CN114286508A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN114286508A CN114286508A CN202011042010.3A CN202011042010A CN114286508A CN 114286508 A CN114286508 A CN 114286508A CN 202011042010 A CN202011042010 A CN 202011042010A CN 114286508 A CN114286508 A CN 114286508A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 174
- 229910052751 metal Inorganic materials 0.000 claims abstract description 174
- 239000000758 substrate Substances 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 20
- 238000009713 electroplating Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000003631 wet chemical etching Methods 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000608 laser ablation Methods 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000007781 pre-processing Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000003292 glue Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 8
- 238000005286 illumination Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
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Abstract
The invention discloses a circuit board and a manufacturing method thereof, wherein the manufacturing method of the circuit board comprises the steps of obtaining a pre-processed circuit board; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board; forming a window on the cover layer to expose the surface of the core plate; forming a groove on the exposed core plate; exposing the metal layer far away from the covering layer in the core plate through the groove; and filling a metal base in the groove to form the circuit board. According to the invention, the groove is formed on the circuit board, and the metal base is formed in the groove, so that the metal bases with various sizes can be conveniently formed in the circuit board, and the heat generated by the circuit board can be conducted to the outside through the metal base; the metal base is directly generated on the circuit board, so that the connection strength of the metal base and the circuit board can be improved, the bonding strength of the circuit board and the metal base is improved, the problems of height difference and glue flowing are avoided, and the circuit board has good reliability and heat dissipation.
Description
Technical Field
The invention relates to the technical field of processing of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
With the development of technology, people have higher and higher integration requirements on integrated circuit boards, and multilayer printed circuit boards have appeared to meet the requirements. At present, electronic products are developed to be light, thin, small, high-density and multifunctional, and the assembly density and the integration level of electronic components on a multilayer printed circuit board are higher and higher. Among them, the flexible printed circuit board is increasingly used in various fields due to its characteristics of high wiring density, light weight, thin thickness, good bending performance, and the like. Therefore, it is very important to solve the heat dissipation problem of the flexible circuit board.
Disclosure of Invention
The invention mainly solves the technical problem of providing a circuit board and a manufacturing method thereof, and solves the heat dissipation problem of the flexible circuit board in the prior art.
In order to solve the technical problems, the first technical scheme adopted by the invention is as follows: provided is a method for manufacturing a wiring board, including: acquiring a pretreatment circuit board; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board; forming a window on the cover layer to expose the surface of the core plate; forming a groove on the exposed core plate; exposing the metal layer far away from the covering layer in the core plate through the groove; and filling a metal base in the groove to form the circuit board.
Obtaining a pretreatment circuit board; the method for pretreating the circuit board comprises the following steps of: obtaining a core board; the core plate comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two opposite surfaces of the substrate; and arranging a covering layer on the surface of the first metal layer far away from the substrate.
Wherein, the step of forming a window on the cover layer to expose the surface of the core plate specifically comprises: a window is formed on the capping layer through an exposure and development operation such that a surface of the first metal layer is exposed through the window.
Wherein a groove is formed on the exposed core plate; the step of exposing the metal layer far away from the covering layer in the core board through the groove specifically comprises the following steps: processing the exposed part of the first metal layer through the window by wet chemical etching to expose the substrate of the core plate through the window; and processing the part of the substrate exposed through the window by a laser ablation method to form a groove, so that the second metal layer is exposed through the groove.
The substrate is a polyimide layer, and the first metal layer and the second metal layer are copper layers.
The step of filling the metal base in the groove to form the circuit board specifically comprises the following steps: depositing a seed layer on the inner wall of the groove; and forming a metal matrix in the groove by electroplating.
The step of forming the metal base in the groove in an electroplating manner specifically comprises the following steps: electroplating the surface of the groove formed in the surface of the pre-treated circuit board to enable the electroplated metal to be filled in the groove to form a metal base, wherein the metal base is higher than the exposed surface of the pre-treated circuit board; and removing the covering layer, and enabling the exposed surface of the metal base to be flush with the surface of the core plate.
Wherein, the distance that the metal matrix is flush with or higher than the exposed surface of the pretreatment circuit board is not more than 5 microns.
Wherein the length and width of the window are no greater than 3 mm.
In order to solve the above technical problems, the second technical solution adopted by the present invention is: provided is a circuit board manufactured by the manufacturing method of the circuit board.
