CN108770200A - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN108770200A CN108770200A CN201810612010.9A CN201810612010A CN108770200A CN 108770200 A CN108770200 A CN 108770200A CN 201810612010 A CN201810612010 A CN 201810612010A CN 108770200 A CN108770200 A CN 108770200A
- Authority
- CN
- China
- Prior art keywords
- metallized
- pcb
- slot
- straight slot
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Abstract
The present invention relates to circuit board technology fields, disclose a kind of PCB.The side for the PCB that the present invention program provides is provided with blind slot, and non-metallized regions and metallized area are arranged at intervals on blind slot cell wall.The purpose of the present invention is to provide a kind of PCB, the space of the stepped groove on PCB is set to be fully utilized, stepped groove contains metallization cell wall and non-metallic cell wall simultaneously, it can realize special-shaped component and a variety of different size component attachments, meet compound multiple functions attachment to require, conducive to the further micromation of PCB, it is suitble to the installation of the component or extraordinary combination element device of polymorphic structure.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of PCB.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB) is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board has accounted in the electronics industry
According to the status of empery.
In order to output blind slot on a printed-wiring board assembly volume and other particular/special requirements, generally use number are reduced to meet
Control milling machine mills out blind slot, and blind slot at this time has non-metallic cell wall and slot bottom, can also sink to cell wall or slot bottom
Copper, electroplating operations form the cell wall or slot bottom of metallization.Therefore, in the prior art, the cell wall or slot bottom of blind slot can only be realized entirely
Portion is non-metallic or all metallizes.Existing design is mainly insufficient：
1, single metallization ladder cell wall or non-metallic stepped groove can not realize that the extraordinary assembling of component is wanted simultaneously
It asks, or integrates other more power amplifying devices.
2, it cannot achieve the selectivity connection that internal layer circuit signal circuit is realized in the same longitudinal space.
Therefore a kind of PCB is needed to solve the above problems.
Invention content
The purpose of the present invention is to provide a kind of PCB, the space of the stepped groove on PCB is set to be fully utilized, stepped groove
Contain metallized area and non-metallized regions simultaneously, can realize special-shaped component and a variety of different size component attachments,
Meet compound multiple functions attachment to require, be conducive to the further micromation of PCB, is suitble to the component of polymorphic structure or extraordinary group
Close the installation of component.
The present invention uses following technical scheme：
The side of a kind of PCB, PCB are provided with blind slot, and non-metallized regions and metallization are arranged at intervals on blind slot cell wall
Region.
As a preferred embodiment of the present invention, non-metallized regions are by offering the straight slot inner wall of the prepreg of straight slot
It is formed.
As a preferred embodiment of the present invention, straight slot inner wall on substrate of the non-metallized regions by offering straight slot and
It is formed with the straight slot inner wall of the prepreg for offering straight slot of substrate bonding.
As a preferred embodiment of the present invention, the metal layer of the substrate of non-metallized regions is provided with first around straight slot
Notch, and the horizontal cross-sectional profile of the first notch is located at the periphery of the horizontal cross-sectional profile of blind slot.
As a preferred embodiment of the present invention, the metallization of the straight slot on substrate of the metallized area by offering straight slot
Inner wall is formed.
As a preferred embodiment of the present invention, line pattern is provided on the slot bottom metal layer of blind slot.
As a preferred embodiment of the present invention, the metal layer of metallized area is layers of copper.
As a preferred embodiment of the present invention, substrate is the combination of core plate and/or daughter board, and daughter board is by least two core plates
It presses.
It is longitudinally spaced to be provided on the cell wall in blind slot as a preferred embodiment of the present invention：
Metallized area and non-metallized regions；
Or non-metallized regions and metallized area；
Or non-metallized regions, metallized area and non-metallized regions；
Or metallized area, non-metallized regions, metallized area and non-metallized regions；
Or non-metallized regions, metallized area, non-metallized regions and metallized area.
Beneficial effects of the present invention：
In the longitudinal space of the same blind slot of PCB provided by the invention, PCB, contain metallized area and Fei Jin simultaneously
Categoryization region realizes the selectivity connection of internal layer circuit signal circuit, is conducive to the further micromation of PCB, and functional diversities are fitted
Close the installation of the component or extraordinary combination element device of polymorphic structure.
Description of the drawings
Fig. 1 is the PCB construction schematic diagram of the embodiment of the present invention one；
Fig. 2 is the PCB construction schematic diagram of the embodiment of the present invention two；
Fig. 3 is the PCB construction schematic diagram of the embodiment of the present invention three；
Fig. 4 is the PCB construction schematic diagram of the embodiment of the present invention four；
Fig. 5 is the PCB construction schematic diagram of the embodiment of the present invention five.
