CN108770210A - A kind of production method of PCB - Google Patents
A kind of production method of PCB Download PDFInfo
- Publication number
- CN108770210A CN108770210A CN201810612053.7A CN201810612053A CN108770210A CN 108770210 A CN108770210 A CN 108770210A CN 201810612053 A CN201810612053 A CN 201810612053A CN 108770210 A CN108770210 A CN 108770210A
- Authority
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- China
- Prior art keywords
- substrate
- straight slot
- prepreg
- pcb
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Abstract
The present invention relates to board production technical fields, disclose a kind of production method of PCB.The present invention program includes the following steps：S1, the prepreg for providing first substrate, offering straight slot offer straight slot and the second substrate of straight slot cell wall metallization；S2, overlapping first substrate, prepreg and second substrate, form component to be laminated；Component to be laminated in S3, pressing S2, forms the PCB with blind slot.The production method of PCB provided by the invention makes in the longitudinal space of the same blind slots of PCB, contains metallization cell wall and non-metallic cell wall simultaneously, realizes the selectivity connection of internal layer circuit signal circuit, is conducive to the further micromation of PCB, functional diversities.
Description
Technical field
The present invention relates to board production technical field more particularly to a kind of production methods of PCB.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB) is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board has accounted in the electronics industry
According to the status of empery.
In order to output blind slot on printed wiring board assembly volume and other particular/special requirements, generally use number are reduced to meet
Control milling machine mills out blind slot, and blind slot at this time has non-metallic cell wall and slot bottom, can also sink to cell wall or slot bottom
Copper, electroplating operations form the cell wall or slot bottom of metallization.Therefore, in the prior art, the cell wall or slot bottom of blind slot can only be realized entirely
Portion is non-metallic or all metallizes.Existing design is mainly insufficient：
1. single metallization ladder cell wall or non-metallic stepped groove can not realize that the extraordinary assembling of component is wanted simultaneously
It asks, or integrates other more power amplifying devices.
2. cannot achieve the selectivity connection for realizing internal layer circuit signal circuit in the same longitudinal space.
Therefore a kind of production method of PCB is needed to solve the above problems.
Invention content
The purpose of the present invention is to provide a kind of production method of PCB, in the longitudinal space for making the same blind slots of PCB, together
Shi Hanyou metallizes cell wall and non-metallic cell wall, realizes the selectivity connection of internal layer circuit signal circuit, conducive to PCB into one
Step micromation, functional diversities.
For this purpose, the present invention uses following technical scheme：
A kind of production method of PCB, includes the following steps：
S1, the prepreg for providing first substrate, offering straight slot offer straight slot and straight slot cell wall metallize second
Substrate；
S2, overlapping first substrate, prepreg and second substrate, form component to be laminated；
Component to be laminated in S3, pressing S2, forms the PCB with blind slot.
As a preferred embodiment of the present invention, further include in step sl：
There is provided and offer straight slot and the non-metallic third substrate of straight slot cell wall, the straight slot horizontal cross-section on third substrate with
The horizontal cross-section of straight slot on second substrate is identical；
Step S2 is specially：
First substrate, prepreg, third substrate, prepreg and second substrate are overlapped successively, form component to be laminated；
Alternatively, overlapping first substrate, prepreg, second substrate, prepreg and third substrate successively, formed to be laminated
Component；
Alternatively, successively overlap first substrate, prepreg, third substrate, prepreg, second substrate, prepreg and
Third substrate forms component to be laminated；
Alternatively, successively overlap first substrate, prepreg, second substrate, prepreg, third substrate, prepreg and
Second substrate forms component to be laminated
As a preferred embodiment of the present invention, second substrate is formed by individual core plate.
As a preferred embodiment of the present invention, second substrate is pressed by multiple core plates and prepreg and is formed.
As a preferred embodiment of the present invention, resistance glue material is placed before stitching operation in straight slot.
As a preferred embodiment of the present invention, further include after step S3：
Step S4, making outer graphics, welding resistance and the operation of surface treatment are carried out to PCB.
As a preferred embodiment of the present invention, first substrate is to offer the substrate of blind slot, and the cell wall metal of blind slot
Change.
As a preferred embodiment of the present invention, provide offer straight slot and straight slot cell wall it is non-metallic third substrate tool
Body includes the following steps：
An at least core plate is provided, notch is opened up in the layers of copper of core plate；
Corresponded on all core plates the notch position open up straight slot after press, or by all core plates press after,
The position of the corresponding notch opens up straight slot, to form the third substrate for offering straight slot；
Wherein, the horizontal cross-sectional profile of the notch is located at the periphery of the horizontal cross-sectional profile of straight slot.
