CN103687279B - A kind of method for manufacturing printed circuit board - Google Patents
A kind of method for manufacturing printed circuit board Download PDFInfo
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- CN103687279B CN103687279B CN201310638904.2A CN201310638904A CN103687279B CN 103687279 B CN103687279 B CN 103687279B CN 201310638904 A CN201310638904 A CN 201310638904A CN 103687279 B CN103687279 B CN 103687279B
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- hole
- circuit board
- printed circuit
- protection ink
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Abstract
The present invention relates to a kind of method for manufacturing printed circuit board.This preparation method is: first embedment protection ink in insulating barrier; then through normal pressing and boring flow process; for avoiding during follow-up hole metallization; chemical copper in the hole wall deposition of embedment protection ink; first protection ink is divested totally before electroless copper plating; the activator adsorbed in protection ink pellet surface will together be removed; the most whole perforation; in addition to cavity portion; one layer of chemical copper all can be deposited on hole wall; and it is positioned at the material surface at hole because without activator attachment, chemical copper will not be deposited, thus cannot form conductive layer.Processing procedure of the present invention is simple, with low cost, low to material requirements, easily realizes batch production, and resistance plating effect can reach 100%.
Description
Technical field
The present invention relates to printed circuit board field, be specifically related to a kind of printed circuit board making side
Method.
Background technology
Along with communication and the development of network technology, signal transmission rate is the highest, high frequency
Circuit is widely used in design of electronic products.For meeting high-frequency signal at printed circuit board
Normal transmission in (Printed Circuit Board, PCB), design and the manufacture to PCB
Propose the most harsh requirement.PCB uses the mode of through hole, buried via hole or blind hole to carry out at present
Electrical connection, it is achieved interconnection and interflow between layers.Under existing PCB manufacturing technology, when
When using electroplating ventilating hole to serve as transmission medium between layers, the signal of telecommunication is a certain by PCB
Layer conductor, electroplated through hole is transferred on another layer conductor, and the signal of telecommunication may only need electroplated logical
In hole, a part is transmitted, and unnecessary part electroplating ventilating hole is referred to as short-term
(stub)。
During the signal of telecommunication transmits, every short-term can produce stray inductance and parasitic capacitance,
When transmitting low frequency signal, the integrality of signal transmission will not be caused significantly negative effect；
But when transmitting high-frequency signal, but signal attenuation can cause geometry level rise, simultaneously also can pole
The big integrality affecting signal.Its middle short line is the longest, and the stray inductance of generation and parasitic capacitance are more
Greatly, the biggest on signal integrity impact.Therefore in high-frequency circuit product, traditional plating
Via design cannot meet the demand of signal transmission.
In order to avoid the short-term impact on high frequency signal transmission integrality, Application No.
201110460708.1 Chinese invention patent application (calling application 1 in the following text) disclosed in a kind of print
Circuit board manufacturing method can solve the problem that the problems referred to above.The method flow of application 1 is: boring → plug
Hole → polishing → row/pressing plate → boring → hole wall removing glue → hole metallization, fills in perforation and uses
In preventing from plating the plating protection ink of conductive material, the hydrophobicity of material itself is utilized to reach
The effect of resistance plating, but, there is following defect in this PCB: 1. wants plating protection ink
Ask high, it is extremely difficult to find, and material cost is high；2. plating protection ink is stayed in PCB,
Affect the reliability of PCB；3. plating protection ink and hole wall are in approximately the same plane, liquid
Flowing can reduce the resistance plating effect of material itself, low qualified.
Summary of the invention
It is an object of the invention to propose a kind of method for manufacturing printed circuit board, it can solve oil
Ink requires high and hinders the problems such as plating poor effect.