The invention has the beneficial effects that: the circuit board and the manufacturing method thereof are provided, which are different from the prior art, the manufacturing method of the circuit board comprises the steps of obtaining a pre-processed circuit board; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board; forming a window on the cover layer to expose the surface of the core plate; forming a groove on the exposed core plate; exposing the metal layer far away from the covering layer in the core plate through the groove; and filling a metal base in the groove to form the circuit board. According to the circuit board, the groove is formed on the circuit board, and the metal base is formed in the groove, so that the metal bases with various sizes can be conveniently formed in the circuit board, and heat generated by the circuit board can be conducted to the outside through the metal base; the metal base is directly generated on the circuit board, so that the connection strength of the metal base and the circuit board can be improved, the bonding strength of the circuit board and the metal base is improved, the problems of height difference and glue flowing are avoided, and the circuit board has good reliability and heat dissipation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a method for manufacturing a circuit board according to the present invention;
FIG. 2 is a schematic flow chart of another embodiment of the method for manufacturing a wiring board according to the present invention;
fig. 3 is a schematic structural diagram of step S21 in the manufacturing method of the circuit board provided in fig. 2;
fig. 4 is a schematic structural diagram of step S22 in the manufacturing method of the wiring board provided in fig. 2;
fig. 5 is a schematic structural diagram of step S23 in the manufacturing method of the wiring board provided in fig. 2;
fig. 6 is a schematic structural diagram of step S24 in the manufacturing method of the wiring board provided in fig. 2;
fig. 7 is a schematic structural diagram of step S25 in the manufacturing method of the wiring board provided in fig. 2;
fig. 8 is a schematic structural diagram of step S26 in the manufacturing method of the wiring board provided in fig. 2;
fig. 9 is a schematic structural diagram of step S27 in the manufacturing method of the wiring board provided in fig. 2;
fig. 10 is a schematic structural diagram of step S28 in the manufacturing method of the wiring board provided in fig. 2;
fig. 11 is a schematic structural diagram of a circuit board provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular system structures, interfaces, techniques, etc. in order to provide a thorough understanding of the present application.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. Further, the term "plurality" herein means two or more than two.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the described features. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators such as up, down, left, right, front, and rear … … in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a method for manufacturing a circuit board according to the present invention. In this embodiment, a method for manufacturing a circuit board is provided, and the circuit board in this embodiment may be a flexible circuit board.
S11: acquiring a pretreatment circuit board; the pre-processed circuit board comprises a core board and a covering layer arranged on the surface of the core board.
Specifically, a core board is obtained; the core plate comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two opposite surfaces of the substrate; and arranging a covering layer on the surface of the first metal layer far away from the substrate.
S12: a window is formed in the cover layer to expose a surface of the core.
Specifically, a window is formed on the cover layer by an exposure and development operation so that the surface of the first metal layer is exposed through the window. Wherein the length and width of the window are no greater than 3 mm.
S13: forming a groove on the exposed core plate; the metal layer in the core board far away from the covering layer is exposed through the groove.
Specifically, the part of the first metal layer exposed through the window is processed through wet chemical etching, so that the substrate of the core plate is exposed through the window; and processing the part of the substrate exposed through the window by a laser ablation method to form a groove, so that the second metal layer is exposed through the groove.
S14: and filling a metal base in the groove to form the circuit board.
Specifically, a seed layer is deposited on the inner wall of the groove; and forming a metal matrix in the groove by electroplating. And electroplating the surface of the groove arranged on the surface of the pretreatment circuit board to enable the electroplating metal to be filled in the groove to form a metal base, wherein the metal base is higher than the exposed surface of the pretreatment circuit board, and the distance from the metal base to the exposed surface of the pretreatment circuit board is not more than 5 microns. And removing the covering layer, and enabling the exposed surface of the metal base to be flush with the surface of the core plate. The copper surface is smooth, and the copper thickness meets the requirements of customers, so that a metal base is embedded into the flexible circuit board in an electroplating mode. The copper surface obtained by the process has good flatness and is beneficial to the later-stage circuit manufacturing. And the problems of poor bonding force of the metal base, height difference, gummosis and the like are avoided, so that the circuit board has good reliability and heat dissipation.
In the manufacturing method of the circuit board provided by this embodiment, the circuit board is pretreated by obtaining; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board; forming a window on the cover layer to expose the surface of the core plate; forming a groove on the exposed core plate; exposing the metal layer far away from the covering layer in the core plate through the groove; and filling a metal base in the groove to form the circuit board. According to the circuit board, the groove is formed on the circuit board, and the metal base is formed in the groove, so that the metal bases with various sizes can be conveniently formed in the circuit board, and heat generated by the circuit board can be conducted to the outside through the metal base; the metal base is directly generated on the circuit board, so that the connection strength of the metal base and the circuit board can be improved, the bonding strength of the circuit board and the metal base is improved, the problems of height difference and glue flowing are avoided, and the circuit board has good reliability and heat dissipation; and the problem of processing the circuit board with the metal matrix smaller than 3mm x 3mm is solved.
