CN113498252A - Electronic equipment, circuit board and preparation method thereof - Google Patents

Electronic equipment, circuit board and preparation method thereof Download PDF

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Publication number
CN113498252A
CN113498252A CN202011072406.2A CN202011072406A CN113498252A CN 113498252 A CN113498252 A CN 113498252A CN 202011072406 A CN202011072406 A CN 202011072406A CN 113498252 A CN113498252 A CN 113498252A
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CN
China
Prior art keywords
current
circuit
metal substrate
board
carrying
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Granted
Application number
CN202011072406.2A
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Chinese (zh)
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CN113498252B (en
Inventor
严振坤
罗奇
王远
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Kinwong Electronic Technology Longchuan Co Ltd
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Kinwong Electronic Technology Longchuan Co Ltd
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Priority to CN202011072406.2A priority Critical patent/CN113498252B/en
Publication of CN113498252A publication Critical patent/CN113498252A/en
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Publication of CN113498252B publication Critical patent/CN113498252B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The application provides an electronic device, a circuit board and a preparation method thereof, wherein the circuit board comprises: a dielectric plate; the circuit layer is arranged on one side of the dielectric plate and is provided with a first circuit for small current to pass through; the metal substrate is arranged on the other side of the dielectric plate; the current-carrying piece penetrates through the dielectric plate and extends out of one side of the dielectric plate so as to be distributed at intervals with the first circuit; the current-carrying piece is connected with the metal substrate and is used for passing large current. The preparation method of the circuit board comprises the following steps: preparing a dielectric plate, preparing a metal substrate, and laminating the dielectric plate and the metal substrate to enable a current-carrying piece to penetrate through the dielectric plate and form a circuit layer on the dielectric plate; the electronic device includes a wiring board. Run through the dielectric-slab and form with metal substrate through the current-carrying piece and be connected for increase the thickness of current-carrying piece under the unchangeable condition of the whole thickness of assurance circuit board, so that the current-carrying piece can lead to the heavy current, and metal substrate can satisfy the heat dissipation demand of current-carrying piece better, guarantees the life of circuit board.

Description

Electronic equipment, circuit board and preparation method thereof
Technical Field
The application belongs to the technical field of circuit board preparation, and particularly relates to an electronic device, a circuit board and a preparation method thereof.
Background
With the increasing of electronic technologies, the functions of electronic products are more and more abundant, and with the increasing of various functions, electronic devices such as functional modules and integrated circuits in the electronic products are more and more dense, which requires a circuit board to have a higher current carrying capacity, so that it is a general demand for a circuit to pass large current.
The current carrying capacity of the circuit board mainly depends on the width and thickness of a circuit, namely the width and thickness of copper foil, and the current carrying capacity provided by the circuit board is limited based on the conventional design of the thickness and width of the copper foil of most of the circuit boards at present, so that the requirement of high power cannot be met. If a large current is applied to a conventional circuit board, the copper foil will generate heat, which may cause circuit breaking due to circuit blowing, and further affect the normal operation of the electronic product.
In order to realize the large current on the circuit board, most of the current improvement schemes are to increase the thickness and the width of the copper foil. The width of the copper foil is increased, so that the using amount of copper is increased, the material cost is increased, the space for placing electronic elements on the circuit board is reduced, and the difficulty of the circuit board production and welding process is increased. For the circuit area through which small current flows, the copper thickness is not required to be increased, and if the copper thickness of the whole circuit layer where the copper foil is located is increased, a large amount of copper is wasted, and the production cost of the circuit board is increased. The improvement scheme of a small part is to tin the copper foil, so that the current carrying capacity of the circuit is improved, but the tin plating thickness is uneven, and the quality is difficult to ensure. In the above, since the width and thickness of the circuit board are limited, it is difficult to improve the current carrying capacity of the circuit, that is, it is difficult to pass a large current.
Disclosure of Invention
One of the purposes of the embodiment of the application is as follows: the utility model provides a circuit board, aims at solving among the prior art, and the limited technical problem who leads to being difficult to realize through heavy current of line width, thickness.
In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:
provided is a wiring board including:
a dielectric plate;
the circuit layer is arranged on one side of the dielectric plate and is provided with a first circuit for small current to pass through;
the metal substrate is arranged on the other side of the dielectric plate;
the current-carrying piece penetrates through the dielectric plate and extends out of one side of the dielectric plate so as to be distributed at intervals with the first circuit; the current-carrying piece is connected with the metal substrate and is used for allowing large current to pass through.
In one embodiment, the current-carrying member is a copper block, the metal substrate is a copper substrate, and the current-carrying member and the metal substrate are in an integrated connection structure.
In one embodiment, the width of the current carrying member is greater than the width of the first line, and the width extending direction of the current carrying member and the width extending direction of the first line are both perpendicular to the distribution direction of the dielectric plate and the metal substrate.
In one embodiment, the metal substrate is provided with an insulating groove, and the insulating groove penetrates through the metal substrate along the distribution direction of the dielectric plate and the metal substrate and isolates the current-carrying element and the first circuit.
In one embodiment, an insulating member is disposed on the metal substrate, and the insulating member penetrates through the metal substrate along a distribution direction of the dielectric plate and the metal substrate and isolates the current-carrying member from the first line.
In one embodiment, the insulating member is an insulating resin.
In one embodiment, the circuit layer further has a second circuit for passing a large current, and the second circuit is spaced from the first circuit and the current carrier.
In one embodiment, the wiring board further comprises a core plate, the current-carrying member penetrating through the core plate;
the circuit board comprises one circuit layer, the core board is arranged on one side of the dielectric board, and the circuit layer is arranged on the core board; or the circuit board comprises at least two circuit layers, one core board is stacked between every two adjacent circuit layers, and one circuit layer is arranged on the dielectric board.
The application also provides a preparation method of the circuit board, which comprises the following steps:
preparing a medium plate;
preparing a metal substrate, and forming a current-carrying piece on the metal substrate;
pressing the dielectric plate and the metal substrate to enable the current-carrying piece to penetrate through the dielectric plate and extend out of one side of the dielectric plate, which is far away from the metal substrate;
and covering a metal layer on one side of the dielectric plate, which is far away from the metal plate, etching the metal layer to form a circuit layer, and enabling the circuit layer to be provided with first circuits which are distributed at intervals with the current-carrying piece.
The application also provides an electronic device which comprises the circuit board.
Compared with the prior art, the electronic equipment, the circuit board and the preparation method thereof have the advantages that: this application overlaps the relative both sides of locating the dielectric-slab respectively through circuit layer and metal substrate, the current-carrying piece runs through the dielectric-slab and forms with metal substrate and be connected, make the thickness of increase current-carrying piece under the unchangeable circumstances of assurance circuit board whole thickness, thereby improve the current carrying capacity of current-carrying piece, then the current-carrying piece can lead to the heavy current, and the circuit layer has with current-carrying piece interval distribution and is used for leading to the first circuit of undercurrent, thus, guarantee under the unchangeable circumstances of holistic thickness of circuit board and width, realize the function that the subregion leads to heavy current and undercurrent, satisfy the circuit layout requirement of circuit board. In addition, the current-carrying piece is directly connected to the metal substrate, so that the metal substrate can better meet the heat dissipation requirement of the current-carrying piece on the basis that the current-carrying piece meets the requirement of passing large current, and the service life of the circuit board is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a top view of a circuit board according to a first embodiment of the present disclosure;
fig. 2 is a cross-sectional view of a circuit board according to an embodiment of the present disclosure;
fig. 3 is a cross-sectional view of a circuit board provided in the second embodiment of the present application, the circuit board being a double-layer board;
fig. 4 is a cross-sectional view of a multilayer board provided in the second embodiment of the present application;
fig. 5 is a flowchart of a manufacturing process of a circuit board provided in the third embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
1-a dielectric plate; 2-a line layer; 21-high current region; 22-low current region; 221-a first line; 3-a metal substrate; 31-a first heat sink member; 32-a second heat sink member; 4-a current carrying member; 5-an insulating member; 6-core plate; y-the first direction.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and can be communicated with each other inside the two components or in an interaction relationship of the two components; similarly, the communication may be direct or indirect via an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
For explaining the technical scheme of the application, the following detailed description is made in conjunction with the specific drawings and the embodiments:
the first embodiment is as follows:
referring to fig. 1 and fig. 2 together, a circuit board according to an embodiment of the present disclosure includes a dielectric board 1, a circuit layer 2, a metal substrate 3, and a current-carrying element 4.
