CN104582237B - A kind of internal layer walks circuit board of high current and preparation method thereof - Google Patents
A kind of internal layer walks circuit board of high current and preparation method thereof Download PDFInfo
- Publication number
- CN104582237B CN104582237B CN201310493369.6A CN201310493369A CN104582237B CN 104582237 B CN104582237 B CN 104582237B CN 201310493369 A CN201310493369 A CN 201310493369A CN 104582237 B CN104582237 B CN 104582237B
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- CN
- China
- Prior art keywords
- metal substrate
- inner plating
- circuit board
- internal layer
- high current
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
Abstract
The invention discloses the production methods that a kind of internal layer walks the circuit board of high current, including：Inner plating is made, the internal layer plate surface has the first line figure for carrying high current；The Metal Substrate of heat transmission is fixed on internal layer plate surface using heat cure insulating materials, so that the Metal Substrate is located at the top of the first line figure, and arrive at inner plating edge；Lamina rara externa is pressed on the inner plating, and processes outer-layer circuit figure in the outer layer plate surface.The embodiment of the present invention also provides corresponding circuit board.Technical solution of the present invention radiates since the heat that internal layer high current generates quickly is transmitted to board edge using embedment Metal Substrate, effectively increases the radiating efficiency of circuit board.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of internal layer walks circuit board and its making side of high current
Method.
Background technology
High power device is applied more and more at present, and corresponding electric current is also corresponding increasing, and walks high current
Circuit is in printed circuit board（PCB）It is interior to be generally all placed in internal layer, to avoid the safety for influencing device and reduce external layer signal
The interference of layer.
But thing followed another question is, for internal layer when walking high current, will produce larger heat can not be timely
It is transmitted to outside, that is, can be because that circuit board temperature liter can not be caused excessively high due to rapid cooling, to temperature-sensitives such as surface capacitance, resistance
Device generates very big influence and even destroys, and then influences the performance of integrated circuit plate.
The heat sink conception used at present radiates generally by modes such as plated through-hole, sidewall metallizations, but because dissipating
Heat dissipation region contact area is small when hot, and cannot effectively solve the problems, such as heat dissipation it is slow this.
Invention content
The embodiment of the present invention provides a kind of internal layer and walks circuit board of high current and preparation method thereof, to solve existing internal layer
Walk the slow technical problem of the heat dissipation for circuit board of big circuit.
First aspect present invention provides the production method that a kind of internal layer walks the circuit board of high current, including：
Inner plating is made, the internal layer plate surface has the first line figure for carrying high current；Utilize heat cure
The Metal Substrate of heat transmission is fixed on internal layer plate surface by insulating materials, so that the Metal Substrate is insulated with the first line figure and is connect
It touches and arrives at inner plating edge；Lamina rara externa is pressed on the inner plating, and processes outer-layer circuit figure in the outer layer plate surface
Shape.
Second aspect of the present invention provides the circuit board that a kind of internal layer walks high current, including：
Inner plating and on inner plating, heat transmission Metal Substrate is fixed on by heat cure insulating materials and is pressed together on institute
State the lamina rara externa on inner plating；There is the first line figure for carrying high current, the lamina rara externa table on the inner plating
Face has outer-layer circuit figure；The Metal Substrate and the first line figure insulated contact and the edge for arriving at circuit board.
The embodiment of the present invention is used is arranged heat transmission and internal layer heavy current circuit insulated contact gold in circuit inner cord
Belong to base, and set Metal Substrate arrives at the technical solution of board edge so that, the heat that internal layer high current generates can lead to
It crosses Metal Substrate and is quickly transmitted to board edge and radiate, effectively increase the radiating efficiency of circuit board.
Description of the drawings
Fig. 1 is the flow chart of the production method for the circuit board that internal layer provided in an embodiment of the present invention walks high current；
Fig. 2 a and 2b are the plan view and sectional view of inner plating respectively；
Fig. 3 is the schematic diagram of the inner plating of fixed Metal Substrate；
Fig. 4 is the schematic diagram for being press-fitted together as one inner plating and lamina rara externa；
Fig. 5 is the schematic diagram that groove is processed in board edge；
Fig. 6 is the schematic diagram of the finished circuit board obtained after cutting.
Specific implementation mode
The embodiment of the present invention provides the production method that a kind of internal layer walks the circuit board of high current, and this method passes through in circuit board
The Metal Substrate of heat transmission is arranged in internal layer so that, the heat that internal layer high current generates can quickly be transmitted to circuit by Metal Substrate
Edges of boards edge radiates, and effectively increases the radiating efficiency of circuit board, to solve the circuit that existing internal layer walks big circuit
Plate radiates slow technical problem.The embodiment of the present invention also provides the circuit board that corresponding internal layer walks high current.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model that the present invention protects
It encloses.
Embodiment one,
Referring to FIG. 1, the embodiment of the present invention provides the production method that a kind of internal layer walks the circuit board of high current, including：
110, inner plating is made, the internal layer plate surface has the first line figure for carrying high current.
The inner plating can be multi-layer board made of double face copper or pressing.As shown in figures 2 a and 2b, in described
210 surface of laminate is machined with for carrying high current for example more than the first line figure 2101 of 30A electric currents and for carrying letter
Number or low current the second line pattern 2102.
120, the Metal Substrate of heat transmission is fixed on internal layer plate surface using heat cure insulating materials, make the Metal Substrate with
The first line figure insulated contact simultaneously arrives at inner plating edge.
As shown in figure 3, the rapid cooling of the heat in order to realize the high current for carrying first line figure, the present embodiment
The middle Metal Substrate 220 by pre-production is fixed on 2101 surface of inner plating by heat cure insulating materials 230.Preferably, thermosetting
It should be the Heat Conduction Material for having excellent heat conductivility to change insulating materials 230.
In concrete application, can according to the first line figure for walking high current width as width, first line figure
To circuit board molding area edge minimum range as length, and as needed radiate the case where determine Metal Substrate sectional area in turn
Computed altitude is fabricated to the Metal Substrate of the different sizes and shapes corresponding to each first line figure.The material of Metal Substrate can
To select the various metals such as copper, aluminium and its alloy.
The step of fixed Metal Substrate 220 may include：Determine that Metal Substrate 220 in the path on 210 surface of inner plating, makes first
It obtains Metal Substrate 220 and is positioned partially or entirely in the top of first line figure 2101, and arrive at 210 edge of inner plating, so as to the gold
Belong to the side that 220 one end of base can finally be exposed to circuit board obtained；Then, in the region coating for needing fixed Metal Substrate 220
Heat cure insulating materials 230 of the thickness between 40 to 60 microns, the width of the heat cure insulating materials 230 of coating are no less than
The width of Metal Substrate, length are no less than the length of Metal Substrate, are in electrical contact to avoid Metal Substrate and inner plating；It finally, will be described
Metal Substrate 220 is placed on the heat cure insulating materials 230, and carries out heat cure, so that the Metal Substrate 220 is fixed on interior
210 surface of laminate is simultaneously electrically insulated with the first line figure 2101.
130, lamina rara externa is pressed on the inner plating, and processes outer-layer circuit figure in the outer layer plate surface.
This step on 210 surface of inner plating for having fixed Metal Substrate 220 as shown in figure 4, press lamina rara externa 240.This implementation
The lamina rara externa 240 that is there is provided of example include outer copper foil and at least one layer of outer-layer circuit layer and between each line layer,
Line layer and the dielectric layer before outer copper foil.The position corresponding to Metal Substrate 220 of the lamina rara externa should offer holding tank, with
Just Metal Substrate 220 is accommodated in pressing.The lamina rara externa 240 and the inner plating 220 are press-fitted together as one, and lamina rara externa 240
Surface processes outer-layer circuit figure 2401, i.e., tentatively obtains the circuit board that internal layer walks high current.The circuit board is buried by inside
The Metal Substrate entered is dispersed by internal layer high current heat transfer to circuit board side in air, realizes rapid cooling.
In the present embodiment, the Metal Substrate 220 is exposed to the end face of circuit board side by it, radiates into air；But
It is that, since the sectional area of Metal Substrate 220 is limited, in order to improve radiating efficiency, in preferred embodiment, pressing can be right after lamina rara externa
Circuit board side is metallized, and metalized sidewall is made to be connect with Metal Substrate 220, passes through the metallization side with larger area
Wall further increases radiating efficiency.In specific implementation, can by whole side galvanic metallizations of circuit board, can also only
Surface galvanic metallization.
In actual circuit board fabrication process, many circuits are often designed in a big circuit board layout
Plate unit in processing outer-layer circuit figure and then cuts into finished circuit plate unit one by one.And after cutting, it is difficult to
Side metal is carried out using existing technique.It is therefore preferable that in embodiment, the step of metallization to circuit board side
It needs after pressing lamina rara externa, executes, can specifically include before processing outer-layer circuit figure：
Add as shown in figure 5, corresponding to the side end position that the Metal Substrate 220 need to be exposed on the lamina rara externa 240
Work groove 250；The groove 250 can be through the straight slot of whole circuit board all inner platings and lamina rara externa；
Groove 250 is metallized, the metallization inner wall of groove 250 is made to be connected with the Metal Substrate 220；In practical application,
It can be by carrying out full page plating to circuit board, groove 250 is metallized in realization.
Then, after 240 surface of lamina rara externa makes outer-layer circuit figure 2401 and some other conventional treatment, just
Shape processing can be carried out, whole circuit board layout is cut into individual circuit board one by one, after cutting, as shown in fig. 6,
The partially metallised inner wall of the groove 250 becomes the metalized sidewall 260 of circuit board.To the heat that internal layer high current generates
Amount can be transmitted in the metalized sidewall 260 of circuit board through Metal Substrate, then be diffused in air, realize rapid cooling.
To sum up, the production method that the circuit board of high current is walked an embodiment of the present invention provides a kind of internal layer, this method use
The Metal Substrate of heat transmission, and set Metal Substrate and internal layer heavy current circuit insulated contact are set in circuit inner cord, and supported
Up to the technical solution of board edge so that the heat that internal layer high current generates can quickly be transmitted to circuit board by Metal Substrate
Edge radiates, and effectively increases the radiating efficiency of circuit board.In preferred embodiment, the circuit that also arrives at Metal Substrate end face
Plate side metal, so as to further increase the radiating efficiency of circuit board.
Embodiment two,
Referring to FIG. 6, the embodiment of the present invention provides the circuit board that a kind of internal layer walks high current, including：Inner plating 210 and logical
Overheat curable dielectric material 230 is fixed on inner plating 210, heat transmission Metal Substrate 220 and is pressed together on the inner plating
Lamina rara externa 240 on 210；There is the first line figure 2101 for carrying high current, the outer layer on the inner plating 210
240 surface of plate has outer-layer circuit figure 2401；The Metal Substrate 220 and 2101 insulated contact of first line figure simultaneously support
Up to the edge of circuit board.
Preferably, the side of the circuit board has the metalized sidewall 260 being connected with the Metal Substrate 220.
Preferably, the heat cure insulating materials is heat cure insulating heat-conduction material.Further, the heat cure is exhausted
The thickness of edge material is between 40 to 60 microns.
To sum up, an embodiment of the present invention provides the circuit boards that a kind of internal layer walks high current.The present embodiment circuit board is in internal layer
It is provided with the Metal Substrate of heat transmission, and set Metal Substrate and internal layer heavy current circuit insulated contact, and arrives at circuit board edge
Edge so that the heat that internal layer high current generates can be quickly transmitted to board edge by Metal Substrate and be radiated, and effectively be carried
The high radiating efficiency of circuit board.In preferred embodiment, the circuit board side for also arriving at Metal Substrate end face is metallized, so as to
To further increase the radiating efficiency of circuit board.
It it is provided for the embodiments of the invention internal layer above walks circuit board of high current and preparation method thereof and carried out in detail
It introduces, but the explanation of above example is only intended to facilitating the understanding of the method and its core concept of the invention, should not be construed as pair
The limitation of the present invention.Those skilled in the art in the technical scope disclosed by the present invention, the variation that can readily occur in or
It replaces, should be covered by the protection scope of the present invention.