In order to achieve the above object, the technical solution adopted in the present invention is as follows:
A kind of method for manufacturing printed circuit board, it comprises the following steps:
Step 1, etch away the two-sided copper foil layer of target central layer；
Hole on the position that step 2, at least one preset hole in target central layer are corresponding
Process, form the through hole running through described target central layer and aperture more than described preset hole, wherein,
Described preset hole is to need not the hole at interlayer transmitting telecommunication number；
Step 3, in described through hole fill protection ink；
Step 4, the lamination treatment that carries out prepreg and central layer, form multilayer printed circuit board,
Wherein, the part or all of prepreg carrying out lamination treatment is described target central layer；
Step 5, described multilayer printed circuit board is carried out boring process, drill described target core
Preset hole in plate, forms perforation；
Step 6, described multilayer printed circuit board perforation hole wall deposition one layer of activator；
Step 7, protection ink to described multilayer printed circuit board move back film and process, and decorporate
Described protection ink and be positioned at the activator on described protection ink；
Step 8, hole wall to the perforation of described multilayer printed circuit board carry out electroless copper plating process.
Preferably, described boring processes the one including in laser drill, machine drilling or punching
Or it is multiple.
Preferably, in step 3, holes filling mode is used to fill protection in described through hole
Ink；Or use mould printing mode to fill protection ink in described through hole；Or employing silk screen
Mode of printing fills protection ink in described through hole.
Preferably, in step 6, the hole wall in the perforation of described multilayer printed circuit board deposits
Before one layer of activator, first described multilayer printed circuit board is carried out removing glue process.
There is advantages that
In through hole, fill protection ink, use organic solvent to remove described guarantor before electroless copper plating
Protect ink, thus the activator on the most described protection ink also removed, formed one little
Hole (for monoblock PCB, be equivalent to disconnect perforation, form disconnected hole), causes
Hole cannot be carried out in subsequent openings metallization, reaches the effect of resistance plating.
1. the requirement of pair ink is low, and material can be found at home, and material cost is relatively low；
2. use stripping process to peel off ink in hole, do not affect the reliability of PCB；
3. in peelling off hole, the activator on ink peelled off by ink simultaneously, forms a hole, hole
Interior without activator, make hole metallization cannot be carried out, it is ensured that resistance plating effect can reach 100%.
Accompanying drawing explanation
Fig. 1 is the flow chart of the method for manufacturing printed circuit board of the embodiment of the present invention；
Fig. 2 with Fig. 3 is the structural representation that step S101 of Fig. 1 is corresponding；
Fig. 4 is the structural representation that step S102 of Fig. 1 is corresponding；
Fig. 5 is the structural representation that step S103 of Fig. 1 is corresponding；
Fig. 6 is the structural representation that step S104 of Fig. 1 is corresponding；
Fig. 7 is the structural representation that step S105 of Fig. 1 is corresponding；
Fig. 8 is the structural representation that step S107 of Fig. 1 is corresponding；
Fig. 9 is the sectional view of the printed circuit board of the embodiment of the present invention.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, the present invention is described further.
In conjunction with shown in Fig. 1 to Fig. 9, a kind of method for manufacturing printed circuit board of the present embodiment, its
Comprise the following steps:
Step S101, as shown in Figures 2 and 3, etches away the two-sided of target central layer 201
Copper foil layer 2012, makes described target central layer 201 only have an insulating barrier 2011；
Step S102, as shown in Figure 4, at least one preset hole in target central layer 201
Carrying out drill hole reason on corresponding position, formation runs through described target central layer 201 and aperture is more than
The through hole 2013 of described preset hole, because described target central layer 201 only has insulating barrier 2011,
Therefore being through the insulating barrier 2011 of described target central layer 201, wherein, described preset hole is
Need not the hole at interlayer transmitting telecommunication number；
Step S103 is as it is shown in figure 5, fill protection ink 208 in described through hole 2013；
Fill protection ink 208 mode can use holes filling mode, mould printing mode or
Use screen printing mode；If after filling protection ink 208, there have at through hole 2013 to be unnecessary
Protection ink highlights outward, then polished off by unnecessary protection ink；