Referring to fig. 2 to 10, fig. 2 is a schematic flow chart of another embodiment of a method for manufacturing a circuit board according to the present invention; fig. 3 is a schematic structural diagram of step S21 in the manufacturing method of the circuit board provided in fig. 2; fig. 4 is a schematic structural diagram of step S22 in the manufacturing method of the wiring board provided in fig. 2; fig. 5 is a schematic structural diagram of step S23 in the manufacturing method of the wiring board provided in fig. 2; fig. 6 is a schematic structural diagram of step S24 in the manufacturing method of the wiring board provided in fig. 2; fig. 7 is a schematic structural diagram of step S25 in the manufacturing method of the wiring board provided in fig. 2; fig. 8 is a schematic structural diagram of step S26 in the manufacturing method of the wiring board provided in fig. 2; fig. 9 is a schematic structural diagram of step S27 in the manufacturing method of the wiring board provided in fig. 2; fig. 10 is a schematic structural diagram of step S28 in the manufacturing method of the wiring board provided in fig. 2. The embodiment provides a manufacturing method of a circuit board. Wherein the circuit board 100 may be a flexible circuit board (FPC). The manufacturing method of the wiring board 100 includes the following steps.
S21: obtaining a core board; the core plate comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two opposite surfaces of the substrate.
Specifically, referring to fig. 3, a core board 1 to be processed with a heat dissipation metal matrix 3 is obtained, where the core board 1 includes a substrate 11, and a first metal layer 12 and a second metal layer 13 disposed on two opposite surfaces of the substrate 11. The material of the substrate 11 may be polyimide or other suitable materials. The materials of the first metal layer 12 and the second metal layer 13 are the same, and the materials of the first metal layer 12 and the second metal layer 13 can both be copper. The shapes and sizes of the substrate 11, the first metal layer 12, and the second metal layer 13 are not limited and may be selected as needed. In one embodiment, the material of the substrate 11 is polyimide, and the first metal layer 12 and the second metal layer 13 are both copper layers.
S22: and arranging a covering layer on the surface of the first metal layer far away from the substrate.
Specifically, referring to fig. 4, a covering layer 2 is disposed on at least one surface of a core board 1. In an alternative embodiment, the cover layer 2 may be applied only to the surface of the first metal layer 12 remote from the substrate 11. In another alternative embodiment, the cover layer 2 may be applied only to the surface of the second metal layer 13 remote from the substrate 11. In another alternative embodiment, the cover layer 2 may be coated on both the surfaces of the first metal layer 12 and the second metal layer 13 away from the substrate 11. In one embodiment, the capping layer 2 may be a photoresist covering the entire surface of the first metal layer 12.
S23: a window is formed on the capping layer through an exposure and development operation such that a surface of the first metal layer is exposed through the window.
Specifically, referring to fig. 5, the cover layer 2 is coated on the surface of the first metal layer 12 and/or the second metal layer 13 of the core board 1 away from the substrate 11. The mask plate designed according to requirements is placed on the covering layer 2, and the ultraviolet light is adopted to carry out illumination treatment on the covering layer 2 with the mask plate covered on the surface, so that the covering layer 2 below the light transmission area of the mask plate is crosslinked and cured under the illumination effect. The covering layer 2 below the shading area of the mask plate is not subjected to light treatment, and the covering layer 2 is not subjected to crosslinking and curing. And removing the mask plate, cleaning the circuit board 100 after illumination by a developer, keeping the cross-linked and cured part of the covering layer 2 on the first metal layer 12 and/or the second metal layer 13 on the core board 1, removing the part of the covering layer 2 on the surface of the core board 1, which is not cross-linked and cured, so as to form a window 21 on the covering layer 2, and exposing the part of the surface of the first metal layer 12 and/or the second metal layer 13 through the window 21. Wherein the window 21 is formed in a rectangular configuration having a length and width dimension of no more than 3mm in cross section. In a preferred embodiment, the size of the cross-section of the window 21 may be a square configuration of 3mm by 3 mm. In another alternative embodiment, the cross section of the window 21 may also be a circular structure with a diameter not exceeding 3mm, the shape of the window 21 is not limited herein, and the shape of the window 21 may be set according to the user's requirement.
S24: and processing the part of the first metal layer exposed through the window by wet chemical etching to expose the substrate of the core plate through the window.
Specifically, referring to fig. 6, wet chemical etching liquid is used to etch the exposed portion of the first metal layer 12 and/or the second metal layer 13 through the window 21, and the exposed portion of the first metal layer 12 and/or the second metal layer 13 through the window 21 is removed, so that a portion of the substrate 11 of the core board 1 is exposed through the window 21. In another embodiment, the portion of the first metal layer 12 and/or the second metal layer 13 exposed through the window 21 may also be etched by dry etching, such as plasma etching.
S25: and processing the part of the substrate exposed through the window by a laser ablation method to form a groove, so that the second metal layer is exposed through the groove.
Specifically, referring to fig. 7, a laser is used to ablate a portion of the surface of the substrate 11 exposed through the window 21, so as to form a groove 111 on the substrate 11, and the second metal layer 13 and/or the first metal layer 12 away from the window 21 are exposed through the groove 111. In an alternative embodiment, when the substrate 11 is ablated in the direction from the first metal layer 12 toward the second metal layer 13 to form the recess 111, a portion of the second metal layer 13 is exposed through the recess 111. In another alternative embodiment, when the substrate 11 is ablated from the second metal layer 13 in the direction of the first metal layer 12 to form the groove 111, a portion of the first metal layer 12 is exposed through the groove 111. In a preferred embodiment, the cross-section of the groove 111 is the same size and shape as the cross-section of the window 21. In an alternative embodiment, the cross-section of the groove 111 may also be different from the size of the cross-section of the window 21, and the cross-section of the groove 111 may also be different from the shape of the cross-section of the window 21. The shape and size of the groove 111 are not limited herein, and the size and shape of the groove 111 can be defined according to the heat dissipation requirement.
S26: and depositing a seed layer on the inner wall of the groove.
Specifically, referring to fig. 8, a seed layer 31 is deposited in the groove 111, and the seed layer 31 may be a copper layer. The copper layer is distributed on the inner wall of the groove 111. The metal base 3 is formed in the groove 111 through the copper layer deposition step, so that the bonding strength of the metal base 3 and the circuit board 100 is improved, and the stability of the circuit board 100 is further enhanced.
S27: and electroplating the surface of the groove formed in the surface of the pretreated circuit board to enable the electroplating metal to be filled in the groove to form a metal base, wherein the metal base is higher than the exposed surface of the pretreated circuit board.
Specifically, referring to fig. 9, the circuit board 100 with the seed layer 31 deposited on the inner wall of the groove 111 is subjected to an electroplating process, and the metal base 3 is electroplated in the groove 111 of the circuit board 100. The formed metal matrix 3 needs to be flush with the surface of the first metal layer 12 or the second metal layer 13 away from the substrate 11 or slightly higher than the surface of the first metal layer 12 or the second metal layer 13 away from the substrate 11. In one embodiment, the metal matrix 3 is formed higher than the cover layer 2 away from the surface of the core 1. Specifically, the metal matrix 3 is not more than 5 μm higher than the surface of the first metal layer 12 or the second metal layer 13 away from the substrate 11. Among them, the material of the metal base 3 is preferably copper.
S28: and removing the covering layer, and enabling the exposed surface of the metal base to be flush with the surface of the core plate.
Specifically, referring to fig. 10, the cover layer 2 disposed on the surface of the first metal layer 12 and/or the second metal layer 13 away from the core board 1 is removed, and the exposed end surface of the metal base 3 is ground, so that the exposed end surface of the metal base 3 is flush with the surface of the first metal layer 12 and/or the second metal layer 13 in the core board 1, which is convenient for subsequent processing.
In the manufacturing method of the circuit board provided by this embodiment, the circuit board is pretreated by obtaining; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board; forming a window on the cover layer to expose the surface of the core plate; forming a groove on the exposed core plate; exposing the metal layer far away from the covering layer in the core plate through the groove; and filling a metal base in the groove to form the circuit board. According to the circuit board, the groove is formed on the circuit board, and the metal base is formed in the groove, so that the metal bases with various sizes can be conveniently formed in the circuit board, and heat generated by the circuit board can be conducted to the outside through the metal base; the metal base is directly generated on the circuit board, so that the connection strength of the metal base and the circuit board can be improved, the bonding strength of the circuit board and the metal base is improved, the problems of height difference and glue flowing are avoided, and the circuit board has good reliability and heat dissipation.
Referring to fig. 11, fig. 11 is a schematic structural diagram of a circuit board provided by the present invention. In the present embodiment, a circuit board 100 is provided, where the circuit board 100 includes a core board 1, a metal base 3 is disposed in the core board 1, the core board 1 includes a substrate 11, and a first metal layer 12 and a second metal layer 13 disposed on two opposite surfaces of the substrate 11, the metal base 3 is disposed in the substrate 11, and two ends of the metal base 3 are connected to the first metal layer 12 and the second metal layer 13, respectively. Wherein the length and width of the cross section of the metal matrix 3 are not more than 3 mm. The wiring board 100 in this embodiment is manufactured by the manufacturing method in the above-described embodiment. The wiring board 100 may be an FPC. The material of the metal base 3 is preferably copper. The material of the first metal layer 12 and the second metal layer 13 is a copper layer. Wherein the metal base 3 includes a seed layer and an electroplating layer.
According to the circuit board provided by the embodiment, the metal base is arranged in the core board, so that heat generated by the circuit board can be conducted to the outside through the metal base, and the heat dissipation problem of the circuit board is solved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for manufacturing a wiring board, comprising:
acquiring a pretreatment circuit board; the pretreatment circuit board comprises a core board and a covering layer arranged on the surface of the core board;
forming a window on the cover layer to expose a surface of the core plate;
forming a groove on the exposed core plate; exposing the metal layer in the core plate far away from the covering layer through the groove;
and filling a metal base in the groove to form the circuit board.
2. The method of manufacturing a wiring board according to claim 1, wherein the obtaining a pre-processed wiring board; the step of preprocessing the circuit board, which comprises a core board and a covering layer arranged on the surface of the core board, specifically comprises the following steps:
obtaining the core board; the core board comprises a substrate, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged on two opposite surfaces of the substrate;
and arranging a covering layer on the surface of the first metal layer far away from the substrate.
3. The method for manufacturing a wiring board according to claim 2, wherein the step of forming a window in the cover layer to expose a surface of the core substrate specifically comprises:
forming a window on the cover layer through an exposure and development operation so that the surface of the first metal layer is exposed through the window.
4. The method of manufacturing a wiring board according to claim 3, wherein the forming of the groove on the exposed core board; the step of exposing the metal layer of the core board far away from the covering layer through the groove specifically comprises the following steps:
processing the exposed part of the first metal layer through the window by wet chemical etching to expose the substrate of the core plate through the window;
and processing the part of the substrate exposed through the window by a laser ablation method to form a groove, so that the second metal layer is exposed through the groove.
5. The method of manufacturing a wiring board according to claim 2, wherein the substrate is a polyimide layer, and the first metal layer and the second metal layer are copper layers.
6. The method for manufacturing a circuit board according to claim 1, wherein the step of filling the groove with the metal base to form the circuit board specifically comprises:
depositing a seed layer on the inner wall of the groove;
and forming a metal matrix in the groove by electroplating.
7. The method for manufacturing a wiring board according to claim 6, wherein the step of forming a metal base in the groove by electroplating specifically comprises:
electroplating the surface of the pretreated circuit board, which is provided with the groove, so that the electroplated metal is filled in the groove to form a metal base, and the metal base is higher than the exposed surface of the pretreated circuit board;
and removing the covering layer, and enabling the exposed surface of the metal base to be flush with the surface of the core plate.
8. The method of manufacturing a wiring board according to claim 7, wherein the metal matrix is flush with or spaced from the exposed surface of the pre-processed wiring board by a distance of not more than 5 μm.
9. A method for manufacturing a wiring board according to claim 1, wherein the length and width of the window are not more than 3 mm.
10. A wiring board produced by the method for producing a wiring board according to any one of claims 1 to 9.
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| CN202011042010.3A CN114286508A (en) | 2020-09-28 | 2020-09-28 | Circuit board and manufacturing method thereof |
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| CN202011042010.3A CN114286508A (en) | 2020-09-28 | 2020-09-28 | Circuit board and manufacturing method thereof |
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2020
- 2020-09-28 CN CN202011042010.3A patent/CN114286508A/en active Pending
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| KR20120087459A (en) * | 2011-01-28 | 2012-08-07 | 지앤피테크놀로지 주식회사 | Method of manufacturing a substrate for display with conductivity line |
| CN102300397A (en) * | 2011-06-30 | 2011-12-28 | 深南电路有限公司 | Metal matrix circuit board and manufacturing method thereof |
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