Claims (6)
1. the production method that a kind of internal layer walks the circuit board of high current, which is characterized in that including：
Inner plating is made, the internal layer plate surface has the first line figure for carrying high current；
The Metal Substrate of heat transmission is fixed on internal layer plate surface using heat cure insulating materials, makes the Metal Substrate and described first
Line pattern insulated contact simultaneously arrives at inner plating edge, wherein Metal Substrate is positioned partially or entirely in the top of first line figure；
Lamina rara externa is pressed on the inner plating, and processes outer-layer circuit figure in the outer layer plate surface；
It is described to further include before the outer layer plate surface processes outer-layer circuit figure：
It metallizes to the side of the inner plating and lamina rara externa, the metalized sidewall to be formed is made to be connected with the Metal Substrate；
The side to the inner plating and lamina rara externa carries out metallization：
Groove is processed, the groove arrives at the Metal Substrate at the inner plating edge, wherein the groove is through entire electricity
The straight slot of road plate all inner platings and lamina rara externa；
By the excess metal, the metallization inner wall of the groove is made to be connected with the Metal Substrate at the inner plating edge.
2. according to the method described in claim 1, it is characterized in that, it is described using heat cure insulating materials by the gold of pre-production
Category base is fixed on internal layer plate surface and includes：
Needing heat cure insulating materials of the region coating thickness of fixed Metal Substrate between 40 to 60 microns；
The Metal Substrate is placed on the heat cure insulating materials, and carries out heat cure, the Metal Substrate is made to be fixed on
Internal layer plate surface and with the first line figure insulated contact.
3. according to the method described in claim 1, it is characterized in that, the lamina rara externa that pressed on the inner plating includes：
Lamina rara externa is provided, the position corresponding to the Metal Substrate of the lamina rara externa offers holding tank；
The lamina rara externa and the inner plating are press-fitted together as one.
4. according to the method described in claim 1, it is characterized in that, the processing groove includes：
Groove of the processing through the inner plating and lamina rara externa so that the Metal Substrate at the inner plating edge is revealed in the slot of groove
Wall.
5. a kind of internal layer walks the circuit board of high current, which is characterized in that including：
Inner plating and by heat cure insulating materials be fixed on inner plating, heat transmission Metal Substrate and be pressed together on it is described in
Lamina rara externa on laminate；There is the first line figure for carrying high current, the outer layer plate surface tool on the inner plating
There is outer-layer circuit figure；The Metal Substrate and the first line figure insulated contact and the edge for arriving at circuit board, wherein gold
Belong to the top that base is positioned partially or entirely in first line figure；
The side of the circuit board has the metalized sidewall being connected with the Metal Substrate.
6. circuit board according to claim 5, it is characterised in that：
The thickness of the heat cure insulating materials is between 40 to 60 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310493369.6A CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310493369.6A CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104582237A CN104582237A (en) | 2015-04-29 |
| CN104582237B true CN104582237B (en) | 2018-11-02 |
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| CN201310493369.6A Active CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109156081A (en) * | 2016-05-30 | 2019-01-04 | 三菱电机株式会社 | The manufacturing method of electronic module and electronic module |
| CN113498252B (en) * | 2020-10-09 | 2022-07-12 | 景旺电子科技(龙川)有限公司 | Electronic equipment, circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201388342Y (en) * | 2009-03-16 | 2010-01-20 | 深圳市深南电路有限公司 | Resonant cavity integrated on PCB |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6847529B2 (en) * | 1999-07-15 | 2005-01-25 | Incep Technologies, Inc. | Ultra-low impedance power interconnection system for electronic packages |
| JP2003069171A (en) * | 2001-08-24 | 2003-03-07 | Yazaki Corp | Circuit board |
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2013
- 2013-10-18 CN CN201310493369.6A patent/CN104582237B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201388342Y (en) * | 2009-03-16 | 2010-01-20 | 深圳市深南电路有限公司 | Resonant cavity integrated on PCB |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
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| CN104582237A (en) | 2015-04-29 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |