CN105722302B - It is embedded in the circuit board and its processing method of boss Metal Substrate - Google Patents
It is embedded in the circuit board and its processing method of boss Metal Substrate Download PDFInfo
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- CN105722302B CN105722302B CN201410734398.1A CN201410734398A CN105722302B CN 105722302 B CN105722302 B CN 105722302B CN 201410734398 A CN201410734398 A CN 201410734398A CN 105722302 B CN105722302 B CN 105722302B
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Abstract
The invention discloses a kind of circuit boards and its processing method for being embedded in boss Metal Substrate, to solve to be embedded in defect present in the processing method of the circuit board of boss Metal Substrate in the prior art.In some feasible embodiments of the present invention, method includes: the step groove for processing boss shape on circuit boards, and the step groove runs through the circuit board, and the shoulder of the step groove manifests an inner-layer conducting layer of the circuit board；Prepreg or conductive bond piece are set in the shoulder of the step groove, one boss Metal Substrate is embedded in the step groove using pressing mode.
Description
Technical field
The present invention relates to field of circuit technology, and in particular to it is a kind of be embedded in boss Metal Substrate circuit board and its processing side
Method.
Background technique
Occur a kind of circuit board for being embedded in boss Metal Substrate at present, is asked for solving the heat dissipation of component on circuit board
Topic.Currently, the processing method of the circuit board of this insertion boss Metal Substrate is usually:
It slots in advance in each layer core material and each layer prepreg, is put into boss metal block, then carries out lamination pressing,
Heavy electroplating gold of copper etc. is carried out after pressing, forms the circuit board of insertion boss Metal Substrate.Due to carrying out heavy copper plating, insertion
Boss Metal Substrate be essentially all fine copper block.
Practice discovery, above-mentioned processing method have the drawback that
1, the above method is during pressing forms circuit board, and pressing is embedded in boss Metal Substrate together, still, for
The board structure of circuit of copper foil pressing, due to being easy the defects of contraposition offset and copper foil corrugation occur in pressing, it is difficult in use
The mode of stating is embedded in boss Metal Substrate；
2, above method needs carry out heavy copper plating after pressing, for shapes such as molybdenum block, tungsten block, molybdenum copper billet, tungsten copper blocks
The boss Metal Substrate of formula, since these materials and copper material difference are excessive, if be directly electroplated, electroplating effect can be very poor,
Therefore, the above method is difficult to ensure the electroplating quality of circuit board.
3, since the above method is during pressing forms circuit board, pressing is embedded in boss Metal Substrate, boss together
The exuberant prepreg of meeting around Metal Substrate cannot achieve boss Metal Substrate and the structure that internal layer ground connection conductive layer is directly connected.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board and its processing method for being embedded in boss Metal Substrate, to solve the prior art
Drawbacks described above present in the processing method of the circuit board of middle insertion boss Metal Substrate.
First aspect present invention provides a kind of processing method of circuit board for being embedded in boss Metal Substrate, comprising:
The step groove of boss shape is processed on circuit boards, and the step groove runs through the circuit board, and the step groove
Shoulder manifest an inner-layer conducting layer of the circuit board；In the shoulder of the step groove, prepreg or conductive bond are set
One boss Metal Substrate is embedded in the step groove by piece using pressing mode.
It is in the first possible implementation, described to process boss on circuit boards in conjunction with first aspect present invention
The step groove of shape includes: to open up hollow slots on the first laminar structure in advance, and first laminar structure includes an at least internal layer
Core plate and at least an insulating layer, and the setting resistance glue gasket in the hollow slots；It is laminated and is pressed based on first laminar structure
Obtain circuit board, wherein the one side of the resistance glue gasket is directly contacted with an inner-layer conducting layer of the circuit board；To the electricity
Road plate carries out first time controlled depth milling, and the depth of controlled depth milling arrives at the resistance glue gasket, after removing the resistance glue gasket, obtains bottom
Manifest the groove of the inner-layer conducting layer；Second of controlled depth milling is carried out to the circuit board, processes and is connected to the groove
Through slot, the length of the through slot is less than the length of the groove, and the width of the through slot is less than the width of the groove, described
Through slot and the groove collectively constitute the step groove of the boss shape through the circuit board.
In conjunction with the first possible implementation of first aspect present invention, in the second possible implementation, institute
After stating the step groove for processing boss shape on circuit boards, further includes: heavy copper and plating are carried out to the circuit board, it will be described
The cell wall of step groove metallizes.