Step S104, as shown in Figure 6, carries out lamination treatment, shape to prepreg and central layer
Becoming multilayer printed circuit board, wherein, the part or all of prepreg carrying out lamination treatment is institute
State target central layer 201；And the multilayer printed circuit board of the present embodiment includes core the most successively
Plate 202, prepreg 203, target central layer 201, prepreg 204 and central layer 205, core
Plate 202 includes two-sided copper foil layer 2022 and insulating barrier 2021, and central layer 205 includes two-sided
Copper foil layer 2052 and insulating barrier 2021；
Step S105 as it is shown in fig. 7, described multilayer printed circuit board is carried out boring process,
Drill the preset hole in described target central layer 201, form perforation 206, say, that many
Layer printed circuit board in the preset hole position of target central layer 201 monoblock multilayer printed circuit board
Drill, owing to protection ink 208 is corresponding with preset hole position, therefore, the most also protection oil
Ink 208 drills；
Step S106, first described multilayer printed circuit board is carried out PLASAM removing glue process or change
Removing glue processes, and to remove the glue slag of perforation 206 wall residual, then carries out hole activation flow process,
In hole wall one layer of activator of deposition of the perforation 206 of described multilayer printed circuit board, activation process
After, the hole wall of perforation 206 and protection ink 208 all can there is one layer of activator；Due to protection
Ink 208 has good acidproof, alkaline-resisting and non-oxidizability, in removing glue and activation process not
Can be destroyed；
Step S107, as shown in Figure 8, the protection ink 208 to described multilayer printed circuit board
Carry out moving back film to process, the described protection ink 208 and being positioned on described protection ink 208 of decorporating
Activator；Organic solvent can be used and move back film device protection ink is divested, sinking meanwhile
Amass the activator in protection ink pellet surface also together to divest with protection ink, make shape in perforation 206
Become a hole, i.e. expose through hole 2013；
Step S108 is as it is shown in figure 9, to the perforation 206 of described multilayer printed circuit board
Hole wall carries out electroless copper plating process, and hole wall deposition has the region of activator can deposit a stratification
Copper 207, and being stripped because of activator at hole, chemical copper cannot at this area deposition, thus
Make perforation 206 in VOID POSITIONS for separating, thus form disconnected hole, ultimately form and there is disconnected hole
Printed circuit board 200.
The boring of the present embodiment processes can use the one in laser drill, machine drilling or punching
Or it is multiple.
As it is shown in figure 9, be made by a kind of method for manufacturing printed circuit board of the present embodiment
Printed circuit board 200 structure.Described printed circuit board 200 includes central layer the most successively
202, prepreg 203, target central layer 201, prepreg 204 and central layer 205.Central layer
202 have insulating barrier 2021 and two-sided copper foil layer 2022, and central layer 205 has insulating barrier 2051
With two-sided copper foil layer 2052, target central layer 201 only has an insulating barrier 2011.Print electricity
Road plate 200 has at least one perforation 206 running through described printed circuit board 200, prints electricity
The target central layer 201 of road plate 200 have a upper surface running through described target central layer 201 and
The through hole 2013 of lower surface, described perforation 206 connects with described through hole 2013, described perforation
206 overlap with the axis of described through hole 2013, and the aperture of described through hole 2013 is more than described
The aperture of perforation 206, the wall that hole wall is target central layer 201 of described through hole 2013 is the most logical
Being formed without chemical copper on the hole wall in hole 2013, chemical copper 207 is only formed at perforation 206
On hole wall.
The principle forming disconnected hole in the perforation of transmission signal is: first imbed protection in insulating barrier
Ink, then through normal pressing and boring flow process, for avoiding in follow-up hole metallization process
In, chemical copper and electro-coppering in the hole wall deposition of embedment protection ink, use organic solvent,
First protection ink is divested totally before electroless copper plating, adsorb the activation in protection ink pellet surface
Agent will together be removed, and organic solvent will not destroy the activation on resin and glass fibre
Agent, the most whole perforation, in addition to cavity portion (being i.e. filled with the through hole of protection ink), hole
All can deposit one layer of chemical copper as plating seed layer on wall, and be positioned at the material list at hole
Face, because adhering to without activator, will not deposit chemical copper, thus cannot form conductive layer.
Above-described embodiment processing procedure is simple, with low cost, low to material requirements, easily realizes batch
Producing, resistance plating effect can reach 100%.
For a person skilled in the art, can technical scheme as described above and structure
Think, make other various corresponding changes and deformation, and all these changes and deformation
Within all should belonging to the protection domain of the claims in the present invention.
Claims (4)
1. a method for manufacturing printed circuit board, it is characterised in that comprise the following steps:
Step 1, etch away the two-sided copper foil layer of target central layer；
Carry out on the position that step 2, at least one preset hole in target central layer are corresponding
Boring processes, and forms the through hole running through described target central layer and aperture more than described preset hole,
Wherein, described preset hole is to need not the hole at interlayer transmitting telecommunication number；
Step 3, in described through hole fill protection ink；
Step 4, prepreg and central layer are carried out lamination treatment, form multilayered printed electricity
Road plate, wherein, the part or all of prepreg carrying out lamination treatment is described target core
Plate；
Step 5, described multilayer printed circuit board is carried out boring process, drill described mesh
Preset hole in mark central layer, forms perforation；
Step 6, described multilayer printed circuit board perforation hole wall deposition one layer of activation
Agent；
Step 7, protection ink to described multilayer printed circuit board move back film and process,
Decorporate described protection ink and be positioned at the activator on described protection ink；
Step 8, hole wall to the perforation of described multilayer printed circuit board carry out electroless copper plating
Process.
2. method for manufacturing printed circuit board as claimed in claim 1, it is characterised in that described boring
Process one or more included in laser drill, machine drilling or punching.
3. method for manufacturing printed circuit board as claimed in claim 1, it is characterised in that in step 3
In, use holes filling mode to fill protection ink in described through hole；Or employing template
Mode of printing fills protection ink in described through hole；Or use screen printing mode in institute
Protection ink is filled in stating through hole.
4. method for manufacturing printed circuit board as claimed in claim 1, it is characterised in that in step 6
In, before hole wall one layer of activator of deposition of the perforation of described multilayer printed circuit board,
First described multilayer printed circuit board is carried out removing glue process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310638904.2A CN103687279B (en) | 2013-12-02 | 2013-12-02 | A kind of method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310638904.2A CN103687279B (en) | 2013-12-02 | 2013-12-02 | A kind of method for manufacturing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687279A CN103687279A (en) | 2014-03-26 |
| CN103687279B true CN103687279B (en) | 2016-08-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310638904.2A Active CN103687279B (en) | 2013-12-02 | 2013-12-02 | A kind of method for manufacturing printed circuit board |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392303B (en) * | 2015-11-06 | 2018-05-25 | 天津普林电路股份有限公司 | A kind of high-density lamination plate PI resin plate slots sink process for copper |
| CN108770200A (en) * | 2018-06-14 | 2018-11-06 | 生益电子股份有限公司 | A kind of PCB |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN112040672B (en) * | 2020-07-30 | 2024-05-07 | 生益电子股份有限公司 | Printed circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN103188886A (en) * | 2011-12-31 | 2013-07-03 | 北大方正集团有限公司 | Printing circuit board and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1117341A (en) * | 1997-06-25 | 1999-01-22 | Hitachi Aic Inc | Frinted multilayer wiring board |
-
2013
- 2013-12-02 CN CN201310638904.2A patent/CN103687279B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| CN103188886A (en) * | 2011-12-31 | 2013-07-03 | 北大方正集团有限公司 | Printing circuit board and manufacturing method thereof |
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| CN103687279A (en) | 2014-03-26 |
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| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Jiao Zhensi Inventor after: Zhou Yong Inventor after: Wu Shaohui Inventor before: Wang Xiaofeng Inventor before: Zhou Yong Inventor before: Jiao Zhensi |
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Free format text: CORRECT: INVENTOR; FROM: WANG XIAOFENG ZHOU YONG JUE ZHENSI TO: JUE ZHENSI ZHOU YONG WU SHAOHUI |
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