper foil (12) of through hole (15)；
4. completing the through hole (15) interior potting resin (14) of panel plating and being penetrated through described in resin filling process
The resin (14) of hole (15) aperture protrusion polishes whole；
5. second copper foil (12) for covering copper foil core plate (1) for described the first of the resin (14) for polishing whole aperture protrusion
Processing forms the second line layer (121)；
6. what one piece of two sides of reselection was coated with different-thickness copper foil covers copper foil core plate as second copper-clad foil core plate (2), described
Second copper-clad foil core plate (2) includes third copper foil (21), is located at the core plate (23) of third copper foil (21) one side and is located at
The third copper foil (21), the 4th copper foil (22) are passed through plate face by the 4th copper foil (22) of core plate (23) another side
Process is electroplated to thicken；
7. third copper foil (21) processing for the second copper-clad foil core plate (2) for completing panel plating is formed tertiary circuit layer
(211)；
2) lamination presses
1. by first overlying copper core (1) for processing second line layer (121), prepreg (3), process it is described
The second copper-clad core plate (2) of tertiary circuit layer (211) presses production by sequence lamination from top to bottom and after being directed at position
At one piece of whole wiring board (4), second line layer (121) and the tertiary circuit layer (211) are located at described half admittedly
The two sides for changing piece (3), the through hole (15) for polishing resin described in whole aperture (14) become blind on the whole wiring board
Hole (16)；
3) processing of integral slab
1. by the whole wiring board (4) pressed using machine drilling mode holes drilled through (41)；
2. whole wiring board (4) the progress through-hole plating of the through-hole (41) will be drilled, on the hole wall for making the through-hole (41)
It plates one layer of hole wall copper (411) and the hole wall copper (411) and the entirety wiring board (4) is thickeied by panel plating process
First copper foil (11) and the 4th copper foil (22)；
3. outer graphics shift, covered on first copper foil (11) and the 4th copper foil (22) thickeied by panel plating
Then upper one layer of photosensitive material dry film carries out contraposition exposure by the Huang film, forms line pattern after development；
4. graphic plating thickeies route layers of copper with electro-plating method on the copper face for showing route after forming line pattern, then plates
Protective layer of the upper tin as route；
5. alkali etching will be not protected by the whole wiring board that graphic plating is completed by taking off film, etching, take off tin
Layers of copper etches away, and forms first line layer (111) and the 4th line layer (221)；
6. rear process processing, checks the overall wire for forming the first line layer (111) and the 4th line layer (221)
The appearance and electric property of road plate (4) then silk-screen solder mask (5) and will make the institute of the solder mask (5) as needed
It states whole wiring board (4) to be surface-treated, the whole wiring board (4) for completing surface treatment is then passed through into gong panel device
Gong is at completing plate, and the aesthetic appearance that has checked plate is bad and packaging.
2. the production method of blind hole wiring board according to claim 1, it is characterised in that: described first covers copper foil core plate
(1) number is one or two or three.
3. the production method of blind hole wiring board according to claim 1, it is characterised in that: the second copper-clad foil core plate
(2) number is one or two or three.
4. blind hole wiring board made of the production method of blind hole wiring board according to claim 1, including first covers copper foil core
Plate (1), second copper-clad foil core plate (2) and to cover copper foil core plate (1) and second copper-clad foil core plate (2) positioned at described first intermediate
Prepreg (3)；Described first, which covers copper foil core plate (1), the second copper-clad foil core plate (2) and the prepreg (3), leads to
It crosses pressing plate and is pressed into one piece of whole wiring board (4)；
Described first, which covers copper foil core plate (1), includes the first copper foil (11), the second copper foil (12) and is located at first copper foil
(11) core plate (13) between second copper foil (12), the second copper-clad foil core plate (2) include third copper foil (21), the 4th
Copper foil (22) and the core plate 23 between the third copper foil (21) and the 4th copper foil (22))；
First copper foil (11), second copper foil (12), the third copper foil (21), the passing through of the 4th copper foil (22)
It learns etching and the first line layer (111), second line layer (121), the tertiary circuit layer (211), institute is respectively prepared
State the 4th line layer (221)；One layer of solder mask is covered on the first line layer (111) and the 4th line layer (221)
(5)；The blind hole wiring board is equipped with the blind hole (16) and the through-hole (41)；
It is characterized by: first copper foil (11), second copper foil (12), the third copper foil (21), the 4th bronze medal
The thickness of foil (22) is not identical, first copper foil (11), second copper foil (12), the third copper foil (21), described
Four copper foils (22) are thickeied by panel plating, and the thickness control before the second copper foil (12) pressing is in 3.0-3.6mil range
It is interior.
5. blind hole wiring board according to claim 4, it is characterised in that: be coated with one layer of hole wall on blind hole (16) hole wall
The first line layer (111) and second line layer (121) are electrically connected by copper (151), the hole wall copper (151), institute
It states in blind hole filled with the resin (14).
6. blind hole wiring board according to claim 4, it is characterised in that: be also coated with one layer on the hole wall of the through-hole (41)
Hole wall copper (411), the hole wall copper (411) is by the first line layer (111), second line layer (121), the third
Line layer (211) and the 4th line layer (221) are electrically connected.
7. blind hole wiring board according to claim 4, it is characterised in that: the completion plate thickness of the blind hole wiring board is
86.6+/-11.8mil。
8. blind hole wiring board according to claim 4, it is characterised in that: the outer layer line of the completion plate of the blind hole wiring board
Minimum line gap between road is 5mil.
9. blind hole wiring board according to claim 4, it is characterised in that: the average hole wall copper of the blind hole is thick minimum
0.8mil, average 1mil；The average hole wall copper of the through-hole thick minimum 0.8mil, average 1mil.
10. blind hole wiring board according to claim 4, it is characterised in that: the blind hole wiring board completes each of plate
The thickness minimum 2.8mil of line layer copper.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811383045.6A CN109413891B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
| CN202011390400.XA CN112739073B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811383045.6A CN109413891B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011390400.XA Division CN112739073B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN109413891A true CN109413891A (en) | 2019-03-01 |
| CN109413891B CN109413891B (en) | 2020-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011390400.XA Active CN112739073B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
| CN201811383045.6A Active CN109413891B (en) | 2018-11-20 | 2018-11-20 | Blind hole circuit board and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN111010815A (en) * | 2019-12-27 | 2020-04-14 | 安捷利（番禺）电子实业有限公司 | Semiconductor chip embedded circuit board and processing method and processing device thereof |
| CN113133214A (en) * | 2021-04-07 | 2021-07-16 | 洛阳伟信电子科技有限公司 | Method for manufacturing asymmetric copper thick multilayer board |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN112739073A (en) | 2021-04-30 |
| CN112739073B (en) | 2021-11-02 |
| CN109413891B (en) | 2020-12-22 |
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