In conjunction with second of possible implementation of first aspect present invention, in the third possible implementation, institute
It states after the cell wall of the step groove metallizes, further includes: make outer-layer circuit figure on the surface of the circuit board
In conjunction with the third possible implementation of first aspect present invention, in the fourth possible implementation, institute
It states after the surface of the circuit board makes outer-layer circuit figure, further includes: form anti-oxidation gold on the surface of the circuit board
Belong to protective layer
In conjunction with the first possible implementation of first aspect present invention, in a fifth possible implementation, institute
It states before one boss Metal Substrate is embedded in the step groove using pressing mode, further includes: in the table of the boss Metal Substrate
Face forms anti-oxidation coat of metal.
In conjunction with first aspect present invention the first to the 5th kind of possible implementation, the 6th kind of possible realization side
In formula, the boss Metal Substrate is the copper billet of step shape, molybdenum block, tungsten block, molybdenum copper billet or tungsten copper block.
In conjunction with the third or the 5th kind of possible implementation of first aspect present invention, the 7th kind of possible realization side
In formula, the anti-oxidation coat of metal is to change layer gold, or change silver layer, or change tin layers or Gold plated Layer or silver coating or silver-plated
Layer.
Second aspect of the present invention provides a kind of circuit board for being embedded in boss Metal Substrate, and the circuit board has the platform of boss shape
Rank slot, the step groove run through the circuit board；The step groove has been embedded in boss Metal Substrate, the step groove with it is described convex
The shoulder of platform Metal Substrate is connected by prepreg or conductive bond piece.
In conjunction with second aspect of the present invention, in the first possible implementation, the boss Metal Substrate is step shape
Copper billet, molybdenum block, tungsten block, molybdenum copper billet or tungsten copper block.
Therefore the embodiment of the present invention uses and forms circuit board in pressing and then process boss on circuit boards
The step groove of shape, and then it is embedded in the technical solution of boss Metal Substrate, achieve following technical effect:
1, due to being to form the step groove of circuit board and then processing boss shape in pressing and be embedded in boss Metal Substrate, because
This will not influence boss because of the defects of contraposition offset caused by pressing and copper foil corrugation for the board structure of circuit of copper foil pressing
The insertion of Metal Substrate；As it can be seen that the technology of the present invention is suitable for the PCB construction of core plate pressing and copper foil pressing simultaneously, can also apply
On HDI (High Density Interconnector, high density interconnection) plate of copper foil pressing.
2, in technical solution of the present invention, electroplating processes can be carried out to circuit board before being embedded in boss Metal Substrate, therefore,
For the boss Metal Substrate of the forms such as molybdenum block, tungsten block, molybdenum copper billet, tungsten copper block, circuit board and boss Metal Substrate can be separated and be electroplated,
Will not lead to the problem of can not be electroplated, it is ensured that the quality of plating；
3, when step groove due to processing boss shape on circuit boards, an inner-layer conducting layer of circuit board is made to be revealed in step
The shoulder of slot, it is thereby achieved that boss Metal Substrate is directly connected with internal layer ground connection conductive layer.
Detailed description of the invention
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of the processing method of circuit board for being embedded in boss Metal Substrate provided in an embodiment of the present invention；
Fig. 2 a is the structural schematic diagram of the first laminar structure in the embodiment of the present invention；
Fig. 2 b is the structural schematic diagram of the circuit board pressed in the embodiment of the present invention；
Fig. 2 c is the schematic diagram for processing groove in the embodiment of the present invention on circuit boards；
Fig. 2 d is to process through slot in the embodiment of the present invention on circuit boards, forms the schematic diagram of step groove；
Fig. 2 e is the schematic diagram for carrying out heavy copper plating in the embodiment of the present invention to circuit board；
Fig. 2 f is the schematic diagram of boss Metal Substrate in the embodiment of the present invention；
Fig. 2 g is the structural schematic diagram that the circuit board of boss Metal Substrate is embedded in the embodiment of the present invention.
Specific embodiment
The embodiment of the present invention provides a kind of circuit board and its processing method for being embedded in boss Metal Substrate, to solve the prior art
Drawbacks described above present in the processing method of the circuit board of middle insertion boss Metal Substrate.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work
It encloses.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides a kind of processing method of circuit board for being embedded in boss Metal Substrate, can wrap
It includes:
110, the step groove of boss shape is processed on circuit boards, and step groove runs through circuit board, and the shoulder of step groove is aobvious
Expose an inner-layer conducting layer of circuit board.