The dielectric sheet 1 is an insulating sheet, and is made of PP material. The circuit layer 2 is disposed on one side of the dielectric board 1 along the first direction y, the circuit layer 2 has a first circuit 221, where it should be noted that the circuit layer 2 includes a large current region 21 and a small current region 22, the first circuit 221 is disposed on the small current region 22, and the first circuit 221 is used for passing a small current. The metal substrate 3 is disposed on the other side of the dielectric plate 1 along the first direction y, that is, the metal substrate 3 and the circuit layer 2 are respectively disposed on two opposite sides of the dielectric plate 1 along the first direction y. The first direction y is a distribution direction of the circuit layer 2, the dielectric plate 1 and the metal substrate 3, such as a vertical direction y illustrated in fig. 2, and is parallel to an axial direction of the circuit layer 2, an axial direction of the dielectric plate 1 and an axial direction of the metal substrate 3.
The current-carrying member 4 penetrates through the dielectric board 1 and extends out of one side of the dielectric board 1, so that the current-carrying member 4 penetrates through the circuit layer 2 and is distributed at an interval with the first circuit 221, and at this time, the current-carrying member 4 is located in the high-current region 21 of the circuit layer 2. The current-carrying piece 4 is a metal piece and is used for passing large current, and the thickness of the current-carrying piece 4 in the first direction y is the thickness of the dielectric plate 1 and the circuit layer 2 in the first direction y after being superposed, so that the current carrying capacity of the current-carrying piece 4 can be improved. In this way, the first line 221 and the current carrier 4 are arranged, so that the design of passing large and small currents in the line layer 2 in a partitioned manner is realized. Wherein, for realizing the planarization of whole circuit layer 2, one side that current-carrying piece 4 deviates from metal substrate 3 flushes the setting with one side that circuit layer 2 deviates from metal substrate 3.
It should be further noted here that the metal substrate 3 is disposed on a side of the dielectric board 1 away from the circuit layer 2, and is mainly used for heat dissipation of the entire circuit board, including heat dissipation of the first circuit 221 and the current carrying member 4. In addition, the current-carrying part 4 is connected with the metal substrate 3, the metal substrate 3 and the current-carrying part 4 are both metal parts, and the metal substrate 3 and the current-carrying part 4 are connected, so that the metal substrate 3 is beneficial to improving the heat dissipation effect of the current-carrying part 4.
In the embodiment of the application, locate the relative both sides of dielectric-slab 1 through circuit layer 2 and metal substrate 3 respectively fold, current-carrying piece 4 runs through dielectric-slab 1 and forms with metal substrate 3 and is connected, make and increase the thickness of current-carrying piece 4 under the unchangeable circumstances of the whole thickness of assurance circuit board, thereby improve the current carrying capacity of current-carrying piece 4, then current-carrying piece 4 can lead to the heavy current, and circuit layer 2 has and leads to 4 interval distribution of current-carrying piece and be used for leading to the first circuit 221 of undercurrent, thus, guarantee under the unchangeable circumstances of holistic thickness of circuit board and width, realize dividing the regional function that leads to heavy current and undercurrent, satisfy the circuit layout requirement of circuit board. In addition, the current-carrying piece 4 is directly connected to the metal substrate 3, so that the metal substrate 3 can better meet the heat dissipation requirement of the current-carrying piece 4 on the basis that the current-carrying piece 4 meets the requirement of passing large current, and the service life of the circuit board is ensured.
Referring to fig. 2, in the present embodiment, the current-carrying component 4 is a copper block, and the metal substrate 3 is a copper substrate, that is, the current-carrying component 4 and the metal substrate 3 are both made of copper, which is helpful for improving the current-carrying capability of the current-carrying component 4. And, current-carrying piece 4 and metal substrate 3 connection structure as an organic whole, that is to say, current-carrying piece 4 is formed to the protrusion on metal substrate 3, so that current-carrying piece 4 runs through dielectric plate 1 and circuit layer 2 respectively, the design of body coupling, make current-carrying piece 4 and metal substrate 3 along the thickness on the first direction y bigger, do benefit to more and improve the current carrying capacity, and still do benefit to and improve metal substrate 3 to the radiating effect of current-carrying piece 4, help improving the protection to whole circuit board, improve the life of circuit board.
Referring to fig. 1 and fig. 2, in the present embodiment, the width of the current-carrying element 4 is greater than the width of the first circuit 221, and the width extending direction of the current-carrying element 4 and the width extending direction of the first circuit 221 are both perpendicular to the distribution direction of the dielectric plate 1 and the metal substrate 3, that is, the width extending directions of the current-carrying element 4 and the first circuit 221 are both perpendicular to the axial direction of the dielectric plate 1. It should be noted here that, the line width of current carrier 4 is greater than the line width of first line 221, and the sectional area of current carrier 4 is greater than the sectional area of first line 221, where the section of current carrier 4 and the section of first line 221 are parallel to plane a illustrated in fig. 1, the width extending directions of current carrier 4 and first line 221 are both parallel to plane a, and plane a is perpendicular to first direction y. By adopting the above technical scheme, the line width of the current-carrying part 4 is greater than the line width of the first line 221, and the current carrying capacity of the current-carrying part 4 is greater than the current carrying capacity of the first line 221, so that the current-carrying part 4 is facilitated to be powered on with large current, and the design that the circuit board is powered on with large current and small current in a subarea is realized, that is, the circuit board is powered on with large current locally and small current locally.
In the present embodiment, the metal substrate 3 is provided with an insulation groove, which penetrates through the metal substrate 3 along the axial direction of the metal substrate 3 and isolates the current carrier 4 and the first line 221. Here, the insulating groove penetrates through the metal substrate 3 in the first direction y, and is provided between the large current region 21 and the small current region 22 of the circuit layer 2, that is, the insulating groove isolates the large current region 21 and the small current region 22 from each other in the first direction y, so that the insulating groove isolates the current carrier 4 and the first circuit 221.
As shown in fig. 2, the insulating groove penetrates the metal substrate 3 in the first direction y so that the metal substrate 3 is divided into two parts, namely, a first heat sink member 31 and a second heat sink member 32, and the first heat sink member 31 and the second heat sink member 32 are independent of each other. The first heat dissipation part 31 corresponds to the large-current region 21 and is connected to the current-carrying part 4, the first heat dissipation part 31 is used for dissipating heat of the large-current region 21, specifically includes dissipating heat of the current-carrying part 4, and heat generated by the current-carrying part 4 during operation is conducted to the first heat dissipation part 31, so that heat dissipation is achieved. The second heat sink portion 32 corresponds to the small current region 22 and is isolated from the current-carrying member 4, and the second heat sink portion 32 is used for dissipating heat from the small current region 22, specifically, for dissipating heat from the first line 221. In this embodiment, since the current-carrying part 4 is used for passing a large current, the first circuit 221 is used for passing a small current, the heating temperature of the current-carrying part 4 is much higher than the heating of the first circuit 221, the first heat dissipation part 31 and the second heat dissipation part 32 are independent from each other, the heat conducted from the current-carrying part 4 to the first heat dissipation part 31 is prevented from being conducted to the second heat dissipation part 32, thereby causing the heat on the second heat dissipation part 32 to be too large and burning out the first circuit 221, thus, the arrangement of the insulation groove allows the first heat dissipation part 31 and the second heat dissipation part 32 to be independent from each other, the partitioned heat dissipation of the large current region 21 and the small current region 22 of the circuit layer 2 is realized, the heat dissipation of the two parts is prevented from being influenced with each other and causing burning out the first circuit 221, the heat dissipation protection of the whole circuit board is enhanced, and the safety performance and the service life of the circuit board are improved.
Referring to fig. 1 and fig. 2, in the present embodiment, the metal substrate 3 is provided with an insulating member 5, and the insulating member 5 penetrates through the metal substrate 3 along the axial direction of the dielectric plate 1 and isolates the current-carrying member 4 and the first circuit 221. It should be noted here that the insulating member 5 penetrates through the metal substrate 3 along the first direction y and is connected to the insulating plate, and the insulating member 5 is disposed between the large current region 21 and the small current region 22 of the circuit layer 2, that is, the insulating member 5 isolates the large current region 21 and the small current region 22 along the first direction y, so that the insulating member 5 isolates the current carrying member 4 and the first circuit 221.
The insulating member 5 penetrates the metal substrate 3 in the first direction y and is connected to the insulating plate, so that the metal substrate 3 is divided into two parts, namely a first heat sink part 31 and a second heat sink part 32, and the first heat sink part 31 and the second heat sink part 32 are independent of each other and are insulated by the insulating member 5. The first heat dissipation part 31 corresponds to the large-current region 21 and is connected to the current-carrying part 4, the first heat dissipation part 31 is used for dissipating heat of the large-current region 21, specifically includes dissipating heat of the current-carrying part 4, and heat generated by the current-carrying part 4 during operation is conducted to the first heat dissipation part 31, so that heat dissipation is achieved. The second heat sink portion 32 corresponds to the small current region 22 and is isolated from the current-carrying member 4, and the second heat sink portion 32 is used for dissipating heat from the small current region 22, specifically, for dissipating heat from the first line 221. In this embodiment, since the current-carrying part 4 is used for passing a large current, and the first line 221 is used for passing a small current, the heating temperature of the current-carrying part 4 is much higher than the heating temperature of the first line 221, and the first heat sink part 31 and the second heat sink part 32 are independent from each other and are insulated by the insulating part 5, so that the heat conducted from the current-carrying part 4 to the first heat sink part 31 is prevented from being conducted to the second heat sink part 32, and the first line 221 is burned out due to the excessive heat in the second heat sink part 32. So, the setting of insulating part 5 improves the effect of first heat sink part 31 and second heat sink part 32 mutual insulation, guarantees that first heat sink part 31 and second heat sink part 32 are completely independent, realizes the subregion heat dissipation to the regional 21 of the heavy current region 21 of circuit layer 2 and undercurrent region 22, avoids heat dissipation between them to influence each other and leads to burning out first circuit 221, strengthens the heat dissipation protection to whole circuit board, improves the security performance and the life of circuit board.
Here, the metal substrate 3 is provided with an insulating groove penetrating the metal substrate 3, and the insulating material 5 is provided in the insulating groove and connected to the dielectric plate 1.
In this embodiment, the insulating member 5 is insulating resin, and the curing temperature of insulating resin is lower to can guarantee insulating resin curing and isolated first heat dissipation part 31 and second heat dissipation part 32, and insulating resin's insulating effect is better, can guarantee that first heat dissipation part 31 and second heat dissipation part 32 are insulating each other and do not influence each other, and set up insulating resin, it is with very low costs, the practicality is high.
In another embodiment, the circuit layer 2 further has a second circuit, the second circuit is disposed in the high current region 21 of the circuit layer 2 and is used for passing a high current, and the second circuit is spaced from the first circuit 221 and the current carrier 4. It should be noted here that the width of the second line is larger than the width of the first line 221, and/or the thickness of the second line is larger than the thickness of the first line 221, so that the first line 221 and the second line are used for passing a small current and a large current, respectively. Thus, by adopting the above technical scheme, on the basis of allowing the line width or thickness of the line layer 2 not to be limited, the second line can be arranged on the large current area 21 of the line layer 2, so that the current carrying capacity is improved, and the large current can pass through the second line.
Referring to fig. 2, in the present embodiment, the circuit board is a single-layer board, that is, the number of the circuit layers 2 is set to be one layer. The circuit board further comprises a core board 6, the core board 6 is arranged on one side of the dielectric board 1 along the first direction y, namely the metal substrate 3 and the core board 6 are respectively arranged on two opposite sides of the dielectric board 1 along the first direction y, the circuit layer 2 is arranged on the core board 6, and at the moment, the circuit layer 2 deviates from the metal substrate 3.
Example two:
referring to fig. 3 and fig. 4, the difference between the first embodiment and the second embodiment is: the circuit board comprises at least two circuit layers 2, a core board 6 is arranged between every two adjacent circuit layers 2 in a stacking mode along the first direction y, and one circuit layer 2 is arranged on the dielectric board 1. The current-carrying member 4 penetrates through the dielectric board 1, the core board 6 and the at least two circuit layers 2.
The circuit board shown in fig. 3 is a double-layer board, two circuit layers 2 are provided, a core board 6 is stacked between the two circuit layers 2, one circuit layer 2 is provided on the dielectric board 1, and the current-carrying member 4 penetrates through the two circuit layers 2 and the core board 6.
The circuit board shown in fig. 4 is an eight-layer board, the number of the circuit layers 2 is eight, the eight circuit layers 2 are sequentially stacked along the first direction y, and one core board 6 is stacked between two adjacent circuit layers 2, so that the number of the core boards 6 is seven, one circuit layer 2 is disposed on the dielectric board 1, and the current-carrying member 4 penetrates through the eight circuit layers 2 and the seven core boards 6.
Of course, the circuit board may also be a four-layer board, a six-layer board, or other multi-layer boards, which is not limited herein.
Example three:
referring to fig. 5, an embodiment of the present application further provides a method for manufacturing a circuit board, where the circuit board in the first embodiment or the second embodiment is manufactured by the method for manufacturing a circuit board in the present embodiment, the circuit board in the present embodiment may refer to the circuit boards described in the first embodiment and the second embodiment, and a specific structure of the circuit board is described with reference to the description of the circuit board in the first embodiment or the second embodiment, which is not described herein in detail.
The preparation method of the circuit board in the embodiment includes the following steps:
s1, preparing a medium plate 1, and opening a hole on the medium plate 1;
s2, preparing a metal substrate 3, and forming a current carrier 4 on the metal substrate 3;
in this embodiment, when the current-carrying member 4 and the metal substrate 3 are an integral connection structure, a boss is formed on the metal substrate 3, and the boss is the current-carrying member 4. The current carrier 4 is formed by etching a line, so that the current carrier 4 can be used for carrying large current.
S3, pressing the dielectric plate 1 and the metal substrate 3, so that the current-carrying piece 4 penetrates through the dielectric plate 1 and extends out of one side of the dielectric plate 1, which is far away from the metal substrate 3;
the step S1 is to form the opening so that the current-carrying member 4 penetrates through the dielectric plate 1 when the dielectric plate 1 and the metal substrate 3 are pressed together.
S4, covering a metal layer on the side of the dielectric board 1 away from the metal board, etching the metal layer to form the circuit layer 2, and making the circuit layer 2 have the first circuit 221 spaced apart from the current carrying member 4.
In this embodiment, run through dielectric plate 1 and form with metal substrate 3 through current-carrying piece 4 and be connected, increase the thickness of current-carrying piece 4 under the unchangeable circumstances of the whole thickness of assurance circuit board, thereby improve the current carrying capacity of current-carrying piece 4, then current-carrying piece 4 can lead to heavy current, and circuit layer 2 has and current-carrying piece 4 interval distribution and be used for leading to the first circuit 221 of undercurrent, so, guarantee under the unchangeable circumstances of holistic thickness of circuit board and width, realize the regional function of leading to heavy current and undercurrent, satisfy the circuit layout requirement of circuit board. In addition, the current-carrying piece 4 is directly connected to the metal substrate 3, so that the metal substrate 3 can better meet the heat dissipation requirement of the current-carrying piece 4 on the basis that the current-carrying piece 4 meets the requirement of passing large current, and the service life of the circuit board is ensured.
Optionally, in this embodiment, an insulating resin penetrates through the metal substrate 3, specifically: an insulating groove is formed in the metal substrate 3, the insulating groove is formed by deep hole milling, and insulating resin is filled in the insulating groove under a vacuum condition. Through adopting above-mentioned technical scheme, can guarantee that insulating resin can realize the insulation of first heat dissipation part 31 and second heat dissipation part 32 after insulating resin sets up in the insulating bath, avoid first heat dissipation part 31 and second heat dissipation part 32 to influence each other when the heat dissipation is worked.
Example four:
the embodiment of the application also provides electronic equipment which comprises a circuit board. The circuit board in this embodiment is the circuit board in the first embodiment or the second embodiment, and the specific structure of the circuit board refers to the description of the circuit board in the first embodiment or the second embodiment, which is not described herein again.
The electronic equipment that this application embodiment provided, circuit layer 2 and metal substrate 3 through the circuit board superpose respectively and locate the relative both sides of dielectric-slab 1, current-carrying piece 4 runs through dielectric-slab 1 and forms with metal substrate 3 and is connected, make the thickness of increase current-carrying piece 4 under the unchangeable condition of the whole thickness of assurance circuit board, thereby improve the current carrying capacity of current-carrying piece 4, then current-carrying piece 4 can lead to the heavy current, and circuit layer 2 has with current-carrying piece 4 interval distribution and be used for leading to the first circuit 221 of undercurrent, thus, guarantee under the unchangeable condition of holistic thickness of circuit board and width, realize dividing the regional function of leading to heavy current and undercurrent, satisfy the circuit layout requirement of circuit board, also be that electronic equipment can satisfy the use of heavy current and undercurrent. In addition, the current-carrying piece 4 is directly connected to the metal substrate 3, so that the metal substrate 3 can better meet the heat dissipation requirement of the current-carrying piece 4 on the basis that the current-carrying piece 4 meets the requirement of passing large current, and the service life of the circuit board is ensured. In this embodiment, electronic equipment can also realize the heat dissipation better on the basis of satisfying the use of heavy current and undercurrent to guarantee electronic equipment's life.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A circuit board, comprising:
a dielectric plate;
the circuit layer is arranged on one side of the dielectric plate and is provided with a first circuit for small current to pass through;
the metal substrate is arranged on the other side of the dielectric plate;
the current-carrying piece penetrates through the dielectric plate and extends out of one side of the dielectric plate so as to be distributed at intervals with the first circuit; the current-carrying piece is connected with the metal substrate and is used for allowing large current to pass through.
2. The circuit board of claim 1, wherein the current-carrying element is a copper block, the metal substrate is a copper substrate, and the current-carrying element and the metal substrate are in an integral connection structure.
3. The circuit board of claim 1, wherein the width of the current carrying element is greater than the width of the first circuit, and the width extending direction of the current carrying element and the width extending direction of the first circuit are perpendicular to the distribution direction of the dielectric board and the metal substrate.
4. The circuit board of claim 1, wherein the metal substrate is formed with an insulation groove, the insulation groove penetrates through the metal substrate along a distribution direction of the dielectric plate and the metal substrate, and isolates the current-carrying element from the first circuit.
5. The circuit board of claim 1, wherein an insulating member is disposed on the metal substrate, and the insulating member penetrates through the metal substrate along a distribution direction of the dielectric board and the metal substrate and isolates the current-carrying member from the first circuit.
6. The wiring board of claim 5, wherein said insulating member is an insulating resin.
7. The wiring board according to any one of claims 1 to 6, wherein a second circuit for passing a large current is further provided on the wiring layer, and the second circuit is spaced apart from the first circuit and the current carrier, respectively.
8. The wiring board of any of claims 1-6, wherein the wiring board further comprises a core, the current-carrying member extending through the core;
the circuit board comprises one circuit layer, the core board is arranged on one side of the dielectric board, and the circuit layer is arranged on the core board; or the circuit board comprises at least two circuit layers, one core board is stacked between every two adjacent circuit layers, and one circuit layer is arranged on the dielectric board.
9. A method for producing a wiring board according to any one of claims 1 to 8, comprising the steps of:
preparing a medium plate;
preparing a metal substrate, and forming a current-carrying piece on the metal substrate;
pressing the dielectric plate and the metal substrate to enable the current-carrying piece to penetrate through the dielectric plate and extend out of one side of the dielectric plate, which is far away from the metal substrate;
and covering a metal layer on one side of the dielectric plate, which is far away from the metal plate, etching the metal layer to form a circuit layer, and enabling the circuit layer to be provided with first circuits which are distributed at intervals with the current-carrying piece.
10. An electronic device characterized by comprising the wiring board according to any one of claims 1 to 9.
CN202011072406.2A 2020-10-09 2020-10-09 Electronic equipment, circuit board and preparation method thereof Active CN113498252B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115500008A (en) * 2022-08-30 2022-12-20 超聚变数字技术有限公司 Computing node and computing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102786A (en) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk Radiator of electronic part and manufacturing method therefor
US20060145340A1 (en) * 2005-01-03 2006-07-06 Tzyy-Jang Tseng Substrate and method for fabricating the same
CN104427784A (en) * 2013-08-30 2015-03-18 深南电路有限公司 High-current circuit board and processing method thereof
CN104582237A (en) * 2013-10-18 2015-04-29 深南电路有限公司 Circuit board with heavy current in inner layer and producing method thereof
CN207947939U (en) * 2018-01-12 2018-10-09 深圳恒宝士线路板有限公司 A kind of structure of the metal substrate of thermoelectricity separation
CN108770191A (en) * 2018-08-21 2018-11-06 信丰福昌发电子有限公司 A kind of copper-based wiring board of new-energy automobile and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102786A (en) * 1999-10-01 2001-04-13 Mizutani Denki Kogyo Kk Radiator of electronic part and manufacturing method therefor
US20060145340A1 (en) * 2005-01-03 2006-07-06 Tzyy-Jang Tseng Substrate and method for fabricating the same
CN104427784A (en) * 2013-08-30 2015-03-18 深南电路有限公司 High-current circuit board and processing method thereof
CN104582237A (en) * 2013-10-18 2015-04-29 深南电路有限公司 Circuit board with heavy current in inner layer and producing method thereof
CN207947939U (en) * 2018-01-12 2018-10-09 深圳恒宝士线路板有限公司 A kind of structure of the metal substrate of thermoelectricity separation
CN108770191A (en) * 2018-08-21 2018-11-06 信丰福昌发电子有限公司 A kind of copper-based wiring board of new-energy automobile and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115500008A (en) * 2022-08-30 2022-12-20 超聚变数字技术有限公司 Computing node and computing equipment

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