CN104582237A - Circuit board with heavy current in inner layer and producing method thereof - Google Patents
Circuit board with heavy current in inner layer and producing method thereof Download PDFInfo
- Publication number
- CN104582237A CN104582237A CN201310493369.6A CN201310493369A CN104582237A CN 104582237 A CN104582237 A CN 104582237A CN 201310493369 A CN201310493369 A CN 201310493369A CN 104582237 A CN104582237 A CN 104582237A
- Authority
- CN
- China
- Prior art keywords
- inner plating
- metal substrate
- circuit board
- lamina rara
- rara externa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
Abstract
The invention discloses a producing method of a circuit board with heavy current in an inner layer. The producing method comprises the following steps: producing an inner layer board, wherein first circuit patterns used for bearing heavy current are arranged on the surface of the inner layer board; utilizing a thermocuring insulating material to fix a metal matrix for heat dissipation onto the surface of the inner layer board, and enabling the metal matrix to be above the first circuit patterns and reach the edge of the inner layer board; pressing an outer layer board on the inner layer board, and processing outer layer circuit patterns on the surface of the outer layer board. The embodiment of the invention further provides a corresponding circuit board. According to the technical scheme provided by the invention, as the metal matrix is buried to quickly transfer heat generated by the inner-layer heavy current to the edge of the circuit board for heat dissipation, the heat radiating efficiency of the circuit board is effectively improved.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of internal layer circuit board walking big current and preparation method thereof.
Background technology
Current high power device application is more and more, and the electric current of its correspondence is also increasing accordingly, and the circuit walking big current is generally all placed in internal layer in printed circuit board (PCB) (PCB), to avoid affecting the fail safe of device and reducing the interference of external layer signal layer.
But thing followed another one problem is, internal layer is when walking big current, larger heat can be produced and cannot be delivered to outside in time, namely, can because of cannot quick heat radiating and cause circuit board temperature rise too high, thus the temperature-sensitive devices such as effects on surface electric capacity, resistance produce very large impact even destroys, and then affect the serviceability of integrated circuit plate.
The heat sink conception of current employing is generally dispelled the heat by the mode such as plated-through hole, sidewall metallization, but during because dispelling the heat, heat dissipation region contact area is little, and effectively can not solve heat radiation this problem slow.
Summary of the invention
The embodiment of the present invention provides a kind of internal layer circuit board walking big current and preparation method thereof, walks the slow technical problem of the heat dissipation for circuit board of large circuit to solve existing internal layer.
First aspect present invention provides a kind of internal layer to walk the manufacture method of the circuit board of big current, comprising:
Make inner plating, described inner plating surface has the first line figure for bearing great current; Utilize hot curing insulating material that the Metal Substrate of heat transmission is fixed on inner plating surface, make described Metal Substrate and described first line figure insulated contact and arrive at inner plating edge; Pressing lamina rara externa on described inner plating, and at described lamina rara externa Surface Machining outer-layer circuit figure.
Second aspect present invention provides a kind of internal layer to walk the circuit board of big current, comprising:
Inner plating and the lamina rara externa being fixed on Metal Substrate on inner plating, heat transmission by hot curing insulating material and being pressed together on described inner plating; Described inner plating has the first line figure for bearing great current, described lamina rara externa surface has outer-layer circuit figure; Described Metal Substrate and described first line figure insulated contact also arrive at the edge of circuit board.
The embodiment of the present invention adopt circuit board internal layer arrange heat transmission, with the Metal Substrate of internal layer heavy current circuit insulated contact, and set Metal Substrate arrives at the technical scheme of board edge, make, the heat that internal layer big current produces can be delivered to board edge fast by Metal Substrate and dispel the heat, and effectively improves the radiating efficiency of circuit board.
Accompanying drawing explanation
Fig. 1 is the flow chart that internal layer that the embodiment of the present invention provides walks the manufacture method of the circuit board of big current;
Fig. 2 a and 2b is plane graph and the sectional view of inner plating respectively;
Fig. 3 is the schematic diagram of the inner plating of fixing metal base;
Fig. 4 is schematic diagram inner plating and lamina rara externa pressing are integrated;
Fig. 5 is the schematic diagram in board edge machined grooves;
Fig. 6 is the schematic diagram of the finished circuit board obtained after cutting.