In the embodiment of the present invention, described circuit board can be to be pressed using multilayer core material and multilayer dielectric layer
Circuit board, be also possible to using multiple layer of copper layers of foil and multilayer dielectric layer pressing made of circuit board, can also be using multilayer
Circuit board made of core material, multiple layer of copper layers of foil and multilayer dielectric layer mixing pressing.Wherein, core material can be two-sided cover
Copper sheet, insulating layer can be prepreg (PP piece).
Pressing obtains circuit board and then carries out controlled depth milling processing to circuit board, process boss shape, through circuit board
Step groove.
In some embodiments of the invention, the step of processing the step groove of boss shape on circuit boards can include:
1101, hollow slots are opened up on the first laminar structure in advance, the first laminar structure includes that a core material and one are exhausted
Edge layer, and the setting resistance glue gasket in hollow slots.
As shown in Figure 2 a, the first described laminar structure may include at least a core material 201 and at least an insulating layer
202, core material 201 is one layer in the multilayer core material of built-up circuit plate, and insulating layer 202 is the multilayer of built-up circuit plate
One layer in insulating layer.In this step, hollow slots 203 are opened up on the first laminar structure in advance, and resistance is set in hollow slots
Glue gasket 204.The resistance glue gasket 204 is used in insulating layer 202 and adjacent another core material instead of prepreg material
Inner-layer conducting layer 205 directly contact.This is because the binding force of the inner-layer conducting layer 205 of prepreg and copper material is larger,
It is subsequent to be not readily separated when opening up groove, it is not easy to manifest inner-layer conducting layer 205.And hinder glue gasket 204 can be easily from copper
The inner-layer conducting layer 205 of material is removed.
1102, circuit board is obtained based on the stacking pressing of the first laminar structure, wherein hinder the one side and circuit board of glue gasket
One inner-layer conducting layer directly contacts.
In this step, for being provided with the first laminar structure of resistance glue gasket 204 in the hollow slots 203 opened up,
Other required structures are laminated again on the first laminar structure, final pressing obtains circuit board.Such as shown in Fig. 2 b, Ke Yi
An insulating layer and a copper foil layer is laminated in the one side of first laminar structure 203, and another side is laminated one absolutely after a core material is laminated again
Edge layer and a copper foil layer, pressing obtain one or six layers of circuit board.It is to be appreciated that board structure of circuit shown in Fig. 2 b is this
A kind of example of invention, is not intended to restrict the invention.
As shown in Figure 2 b, it is seen then that in the circuit board 20 after pressing, in the one side and the one of circuit board 20 of resistance glue gasket 204
Layer conductive layer 205 directly contacts.
1103, first time controlled depth milling is carried out to circuit board, the depth of controlled depth milling arrives at resistance glue gasket, removal resistance glue gasket
Afterwards, it obtains to bottom and manifests the groove of inner-layer conducting layer.
As shown in Figure 2 c, in this step, first time controlled depth milling, the region of controlled depth milling can be carried out from the one side of circuit board 20
Identical as the region where resistance glue gasket 204, the depth of controlled depth milling arrives at resistance glue gasket 204, in this way, after controlled depth milling, removal
Glue gasket 204 is hindered, obtains a groove 206, the bottom of the groove 206 manifests inner-layer conducting layer 205.
1104, second of controlled depth milling is carried out to circuit board, processes the through slot being connected to groove, through slot is less than groove, leads to
Slot and groove collectively constitute the step groove of the boss shape through circuit board.
As shown in Figure 2 d, in this step, can from the one surface or the other surface of circuit board 20 carry out second of controlled depth milling, second
The region of secondary controlled depth milling falls into the region where resistance glue gasket 204, but it should it is less than the region where resistance glue gasket 204, second
Secondary controlled depth milling directly mills and wears circuit board 20, processes the through slot 208 being connected to groove 206, and through slot 208 is less than groove 206, through slot
208 collectively constitute the step groove 209 through the boss shape of circuit board 20 with groove 206.Wherein, the length of through slot 208 is less than recessed
The length of slot 206, and the width of through slot 208 is less than the width of groove 206.It can be seen from figure 2d that the step groove of boss shape
At 209 shoulder 210, inner-layer conducting layer 205 is manifested.
Optionally, after step 1104, can also include:
1105, heavy copper and plating as shown in Figure 2 e, are carried out to circuit board 20, the cell wall of step groove 209 is metallized.This step
Suddenly it is optional step, if necessary to carry out interlayer interconnection by the cell wall of step groove 209, then this step can be executed, if not
It needs, this step can not also be executed.
