Summary of the invention
In view of this, the present invention provides one will not increase circuit board thickness and lower-cost
Circuit board with radiator structure and preparation method thereof.
The manufacture method of a kind of circuit board with radiator structure, including step: provide an electricity
Base board, described circuit substrate includes basal layer and is formed at the first of described basal layer both sides
And second copper foil layer, described circuit substrate also includes radiating area and surrounding zone;In described heat radiation
Form multiple through hole on circuit substrate in district, the through described basal layer of the plurality of through hole and
First and second copper foil layer of described basal layer both sides;Described circuit substrate phase in radiating area
First and second copper foil layer surface described in both sides and the plurality of through-hole side wall are formed one even
Continuous metal level, first and second copper foil layer described of radiating area, the plurality of through hole and institute
State metal level and form a radiator structure;And first and second the copper foil layer system by described surrounding zone
Make to be formed conducting wire, thus form the circuit board with radiator structure.
A kind of circuit board with radiator structure, including basal layer and to be formed at basal layer relative
First and second conductive circuit layer of both sides;Described circuit board includes radiating area and around institute
State the surrounding zone of radiating area;Described first conductive circuit layer includes the first conducting wire and first
Radiating circuit, described first conducting wire is only formed at described surrounding zone, described first heat radiation
Circuit is formed at described radiating area, described second conductive circuit layer include the second conducting wire and
Second radiating circuit, described second conducting wire is only formed at described surrounding zone, and described second
Radiating circuit is formed at described radiating area;Described radiating area is formed with multiple through hole, described logical
Hole is offered from the most described second radiating circuit side of described first radiating circuit;Described first and
The hole wall of the second radiating circuit surface and described through hole is formed all described continuous print metal level,
Described through hole, described continuous print metal level and described first, second radiating circuit form one and dissipate
Heat structure.
The manufacture method of a kind of circuit board with radiator structure, including step: provide an electricity
Base board, described circuit substrate includes basal layer and is formed at the first of described basal layer both sides
And second copper foil layer, described circuit substrate also includes radiating area and surrounding zone;In described heat radiation
District forms a groove, and the described groove the first copper foil layer from described basal layer side is to described base
Bottom is offered, and described groove is for housing an electronic component;Circuit in described radiating area
Forming multiple through hole on substrate, the plurality of through hole is from the second bronze medal of described basal layer opposite side
Layers of foil is offered to described basal layer, and the plurality of through hole all connects with described groove;?
The diapire of described groove, formed the described radiating area of described through hole the second copper foil layer surface and
The plurality of through-hole side wall forms a continuous print metal level, forms the radiating area of described through hole
Described second copper foil layer, the plurality of through hole and described metal level form a radiator structure;And
First and second copper foil layer of described surrounding zone is made and forms conducting wire, thus form tool
There is the circuit board of radiator structure.
A kind of circuit board with radiator structure, including basal layer and to be formed at basal layer relative
First and second conductive circuit layer of both sides;Described circuit board includes radiating area and around institute
State the surrounding zone of radiating area;Described first conductive circuit layer is only formed at described surrounding zone, institute
State the second conductive circuit layer and include that conducting wire and radiating circuit, described conducting wire are only formed
In described surrounding zone, described radiating circuit is formed at described radiating area;Described radiating area is formed
The through hole that fluted and multiple and described groove is through, described groove from described basal layer away from
The side of described second conductive circuit layer is offered to described base layer interior, and described through hole is from institute
State the second conductive circuit layer to offer to described basal layer;The diapire of described groove, described through hole
Sidewall and the surface of described radiating circuit be formed with a continuous print metal level, described through hole,
Described continuous print metal level and described radiating circuit form a radiator structure.
Compared to prior art, the embodiment of the present invention forms radiator structure in circuit board, as
This setting not only makes circuit board have good radiating efficiency, also reduces circuit board simultaneously
Thickness.
Accompanying drawing explanation
Fig. 1 is the generalized section of the circuit substrate that the embodiment of the present invention provides.
Fig. 2 is the generalized section forming groove in FIG on circuit substrate.
Fig. 3 is the section signal forming multiple through hole in fig. 2 on the circuit substrate in groove
Figure.
The top view of Fig. 4 circuit substrate in figure 3.
Fig. 5 is the top view of the circuit substrate after the formation through hole of another example.
Fig. 6 is the groove bottom wall of circuit substrate in figure 3, through-hole side wall and radiating area
Copper foil layer surface forms the generalized section of a continuous metal layer.
Fig. 7 is that the copper foil layer in Fig. 6 is made the generalized section after forming conductive circuit layer.
Fig. 8 is the generalized section after conductive circuit layer surface in the figure 7 forms welding resisting layer.
Fig. 9 be electronic component is set in groove in fig. 8 after formed there is radiator structure
The generalized section of circuit board.
Figure 10 is that the section of the circuit board with radiator structure formed in another embodiment shows
It is intended to.
Main element symbol description
Circuit board 10
Circuit substrate 100,900
Basal layer 120
First copper foil layer 131
Second copper foil layer 132
Radiating area 20,920
Surrounding zone 21,921
Substrate layer 110
3rd conductive circuit layer 111
4th conductive circuit layer 112
First dielectric layer 121
Second dielectric layer 122
Groove 40
Through hole 150,950
Opening 1501
First conductive circuit layer 161,961
Second conductive circuit layer 162,962
Conducting wire 1621
Radiating circuit 1622
Metal level 170,970
Radiator structure 180,980
First, second welding resisting layer 190
Electronic component 30,930
First conducting wire 9611
First radiating circuit 9612
Second conducting wire 9621
Second radiating circuit 9622
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
First embodiment of the invention provides a kind of circuit board 10 with radiator structure and makes
Method.
The first step, refers to Fig. 1, it is provided that a kind of circuit substrate 100, described circuit substrate 100
Including basal layer 120, the first copper foil layer 131 and the second Copper Foil of being formed at basal layer 120 both sides
Layer 132.
Described basal layer 120 can be flexible resin layer, as polyimides (Polyimi112e,
PI), polyethylene terephthalate (Polyethylene Terephth161l161te, PET)
Or PEN (Polythylene N161phth161l161te, PEN), also
It can be multilager base plate.In the present embodiment, described basal layer 120 is multilager base plate, including base
Sheet material layers 110, it is formed at the 3rd conductive circuit layer 111 and the 4th conductor wire of substrate layer 110 both sides
Road floor 112, it is formed at the 3rd conductive circuit layer 111 away from the first of described substrate layer 110 surface
Dielectric layer 121, be formed at the 4th conductive circuit layer 112 away from described substrate layer 110 surface
Second dielectric layer 122.
Described circuit substrate 100 includes a radiating area 20 and the surrounding zone around described radiating area
21, the position of described radiating area 20 correspondence is used for being formed radiator structure, therefore described radiating area 20
Inside it is formed without conducting wire, namely described 3rd conductive circuit layer 111 and the 4th conducting wire
Layer 112 is only formed at described surrounding zone 21.
In other embodiments, described 3rd and the 4th conductive circuit layer 111,112 can also
Including being positioned at the conducting wire of surrounding zone 21 and being positioned at insulating mutually with conducting wire of radiating area 20
Radiating circuit.
Second step, refers to Fig. 2, offers a groove 40 on described circuit substrate 100.
Use the mode circuit base in described radiating area 20 correspondence of machining or laser ablation
Plate 100 offers a groove 40 from described first copper foil layer 131 to described basal layer 120.
In the present embodiment, described groove 40 is rectangular-shaped, and has four sidewalls and one
Diapire, described diapire is positioned at described substrate layer 110.Described groove 40 is used for housing and encapsulating electricity
Sub-element.The degree of depth of described groove 40 is determined by the thickness of described electronic component, not with this
Embodiment is limited, and the most described diapire may be located on described second dielectric layer 122 or described first
Dielectric layer 121;It addition, described groove 40 can also be for extend to circuit board two opposite edges
Groove.
3rd step, refers to Fig. 3~4, at the described circuit base in described radiating area 20 correspondence
Formed multiple and described recessed to described basal layer 120 from described second copper foil layer 132 in plate 100
The through hole 150 that groove 40 is through.
In the present embodiment, the plurality of through hole 150 is rectangular-shaped, and the plurality of through hole
150 openings 1501 on the surface away from described substrate layer 110 of the second copper foil layer 132 all in
Oblong-shaped and in being arranged side by side, and the length of described opening 1501 and described groove 40 Tongfang
To length identical.The institute after forming through hole 150 is overlooked from described first copper foil layer 131 direction
Stating circuit substrate 100 visible, the circuit substrate 100 in described radiating area 20 is spaced by through hole 150
Sheet material for multiple parallel distributions.
The plurality of through hole 150 can be formed in the way of using machine drilling or laser pit.
In other embodiments, described through hole 150 can also be other arbitrary shapes such as cylinder
Shape, prism-shaped or wavy etc., described opening 1501 can also be other arbitrary shapes such as circle
Shape, polygon, L-shaped, Z-shaped etc., and described opening 1501 can be non-being arranged side by side, as
Can be pitch arrangement mutually, join end to end arrangement etc..Such as, the plurality of through hole 150 can set
It is set to as it is shown in figure 5, the plurality of through hole 150 is rectangular-shaped, and the plurality of through hole
150 openings 1501 on the surface away from described substrate layer 110 of the second copper foil layer 132 all in
Oblong-shaped and in latticed array.
4th step, refers to Fig. 6, in diapire, the side of described through hole 150 of described groove 40
The surface of the second copper foil layer 132 of wall and corresponding described radiating area 20 forms a continuous print gold
Belong to layer 170, described through hole 150, described continuous print metal level 170 and corresponding described radiating area 20
The second copper foil layer 132 form radiator structure 180.
Specifically, first at sidewall formation one electricity of described groove 40 bottom surface, described through hole 150
Plating sublayer, in the present embodiment, forms described plating seed layer by chemical plating;The most again
The surface of the second copper foil layer 132 of described plating seed layer surface and corresponding described radiating area 20
Described continuous print metal level 170 is formed by plating.
5th step, refers to Fig. 7, and described first copper foil layer 131 makes formation the first conduction
Line layer 161, makes formation the second conductive circuit layer 162 by described second copper foil layer 132.Its
In, described first conductive circuit layer 161 is only formed at described surrounding zone 21, described second conduction
Line layer 162 includes conducting wire 1621 and radiating circuit 1622, described conducting wire 1621
Only being formed at described surrounding zone 21, described radiating circuit 1622 is formed at described radiating area 20,
Described radiating circuit 1622 surface is formed with described metal level 170, described conducting wire 1621
Electrically connect thus mutually insulated with being formed without between described radiating circuit 1622.That is, it is described
Through hole 150, described continuous print metal level 170 and described radiating circuit 1622 form described heat radiation
Structure 180.
In other embodiments, it is also possible to fill in the through hole 150 of described radiator structure 180
Heat Conduction Material, such as resin or metal paste etc., and promote the heat radiation effect of circuit board 10 with this
Really.
In other embodiments, if described 3rd and the 4th conductive circuit layer 111,112 also
Can include the conducting wire being positioned at surrounding zone 21 and be positioned at radiating area 20 with conducting wire phase
The radiating circuit of insulation, described metal level 170 can electrically connect the 3rd and the 4th conductive circuit layer
111, the described radiating circuit of 112 is to increase the area of heat sink material, improves radiating effect.
6th step, refers to Fig. 8, at described first conductive circuit layer 161 and the second conductor wire
Road floor 162 surface forms first and second welding resisting layer 190 respectively, to protect described first conduction
Line layer 161 and the second conductive circuit layer 162.In the present embodiment, described first welding resisting layer 190
Offer anti-welding opening and form electric contact mat with expose portion conducting wire, to electrically connect electricity
Sub-part etc..In other embodiments, it is also possible to offer anti-welding at described second welding resisting layer 190
Opening.
7th step, refers to Fig. 9, houses an electronic component 30 in described groove 40, thus
Obtain circuit board 10.
In the present embodiment, described electronic component 30 passes through described electric contact mat 1111 with described
First conductive circuit layer 161 electrically connects.In other embodiments, it is possible to so that described electronics zero
Part 30 is electrically connected with described second conductive circuit layer 162.
Described circuit board 10 includes basal layer 120, is formed at the of basal layer 120 opposite sides
One conductive circuit layer 161 and the second conductive circuit layer 162 and electronic component 30.Described basal layer
120 can be insulating barrier or multilager base plate, and in the present embodiment, described basal layer 120 is multilamellar
Substrate, including substrate layer the 110, the 3rd conductive circuit layer the 111, the 4th conductive circuit layer 112,
First dielectric layer 121 and the second dielectric layer 122, described 3rd conductive circuit layer 111 and the 4th is led
Electric line layer 112 is formed at substrate layer 110 opposite sides, and described first dielectric layer 121 is formed at
3rd conductive circuit layer 111 is away from the surface of described substrate layer 110, described second dielectric layer 122
It is formed at the 4th conductive circuit layer 112 surface away from described substrate layer 110.Further, described
First conductive circuit layer 161 is formed at the first dielectric layer 121 and is away from described 3rd conductor wire
The side of road floor 111, described second conductive circuit layer 162 is formed at the second dielectric layer 122 and remote
From in the side of described 4th conductive circuit layer 112.
Described circuit board 10 includes radiating area 20 and the surrounding zone around described radiating area 20
21, described first to the 3rd conductive circuit layer 111,112,161 is the most only formed at described periphery
District 21, described second conductive circuit layer 162 includes conducting wire 1621 and radiating circuit 1622,
Described conducting wire 1621 is only formed at described surrounding zone 21, and described radiating circuit 1622 is formed
Not shape between described radiating area 20, described conducting wire 1621 and described radiating circuit 1622
Become electrical connection thus mutually insulated.Described radiating area 20 is formed with groove 40 and multiple and described
The through hole 150 that groove 40 is through, described groove 40 dissipates to described from described first dielectric layer 121
Caving in side, hot line road 1622, described through hole 150 is situated between to described first from described radiating circuit 1622
Cave in electric layer 121 side.The diapire of described groove 40, the sidewall of described through hole 150 and described
The surface of radiating circuit 1622 is formed with a continuous print metal level 170, described through hole 150, institute
State continuous print metal level 170 and described radiating circuit 1622 forms radiator structure 180.Described electricity
Sub-part 30 is contained in described groove 40, and described electronic component 30 conducts electricity with described first
Line layer 161 is electrically connected.
The embodiment of the present invention is the most first offered with groove 40, is formed in groove 40
Above-mentioned radiator structure 180, is finally installed on electronic component in described groove 40, is arranged such
Not only make circuit board 10 have good radiating efficiency, reduce the thickness of circuit board 10 simultaneously.
Second embodiment of the invention provides a kind of circuit board 90 with radiator structure and makes
Method, refers to Figure 10, and compared with the method for first embodiment, it omits first embodiment
In second step, be i.e. formed without groove, directly in the radiating area 920 of described circuit substrate 900
Forming multiple through hole 950, subsequent step is constant, finally forms heat radiation on described circuit board 90
Structure 980, described electronic component is also arranged at the corresponding heat radiation knot on the surface of described circuit board 90
The position of structure 980.
The circuit board 90 with radiator structure that the present embodiment is formed also with the electricity of first embodiment
Road plate 10 is roughly the same, and difference is, described first conductive circuit layer 961 includes the first conduction
Circuit 9611 and the first radiating circuit 9622, described first conducting wire 9611 is only formed at institute
Stating surrounding zone 921, described first radiating circuit 9622 is formed at described radiating area 920, described
Be formed without between first conducting wire 9611 with described first radiating circuit 9612 electrically connect thus
Mutually insulated.Described second conductive circuit layer 962 includes that the second conducting wire 9621 and second dissipates
Hot line road 9622, described second conducting wire 9621 is only formed at described surrounding zone 921, described
Second radiating circuit 9622 is formed at described radiating area 920, described second conducting wire 9621
Electrically connect thus mutually insulated with being formed without between described second radiating circuit 9622.Described
One and second radiating circuit 9612,9622 surface formed and all have described continuous print metal level 970,
Thus, described through hole 950, described continuous print metal level 970 and described first, second heat radiation
Circuit 9612,9622 forms described radiator structure 980.Electronic component 930 is formed at heat radiation knot
On structure 980.
The present embodiment directly forms a radiator structure 980 in circuit board 90, by by electronics unit
Part is directly mounted on this heat radiation radiator structure 980, and relatively first embodiment processing technology is the simplest
Single, the radiating efficiency of circuit board can also be greatly improved, and radiator structure 980 is built in circuit
In plate 90, also can to a certain degree reduce the thickness of circuit board 90.
It is understood that for the person of ordinary skill of the art, can be according to this
Other various corresponding changes and deformation is made in the technology design of invention, and all these change
With the protection domain that deformation all should belong to the claims in the present invention.