Beneficial effects of the present invention：
The production method of PCB provided by the invention in the longitudinal space for making the same blind slots of PCB, contains metallization simultaneously
Cell wall and non-metallic cell wall realize the selectivity connection of internal layer circuit signal circuit, are conducive to the further micromation of PCB, work(
Can be diversified, it is suitble to the installation of the component or extraordinary combination element device of polymorphic structure.
Description of the drawings
Fig. 1 is the production method flow chart of PCB provided by the invention；
Fig. 2 is a kind of schematic diagram of step 1 in the embodiment of the present invention one；
Fig. 3 is another schematic diagram of step 1 in the embodiment of the present invention one；
Fig. 4 is the schematic diagram of step 2 in the embodiment of the present invention one；
Fig. 5 is the schematic diagram of step 3 in the embodiment of the present invention one；
Fig. 6 is the schematic diagram of step 4 in the embodiment of the present invention one；
Fig. 7 is the schematic diagram of step 1 in the embodiment of the present invention two；
Fig. 8 is the schematic diagram of step 2 in the embodiment of the present invention two；
Fig. 9 is the schematic diagram of step 3 in the embodiment of the present invention two；
Figure 10 is the schematic diagram of step 4 in the embodiment of the present invention two；
Figure 11 is the schematic diagram of the first substrate using another structure in the embodiment of the present invention two.
In figure：
1, first substrate；2, straight slot；3, prepreg；4, second substrate；5, blind slot；6, third substrate；7, glue material is hindered.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
In all embodiments of the invention, substrate can be the daughter board that individual core plate or multiple core plates are pressed into, can also root
Core plate and/or daughter board is selected to be combined according to design requirement, to obtain the layers of copper quantity for meeting demand；Also, these core plates and/
Or the combination of daughter board can first be pressed into force fit plate in some is rapid, can also press together in the following step；It needs to note
Meaning, if substrate includes slot or the hole of metallization, the combination of these core plates and/or daughter board should be carried out to slot or hole
It is first pressed before metalized.
Embodiment one：
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, the embodiment of the present invention one provides a kind of production method of PCB, this method, which can make one kind, to be had
The cell wall of the PCB of blind slot, wherein blind slot are partially metallised, and part is non-metallic.This method comprises the following steps.
Step 1：
The schematic diagram of step 1 can be as shown in Figures 2 and 3 respectively there are two form in the embodiment of the present invention one, provides
First substrate 1 can make line pattern, 1 unslotted of first substrate on first substrate 1, wherein with 1 demand copper of first substrate
For the quantity of layer is 6, first substrate 1 can be：
As shown in Fig. 2, providing individual core plate, prepreg and daughter board to be laminated, wherein make circuit on individual core plate
Figure, daughter board are first pressed by two core plates and are formed, and the making of inner line figure, therefore first in Fig. 2 are completed before pressing
The needs of substrate 1 press together in the following step；
As shown in figure 3, providing daughter board, wherein line pattern is made on daughter board.
Further, straight slot is opened up on the prepreg 3 between first substrate 1 and second substrate 4, straight slot passes through numerical control
Milling machine mills out；The second substrate 4 for offering straight slot 2 and the metallization of 2 cell wall of straight slot is provided.
Specifically, the making step of second substrate 4 is：
1, when second substrate 4 is formed by individual core plate, straight slot 2 is milled out to individual core plate by numerical control milling machine, to straight slot 2
Heavy copper, electroplating processes are carried out, the cell wall of straight slot 2 is made to metallize, form second substrate 4；
2, when second substrate 4 is pressed by multiple core plates and prepreg to be formed, multiple core plates are subjected to pressing shape first
At daughter board, straight slot is milled out by numerical control milling machine, then heavy copper, electroplating processes are carried out to straight slot, so that the cell wall of straight slot is metallized, formed
Second substrate 4.
Step 2：
The schematic diagram of step 2 as shown in figure 4, overlap first substrate 1,3 and of prepreg successively in the embodiment of the present invention one
Second substrate 4 is aligned straight slot, forms component to be laminated, and resistance glue material 7 is put into straight slot, can also use extraordinary low flowing
Degree jointing material is pressed, as long as the technology of the gummosis extremely cell wall of metallization straight slot in pressing of prepreg 3 can be prevented
Scheme is within the protection domain of the application.
Step 3：
The schematic diagram of step 3 is as shown in figure 5, press the component to be laminated in step 2 in the embodiment of the present invention one
It closes, forms the PCB with blind slot 5.
Step 4：
In the embodiment of the present invention one step 4 schematic diagram as shown in fig. 6, to PCB carry out making outer graphics, welding resistance and
The operation of surface treatment.
