CN210247149U - Printed circuit board heat radiation structure and printed circuit board - Google Patents
Printed circuit board heat radiation structure and printed circuit board Download PDFInfo
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- CN210247149U CN210247149U CN201921203990.3U CN201921203990U CN210247149U CN 210247149 U CN210247149 U CN 210247149U CN 201921203990 U CN201921203990 U CN 201921203990U CN 210247149 U CN210247149 U CN 210247149U
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Abstract
The utility model relates to the field of printed circuit board manufacturing, and discloses a printed circuit board heat dissipation structure and a printed circuit board, which comprises a circuit substrate, wherein copper-clad layers are arranged on the upper surface and the lower surface of the circuit substrate, a base material is arranged between the copper-clad layers on the upper surface and the lower surface, the circuit substrate is provided with a groove, and the bottom of the groove extends into the copper-clad layer on the lower surface of the circuit substrate; the bottom of the groove is electroplated with a heat dissipation copper layer, and the heat dissipation copper layer is connected with the copper-clad layer on the lower surface of the circuit substrate into a whole. The utility model discloses a set up the recess, electroplate the heat dissipation copper layer in the recess, make the copper layer that covers of heat dissipation copper layer and circuit substrate form as whole, the cohesion is stronger, and the thermal diffusivity is better, has reduced the printed circuit board preparation degree of difficulty.
Description
Technical Field
The utility model relates to a printed circuit board makes the field, particularly, relates to a printed circuit board heat radiation structure and printed circuit board.
Background
At present, a large number of high-power devices are mature and applied to a PCB, and because the high-power devices generate a large amount of heat energy during working, the service life of the components can be shortened due to the obvious rise of the temperature of the high-power devices. In order to solve the heat dissipation problem of the high power device, a metal-based printed circuit board with good heat dissipation performance is generally used as a mounting carrier of the high power device. For example, chinese patent publication No. CN202103943U discloses a printed circuit board with a metal micro heat sink. Chinese patent publication No. CN102291938B discloses a method for manufacturing a printed circuit board with a metal micro-heat sink. According to the printed circuit board, the metal micro radiator with high heat conductivity is combined with the conventional printed circuit board, the heating element is arranged on the end face of the metal micro radiator, and heat dissipated by the heating element during working can be conducted to the metal bottom layer through the metal micro radiator and then conducted to the outside of the printed circuit board through the metal bottom layer, so that the heat dissipation function is realized.
The preparation method of the printed circuit board comprises the steps of firstly forming the metal micro radiator on the metal bottom layer, forming the mounting hole on the circuit substrate, then embedding the metal micro radiator into the mounting hole of the circuit substrate and carrying out hot pressing, so that the alignment precision between the metal micro radiator and the mounting hole is poor, the manufacturing difficulty of the printed circuit board is high, and the product percent of pass is low; the metal micro radiator and the circuit substrate have insufficient bonding force and poor heat resistance; and the overflow glue generated in the hot pressing process is difficult to remove, thus affecting the heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
To foretell not enough among the prior art, the utility model provides a printed circuit board heat radiation structure and printed circuit board to it is big to solve the printed circuit board preparation degree of difficulty of utensil heat radiation structure, and the heat resistance is poor, problem that the product percent of pass is low.
The utility model adopts the technical proposal that:
a printed circuit board heat dissipation structure comprises a circuit substrate, wherein copper-clad layers are arranged on the upper surface and the lower surface of the circuit substrate, a base material is arranged between the copper-clad layer on the upper surface and the copper-clad layer on the lower surface of the circuit substrate, a groove is formed in the circuit substrate, and the bottom of the groove extends into the copper-clad layer on the lower surface of the circuit substrate; the bottom of the groove is electroplated with a heat dissipation copper layer, and the heat dissipation copper layer is connected with the copper-clad layer on the lower surface of the circuit substrate into a whole.
Furthermore, a thickened copper layer is arranged on the copper-clad layer on the lower surface of the circuit substrate.
Furthermore, the groove is formed by milling through a numerical control milling machine, and the depth of the copper coating layer on the lower surface of the circuit substrate milled into the bottom of the groove is 10-20 microns.
Furthermore, a conductive gold layer is arranged on the surface of the heat dissipation copper layer.
Furthermore, the circuit substrate is a multilayer board, and the base material of the circuit substrate is formed by laminating a plurality of core boards.
Further, the thickness of the heat dissipation copper layer is 0.1 mm-0.5 mm.
The utility model also provides a printed circuit board, it includes above-mentioned printed circuit board heat radiation structure.
The utility model has the advantages that:
the utility model discloses a set up the recess, electroplate the heat dissipation copper layer in the recess, make the copper layer that covers of heat dissipation copper layer and circuit substrate be connected as whole. Compared with the prior art that the radiator is embedded into the mounting hole of the circuit substrate for hot pressing, the bonding force is insufficient and the heat resistance is poor due to unqualified hot pressing; the utility model discloses a heat radiation structure, its heat dissipation copper layer is connected as an organic wholely with covering copper layer, as holistic heat dissipation layer, and the cohesion is stronger, and the thermal diffusivity is better, does not have the excessive glue of hot pressing, does not have the problem that the product percent of pass is low, has reduced the printed circuit board preparation degree of difficulty. The utility model discloses a printed circuit board because the recess has certain degree of depth, can place high-power components and parts in the recess and not influence printed circuit board's whole thickness, is applicable to the integrated installation environment that requires highly to the circuit board size.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention.
Reference numerals: 1-copper-clad layer, 2-substrate, 3-thickened copper layer, 4-groove, 5-heat-dissipation copper layer and 6-conductive gold layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the accompanying drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention.