Optionally, after step 1105, can also include:
1106, outer-layer circuit figure is made on the surface of circuit board 20.Conventional outer graphics technique can be used in this step
Processing, is no longer described in detail herein.
Optionally, after step 1106, can also include:
1107, anti-oxidation coat of metal is formed on the surface of circuit board 20.
Since copper foil layer is oxidized easily, in the embodiment of the present invention, preferably above-mentioned production outer-layer circuit patterning step it
Afterwards, then on the surface of circuit board 20 anti-oxidation coat of metal is formed.The anti-oxidation coat of metal can be through chemistry side
The change layer gold that method generates, or change silver layer, or change tin layers, it is also possible to the Gold plated Layer formed by electro-plating method or silver coating, or
Silver coating.
120, prepreg or conductive bond piece are set in the shoulder of step groove, using pressing mode by a boss Metal Substrate
It is embedded in step groove.
Such as Fig. 2 f, the embodiment of the present invention also provides one and the matched boss Metal Substrate 211 of step groove 209, the boss metal
Base 211 is used for the step groove 209 of embedded circuit plate 20, such as plays heat spreading function.In the embodiment of the present invention, boss Metal Substrate 211
It can be the copper billet of step shape, molybdenum block, tungsten block, molybdenum copper billet or tungsten copper block.
It aoxidizes in order to prevent, anti-oxidation metal coating can be formed on the surface of boss Metal Substrate 211 before embedding operation
Layer.The anti-oxidation coat of metal can be the change layer gold generated by chemical method, or change silver layer, or change tin layers, can also be with
It is the Gold plated Layer formed by electro-plating method or silver coating or silver coating.
As shown in Figure 2 g, in this step, prepreg or conductive bond piece first are set in the shoulder 210 of step groove 209
212, then boss Metal Substrate 211 is embedded in step groove 209 using pressing mode.Prepreg or conductive bond piece 212 can
Its cementation is electrically connected if necessary to boss Metal Substrate 211 with inner-layer conducting layer 205, then setting conductive bond piece may be selected,
Such as when inner-layer conducting layer 205 serves as ground electric layer；If you do not need to boss Metal Substrate 211 is electrically connected with inner-layer conducting layer 205,
Setting prepreg then may be selected.
So far, the circuit board of the insertion boss Metal Substrate of the embodiment of the present invention is obtained.
Therefore the embodiment of the present invention uses and forms circuit board in pressing and then process boss on circuit boards
The step groove of shape, and then it is embedded in the technical solution of boss Metal Substrate, achieve following technical effect:
1, due to being to form the step groove of circuit board and then processing boss shape in pressing and be embedded in boss Metal Substrate, because
This will not influence boss because of the defects of contraposition offset caused by pressing and copper foil corrugation for the board structure of circuit of copper foil pressing
The insertion of Metal Substrate；As it can be seen that the technology of the present invention is suitable for the PCB construction of core plate pressing and copper foil pressing simultaneously, can also apply
On HDI (High Density Interconnector, high density interconnection) plate of copper foil pressing.
2, in technical solution of the present invention, electroplating processes can be carried out to circuit board before being embedded in boss Metal Substrate, therefore,
For the boss Metal Substrate of the forms such as molybdenum block, tungsten block, molybdenum copper billet, tungsten copper block, circuit board and boss Metal Substrate can be separated and be electroplated,
Will not lead to the problem of can not be electroplated, it is ensured that the quality of plating；
3, when step groove due to processing boss shape on circuit boards, an inner-layer conducting layer of circuit board is made to be revealed in step
The shoulder of slot, it is thereby achieved that boss Metal Substrate is directly connected with internal layer ground connection conductive layer.
Embodiment two,
Fig. 2 g is please referred to, the embodiment of the present invention provides a kind of circuit board 20 for being embedded in boss Metal Substrate.
Circuit board 20 has the step groove 209 of boss shape, and step groove 209 runs through circuit board 20；Step groove 209 has been embedded in
Boss Metal Substrate 211, step groove 209 are connect with the shoulder 210 of boss Metal Substrate 211 by prepreg or conductive bond piece.
Optionally, boss Metal Substrate is the copper billet of step shape, molybdenum block, tungsten block, molybdenum copper billet or tungsten copper block.