At this point, in the longitudinal space of the same blind slot of PCB, contain metallization cell wall and non-metallic cell wall simultaneously,
The selectivity connection that can realize internal layer circuit signal circuit, is conducive to the further micromation of PCB, and functional diversities are suitble to different
The installation of the component of shape structure or extraordinary combination element device.
Embodiment two：
For the concrete structure for realizing in embodiment two, (identical portions are made using following steps on the basis of embodiment one
Divide and repeat no more)：
Step 1：
The schematic diagram of step 1 as shown in fig. 7, providing first substrate 1, do not open by first substrate 1 in the embodiment of the present invention two
Slot, the first substrate 1 in embodiment two are individual core plate, and line pattern can be made on first substrate 1；Offer offers logical
The prepreg 3 of slot, straight slot are milled out by numerical control milling machine；The second substrate for offering straight slot 2 and the metallization of 2 cell wall of straight slot is provided
4, second substrate 4 is individual core plate；Third substrate 6 is provided, third substrate 6 offers straight slot, and straight slot cell wall is non-metallic.
Specifically, the making step of third substrate 6 is：
An at least core plate is provided, notch is opened up in the layers of copper of core plate；The position that the notch is corresponded on core plate is logical
It crosses numerical control milling machine and mills out straight slot, and the horizontal cross-sectional profile of the notch is located at the periphery of the horizontal cross-sectional profile of straight slot, at this
Step is pressed or is pressed together in subsequent pressing step, forms the third substrate 6 for offering straight slot；Or it will open up and lack
All core plates of mouth output straight slot after being pressed into force fit plate, form the third substrate 6 for offering straight slot.
Step 2：
In the embodiment of the present invention two step 2 schematic diagram as shown in figure 8, successively overlapping third substrate 6, second substrate 4,
First substrate 1 and prepreg 3 are aligned straight slot, form component to be laminated, and resistance glue material 7 is put into straight slot, can also be used
Extraordinary low fluidity jointing material is pressed, as long as the gummosis extremely metallization straight slot in pressing of prepreg 3 can be prevented
The technical solution of cell wall is within the protection domain of the application.
Step 3：
The schematic diagram of step 3 is as shown in figure 9, press the component to be laminated in step 2 in the embodiment of the present invention two
It closes, forms the PCB with blind slot 5.
Step 4：
The schematic diagram of step 4 is as shown in Figure 10 in the embodiment of the present invention two, to PCB carry out making outer graphics, welding resistance and
The operation of surface treatment.
Embodiment three：
At this point, in the longitudinal space of the same blind slot of PCB, metallized area is alternately arranged with non-metallized regions,
The selectivity connection that can realize internal layer circuit signal circuit, is conducive to the further micromation of PCB, and functional diversities are suitble to different
The installation of the component of shape structure or extraordinary combination element device.
Predictably, according to technical solution provided by the invention, in the longitudinal space of the same blind slot of PCB,
Realize different structure form caused by the permutation and combination difference of the metallization of part cell wall, the non-metallic distribution of part cell wall, example
Such as, first part is non-metallic, the structure type of second part metallization, and realizes the metallization of part cell wall, part cell wall
Different structure form caused by the variation of the quantity of non-metallic distribution, for example, first part is non-metallic, second part is golden
The non-metallic structure type etc. of categoryization, Part III, within protection scope of the present invention.
Further, in the scheme of above-described embodiment, 1 unslotted of first substrate, though it is foreseeable that first substrate 1
Can offer the substrate of blind slot, and the cell wall of blind slot metallizes.The structure setting of this first substrate 1 so that the letter of PCB
It number can be conducted with the core plate of the bottom.As shown in figure 11, it is the technical solution used in embodiment two, and uses and offer
The cell wall of blind slot and blind slot metallization first substrate 1 pressed after schematic diagram.In Figure 11, the same blind slot of blind slot 5
Longitudinal space in, form it is non-metallic, metallization, it is non-metallic and metallization four regions.Predictably, it uses
Another structure of first substrate 1, can also realize in the longitudinal space of the same blind slot, be sequentially distributed in embodiment three
Non-metallic and metallization, the structure in totally two regions.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement etc., should be included in the claims in the present invention made by within the spirit and principle of invention
Protection domain within.
Claims (8)
1. a kind of production method of PCB, which is characterized in that include the following steps：
S1, the prepreg for providing first substrate, offering straight slot offer straight slot and the second base of straight slot cell wall metallization
Plate；
S2, the overlapping first substrate, prepreg and second substrate, form component to be laminated；
Component to be laminated in S3, pressing S2, forms the PCB with blind slot.
2. the production method of PCB according to claim 1, which is characterized in that further include in step sl：
It provides and offers straight slot and the non-metallic third substrate of straight slot cell wall, the straight slot horizontal cross-section and second on third substrate
The horizontal cross-section of straight slot on substrate is identical；
Step S2 is specially：
The first substrate, prepreg, third substrate, prepreg and second substrate are overlapped successively, form component to be laminated；
Alternatively, overlapping the first substrate, prepreg, second substrate, prepreg and third substrate successively, formed to be laminated
Component；
Alternatively, overlap successively the first substrate, prepreg, third substrate, prepreg, second substrate, prepreg and
Third substrate forms component to be laminated；
Alternatively, overlap successively the first substrate, prepreg, second substrate, prepreg, third substrate, prepreg and
Second substrate forms component to be laminated.
3. the production method of PCB according to claim 2, which is characterized in that the second substrate is formed by individual core plate.
4. the production method of PCB according to claim 2, which is characterized in that the second substrate is by multiple core plates and half
Cured sheets press to be formed.
5. the production method of PCB according to claim 1, which is characterized in that put in the straight slot before stitching operation
Set resistance glue material.
6. the production method of PCB according to claim 1, which is characterized in that further include after step S3：
Step S4, making outer graphics, welding resistance and the operation of surface treatment are carried out to the PCB.
7. the production method of the PCB according to claim 1-6 any one, which is characterized in that the first substrate is out
Substrate equipped with blind slot, and the cell wall metallization of blind slot.
8. the production method of PCB according to claim 2, which is characterized in that offer offers straight slot and straight slot cell wall is non-
The third substrate of metallization specifically includes following steps：
An at least core plate is provided, notch is opened up in the layers of copper of core plate；
Corresponded on all core plates the notch position open up straight slot after press, or by all core plates press after, in correspondence
The position of the notch opens up straight slot, to form the third substrate for offering straight slot；
Wherein, the horizontal cross-sectional profile of the notch is located at the periphery of the horizontal cross-sectional profile of straight slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612053.7A CN108770210A (en) | 2018-06-14 | 2018-06-14 | A kind of production method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810612053.7A CN108770210A (en) | 2018-06-14 | 2018-06-14 | A kind of production method of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108770210A true CN108770210A (en) | 2018-11-06 |
Family
ID=64022405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810612053.7A Pending CN108770210A (en) | 2018-06-14 | 2018-06-14 | A kind of production method of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108770210A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888192A (en) * | 2020-12-29 | 2021-06-01 | 江西志浩电子科技有限公司 | Novel 5G antenna circuit board pressing manufacturing method |
| CN114025486A (en) * | 2021-10-21 | 2022-02-08 | 深圳明阳电路科技股份有限公司 | Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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|---|---|---|---|---|
| US20090166080A1 (en) * | 2007-12-27 | 2009-07-02 | Fujitsu Limited | Multilayer wiring board and method of manufacturing the same |
| CN102958295A (en) * | 2011-08-31 | 2013-03-06 | 深南电路有限公司 | Manufacturing method of step plate |
| CN104023473A (en) * | 2014-05-21 | 2014-09-03 | 烽火通信科技股份有限公司 | Printed circuit board with semi-metalized through hole |
| CN104080274A (en) * | 2013-03-29 | 2014-10-01 | 深南电路有限公司 | Package substrate and manufacturing method of package substrate and substrate assembly |
-
2018
- 2018-06-14 CN CN201810612053.7A patent/CN108770210A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090166080A1 (en) * | 2007-12-27 | 2009-07-02 | Fujitsu Limited | Multilayer wiring board and method of manufacturing the same |
| CN102958295A (en) * | 2011-08-31 | 2013-03-06 | 深南电路有限公司 | Manufacturing method of step plate |
| CN104080274A (en) * | 2013-03-29 | 2014-10-01 | 深南电路有限公司 | Package substrate and manufacturing method of package substrate and substrate assembly |
| CN104023473A (en) * | 2014-05-21 | 2014-09-03 | 烽火通信科技股份有限公司 | Printed circuit board with semi-metalized through hole |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888192A (en) * | 2020-12-29 | 2021-06-01 | 江西志浩电子科技有限公司 | Novel 5G antenna circuit board pressing manufacturing method |
| CN114025486A (en) * | 2021-10-21 | 2022-02-08 | 深圳明阳电路科技股份有限公司 | Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof |
| CN114025486B (en) * | 2021-10-21 | 2024-02-23 | 深圳明阳电路科技股份有限公司 | Blind groove of printed circuit board, electronic equipment and manufacturing method of blind groove |
| CN114980575A (en) * | 2022-05-26 | 2022-08-30 | 珠海杰赛科技有限公司 | Processing method of half-side metalized half-side non-metalized blind groove and printed circuit board |
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Application publication date: 20181106 |