In figure：
1, blind slot；2, non-metallized regions；3, metallized area；4, prepreg；5, substrate.
Specific implementation mode
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one：
The concrete structure of the embodiment of the present invention one is as shown in Figure 1.
Fig. 1 shows a kind of PCB, is pressed by three core plates, prepreg 4 is provided between core plate.Wherein, first
It opens core plate and second core plate and forms substrate 5 with the pressing of prepreg 4, offer straight slot on substrate 5, the cell wall metal of the straight slot
Change, substrate 5 is pressed by prepreg 4 and third core plate, forms the PCB in Fig. 1, and the side of PCB is made to form blind slot
1, line pattern can be provided on the slot bottom metal layer of blind slot 1.Further, the slot bottom line pattern of blind slot 1 and periphery
Metal layer insulate, and after pressing, prepreg 4 coats the part other than slot bottom line pattern, forms non-metallic cell wall.
Since the cell wall of straight slot on substrate 5 metallizes the metallized area 3 to be formed on 1 cell wall of blind slot, the formation of prepreg 4
Therefore non-metallized regions 2 on 1 cell wall of blind slot form spaced metallized area 3 and Fei Jin on 1 cell wall of blind slot
Categoryization region 2.
Specifically, in the embodiment of the present invention one, substrate 5 is daughter board, and daughter board is pressed by two core plates.It is predictable
It is that substrate 5 may include the combination of any number of core plate and/or daughter board, daughter board is pressed by least two core plates.Metal
The metal layer for changing region 3 is layers of copper.
The PCB construction that the embodiment of the present invention one provides contains gold simultaneously in the longitudinal space of the same blind slot 1 of PCB
Categoryization region 3 and non-metallized regions 2, the metal layer of metallized area 3, which can be realized, to be conducted and signal conduction, non-metallic
Region 2 is conducive to the further micromation of PCB, functional diversities are suitble to the member of polymorphic structure without conducting and signal conduction
The installation of device or extraordinary combination element device.
Embodiment two：
The concrete structure of the embodiment of the present invention two is as shown in Figure 2.
Compared with embodiment one, unlike two structure of embodiment, PCB in embodiment two pressed by four core plates and
At.Wherein, such as first core plate and second core plate press to form substrate 5, offer straight slot on substrate 5, the slot of the straight slot
Wall metallizes.Third core plate offers straight slot, and the cell wall of straight slot is non-metallic, and specifically, the metal layer of third core plate encloses
Straight slot is provided with the first notch, and the horizontal cross-sectional profile of the first notch is located at the periphery of the horizontal cross-sectional profile of straight slot, presses
In the metal layer of the first indentation, there can be coated on by prepreg 4 after conjunction.4th core plate is the core plate of unslotted, the 4th
The interior metal layer of core plate is the slot bottom metal layer of the blind slot 1 formed after pressing.
Above-mentioned core plate is stacked, straight slot alignment is bonded using prepreg 4, forms the PCB in Fig. 2 so that the one of PCB
Side forms blind slot 1, and line pattern, the metal layer of slot bottom line pattern and surrounding can be provided on the slot bottom metal layer of blind slot 1
Conducting.
Since the cell wall of straight slot on substrate 5 metallizes the metallized area 3 to be formed on 1 cell wall of blind slot, prepreg 4 and
Therefore the non-metallic non-metallized regions 2 formed on 1 cell wall of blind slot of straight slot inner wall of three core plates are formed on 1 cell wall of blind slot
Spaced metallized area 3 and non-metallized regions 2.
PCB construction provided by Embodiment 2 of the present invention contains gold simultaneously in the longitudinal space of the same blind slot 1 of PCB
Categoryization region 3 and non-metallized regions 2, may be implemented the several layers of metal layers in top conduct and signal conduction, middle section are several
Layer metal layer without conducting and signal conduction is suitble to that metal layer at top conducting, middle section metal layer is required to be not turned on
The installation of the component of polymorphic structure or extraordinary combination element device.
Embodiment three：
The specific structure is shown in FIG. 3 for the embodiment of the present invention three.
Compared with embodiment one, unlike three structure of embodiment, PCB in embodiment three pressed by five core plates and
At.Wherein, first core plate and second core plate press to form substrate 5, and third core plate and the 4th core plate pressing are also formed
Substrate 5 offers straight slot, the cell wall metallization of straight slot on two substrates 5.5th core plate is the core plate of unslotted.Two
It is provided with the prepreg 4 for offering straight slot between substrate 5, between substrate 5 and the 5th core plate.Above-mentioned each substrate and half is solid
Change piece 4 to stack, straight slot alignment is pressed, forms the PCB in Fig. 3 so that the side of PCB forms blind slot 1, the slot bottom of blind slot 1
Line pattern can be provided on metal layer.
Since the cell wall of straight slot on substrate 5 metallizes the metallized area 3 to be formed on 1 cell wall of blind slot, the formation of prepreg 4
Therefore non-metallized regions 2 on 1 cell wall of blind slot form 3 He of metallized area being arranged alternately successively on 1 cell wall of blind slot
Non-metallized regions 2.I.e. as shown in Figure 3, in the longitudinal space of the same blind slot 1, be sequentially distributed metallized area 3,
Non-metallized regions 2, metallized area 3 and non-metallized regions 2, totally four parts.
According to the structure of embodiment one and embodiment three, though it is foreseeable that non-metallized regions 2 and metallized area 3
Quantity be not limited to Fig. 1 two parts or Fig. 3 shown in four parts, as long as meeting in the vertical of the same blind slot 1
Into space, non-metallized regions 2 are arranged alternately successively with metallized area 3, are not construed as limiting in quantity, in the guarantor of the application
It protects in range.
Likewise, in conjunction with the embodiments one with the difference of embodiment two, the non-metallized regions 2 in embodiment three can also adopt
With the structure type in embodiment two, within the scope of protection of this application.
The PCB construction that the embodiment of the present invention three provides contains gold simultaneously in the longitudinal space of the same blind slot 1 of PCB
Categoryization region 3 and non-metallized regions 2, may be implemented the several layers of metal layers in top conduct and signal conduction, middle section is also
Some metal layer, which can be realized, to be conducted and signal conduction, is suitble to require metal layer at top conducting, middle section metal layer
Conducting, but the installation of the component or extraordinary combination element device for the polymorphic structure being independent of each other is connected in two parts.
Example IV：
The concrete structure of the embodiment of the present invention four is as shown in Figure 4.
Compared with embodiment one, unlike example IV structure, PCB in example IV pressed by four core plates and
At.Wherein, such as first core plate offers straight slot, and the cell wall of straight slot is non-metallic, and the metal layer of this core plate surrounds straight slot
It is provided with the first notch, and the horizontal cross-sectional profile of the first notch is located at the periphery of the horizontal cross-sectional profile of straight slot；Second core
Plate and third core plate press to form substrate 5, and straight slot is offered on substrate 5, the cell wall metallization of the straight slot.Above-mentioned core plate is folded
It puts, straight slot alignment is pressed using prepreg 4, forms the PCB in Fig. 4 so that the side of PCB forms blind slot 1, blind slot 1
Slot bottom metal layer on can be provided with line pattern.
Since the straight slot inner wall of first core plate is non-metallic, the straight slot inner wall of prepreg 4 and first core plate is formed
Non-metallized regions 2 on 1 cell wall of blind slot, the cell wall of straight slot metallizes the metallized area to be formed on 1 cell wall of blind slot on substrate 5
3.Therefore, as shown in Figure 4, spaced non-metallized regions 2 and metallized area 3 are formd on 1 cell wall of blind slot, same
In the longitudinal space of one blind slot 1, non-metallized regions 2, metallized area 3 and non-metallized regions 2 have been sequentially distributed, totally three
A part.
The PCB construction that the embodiment of the present invention four provides contains gold simultaneously in the longitudinal space of the same blind slot 1 of PCB
Categoryization region 3 and non-metallized regions 2, may be implemented the several layers of metal layers in top without conducting and signal conduction, middle part
Point metal layer, which can be realized, to be conducted and signal conduction, is suitble to require metal layer at top without conducting, middle section metal layer
The installation of the component of the polymorphic structure of conducting or extraordinary combination element device.
Embodiment five：
The concrete structure of the embodiment of the present invention five is as shown in Figure 5.
Compared with example IV, unlike five structure of embodiment, PCB in embodiment five pressed by five core plates and
At, wherein it counts from top to bottom, the 4th core plate offers straight slot, and forms blind slot after being pressed with the 5th core plate, the blind slot
Cell wall metallization.
Therefore, non-metallized regions 2 are arranged alternately successively with metallized area 3, i.e., as shown in Figure 5, same blind
In the longitudinal space of slot 1, it is sequentially distributed non-metallized regions 2, metallized area 3, non-metallized regions 2 and metallized area
3, totally four parts.
Signal may be implemented compared to the PCB construction that example IV provides in the PCB construction that the embodiment of the present invention five provides
With conducting for bottom core plate.Predictably, it such as the structure in embodiment five, can also realize in the same blind slot 1
Longitudinal space in, be sequentially distributed non-metallized regions 2 and metallized area 3, the structure of totally two parts.
According to the structure of embodiment one and embodiment five, though it is foreseeable that non-metallized regions 2 and metallized area 3
Permutation and combination it is different, generated different structure form, it is not limited to structure type shown in Fig. 1 to Fig. 5, as long as full
Foot is in the longitudinal space of the same blind slot 1, and non-metallized regions 2 are arranged alternately successively with metallized area 3, in the application
Protection domain in.
In the longitudinal space of the same blind slot 1 of PCB provided by the invention, PCB, contain metallized area 3 and non-simultaneously
Metallized area 2, metallized area 3 and non-metallized regions 2 are arranged alternately successively, and alternate quantity is at least primary, real
The selectivity connection for having showed internal layer circuit signal circuit, is conducive to the further micromation of PCB, and functional diversities are suitble to abnormity knot
The installation of the component of structure or extraordinary combination element device.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement etc., should be included in the claims in the present invention made by within the spirit and principle of invention
Protection domain within.
Claims (9)
1. a kind of PCB, which is characterized in that the side of the PCB is provided with blind slot, and non-gold is arranged at intervals on the blind slot cell wall
Categoryization region and metallized area.
2. PCB according to claim 1, which is characterized in that the non-metallized regions are by offering the semi-solid preparation of straight slot
The straight slot inner wall of piece is formed.
3. PCB according to claim 1, which is characterized in that on substrate of the non-metallized regions by offering straight slot
Straight slot inner wall and formed with the straight slot inner wall of the prepreg for offering straight slot of substrate bonding.
4. PCB according to claim 3, which is characterized in that the metal layer of the substrate of the non-metallized regions is around logical
Slot is provided with the first notch, and the horizontal cross-sectional profile of first notch is located at the periphery of the horizontal cross-sectional profile of straight slot.
5. PCB according to claim 1, which is characterized in that on substrate of the metallized area by offering straight slot
The metallization inner wall of straight slot is formed.
6. PCB according to claim 1, which is characterized in that be provided with line pattern on the slot bottom metal layer of the blind slot.
7. PCB according to claim 1, which is characterized in that the metal layer of the metallized area is layers of copper.
8. PCB according to claim 3 or 4, which is characterized in that the substrate is the combination of core plate and/or daughter board；It is described
Daughter board is pressed by least two core plates.
9. PCB according to claim 1, which is characterized in that longitudinally spaced to be provided on the cell wall in the blind slot：
Metallized area and non-metallized regions；
Or non-metallized regions and metallized area；
Or non-metallized regions, metallized area and non-metallized regions；
Or metallized area, non-metallized regions, metallized area and non-metallized regions；
Or non-metallized regions, metallized area, non-metallized regions and metallized area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612010.9A CN108770200A (en) | 2018-06-14 | 2018-06-14 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612010.9A CN108770200A (en) | 2018-06-14 | 2018-06-14 | A kind of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770200A true CN108770200A (en) | 2018-11-06 |
Family
ID=64021176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810612010.9A Pending CN108770200A (en) | 2018-06-14 | 2018-06-14 | A kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770200A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090166080A1 (en) * | 2007-12-27 | 2009-07-02 | Fujitsu Limited | Multilayer wiring board and method of manufacturing the same |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103517581A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Manufacturing method of multilayer PCB board and multilayer PCB board |
| CN103687279A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Printed circuit board and manufacturing method for same |
| CN103687341A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Method for forming breakage holes in printed circuit board |
| CN107613673A (en) * | 2017-09-27 | 2018-01-19 | 生益电子股份有限公司 | A kind of PCB processing method and PCB |
-
2018
- 2018-06-14 CN CN201810612010.9A patent/CN108770200A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090166080A1 (en) * | 2007-12-27 | 2009-07-02 | Fujitsu Limited | Multilayer wiring board and method of manufacturing the same |
| CN103517581A (en) * | 2012-06-15 | 2014-01-15 | 深南电路有限公司 | Manufacturing method of multilayer PCB board and multilayer PCB board |
| CN102946695A (en) * | 2012-10-31 | 2013-02-27 | 华为技术有限公司 | Through hole structure, printed circuit board, and manufacture method of through hole structure |
| CN103687279A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Printed circuit board and manufacturing method for same |
| CN103687341A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Method for forming breakage holes in printed circuit board |
| CN107613673A (en) * | 2017-09-27 | 2018-01-19 | 生益电子股份有限公司 | A kind of PCB processing method and PCB |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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Application publication date: 20181106 |