The utility model provides a printed circuit board heat radiation structure, includes circuit substrate, circuit substrate's upper surface and lower surface all are provided with and cover copper layer 1, and the upper surface covers copper layer 1 and the lower surface covers and be substrate 2 between the copper layer 1, circuit substrate is provided with recess 4, the bottom of recess 4 gos deep into the copper layer 1 that covers of circuit substrate lower surface. The bottom of the groove 4 is electroplated with a heat dissipation copper layer 5, and the heat dissipation copper layer 5 is connected with the copper-clad layer 1 on the lower surface of the circuit substrate into a whole. And a thickened copper layer 3 is electroplated on the copper-clad layer 1 on the lower surface of the circuit substrate. And a conductive gold layer 6 is electroplated on the surface of the heat dissipation copper layer 5.
The manufacturing method of the printed circuit board heat dissipation structure comprises the following steps:
and S1, providing a circuit substrate, specifically, the circuit substrate is a single-sided board, a double-sided board or a multi-layered board, the circuit substrate is subjected to cutting treatment, copper-clad layers are arranged on the upper surface and the lower surface of the circuit substrate, and a base material is arranged between the upper copper-clad layer and the lower copper-clad layer. In this embodiment, the circuit board is a multilayer board, and the base material is formed by laminating multiple core boards. The core plate is composed of polytetrafluoroethylene and glass fiber cloth, has low dielectric constant and low dielectric loss, and can be used for high-frequency transmission.
And S2, milling a groove at the set position of the circuit substrate, and milling the bottom of the groove into the copper-clad layer on the lower surface of the circuit substrate. The mode of milling the groove is as follows: and (3) milling the base material of the circuit substrate by adopting a numerical control milling machine device and controlling the descending depth of the milling cutter to expose the copper-coated layer on the lower surface of the circuit substrate. Because the surface of the copper-clad layer is coated with insulating materials such as resin, the depth of the copper-clad layer at the bottom of the groove milled into the lower surface of the circuit substrate is 10-20 mu m, so that the insulating layer is milled completely, and the electroplating effect is ensured.
And S3, electroplating a heat dissipation copper layer with the thickness of 0.1 mm-0.5 mm at the bottom of the groove, and connecting the heat dissipation copper layer and the copper-clad layer on the lower surface of the circuit substrate into a whole. Before the heat dissipation copper layer is electroplated, a pattern mask is needed to be carried out on the circuit substrate to shield the position which does not need to be electroplated, and the groove is exposed. Then a certain current is applied, and pattern electroplating is carried out within a certain time, namely, a heat dissipation copper layer is electroplated at the bottom of the exposed groove. In this embodiment, the thickness of the heat dissipation copper layer is 0.2 mm.
S4, electroplating a conductive gold layer on the surface of the heat dissipation copper layer formed in the step S3. In this embodiment, the thickness of the conductive gold layer is 2 μm.
In order to enhance the heat dissipation effect, in step S2, before milling the groove, a thickened copper layer is electroplated on the copper clad layer on the lower surface of the circuit substrate, and the copper clad layer on the lower surface of the circuit substrate is thickened to 70 μm.
According to the printed circuit board radiating structure manufactured by the method, the radiating copper layer is integrally connected with the copper-clad layer, so that the bonding force is stronger, and the radiating performance is better. The printed circuit board with the heat dissipation structure has the advantages that the groove has a certain depth, so that high-power components can be placed in the groove without affecting the overall thickness of the printed circuit board, and the printed circuit board is suitable for an integrated installation environment.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A printed circuit board heat radiation structure comprises a circuit substrate, wherein copper-clad layers are arranged on the upper surface and the lower surface of the circuit substrate, and a base material is arranged between the copper-clad layers on the upper surface and the lower surface; the bottom of the groove is electroplated with a heat dissipation copper layer, and the heat dissipation copper layer is connected with the copper-clad layer on the lower surface of the circuit substrate into a whole.
2. The printed circuit board heat dissipation structure of claim 1, wherein the copper clad layer of the lower surface of the circuit substrate is provided with a thickened copper layer.
3. The heat dissipation structure of claim 2, wherein the groove is milled by a numerically controlled milling machine, and the depth of the copper layer coated on the bottom surface of the circuit substrate milled into the bottom of the groove is 10-20 μm.
4. The printed circuit board heat dissipation structure of claim 1, wherein the surface of the heat dissipation copper layer is provided with a conductive gold layer.
5. The heat dissipating structure of a printed circuit board according to claim 1, wherein the circuit substrate is a multi-layer board having a substrate formed by laminating a plurality of core boards.
6. The printed circuit board heat dissipation structure of claim 1, wherein the thickness of the heat dissipation copper layer is 0.1 mm to 0.5 mm.
7. A printed circuit board comprising the printed circuit board heat dissipating structure of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921203990.3U CN210247149U (en) | 2019-07-29 | 2019-07-29 | Printed circuit board heat radiation structure and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921203990.3U CN210247149U (en) | 2019-07-29 | 2019-07-29 | Printed circuit board heat radiation structure and printed circuit board |
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| Publication Number | Publication Date |
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| CN210247149U true CN210247149U (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921203990.3U Active CN210247149U (en) | 2019-07-29 | 2019-07-29 | Printed circuit board heat radiation structure and printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114521041A (en) * | 2020-11-18 | 2022-05-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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2019
- 2019-07-29 CN CN201921203990.3U patent/CN210247149U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114521041A (en) * | 2020-11-18 | 2022-05-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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