Embodiment
The embodiment of the present invention provides a kind of internal layer to walk the manufacture method of the circuit board of big current, the method is by arranging the Metal Substrate of heat transmission at circuit board internal layer, make, the heat that internal layer big current produces can be delivered to board edge fast by Metal Substrate and dispel the heat, effectively improve the radiating efficiency of circuit board, thus solve existing internal layer and walk the slow technical problem of the heat dissipation for circuit board of large circuit.The embodiment of the present invention also provides corresponding internal layer to walk the circuit board of big current.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of internal layer to walk the manufacture method of the circuit board of big current, comprising:
110, make inner plating, described inner plating surface has the first line figure for bearing great current.
Described inner plating can be the multi-layer sheet of double face copper or pressing.As shown in figures 2 a and 2b, described inner plating 210 Surface Machining has for bearing great current such as more than the first line figure 2101 of 30A electric current and the second line pattern 2102 for carrying signal or small area analysis.
120, utilize hot curing insulating material that the Metal Substrate of heat transmission is fixed on inner plating surface, make described Metal Substrate and described first line figure insulated contact and arrive at inner plating edge.
As shown in Figure 3, in order to realize the quick heat radiating of the heat of the big current carried by first line figure, the Metal Substrate 220 will made in advance in the present embodiment, be fixed on inner plating 2101 surface by hot curing insulating material 230.Preferably, hot curing insulating material 230 should be the Heat Conduction Material with excellent heat conductivility.
In embody rule, can according to the width of first line figure walking big current as width, first line figure to the minimum range of circuit board molding area edge as length, and the situation determination Metal Substrate sectional area dispelled the heat as required and then computed altitude, be made into the Metal Substrate of different size corresponding to each first line figure and shape.The material of Metal Substrate can select the various metal such as copper, aluminium and alloy thereof.
The step of fixing metal base 220 can comprise: first determine the path of Metal Substrate 220 on inner plating 210 surface, Metal Substrate 220 is made partly or entirely to be positioned at the top of first line figure 2101, and arrive at inner plating 210 edge, so that this Metal Substrate 220 one end finally can be exposed to the side of obtained circuit board; Then, at the hot curing insulating material 230 needing the region coating thickness of fixing metal base 220 between 40 to 60 microns, the width of the hot curing insulating material 230 of coating should not be less than the width of Metal Substrate, and length should not be less than the length of Metal Substrate, to avoid Metal Substrate and inner plating electrical contact; Finally, described Metal Substrate 220 is placed on described hot curing insulating material 230, and carries out hot curing, make described Metal Substrate 220 be fixed on inner plating 210 surface and with described first line figure 2101 electric insulation.
130, pressing lamina rara externa on described inner plating, and at described lamina rara externa Surface Machining outer-layer circuit figure.
This step as shown in Figure 4, at the surperficial pressing lamina rara externa 240 of inner plating 210 of fixing metal base 220.The lamina rara externa 240 that the present embodiment provides comprises outer copper foil and at least one level outer-layer circuit layer and dielectric layer between each line layer, before line layer and outer copper foil.The position corresponding to Metal Substrate 220 of this lamina rara externa should offer holding tank, to hold Metal Substrate 220 when pressing.Described lamina rara externa 240 is integrated with the pressing of described inner plating 220, and lamina rara externa 240 Surface Machining goes out outer-layer circuit figure 2401, namely tentatively obtains the circuit board that internal layer walks big current.Internal layer big current heat, by the inner Metal Substrate imbedded, is delivered to circuit board side, is dispersed in air, realizes quick heat radiating by this circuit board.
In the present embodiment, described Metal Substrate 220 is exposed to the end face of circuit board side by it, dispel the heat in air; But, because the sectional area of Metal Substrate 220 is limited, in order to improve radiating efficiency, in preferred embodiment, can metallize to circuit board side after pressing lamina rara externa, metalized sidewall is connected with Metal Substrate 220, and the metalized sidewall having larger area by this improves radiating efficiency further.In concrete enforcement, can by whole sides galvanic metallization of circuit board, also can only surface galvanic metallization.
