CN108055764B - PCB manufacturing method and PCB - Google Patents
PCB manufacturing method and PCB Download PDFInfo
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- CN108055764B CN108055764B CN201810040863.XA CN201810040863A CN108055764B CN 108055764 B CN108055764 B CN 108055764B CN 201810040863 A CN201810040863 A CN 201810040863A CN 108055764 B CN108055764 B CN 108055764B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of circuit board production, and discloses a manufacturing method of a PCB, which comprises the following steps: s1, providing a heat dissipation substrate and a substrate with a through groove, respectively laying copper layers on the upper surface and the side wall of the heat dissipation substrate, and manufacturing a circuit pattern of the heat dissipation substrate on the copper layer on the upper surface of the heat dissipation substrate; s2, embedding the heat dissipation substrate into the through groove of the substrate, so that the upper surface of the heat dissipation substrate is arranged in the through groove, and the lower surface of the heat dissipation substrate is flush with the lower surface of the substrate. According to the PCB manufacturing method and the PCB, the heat dissipation substrate with the surface lower than the surface of the PCB is embedded in the PCB, the installation space of the PCB is saved, the side wall metallization of the heat dissipation substrate is combined with the circuit pattern on the surface of the heat dissipation substrate, and the arrangement density of power devices on the surface of the heat dissipation substrate is improved.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a PCB manufacturing method and a PCB.
Background
Due to the rapid development of electronic technology, PCBs are being miniaturized, multifunctional, and continuously improved in the direction of high integration and high power, so that the requirement on the heat dissipation performance of PCBs is also increasing, the current mainstream PCB heat dissipation technology mainly comprises a metal substrate (aluminum substrate, copper substrate) technology, a ceramic substrate technology, a copper block embedding technology and the like, the heat dissipation technology utilizes the high heat conduction performance of metals such as copper, aluminum and the like and nonmetals such as ceramics and the like, the heat generated during the operation of high-power devices on the surface of PCBs is timely dissipated, thereby reducing the temperature of electrical appliances and equipment, and prolonging the service life of each high-power element and improving the working performance and reliability of the whole electrical appliances.
However, the heat dissipation technology of the PCB has the problems that when the PCB is manufactured, a metal heat dissipation device needs to be arranged on the whole PCB, the whole weight of the PCB is heavy due to the large amount of metal used, and the complexity of the manufacturing process and the flow is increased, so that the popularization and the use of the PCB adopting the heat dissipation technology are limited to a certain extent for light-weight electronic products. Therefore, there is a need to develop a new heat dissipation technology and structure, which can save the amount of heat conduction material and reduce the weight, and can also reduce the process flow and the manufacturing cost.
Disclosure of Invention
The invention aims to provide a PCB manufacturing method and a PCB, which improve the heat dissipation efficiency of a power device, improve the arrangement density of the power device on the surface of a heat dissipation substrate and save the installation space of the PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of manufacturing a PCB, comprising the steps of:
s1, providing a heat dissipation substrate and a substrate with a through groove, respectively laying copper layers on the upper surface and the side wall of the heat dissipation substrate, and manufacturing a circuit pattern of the heat dissipation substrate on the copper layer on the upper surface of the heat dissipation substrate;
s2, embedding the heat dissipation substrate into the through groove of the substrate, so that the upper surface of the heat dissipation substrate is arranged in the through groove, and the lower surface of the heat dissipation substrate is flush with the lower surface of the substrate.
Preferably, the number and the positions of the heat dissipation substrates embedded in the substrate are determined according to the number of preset components to be mounted.
Specifically, after the heat dissipation substrate is embedded into the through groove on the substrate, the thickness of the heat dissipation substrate is smaller than that of the substrate, and the upper surface of the heat dissipation substrate is arranged in the through groove, so that a component hiding groove is formed above the upper surface of the heat dissipation substrate, and in the application process of the PCB, the components are installed in the component hiding groove and electrically connected with a circuit pattern of the heat dissipation substrate. Firstly, the thickness of the PCB during application can be effectively reduced by mounting the components in the component hiding groove, the assembly space of the PCB is saved, and the PCB can be used in a more compact space or structure; secondly, the design density of the circuit pattern can be improved by arranging the circuit pattern of the heat dissipation substrate, so that the further miniaturization of the PCB is facilitated; thirdly, the heat dissipation substrate is embedded, so that the thickness of the PCB can be reduced, the heat dissipation efficiency of high-power components at local positions can be effectively improved, the components are at relatively low working temperature, and the service life of the components and the PCB is prolonged; and finally, the side wall metallization of the radiating substrate is combined with the circuit pattern on the surface of the radiating substrate, so that the arrangement density of the power devices on the surface of the radiating substrate is improved.
Preferably, in step S1, before the substrate is grooved, the substrate is drilled, copper is deposited, and plated.
Specifically, a mechanical drilling mode is adopted to drill a through hole or a mechanical blind hole on a substrate, a laser drilling mode is adopted to drill a blind hole on the substrate, copper deposition and electroplating are carried out on the substrate, hole walls of the through hole or the blind hole form hole wall copper, the hole wall copper can realize electrical communication of all layers of circuit patterns on the substrate, after copper deposition and electroplating are carried out on the substrate, a milling machine is adopted to process the through groove, and the side wall of the through groove is not metallized.
As a preferred technical solution, in step S1, the substrate is formed by laminating a plurality of core boards, and a prepreg is stacked between two adjacent core boards and laminated to form the substrate.
Preferably, in step S1, a copper layer is formed on the lower surface of the heat dissipating substrate, and a heat dissipating substrate circuit pattern is formed on the copper layer.
Specifically, lay the copper layer and with the lower surface parallel and level of base plate at the lower surface of radiating basal plate, further reduced PCB's height effectively, the copper layer of radiating basal plate lower surface communicates with the copper layer of radiating basal plate lateral wall, and then communicates with the surperficial copper layer of base plate lower surface, is convenient for make complete face circuit figure at the lower surface of base plate.
As a preferred technical solution, the heat dissipation substrate circuit pattern includes at least one pad.
As a preferred technical solution, after the step S2, the method further includes: and step S3, carrying out pattern transfer, solder mask and surface treatment on the substrate.
Specifically, the substrate embedded with the heat dissipation substrate is subjected to surface treatment through processes of hot air leveling, organic coating, chemical nickel/gold plating, silver immersion, tin immersion and the like, and finally the high-heat-conductivity PCB is obtained.
As a preferred technical solution, the heat dissipation substrate is a ceramic substrate.
Specifically, the heat dissipation substrate may also be a metal substrate such as iron, aluminum, copper, or any other substrate capable of efficiently dissipating heat of the high-power component.
As a preferred technical scheme, at least one group of opposite sharp corners are arranged on the ceramic substrate, and the sharp corners are clamped into the side walls of the through grooves in an interference mode.
In particular, in order to realize embedding of the ceramic substrate in the substrate, at least one set of opposing sharp corners is provided on the ceramic substrate. Through exerting pressure to the ceramic substrate, can advance logical groove with the slow pressure of the closed angle on the ceramic substrate, because ceramic substrate's hardness is greater than the hardness of PCB base plate, ceramic substrate's closed angle can be with leading to the corresponding position extrusion deformation of groove lateral wall, the PCB base plate after the deformation blocks ceramic substrate firmly to ceramic substrate can not follow the PCB base plate and drop, this kind of connected mode simple structure, and easy to carry out can effectual reduction PCB's cost of manufacture.
A PCB is manufactured according to the manufacturing method of the PCB.
The invention has the beneficial effects that: firstly, the thickness of the PCB during application can be effectively reduced by mounting the components in the component hiding groove, the assembly space of the PCB is saved, and the PCB can be used in a more compact space or structure; secondly, the design density of the circuit pattern can be improved by arranging the circuit pattern of the heat dissipation substrate, so that the further miniaturization of the PCB is facilitated; thirdly, the heat dissipation substrate is embedded, so that the thickness of the PCB can be reduced, the heat dissipation efficiency of high-power components at local positions can be effectively improved, the components are at relatively low working temperature, and the service life of the components and the PCB is prolonged; and finally, the side wall metallization of the radiating substrate is combined with the circuit pattern on the surface of the radiating substrate, so that the arrangement density of the power devices on the surface of the radiating substrate is improved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a PCB according to an embodiment of the present invention.
In the figure:
1. a substrate; 101. a through groove; 2. a heat-dissipating substrate; 201. a copper layer; 3. a component hiding groove.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
As shown in fig. 1, the present embodiment provides a method for manufacturing a PCB, including the steps of:
step one, providing a substrate 1, and sequentially drilling, depositing copper, electroplating and opening a groove 101 on the substrate 1.
Specifically, the substrate 1 may be a single core board, or a multi-layer board formed by laminating a plurality of core boards. When the substrate 1 is a multilayer board formed by laminating a plurality of core boards, the substrate 1 is manufactured by providing a plurality of core boards and prepregs, laminating the prepregs between two adjacent core boards, and laminating. In the present embodiment, the substrate 1 is formed by laminating two core boards.
Through machining via hole or mechanical blind hole on base plate 1 of mechanical drilling's mode, through the blind hole of laser drilling's mode processing on base plate 1, carry out heavy copper, electroplating process to base plate 1, make the pore wall of via hole and blind hole form the pore wall copper, then open groove 101 on base plate 1 through the mode of milling machine processing, specifically, the horizontal cross-section that leads to the groove can be the square, four angles that lead to groove 101 are the fillet, just the groove wall that leads to groove 101 is non-metallized.
In addition, the number and positions of the through grooves 101 formed in the substrate 1 are determined according to the number of components to be mounted.
Step two, providing a heat dissipation substrate 2, respectively laying copper layers 201 on the upper surface, the lower surface and the side walls of the heat dissipation substrate 2, and respectively manufacturing heat dissipation substrate circuit patterns on the copper layers 201 on the upper surface and the lower surface of the heat dissipation substrate 2.
Further, it is also possible to lay the copper layer 201 only on the upper surface of the heat dissipating substrate 2 and to fabricate a heat dissipating substrate circuit pattern including at least one pad.
In the embodiment, the heat dissipation substrate 2 is a ceramic substrate, and before the ceramic substrate is embedded into the through groove 101 of the substrate, copper layers 201 are respectively laid on the upper surface, the lower surface and the side walls of the ceramic substrate, in the embodiment, the copper layers 201 on the surface of the ceramic substrate can ensure that a power element is well attached to the ceramic substrate, and the heat dissipation effect is improved.
In addition, the heat dissipation substrate 2 may also be a metal substrate such as an iron substrate, an aluminum substrate, a copper substrate, or any other substrate capable of dissipating heat efficiently, which is not described herein any more.
And step three, embedding the heat dissipation substrate 2 into the through groove 101 of the substrate 1, so that the upper surface of the heat dissipation substrate 2 is arranged in the through groove 101, and the lower surface of the heat dissipation substrate 2 is flush with the lower surface of the substrate 1.
Specifically, the thickness of radiating substrate 2 is less than the thickness of base plate 1, and with radiating substrate 2 embedding base plate 1 lead to the inslot 101, make the upper surface of radiating substrate 2 arranges in and leads to the inslot 101, radiating substrate 2's lower surface and base plate 1's lower surface parallel and level, radiating substrate 2's upper surface and radiating substrate 2 top lead to the groove 101 and form the hidden groove 3 that is used for placing power components and parts, just radiating substrate circuit figure and base plate 1's inlayer circuit figure intercommunication is with the copper layer of radiating substrate 2 lateral walls. In addition, the copper layer 201 on the upper surface and the copper layer 201 on the lower surface of the heat dissipation substrate 2 are respectively communicated with the copper layer 201 on the lower surface of the substrate 1 through the copper layer 201 on the side wall of the heat dissipation substrate 2.
Power components and parts are placed and are hidden a groove 3 and with heat dissipation base plate 2 contact, have realized power components and parts's effective heat dissipation and reduced PCB's height on the whole, make PCB further miniaturized, in addition, heat dissipation base plate 2 is embedded in logical groove 101 of base plate 1 and has also reduced PCB's height.
The copper layer 201 on the lower surface of the heat dissipation substrate 2 is communicated with the surface copper layer on the lower surface of the substrate 1 through the copper layer 201 on the side wall of the heat dissipation substrate 2, so that a complete circuit pattern can be conveniently manufactured on the lower surface of the substrate 1.
In the present embodiment, a wiring pattern is first formed on the heat dissipation substrate 2, and then the heat dissipation substrate 2 is inserted into the through-groove 101 of the substrate 1. Alternatively, the heat dissipating substrate 2 may be first inserted into the through-groove 101 of the substrate 1, and then the circuit patterns may be formed on the copper layers 201 on the upper and lower surfaces of the heat dissipating substrate 2.
In this embodiment, the heat dissipation substrate 2 is a ceramic substrate, at least one set of opposite sharp corners is disposed on the ceramic substrate, and the sharp corners are all clamped into the side walls of the through grooves 101 in an interference manner.
The horizontal cross section of ceramic substrate is the square, is equipped with at least a set of relative closed angle on the ceramic substrate, during the logical groove 101's of card income of the equal interference of closed angle lateral wall, preferably, copper layer 201 has been plated at the lateral wall of ceramic substrate's closed angle, because closed angle interference's card goes into logical groove 101's lateral wall, and copper layer 201 sets up the surface at the closed angle, consequently, the same interference card of copper layer 201 goes into logical groove 101's lateral wall, copper layer 201 can closely laminate with base plate 1 promptly, thereby circuit figure on the ceramic substrate realizes electric conduction through copper layer 201 and the circuit figure on the base plate 1. Compared with the prior art, the manufacturing and processing technology of the existing PCB is optimized, and the corners are preferably plated with copper, so that the copper plating area is reduced, the copper raw material is saved, and the production cost is reduced. In addition, copper may be plated on all of the four side surfaces of the ceramic substrate.
When in logical groove 101 with ceramic substrate embedding base plate 1, through exerting pressure to the ceramic substrate, press into logical groove 101 with ceramic substrate is slow, press the in-process, because the hardness of ceramic substrate and copper layer 201 will be greater than base plate 1's hardness, copper layer 201 on ceramic substrate's the closed angle and the closed angle can be with the corresponding position extrusion deformation of the lateral wall that leads to groove 101, base plate 1 after the deformation blocks copper layer 201 firmly, thereby ceramic substrate can not follow logical groove 101 and drop, and this kind of connected mode simple structure, easy to carry out, the cost of manufacture that can effectual reduction PCB.
It can be understood that the ceramic substrate in this embodiment may be made into a suitable shape according to the specific shape of the heating element to be heat-dissipated, and the sharp angle may be an acute angle, or may be a right angle or an obtuse angle.
And step four, carrying out pattern transfer, solder resistance and surface treatment on the substrate 1.
In this embodiment, a board surface circuit pattern is formed on the surface of the substrate 1, and the board surface circuit pattern on the lower surface of the substrate 1 is connected to the heat dissipating substrate circuit pattern through the copper layer 201 on the side wall of the heat dissipating substrate 2. The copper layer 201 on the side wall of the heat dissipating substrate 2 also connects the inner layer circuit patterns of the substrate 1 to each other and to the board surface circuit pattern on the lower surface of the substrate 1.
In this embodiment, the power component is placed in the component hiding groove 3, the power component is connected with the circuit pattern of the heat dissipation substrate 2, the circuit pattern of the heat dissipation substrate is communicated with the circuit pattern of the lower surface of the substrate 1 through the copper layer 201 on the side wall of the heat dissipation substrate 2, in addition, the copper layer 201 on the side wall of the heat dissipation substrate 2 also enables the inner layer circuit pattern of the substrate 1 and the circuit pattern of the lower surface of the substrate 1 to be communicated with each other, the inner layer circuit pattern comprises a signal layer and a ground layer, and therefore, when the power component is placed in the component hiding groove 3 and connected with the circuit pattern of the heat dissipation substrate, reliable electrical communication between the power component and the signal layer or the ground layer of the.
In addition, the substrate 1 embedded with the heat dissipation substrate 2 is subjected to surface treatment through processes of hot air leveling, organic coating, chemical nickel/gold plating, silver immersion, tin immersion and the like, and finally the PCB with high heat conductivity is obtained.
As shown in fig. 2, the present embodiment further provides a PCB manufactured by the above-mentioned PCB manufacturing method. In this embodiment, PCB includes base plate 1, it has logical groove 101 to open on base plate 1, it has heat dissipation base plate 2 to lead to the inslot of groove 101, heat dissipation base plate 2 and lead to groove 101 interference fit, and heat dissipation base plate 2's upper surface is arranged in logical groove 101, and heat dissipation base plate 2's upper surface and the lateral wall that leads to groove 101 form and hide a groove 3, and heat dissipation base plate 2's upper surface, lower surface and lateral wall have plated copper layer 201, be equipped with heat dissipation base plate circuit figure on heat dissipation base plate 2 upper surface and the copper layer 201 of lower surface respectively, base plate 1's surface is equipped with face circuit figure, the face circuit figure of base plate 1 lower surface passes through copper layer 201 and the heat dissipation base plate circuit figure intercommunication of heat dissipation base plate.
In the PCB application process, components are arranged in the component hiding groove 3 and are electrically communicated with the circuit pattern of the heat dissipation substrate. Firstly, the thickness of the PCB during application is effectively reduced by installing components in the component hiding groove 3, the assembly space of the PCB is saved, and the application of the PCB in a more compact space or structure is utilized; secondly, the design density of the circuit pattern can be improved by arranging the circuit pattern of the heat dissipation substrate, so that the further miniaturization of the PCB is facilitated; thirdly, the heat dissipation substrate 2 is embedded, so that the thickness of the PCB can be reduced, the heat dissipation efficiency of high-power components at local positions can be effectively improved, the components are at relatively low working temperature, and the service life of the components and the PCB is prolonged; finally, the copper layer 201 on the side wall of the heat dissipation substrate 2 is communicated with the copper layer 201 on the upper surface of the heat dissipation substrate 2, so that the setting density of the power devices on the surface of the heat dissipation substrate 2 is improved.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (6)
1. A method for manufacturing a PCB, comprising the steps of:
s1, providing a heat dissipation substrate and a substrate with a through groove, respectively laying copper layers on the upper surface and the side wall of the heat dissipation substrate, and manufacturing a circuit pattern of the heat dissipation substrate on the copper layer on the upper surface of the heat dissipation substrate;
s2, embedding the heat dissipation substrate into the through groove of the substrate, so that the upper surface of the heat dissipation substrate is arranged in the through groove, and the lower surface of the heat dissipation substrate is flush with the lower surface of the substrate;
the heat dissipation substrate is a ceramic substrate, at least one group of opposite sharp corners are arranged on the ceramic substrate, the sharp corners are clamped into the side walls of the through grooves in an interference manner, and the side walls of the sharp corners are plated with the copper layers;
and laying a copper layer on the lower surface of the radiating substrate, and manufacturing a radiating substrate circuit pattern on the copper layer.
2. The method of manufacturing a PCB of claim 1, wherein the substrate is drilled, copper-plated and electroplated before being grooved in step S1.
3. The method of claim 1, wherein in step S1, the substrate is formed by laminating a plurality of core boards, and a prepreg is laminated between two adjacent core boards to form the substrate.
4. The method of manufacturing a PCB of claim 1, wherein the heat-dissipating substrate trace pattern includes at least one pad.
5. The method for manufacturing a PCB of claim 1, further comprising, after the step S2: and step S3, carrying out pattern transfer, solder mask and surface treatment on the substrate.
6. A PCB manufactured by the method of manufacturing a PCB according to any of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810040863.XA CN108055764B (en) | 2018-01-16 | 2018-01-16 | PCB manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810040863.XA CN108055764B (en) | 2018-01-16 | 2018-01-16 | PCB manufacturing method and PCB |
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| Publication Number | Publication Date |
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| CN108055764A CN108055764A (en) | 2018-05-18 |
| CN108055764B true CN108055764B (en) | 2020-03-27 |
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| CN113438831B (en) * | 2021-06-03 | 2022-08-09 | 中国电子科技集团公司第三十八研究所 | Microwave multifunctional assembly with interconnected embedded chips in any layer and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6818477B2 (en) * | 2001-11-26 | 2004-11-16 | Powerwave Technologies, Inc. | Method of mounting a component in an edge-plated hole formed in a printed circuit board |
| CN103096638B (en) * | 2011-10-27 | 2016-01-13 | 北大方正集团有限公司 | A kind of press in type printed circuit board with high thermal conductivity and preparation method thereof |
| CN105472877B (en) * | 2015-09-22 | 2018-10-16 | 乐健科技（珠海）有限公司 | Printed circuit board and preparation method thereof with thermally conductive and electrically insulating micro- radiator |
| CN205491427U (en) * | 2016-01-12 | 2016-08-17 | 乐健科技（珠海）有限公司 | High frequency printed circuit board and LED light source module with pottery radiator |
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