Therefore the embodiment of the invention provides a kind of circuit board for being embedded in boss Metal Substrate, following technology is achieved
Effect:
1, due to being to form the step groove of circuit board and then processing boss shape in pressing and be embedded in boss Metal Substrate, because
This will not influence boss because of the defects of contraposition offset caused by pressing and copper foil corrugation for the board structure of circuit of copper foil pressing
The insertion of Metal Substrate；As it can be seen that the technology of the present invention is suitable for the PCB construction of core plate pressing and copper foil pressing simultaneously, can also apply
On HDI (High Density Interconnector, high density interconnection) plate of copper foil pressing.
2, in technical solution of the present invention, electroplating processes can be carried out to circuit board before being embedded in boss Metal Substrate, therefore,
For the boss Metal Substrate of the forms such as molybdenum block, tungsten block, molybdenum copper billet, tungsten copper block, circuit board and boss Metal Substrate can be separated and be electroplated,
Will not lead to the problem of can not be electroplated, it is ensured that the quality of plating；
3, when step groove due to processing boss shape on circuit boards, an inner-layer conducting layer of circuit board is made to be revealed in step
The shoulder of slot, it is thereby achieved that boss Metal Substrate is directly connected with internal layer ground connection conductive layer.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for the various method embodiments described above, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and not necessarily the present invention must for related actions and modules
Must.
The circuit board and its processing method for being provided for the embodiments of the invention insertion boss Metal Substrate above have carried out in detail
It is thin to introduce, but the above description of the embodiment is only used to help understand the method for the present invention and its core ideas, should not be construed as
Limitation of the present invention.Those skilled in the art, according to the thought of the present invention, the invention discloses technical scope
Interior, any changes or substitutions that can be easily thought of, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of processing method for the circuit board for being embedded in boss Metal Substrate characterized by comprising
The step groove of boss shape is processed on circuit boards, and the step groove runs through the circuit board, and the shoulder of the step groove
Portion manifests an inner-layer conducting layer of the circuit board；
Conductive bond piece is set in the shoulder of the step groove, a boss Metal Substrate is embedded in by the step groove using pressing mode
In, so that the boss Metal Substrate is directly connected with internal layer ground connection conductive layer.
2. the method according to claim 1, wherein the step groove packet for processing boss shape on circuit boards
It includes:
Hollow slots are opened up on the first laminar structure in advance, first laminar structure includes an at least core material and at least one
Insulating layer, and the setting resistance glue gasket in the hollow slots；
Circuit board is obtained based on first laminar structure stacking pressing, wherein the one side of the resistance glue gasket and the circuit
One inner-layer conducting layer of plate directly contacts；
First time controlled depth milling is carried out to the circuit board, the depth of controlled depth milling arrives at the resistance glue gasket, removes the resistance rubber mat
After piece, obtains to bottom and manifest the groove of the inner-layer conducting layer；
Second of controlled depth milling is carried out to the circuit board, processes the through slot being connected to the groove, the length of the through slot is small
In the length of the groove, the width of the through slot is less than the width of the groove, and the through slot is collectively constituted with the groove
Through the step groove of the boss shape of the circuit board.
3. according to the method described in claim 2, it is characterized in that, the step groove for processing boss shape on circuit boards it
Afterwards, further includes:
Heavy copper and plating are carried out to the circuit board, the cell wall of the step groove is metallized.
4. according to the method described in claim 3, it is characterized in that, being gone back after the cell wall metallization by the step groove
Include:
Outer-layer circuit figure is made on the surface of the circuit board.
5. according to the method described in claim 4, it is characterized in that, the surface in the circuit board makes outer-layer circuit figure
After shape, further includes:
Anti-oxidation coat of metal is formed on the surface of the circuit board.
6. the method according to claim 1, wherein described be embedded in institute for a boss Metal Substrate using pressing mode
Before stating in step groove, further includes:
Anti-oxidation coat of metal is formed on the surface of the boss Metal Substrate.
7. according to claim 1 to any method in 6, which is characterized in that
The boss Metal Substrate is copper billet, molybdenum block, tungsten block, molybdenum copper billet or the tungsten copper block of step shape.
8. method according to claim 5 or 6, which is characterized in that
The anti-oxidation coat of metal is to change layer gold, change silver layer, change tin layers, Gold plated Layer or silver coating, describedization layer gold, described
Change silver layer and describedization tin layers to generate by chemical method, the Gold plated Layer and the silver coating are raw by electro-plating method
At.
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| CN201410734398.1A CN105722302B (en) | 2014-12-04 | 2014-12-04 | It is embedded in the circuit board and its processing method of boss Metal Substrate |
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| CN201410734398.1A CN105722302B (en) | 2014-12-04 | 2014-12-04 | It is embedded in the circuit board and its processing method of boss Metal Substrate |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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