In the circuit board fabrication process of reality, in a large circuit board layout, be designed with a lot of circuit board units often, after processing outer-layer circuit figure, then cut into finished circuit Slab element one by one.And after cutting, adopt existing technique to carry out side metal with regard to being difficult to.Therefore, in preferred embodiment, metallized step needs are carried out after pressing lamina rara externa to circuit board side, perform before processing outer-layer circuit figure, specifically can comprise:
As shown in Figure 5, described lamina rara externa 240 corresponds to the side end position machined grooves 250 that described Metal Substrate 220 need be exposed; This groove 250 can be the groove running through all inner platings of whole circuit board and lamina rara externa;
Groove 250 is metallized, the metallization inwall of groove 250 is connected with described Metal Substrate 220; In practical application, can, by carrying out justifying plating to circuit board, realize groove 250 to metallize.
Then, outer-layer circuit figure 2401 is made on lamina rara externa 240 surface, and after some other conventional treatment, just profile process can be carried out, whole circuit board layout is cut into circuit board independent one by one, after cutting, as shown in Figure 6, the partially metallised inwall of described groove 250 becomes the metalized sidewall 260 of circuit board.Thus the heat that internal layer big current produces just can be delivered in the metalized sidewall 260 of circuit board through Metal Substrate, then diffuses in air, realizes quick heat radiating.
To sum up, embodiments provide the manufacture method that a kind of internal layer walks the circuit board of big current, the method adopts the Metal Substrate arranging heat transmission at circuit board internal layer, and set Metal Substrate and internal layer heavy current circuit insulated contact, and arrive at the technical scheme of board edge, the heat that internal layer big current is produced can be delivered to board edge fast by Metal Substrate and dispel the heat, and effectively improves the radiating efficiency of circuit board.In preferred embodiment, the circuit board side metallization of also Metal Substrate end face being arrived at, thus the radiating efficiency of circuit board can be improved further.
Embodiment two,
Please refer to Fig. 6, the embodiment of the present invention provides a kind of internal layer to walk the circuit board of big current, comprising: inner plating 210 and the lamina rara externa 240 being fixed on Metal Substrate 220 on inner plating 210, heat transmission by hot curing insulating material 230 and being pressed together on described inner plating 210; Described inner plating 210 has the first line figure 2101 for bearing great current, described lamina rara externa 240 surface has outer-layer circuit figure 2401; Described Metal Substrate 220 is with described first line figure 2101 insulated contact and arrive at the edge of circuit board.
Preferably, the side of described circuit board have be connected with described Metal Substrate 220 metalized sidewall 260.
Preferably, described hot curing insulating material is hot curing insulating heat-conduction material.Further, the thickness of described hot curing insulating material is between 40 to 60 microns.
To sum up, the circuit board that a kind of internal layer walks big current is embodiments provided.The present embodiment circuit board is provided with the Metal Substrate of heat transmission at internal layer, and set Metal Substrate and internal layer heavy current circuit insulated contact, and arrive at board edge, the heat that internal layer big current is produced can be delivered to board edge fast by Metal Substrate and dispel the heat, and effectively improves the radiating efficiency of circuit board.In preferred embodiment, the circuit board side metallization of also Metal Substrate end face being arrived at, thus the radiating efficiency of circuit board can be improved further.
Above internal layer circuit board walking big current that the embodiment of the present invention provides and preparation method thereof is described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art are in the technical scope that the present invention discloses, and the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (9)
1. internal layer walks a manufacture method for the circuit board of big current, it is characterized in that, comprising:
Make inner plating, described inner plating surface has the first line figure for bearing great current;
Utilize hot curing insulating material that the Metal Substrate of heat transmission is fixed on inner plating surface, make described Metal Substrate and described first line figure insulated contact and arrive at inner plating edge;
Pressing lamina rara externa on described inner plating, and at described lamina rara externa Surface Machining outer-layer circuit figure.
2. method according to claim 1, is characterized in that, describedly also comprises before described lamina rara externa Surface Machining outer-layer circuit figure:
Metallized in the side of described inner plating and lamina rara externa, the metalized sidewall of formation is connected with described Metal Substrate.
3. method according to claim 2, is characterized in that, the described side to described inner plating and lamina rara externa is carried out metallization and comprised:
Machined grooves, described groove at least arrives at the described Metal Substrate at described inner plating edge;
By described excess metal, the metallization inwall of described groove is connected with the Metal Substrate at described inner plating edge.
4. according to the method in any one of claims 1 to 3, it is characterized in that, describedly utilize hot curing insulating material that the Metal Substrate made in advance is fixed on inner plating surface to comprise:
At the hot curing insulating material needing the region coating thickness of fixing metal base between 40 to 60 microns;
Described Metal Substrate is placed on described hot curing insulating material, and carries out hot curing, make described Metal Substrate be fixed on inner plating surface and with described first line figure insulated contact.
5. according to the method in any one of claims 1 to 3, it is characterized in that, described on described inner plating pressing lamina rara externa comprise:
There is provided lamina rara externa, the position corresponding to described Metal Substrate of described lamina rara externa offers holding tank;
Described lamina rara externa and described inner plating pressing are integrated.
6. method according to claim 3, is characterized in that, described machined grooves comprises:
Processing runs through the groove of described inner plating and lamina rara externa, makes the Metal Substrate at described inner plating edge be revealed in the cell wall of groove.
7. internal layer walks a circuit board for big current, it is characterized in that, comprising:
Inner plating and the lamina rara externa being fixed on Metal Substrate on inner plating, heat transmission by hot curing insulating material and being pressed together on described inner plating; Described inner plating has the first line figure for bearing great current, described lamina rara externa surface has outer-layer circuit figure; Described Metal Substrate and described first line figure insulated contact also arrive at the edge of circuit board.
8. circuit board according to claim 7, is characterized in that:
The side of described circuit board have be connected with described Metal Substrate metalized sidewall.
9. the circuit board according to claim 7 or 8, is characterized in that:
The thickness of described hot curing insulating material is between 40 to 60 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310493369.6A CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310493369.6A CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582237A true CN104582237A (en) | 2015-04-29 |
| CN104582237B CN104582237B (en) | 2018-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310493369.6A Active CN104582237B (en) | 2013-10-18 | 2013-10-18 | A kind of internal layer walks circuit board of high current and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109156081A (en) * | 2016-05-30 | 2019-01-04 | 三菱电机株式会社 | The manufacturing method of electronic module and electronic module |
| CN113498252A (en) * | 2020-10-09 | 2021-10-12 | 景旺电子科技(龙川)有限公司 | Electronic equipment, circuit board and preparation method thereof |
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| JP2003069171A (en) * | 2001-08-24 | 2003-03-07 | Yazaki Corp | Circuit board |
| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201388342Y (en) * | 2009-03-16 | 2010-01-20 | 深圳市深南电路有限公司 | Resonant cavity integrated on PCB |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030002268A1 (en) * | 1999-07-15 | 2003-01-02 | Dibene Joseph Ted | Ultra-low impedance power interconnection system for electronic packages |
| JP2003069171A (en) * | 2001-08-24 | 2003-03-07 | Yazaki Corp | Circuit board |
| CN101553094A (en) * | 2008-03-25 | 2009-10-07 | 钰桥半导体股份有限公司 | A method for manufacturing a circuit board provided with an embedded typed metal conduction column |
| CN201388342Y (en) * | 2009-03-16 | 2010-01-20 | 深圳市深南电路有限公司 | Resonant cavity integrated on PCB |
| CN102076174A (en) * | 2011-01-30 | 2011-05-25 | 乐健线路板（珠海）有限公司 | Method for manufacturing dual-layer sandwiched metal base PCB (printed circuit board) with high thermal conductivity |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109156081A (en) * | 2016-05-30 | 2019-01-04 | 三菱电机株式会社 | The manufacturing method of electronic module and electronic module |
| CN113498252A (en) * | 2020-10-09 | 2021-10-12 | 景旺电子科技(龙川)有限公司 | Electronic equipment, circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582237B (en) | 2018-11-02 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |