CN102291940A - Method for making printed circuit board (PCB) with step groove - Google Patents
Method for making printed circuit board (PCB) with step groove Download PDFInfo
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- CN102291940A CN102291940A CN2011102188346A CN201110218834A CN102291940A CN 102291940 A CN102291940 A CN 102291940A CN 2011102188346 A CN2011102188346 A CN 2011102188346A CN 201110218834 A CN201110218834 A CN 201110218834A CN 102291940 A CN102291940 A CN 102291940A
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- location hole
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- prepreg
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Abstract
The invention relates to a method for making a printed circuit board (PCB) with a step groove. The method comprises the following steps of: 1, providing an inner core board and arranging a first positioning hole; 2, arranging a first prepreg and a second prepreg on the two sides of the inner core board, and respectively arranging through holes; 3, arranging a first outer core board and a second outer core board at outer sides of the first prepreg and the second prepreg, and forming a second positioning hole in the second outer core board; 4, providing a gasket, burying the gasket in an accommodating space formed by the first positioning hole, the through holes and the second positioning hole, and positioning the gasket in the center of the through holes of the first prepreg and the second prepreg by the first positioning hole and the second positioning hole; 5, laminating the inner core board, the prepregs and the outer core boards together to form the PCB with the built-in gasket; 6, performing depth control and milling on the laminated PCB, and milling from the second outer core board to the inside of the gasket; and 7, taking the gasket out to form a step groove. The method is short in flow and high in efficiency, and ensures uniform flowing glue around the step groove.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to a kind of manufacture method of pcb board of tool step trough.
Background technology
Wiring board assembling and assembling need be produced step trough in the pcb board part often, satisfying the raising with wiring density dwindled of modularization assembling volume, and the realization of satisfying specific function.For example, in the circuit board that is provided with the microwave radio emitter, often need suitable big or small step trough in case loss that the stop signal disresonance causes and decay.
Pcb board often adopts the silica gel sheet to be filled in the step trough gummosis is stopped when making step trough now.But it is inaccurate that filling gel sheet pressing plate needs repeatedly pressing and silica gel sheet to locate, and causes long flow path and gummosis amount to be difficult to stable control.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of manufacture method of pcb board of tool step trough, the mode of a lamination pressing of employing is made the step trough in the route plate, and flow process is short and efficient is high, and by embedding pad and position control, guarantee step trough around gummosis even.
For achieving the above object, the invention provides a kind of manufacture method of pcb board of tool step trough, may further comprise the steps:
Step 1: core material is provided, on core material, offers first location hole;
Step 2: first, second prepreg is provided, is located at the upper and lower both sides of core material respectively, first location hole of corresponding core material is offered through hole on first, second prepreg;
Step 3: first, second outer central layer is provided, is located at the outside of first, second prepreg respectively, first location hole of corresponding core material is offered second location hole on the second outer central layer that is positioned at downside;
Step 4: pad is provided, pad is embedded in by first location hole, through hole and second location hole formed in the receiving space, and second location hole of first location hole by core material and the second outer central layer is positioned to pad at the through hole center of first, second prepreg;
Step 5: lamination, core material, prepreg and outer central layer are pressed together, form the pcb board of inner embedding pad;
Step 6: the pcb board behind the lamination controlled mill plate deeply, mill to pad inside by the second outer central layer;
Step 7: take out pad, form step trough.
Wherein, the material of described pad is a polytetrafluoroethylene.
Wherein, in the described step 4, carried out surface coarsening before pad is inserted and handled, with the seal of reinforced gasket and first, second outer central layer applying.
Wherein, described surface coarsening is treated to plasma-activated processing.
Wherein, described second location hole runs through the second outer central layer, the aperture of the through hole of described first prepreg is greater than the aperture of first location hole of core material, the aperture of the through hole of described second prepreg is less than the aperture of first location hole of core material, the aperture of second location hole of the described second outer central layer is less than the aperture of the through hole of second prepreg, in the described step 4, the pad that is provided comprises body and the projection that is extended downwards by body, and described projection is located in second location hole of the through hole of second prepreg and the second outer central layer.
Wherein, in the described step 2, the number of offering of through hole is a plurality of on second prepreg, in the described step 3 on the second outer central layer on the number of the number of second location hole and the set projection of step 4 Intermediate gasket and second prepreg number of through hole identical, and the aperture of second location hole of the aperture of the through hole of described second prepreg and the second outer central layer is all less than the aperture of first location hole of core material.
Wherein, in the described step 6, mill the control of the plate degree of depth and mill to the centre position of core material thickness direction.
Wherein, described second location hole is a blind hole, the aperture of the through hole of described first, second prepreg equates and all greater than the aperture of first location hole of core material, the aperture of second location hole of the described second outer central layer equals the aperture of first location hole of core material.
Wherein, in the described step 6, mill the control of the plate degree of depth and mill to the centre position of spacer thickness direction.
Wherein, before carry out step 5, second location hole of second outer central layer bottom is manufactured with plated-through hole, line pattern or protective layer.
Beneficial effect of the present invention: the manufacture method of the pcb board of tool step trough of the present invention, first location hole by core material and second location hole of the second outer central layer are positioned to pad at the through hole center of first, second prepreg, guarantee that pad is positioned at the center of step trough, make that pad can be to evenly expanding with resistance glue in the lamination process of HTHP all around, gummosis is even all around to guarantee step trough.And, by burying pad underground, only need to carry out the pcb board that lamination can be made the tool step trough, it is short and efficient is high to make flow process.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 is the flow chart of the manufacture method of the pcb board of tool step trough of the present invention.
When Fig. 2 makes the reduced size step trough for the manufacture method of the pcb board of employing tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
When Fig. 3 makes the large-size step trough for the manufacture method of the pcb board of employing tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
Embodiment
As shown in Figure 1, the manufacture method of the pcb board of tool step trough of the present invention comprises the steps;
Step 1: core material is provided, offers first location hole on core material, wherein the aperture of first location hole is identical with the aperture of waiting the step trough of making;
Step 2: first, second prepreg is provided, is located at the upper and lower both sides of core material respectively, first location hole of corresponding core material is offered through hole on first, second prepreg;
Step 3: first, second outer central layer is provided, be located at the outside of first, second prepreg respectively, first location hole of corresponding core material is offered second location hole on the second outer central layer that is positioned at downside, and described second location hole is for running through the second outer central layer or being blind hole;
Step 4: pad is provided, pad is embedded in by first location hole, the through hole and second location hole form in the receiving space, and pad is positioned to first by first location hole of core material and second location hole of the second outer central layer, the through hole center of second prepreg, wherein, the material of pad is a polytetrafluoroethylene (PTFE), and carrying out surface coarsening before pad is inserted handles, with reinforced gasket and first, the seal that the second outer central layer is fitted, described surface coarsening is treated to plasma-activated processing, in addition, second location hole of second outer central layer bottom is manufactured with plated-through hole, line pattern or protective layer;
Step 5: lamination, core material, prepreg and outer central layer are pressed together by HTHP, form the pcb board of inner embedding pad;
Step 6: the pcb board behind the lamination controlled mill plate deeply, mill to pad inside, promptly mill the control of the plate degree of depth and mill pad, do not wear but do not mill by the second outer central layer;
Step 7: take out pad, form step trough.
For the step trough of different sizes, slightly different when pad is positioned control, more even to guarantee the gummosis around the step trough.
As shown in Figure 2, when making reduced size step trough (being the step trough of size) less than 20mmx20mm for the manufacture method of the pcb board that adopts tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
When making the step trough 16 of reduced size, the second outer central layer 10, second prepreg 11, core material 12, first prepreg 13 and the first outer central layer 14 that is provided is successively by descending from last stacked.Wherein, second location hole 101 runs through the second outer central layer 10, the aperture of the through hole 131 on first prepreg 13 is greater than the aperture of first location hole 121 of core material 12, the aperture of the through hole 111 of second prepreg 11 is less than the aperture of first location hole 121 of core material 12, and the aperture of second location hole 101 of the second outer central layer 10 is less than the aperture of the through hole 131 of second prepreg 11.Pad 15 comprises body 151 and the projections 152 that extended by body 151 downwards, and described projection 152 is located in second location hole 101 of the through hole 111 of second prepreg 11 and the second outer central layer 10.For the step trough 16 of making reduced size, body 151 by pad 15 cooperates with first location hole 121 of core material 12, and the projection 152 of pad 15 and second location hole 101 that runs through the second outer central layer 10, can accurately locate pad 15.By after the pressing process of HTHP, reach the surface around the projection 152 of pad 15 and blocked fully by resin.
When making the step trough 16 of reduced size, the number of offering of through hole 111 can be for one or more on second prepreg 11, on the second outer central layer 10 on the number of the number of second location hole 101 and pad 15 set projections 152 and second prepreg 11 number of through hole 111 identical, and the aperture of second location hole 101 of the aperture of the through hole 111 of described second prepreg 11 and the second outer central layer 10 is all less than the aperture of first location hole 121 of core material 12.In addition, the pcb board behind the lamination is controlled when milling plate deeply, milled the control of the plate degree of depth and mill centre position (shown in frame of broken lines among Fig. 2) to core material 12 thickness directions.
As shown in Figure 3, when making large-size step trough (being the step trough 16 of size) more than or equal to 20mmx20mm for the manufacture method of the pcb board that adopts tool step trough of the present invention, the cross-sectional view of each preparatory phase pcb board.
When making the step trough 26 of large-size, the second outer central layer 20, second prepreg 21, core material 22, first prepreg 23 and the first outer central layer 24 that is provided is successively by descending from last stacked.Wherein, second location hole 201 on the second outer central layer 20 is a blind hole, the aperture of the through hole 231,211 of first, second prepreg 23,21 equates and all greater than the aperture of first location hole 221 of core material 22, the aperture of second location hole 201 of the second outer central layer 20 equals the aperture of first location hole 221 of core material 22.Step trough 26 for making large-size then need not be provided with projection, adopts the pad 25 of external diameter homogeneous, can accurately locate by first location hole 221 and 201 pairs of pads 25 of second location hole.In addition, the pcb board behind the lamination is controlled when milling plate deeply, milled the control of the plate degree of depth and mill centre position (shown in frame of broken lines among Fig. 3) to pad 25 thickness directions.
In the manufacture method of the pcb board of above-mentioned tool step trough, first location hole by core material and second location hole of the second outer central layer are positioned to pad at the through hole center of first, second prepreg, guarantee that pad is positioned at the center of step trough, make that pad can be to evenly expanding with resistance glue in the lamination process of HTHP all around, gummosis is even all around to guarantee step trough.And, by burying pad underground, only need to carry out the pcb board that lamination can be made the tool step trough, it is short and efficient is high to make flow process.In addition, add large compensation by the through hole to first, second prepreg, gummosis enters in the step trough in the time of can stoping pressure high effectively.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (10)
1. the manufacture method of the pcb board of a tool step trough is characterized in that, may further comprise the steps:
Step 1: core material is provided, on core material, offers first location hole;
Step 2: first, second prepreg is provided, is located at the upper and lower both sides of core material respectively, first location hole of corresponding core material is offered through hole on first, second prepreg;
Step 3: first, second outer central layer is provided, is located at the outside of first, second prepreg respectively, first location hole of corresponding core material is offered second location hole on the second outer central layer that is positioned at downside;
Step 4: pad is provided, pad is embedded in by first location hole, through hole and second location hole formed in the receiving space, and second location hole of first location hole by core material and the second outer central layer is positioned to pad at the through hole center of first, second prepreg;
Step 5: lamination, core material, prepreg and outer central layer are pressed together, form the pcb board of inner embedding pad;
Step 6: the pcb board behind the lamination controlled mill plate deeply, mill to pad inside by the second outer central layer;
Step 7: take out pad, form step trough.
2. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, the material of described pad is a polytetrafluoroethylene.
3. the manufacture method of the pcb board of tool step trough as claimed in claim 1 or 2 is characterized in that, in the described step 4, carries out surface coarsening before pad is inserted and handles, with the seal of reinforced gasket and first, second outer central layer applying.
4. the manufacture method of the pcb board of tool step trough as claimed in claim 3 is characterized in that, described surface coarsening is treated to plasma-activated processing.
5. the manufacture method of the pcb board of tool step trough as claimed in claim 1, it is characterized in that, described second location hole runs through the second outer central layer, the aperture of the through hole of described first prepreg is greater than the aperture of first location hole of core material, the aperture of the through hole of described second prepreg is less than the aperture of first location hole of core material, the aperture of second location hole of the described second outer central layer is less than the aperture of the through hole of second prepreg, in the described step 4, the pad that is provided comprises body and the projection that is extended downwards by body, and described projection is located in second location hole of the through hole of second prepreg and the second outer central layer.
6. the manufacture method of the pcb board of tool step trough as claimed in claim 5, it is characterized in that, in the described step 2, the number of offering of through hole is a plurality of on second prepreg, in the described step 3 on the second outer central layer on the number of the number of second location hole and the set projection of step 4 Intermediate gasket and second prepreg number of through hole identical, and the aperture of second location hole of the aperture of the through hole of described second prepreg and the second outer central layer is all less than the aperture of first location hole of core material.
7. the manufacture method of the pcb board of tool step trough as claimed in claim 6 is characterized in that, in the described step 6, mills the control of the plate degree of depth and mills to the centre position of core material thickness direction.
8. the manufacture method of the pcb board of tool step trough as claimed in claim 1, it is characterized in that, described second location hole is a blind hole, the aperture of the through hole of described first, second prepreg equates and all greater than the aperture of first location hole of core material, the aperture of second location hole of the described second outer central layer equals the aperture of first location hole of core material.
9. the manufacture method of the pcb board of tool step trough as claimed in claim 8 is characterized in that, in the described step 6, mills the control of the plate degree of depth and mills to the centre position of spacer thickness direction.
10. the manufacture method of the pcb board of tool step trough as claimed in claim 1 is characterized in that, before carry out step 5, second location hole of second outer central layer bottom is manufactured with plated-through hole, line pattern or protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110218834 CN102291940B (en) | 2011-08-01 | 2011-08-01 | Method for making printed circuit board (PCB) with step groove |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110218834 CN102291940B (en) | 2011-08-01 | 2011-08-01 | Method for making printed circuit board (PCB) with step groove |
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| CN102291940A true CN102291940A (en) | 2011-12-21 |
| CN102291940B CN102291940B (en) | 2013-05-01 |
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| CN 201110218834 Active CN102291940B (en) | 2011-08-01 | 2011-08-01 | Method for making printed circuit board (PCB) with step groove |
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| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
| CN103517560A (en) * | 2012-06-27 | 2014-01-15 | 深南电路有限公司 | Processing method of PCB stepped groove |
| CN104270896A (en) * | 2014-09-30 | 2015-01-07 | 苏州安洁科技股份有限公司 | Process for overcoming deviation of cover films during electrode slice shape punching |
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| CN104507261A (en) * | 2014-12-18 | 2015-04-08 | 安徽四创电子股份有限公司 | Method for manufacturing microwave printed circuit board with step groove |
| CN104735912A (en) * | 2015-03-10 | 2015-06-24 | 广州杰赛科技股份有限公司 | Step plate manufacturing method |
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| CN105188283A (en) * | 2015-08-06 | 2015-12-23 | 高德（无锡）电子有限公司 | Manufacturing technique of stepped-design-based PCB |
| CN105246275A (en) * | 2015-11-13 | 2016-01-13 | 中国电子科技集团公司第二十九研究所 | Multilayer microwave printed circuit board blind slot machining method and used spacers thereof |
| CN105451468A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Method of manufacturing a circuit board |
| CN105451450A (en) * | 2015-12-14 | 2016-03-30 | 深圳崇达多层线路板有限公司 | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow |
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| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| CN109068504A (en) * | 2018-10-30 | 2018-12-21 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
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| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN103517560A (en) * | 2012-06-27 | 2014-01-15 | 深南电路有限公司 | Processing method of PCB stepped groove |
| CN103517560B (en) * | 2012-06-27 | 2017-02-15 | 深南电路有限公司 | Processing method of PCB stepped groove |
| CN102769996A (en) * | 2012-08-03 | 2012-11-07 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN102769996B (en) * | 2012-08-03 | 2015-03-18 | 广州杰赛科技股份有限公司 | Machining method of printed circuit board (PCB) of step blind slot |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
| CN105451468A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Method of manufacturing a circuit board |
| CN104270896A (en) * | 2014-09-30 | 2015-01-07 | 苏州安洁科技股份有限公司 | Process for overcoming deviation of cover films during electrode slice shape punching |
| CN104284532A (en) * | 2014-09-30 | 2015-01-14 | 台山市精诚达电路有限公司 | Processing method for multilayer flexible printed circuit board |
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| CN104507261A (en) * | 2014-12-18 | 2015-04-08 | 安徽四创电子股份有限公司 | Method for manufacturing microwave printed circuit board with step groove |
| CN104507261B (en) * | 2014-12-18 | 2017-10-27 | 安徽四创电子股份有限公司 | A kind of preparation method of the microwave printed board containing step groove |
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| CN104735912B (en) * | 2015-03-10 | 2018-07-06 | 广州杰赛科技股份有限公司 | A kind of production method of stepped plate |
| CN105188283A (en) * | 2015-08-06 | 2015-12-23 | 高德（无锡）电子有限公司 | Manufacturing technique of stepped-design-based PCB |
| CN105163527A (en) * | 2015-09-10 | 2015-12-16 | 珠海城市职业技术学院 | Manufacturing method of semi-flexible circuit board |
| CN105163527B (en) * | 2015-09-10 | 2018-08-31 | 珠海城市职业技术学院 | A kind of production method of half soft-circuit board |
| CN105246275A (en) * | 2015-11-13 | 2016-01-13 | 中国电子科技集团公司第二十九研究所 | Multilayer microwave printed circuit board blind slot machining method and used spacers thereof |
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| CN106255349A (en) * | 2016-08-16 | 2016-12-21 | 生益电子股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106686914A (en) * | 2016-12-30 | 2017-05-17 | 生益电子股份有限公司 | PCB stepped groove processing method capable of avoiding resin residue |
| CN106686914B (en) * | 2016-12-30 | 2019-04-16 | 生益电子股份有限公司 | A kind of processing method for the PCB step groove avoiding resin residue |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| CN110867508A (en) * | 2018-08-28 | 2020-03-06 | 青岛海信电器股份有限公司 | PCB (printed circuit board), manufacturing method thereof, lamp panel and display device |
| CN109068504A (en) * | 2018-10-30 | 2018-12-21 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove that side wall is non-metallic |
| CN109068504B (en) * | 2018-10-30 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of stepped groove with non-metalized side wall and PCB |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
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