KR20200144286A - method for manufacturing printed circuit board with high heat radiation and the PCB thereby - Google Patents

Abstract

The present invention relates to a method for manufacturing a high heat dissipation PCB, capable of rapidly dissipating heat generated in an electronic component by inserting a metal plate for a heat sink into a PCB, and a high heat dissipation PCB manufactured thereby. According to a first characteristic of the present invention, the method for manufacturing a high heat dissipation PCB comprises: a step (a) of forming one or more insulation holes vertically penetrating a metal plate for a heat sink in a state of preparing the metal plate for a heat sink; a step (b) of filling the insulation hole with liquid insulation resin and curing the same; a step (c) of laminating an insulating sheet and a metal sheet on upper and lower surfaces of the metal plate for a heat sink, respectively, so that the metal sheet faces outward; a step (d) of allowing an insulation filler to vertically penetrate part after the step (c), and forming a through-hole having the diameter smaller than that of the insulation hole; and a step (e) of filling a through-hole area with metal. In the first characteristic, the method for manufacturing a high heat dissipation PCB further comprises a step of filling a plurality of heat transfer paths with metal after forming the heat transfer paths formed of a via groove with the depth that is in contact with the metal plate for a heat sink on the insulation sheet and the metal sheet after the step (c), wherein formation of the through-hole and the heat transfer paths is performed at the same time, and filling of the through-hole and the heat transfer paths is performed at the same time. In the step (a), one or more insulation slits formed of a long hole vertically penetrating the metal plate for a heat sink are formed together when forming the insulation hole, and in the step (b), the insulation slit is filled together when filling the insulation hole with the liquid insulation resin.

Description

Method for manufacturing printed circuit board with high heat radiation and the PCB thereby}

The present invention relates to a high heat dissipation PCB manufacturing method and a high heat dissipation PCB manufactured thereby. In particular, by inserting a metal plate for heat sink into the inside of the PCB, it is possible to rapidly dissipate heat generated from electronic components, and It relates to a method of manufacturing a high heat dissipation PCB that can be utilized as a ground terminal (layer) or a power terminal (layer), and a high heat dissipation PCB manufactured thereby.

Due to the high functionality and high speed of electronic products, a PCB that emits heat generated from semiconductor ICs is important, but the existing PCB structure is a general structure that does not emit heat well.

Electronic circuit module 10, for example, one or more electronic components on a single PCB (hereinafter referred to as'module PCB') 11, for example, various semiconductors such as UV (Ultra Violet) LEDs, laser diodes, or semiconductor ICs In the case of the electronic circuit module 10 that is modularized and handled with the element 13 and the driver IC 12 mounted thereon, a heat sink is required to rapidly dissipate the generated heat. Since the sink must not cover the top surface of the laser diode, it is unavoidable to radiate heat through the module PCB 11.

On the other hand, the module PCB 11 may be implemented as a multilayer PCB, and a press-fitting process, etc. is performed in a state in which a heat sink insertion groove is formed through drilling, routering, or laser processing from the top to a predetermined depth in a partial area of the multilayer PCB. A heat sink 14 made of a metal plate is inserted through it. Meanwhile, the electronic circuit module 10 is soldered to a separate main PCB 20 for a motherboard to form a part of the corresponding electronic device. Reference numerals 15 and 16 denote a multilayer pattern and a soldering area, respectively.

However, in the case of such a module PCB 11, since it is made of a multilayer PCB, the heat sink 14 inserted through a press-fitting process or the like has to be formed only in a partial area of the multilayer PCB. There is a limitation in rapidly discharging the heat generated in 13), and accordingly, there is a problem such as deterioration of the performance of the electronic circuit module 10.

2 is a cross-sectional view of an electronic circuit module for explaining the MI-PCB (Metal Insertes PCB) used in the battery protection device, which is a prior patent of the present applicant, presented as Prior Art 1 below. As shown in FIG. 2, according to the battery protection device of the present invention, a PCB upper plate 100, a PCB lower plate 300, and a metal plate (hereinafter referred to as a'spacer metal plate') 200 to function as a spacer are provided.

On the other hand, in order to prevent the spacer metal plate 200 from being electrically connected together in electrically connecting the pattern between the PCB upper plate 100 and the PCB lower plate 300 through each through hole, the spacer metal plate 200 A hole having a larger diameter than the through hole (hereinafter, referred to as'insulation hole') 210 is formed in advance, for example, by drilling, laser or press processing (punching).

Next, with the spacer metal plate 200 interposed therebetween, the upper PCB plate 100 and the lower PCB plate 300 are bonded by thermal compression with an insulating material such as an epoxy resin-based adhesive resin 400 interposed therebetween. Accordingly, an adhesive 400 made of an insulating material is filled inside the insulating hole 210.

Next, after forming a circuit pattern on the upper PCB 100 and the lower PCB 300 using a conventional method, the diameter is smaller than the insulating hole 210 formed on the metal plate 200 for spacers, and the PCB upper plate 100 and the PCB A through hole penetrating all of the lower plate 300 is formed. Finally, by plating the inner surface of the insulating hole 210 with a plating body 500 by a plating process, the pattern of the upper PCB plate 100 and the pattern of the lower PCB plate 300 are electrically connected. Such a plating body 500 Accordingly, the PCB upper plate 100 and the PCB lower plate 300 are electrically connected to each other while being electrically insulated from the spacer metal plate 200.

According to the above-described method of manufacturing a battery protection device and a battery protection device manufactured by the present applicant's prior patent invention, since the metal plate for spacer 200 is interposed between the PCBs, heat generated from the PCB can be quickly released. Accordingly, the reliability of the PCB can be improved and a longer life can be achieved.

However, since the above-described prior patent invention of the present applicant is limited to the battery protection device, the spacer metal plate 200 has no choice but to be implemented as a relatively thin plate having a very thin thickness of 0.3 mm or less, thereby generating a lot of heat. There was a lack of use as a high heat dissipation PCB that functions as a heat sink for circuit modules.

On the other hand, the above-described problem can be solved by using a relatively thick plate of 0.3 to 2 mm or more for the spacer metal plate, but in this case, the insulating material is incompletely filled in the insulating hole when thermal compression bonding with the insulating material interposed therebetween. Voids may be formed.If moisture infiltrating into such empty spaces evaporates, not only may the insulation hole burst or crack, but also reliability problems such as disconnection of the plating body for connection may occur. have.

Prior art 1: 10-1411584 registered patent publication (name of invention: battery protection device manufacturing method and battery protection device) Prior Art 2: Patent Publication No. 10-2009-0001232 (name of the invention: heat sink coated with high-radiation radiation ceramic inorganic material, manufacturing method thereof, and metal PCB having the same) Prior Art 3: Patent Publication No. 10-1125655 (name of invention: heat dissipation rigid PCB and its manufacturing method) Prior Art 4: Patent Publication No. 10-1652904 (name of invention: high-power multilayer PCB for heat dissipation of power semiconductor module package and PCB, and its manufacturing method)

The present invention was conceived to solve the above-described problem, by inserting a metal plate for heat sink into the inside of a PCB to quickly dissipate heat generated from an electronic component, and the metal plate to a ground terminal (layer) or power supply It is an object of the present invention to provide a high heat dissipation PCB manufacturing method that can be used as a terminal (layer) and a high heat dissipation PCB manufactured thereby.

According to a first feature of the present invention for achieving the above object, (a) forming at least one insulating hole vertically penetrating the metal plate for a heat sink is prepared; (B) curing the insulating hole after filling it with a liquid insulating resin; (C) laminating an insulating sheet and a metal sheet on the upper and lower surfaces of the heat sink metal plate so that the metal sheet faces the outside; Including the step (d) of forming a through-hole having a diameter smaller than that of the insulating hole but vertically penetrating the portion of the insulating plug after step (c), and (e) filling the through-hole region with metal. A method of manufacturing a high heat radiating PCB made is provided.

In the first feature described above, after the step (c), after forming a plurality of heat transfer passages including via grooves having a depth contacting the heat sink metal plate in the insulating sheet and the metal sheet, the heat transfer passage is made of metal. It further comprises a filling step.

Metal plugging of the through hole or the heat transfer passage is performed by metal plating or an additional clamping process after metal plating.

The formation of the through hole and the heat transfer passage is performed simultaneously or sequentially,

The plugging of the through hole and the heat transfer passage is performed simultaneously or sequentially.

When preparing the heat sink metal plate in step (a), a groove for forming a step is formed on the upper or lower surface of the insulating hole forming portion.

When forming the insulating hole in step (a), at least one insulating slit formed of a long hole vertically penetrating the heat sink metal plate is formed together, and the insulating hole is filled with a liquid insulating resin in step (b). Insulation slits are plugged together.

According to a second aspect of the present invention, a high heat dissipation PCB manufactured by the manufacturing method of the first aspect described above is provided.

According to the high heat dissipation PCB and its manufacturing method of the present invention, since heat generated from electronic components can be quickly released by inserting a heat sink metal plate inside the PCB, the heat dissipation PCB is interposed between the module PCB and the main PCB. You can play a role efficiently. In contrast, it is not interposed between the module PCB and the main PCB, and can be used as a module PCB or a main PCB by itself.

1 is a cross-sectional view of an electronic circuit module for explaining a conventional PCB heat dissipation structure.
2 is a cross-sectional view of an electronic circuit module for explaining an MI-PCB used in a conventional battery protection device.
3 is a process flow diagram for explaining the high heat dissipation PCB manufacturing method of the present invention.
4A to 4F are cross-sectional views of each process of a method of manufacturing a high heat dissipation PCB of the present invention, respectively.
5 is a cross-sectional view of a high heat dissipation PCB according to another embodiment of the present invention.
6 is a cross-sectional view of an electronic device showing a state of use of a high heat dissipation PCB according to the embodiment shown in FIG. 4F
7 is a cross-sectional view of an electronic device showing a state of use of a high heat dissipation PCB according to the embodiment shown in FIG. 5.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the high heat dissipation PCB manufacturing method of the present invention and the high heat dissipation PCB manufactured thereby.

Figure 3 is a process flow diagram for explaining the high heat dissipation PCB manufacturing method of the present invention, Figures 4a to 4f are sectional views of each process of the high heat dissipation PCB manufacturing method of the present invention. First, in step S10 of FIG. 3, one or more insulating holes 612 vertically penetrating the heat sink metal plate (hereinafter simply referred to as'metal plate') 600 as shown in FIG. 4A are prepared, or in addition thereto. One or more insulating slits 614 are formed. In the example of FIG. 4A, a total of 6 heat sinks for high heat dissipation PCBs are provided on a metal plate 600 of 500 mm in width, 300 mm in length, and 0.3 to 2 mm in thickness, for example, copper, aluminum, nickel, or an alloy thereof. 610) are arranged.

In addition, in the proper place of each heat sink 610, an insulating hole 612 that electrically insulates the heat sink 610 and the electrical conductor (to be described later) electrically connecting the conductive wire patterns on the upper and lower surfaces of a multilayer, at least double-sided PCB, is provided. At least one is formed by vertically penetrating the heat sink 610, and if necessary, a long hole-shaped insulating slit 614 that electrically insulates each heat sink 610 into two or more regions vertically connects each heat sink 610. At least one is formed by penetrating. The insulating hole 612 and the insulating slit 614 may be formed by a known hole processing process, for example, a drilling process, a punching process, a press mold process, a routing process, or the like, but there is no particular limitation on the formation method thereof. In addition to the heat sink function, the insulating slit 614 can be used as a ground (GND) as another function of a heat sink when designing a multilayer PCB, and some areas divided by the insulation slit are used as ground terminals (GND) and the remaining areas are used as power terminals. By enabling it to be utilized, the number of layers of the multilayer PCB can be reduced.

The following process is performed for the entire metal plate 600, but for convenience, only one heat sink 610 will be described. In step S20, the insulating hole 612 and the insulating slit 614 are formed using a liquid insulating resin, for example, a liquid insulating material, such as a liquid insulating resin or plug-in ink, as shown in FIG. 4B. ) Plug (insulation plug: 616) and harden, then perform the front side if necessary. Here, the plugging process may be performed by a known screen printing method, a silk screen method, or a direct scanning method, but there is no particular limitation on the plugging method. On the other hand, if the above-described plugging process is performed, the heat sink 610 may become uneven due to the liquid insulating material on its surface.In order to smooth this, a front process through a grinding machine or sandpaper may be additionally performed.

In step S30, as shown in FIG. 4C, an insulating sheet 620, for example, a PPG sheet and a pattern metal sheet 630, for example, a copper foil sheet, are stacked on the upper and lower surfaces of the heat sink 610 at high temperature. And laminated by hot pressing at high pressure.

In step S40, as shown in FIG. 4D, through holes 640 for connecting the upper and lower surfaces of the multilayer PCB are formed in the insulating plug 616 in the insulating hole 612 region. Such a through hole 640 Of course, the diameter should be smaller than the insulating hole 612. The through hole 640 may be formed by a known general drilling process or a laser drilling process, but there is no particular limitation on the formation method thereof.

In step S50, as shown in FIG. 4E, the heat sink (in the insulating sheet 620) and the metal sheet 630 are applied so that heat dissipation through the heat sink 610 is made more smoothly and quickly without interference from the insulating sheet 620. A plurality of heat transfer passages 650 formed of via grooves having a depth in contact with the 610 are formed, and these heat transfer passages 650 may also be formed by a known general drilling process or a laser drilling process. There are no special restrictions on the method. Furthermore, the process of forming the heat transfer passage 650 may be performed simultaneously with the through-hole process of step S40.

In step S60, the through hole 640 and the heat transfer passage 650 are filled with metal, for example copper, as shown in FIG. 4F. In this case, the process of plugging the through hole 640 is applied to the metal (copper) plating process. And performing an additional plugging process if necessary, for example, a process of filling metal plating or liquid copper by printing screen or silk screen printing several times.

The heat transfer passage 650 can be plugged by plating the inner surface of the passage through copper plating through a copper plating process and then secondaryly performing metal plating by electroplating or pulse plating, and is a secondary method. , For example, the liquid copper may be formed by screen printing, and there is no particular limitation on the formation method thereof. When step S60 is performed, an electrical conductor 660 is formed in the through-hole region 640, and a heat conductor 670 is formed in the heat transfer passage. On the other hand, in the case of performing the metal plugging process, the upper or lower surface of the metal sheet 630 may be uneven, and the front process as described above may be additionally performed in order to smooth this.

Finally, in step S70, a necessary pattern is formed on the metal sheet 630. In order to form an additional layer, the insulation sheet and metal sheet lamination process, through hole, internal via hole formation and plugging process are repeatedly performed. You will do it.

Since the subsequent processes can be performed in the same way as the general PCB manufacturing process, detailed descriptions are omitted.

5 is a cross-sectional view of a high heat dissipation PCB according to another embodiment of the present invention. In the embodiment of FIG. 5, the insulating slit 614 is not formed in step S20, and a predetermined area 680 on one side of the heat sink 610', for example, the top surface in step S50 (hereinafter referred to as'exposed area'). ), the metal sheet 630 and the insulating sheet 620 may be completely removed and a high heat dissipation PCB may be manufactured, and a method of utilization thereof will be described later.

The high heat dissipation PCB of the present invention is itself used as a high heat dissipation PCB substrate or, as shown in FIG. 1, for heat dissipation inserted between the module PCB 11 and the main PCB 20 such as a mother board for a heat sink. It could be used as a PCB.

6 is a cross-sectional view of an electronic device showing a state of use of a high heat dissipation PCB according to the embodiment shown in FIG. 4F. As shown in Figure 6, the high heat dissipation PCB according to this embodiment can be used as a heat dissipation PCB between the electronic circuit module (module PCB) 10 and the main PCB 20, in this embodiment, the heat sink ( Since 610 is separated into two areas electrically insulated by the insulating plug 616, the left area of the heat sink 610 may perform a function of ground (GND) in addition to the heat sink function. In another embodiment, the left region and the right region may function as a ground terminal GND and a power terminal, respectively, or vice versa.

7 is a cross-sectional view of an electronic device showing a use mode of the high heat dissipation PCB according to the embodiment shown in FIG. 5. As shown in Figure 7, the high heat dissipation PCB according to the present embodiment can be used as a heat dissipation PCB between the electronic circuit module (module PCB) 10 and the main PCB 20, in this embodiment, a heat sink ( 610') may perform a function of ground (GND) in addition to the original heat sink function. On the other hand, in this case, if the exposed area 680 is left as it is, a space is created between the heat sink 610' and the heat generated from the right electronic component 13 cannot be properly discharged, while the circuit pattern of the module PCB 11 and Since the heat sink 610' should not be in electrical contact, the exposed area 680 is filled with a liquid insulating material 690, which is electrically insulator, while the exposed area 680 is a conductor thermally.

8 is a cross-sectional view of a process according to another embodiment of the present invention. As shown in FIG. 8, as the thickness of the metal plate 600 increases, it may be difficult to form the through-hole 612 through laser drilling, etc., in consideration of this, in advance through press processing, etc. in the metal plate preparation step. In a state in which a groove (or stepped; hereinafter referred to as'groove') 619 that is relatively thinner than other portions is formed in the hole forming region (or in addition to the insulating slit region), such a step forming groove 619 After the through-hole 612 is formed, it may be plugged with a liquid insulating material 616'.

In the above, with reference to the accompanying drawings, the method of manufacturing a high heat dissipation PCB and a preferred embodiment of the high heat radiation PCB manufactured thereby have been described in detail, but this is only an example, and various modifications within the scope of the technical idea of the present invention And changes will be possible. Therefore, the scope of the present invention should be determined by the description of the following claims.

10: electronic circuit module, 11: module PCB,
12, 13: electronic components, 14: heat sink,
20: main PCB,
600: metal plate, 610, 610': heat sink,
612: insulation hole, 614: insulation slit,
616: insulation plug, 620: insulation sheet,
630: metal sheet, 640: through hole,
650: heat transfer passage, 660: electric conductor,
670: heat conductor, 680: exposed area,
690: liquid insulating material (heat conductor)

Claims (7)

(A) forming one or more insulating holes vertically penetrating the metal plate for heat sinking;
(B) curing the insulating hole after filling it with a liquid insulating resin;
(C) laminating an insulating sheet and a metal sheet on the upper and lower surfaces of the heat sink metal plate so that the metal sheet faces the outside;
Step (d) of forming a through-hole having a diameter smaller than that of the insulating hole but vertically penetrating the insulating plug portion after the step (c), and
High heat dissipation PCB manufacturing method comprising (e) filling the through-hole region with metal. The method according to claim 1,
After the step (c), after forming a plurality of heat transfer passages including via grooves having a depth contacting the metal plate for heat sinking in the insulating sheet and the metal sheet, filling the heat transfer passages with metal is further provided. High heat dissipation PCB manufacturing method, characterized in that. The method according to claim 2,
The high heat dissipation PCB manufacturing method, characterized in that the metal plugging of the through hole or the heat transfer passage is made of a metal plating or an additional clamping process after metal plating. The method of claim 3,
The formation of the through hole and the heat transfer passage is performed simultaneously or sequentially,
The high heat dissipation PCB manufacturing method, characterized in that the plugging of the through hole and the heat transfer passage is performed simultaneously or sequentially. The method according to claim 1,
When preparing the heat sink metal plate in the step (a), a groove for forming a step is formed on an upper surface or a lower surface of the insulating hole forming portion. In the step (a), when the insulating hole is formed, at least one insulating slit formed of a long hole vertically penetrating the heat sink metal plate is formed together,
When the insulating hole is filled with a liquid insulating resin in the step (b), the insulating slit is filled together. High heat dissipation PCB manufactured by the manufacturing method of any one of claims 1 to 6.

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