CN203219609U - Novel metal core printed circuit board - Google Patents
Novel metal core printed circuit board Download PDFInfo
- Publication number
- CN203219609U CN203219609U CN 201320101403 CN201320101403U CN203219609U CN 203219609 U CN203219609 U CN 203219609U CN 201320101403 CN201320101403 CN 201320101403 CN 201320101403 U CN201320101403 U CN 201320101403U CN 203219609 U CN203219609 U CN 203219609U
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- printed circuit
- circuit board
- metal
- metal base
- layer
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Abstract
The utility model provides a novel metal core printed circuit board comprising a metal base layer, a PI insulation layer, a copper layer line, and a solder mask layer, wherein a surface of the PI insulation layer is adhered to the metal base layer, the copper layer line is formed on the other surface of the PI insulation layer, the solder mask layer is also formed on the other surface of the PI insulation layer, the solder mask layer is provided with windows, the copper layer line is exposed at the window parts and therefore electric connection zones are formed, the other surface of the metal base layer is not adhered to the PI insulation and is provided with at least a groove, and the depth of the groove is smaller than the thickness of the metal base layer. The novel metal core printed circuit board is characterized in that a metal core printed circuit board which can be applied to manufacturing various kinds of bendable electrical module groups can be manufactured just by cutting one or more grooves at the bottom part of the metal base layer of the metal core printed circuit board and by adopting the insulation layer made of a PI material, and therefore the novel metal core printed circuit board is simple in structure and low in manufacture cost, and weight reduction of the metal core printed circuit board can be helped to be realized.
Description
Technical field
The utility model relates to the LED technical field, is specifically related to a kind of novel metal base printed circuit board.
Background technology
In recent years, led light source is because the remarkable advantage that its life-span is long, light efficiency is high, radiation is low and low in energy consumption has obtained extensive use in various fields.
LED also produces a large amount of heats when high brightness output is provided, therefore, under high-temperature work environment, problems such as colour cast, brightness reduction, shortening in useful life can take place LED, even fault immediately can occur.For avoiding occurring the problems referred to above, require the substrate of carrying LED can derive the heat that produces when LED works in time, fully, be extensive use of metal base printed circuit board at present and carried LED to satisfy the requirement to the substrate heat conductivility.
Existing metal base printed circuit board comprises metal-based layer, high heat conductive insulating dielectric layer and copper layer line layer.The insulating medium layer effect of edge effect and bonded metal basic unit, copper layer line layer of drawing last breath that electrifies, the inorganic filler powder of the high heat conduction of general employing and epoxy resin are mixed with and form, can not carry out bending process, and metal-based layer is dull and stereotyped sheet material, cause above-mentioned metal base printed circuit board can't satisfy the LED lighting device to the diversified demand of led light source module shape for the preparation of the led light source module of flat shape.
The utility model content
In view of this, be necessary the problem mentioned at background technology to provide a kind of metal base printed circuit board for the preparation of bent led light source module.
The purpose of this utility model is achieved through the following technical solutions:
A kind of novel metal base printed circuit board, it comprises:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at described PI insulating barrier offers window on this solder mask, thus exposed formation the in described copper layer line road that is positioned at the window place is electrically connected the zone;
Offer at least one groove on another surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described groove is less than the thickness of described metal-based layer.
Described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
Described groove is V-type groove, U-shaped groove, deep-slotted chip breaker or dovetail groove.
The degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
The drift angle of described V-type groove 5 is greater than 30 °.
The degree of depth of described U-shaped groove is 1/4 to 3/4 of described metal-based layer thickness, and its width is 1.0-5.0mm.
Compared with prior art, the utility model possesses following advantage:
The utility model only needs at the metal-based layer bottom of metal base printed circuit board cutting groove, and the insulating barrier of employing PI material, can prepare and can be used for preparing bent all kinds of electric module, the metal base printed circuit board that comprises the led light source module, simple in structure, preparation cost is low, and helps to alleviate the weight of metal base printed circuit board.
Description of drawings
Fig. 1 is the not bending state cross-sectional view of the utility model embodiment one;
Fig. 2 is the bending state cross-sectional view of the utility model embodiment one;
Fig. 3 is the not bending state cross-sectional view of the utility model embodiment two;
Fig. 4 is the not bending state cross-sectional view of the utility model embodiment three;
Fig. 5 is the bending state cross-sectional view of the utility model embodiment three.
Embodiment
Embodiment one:
As shown in Figure 1, the described a kind of novel metal base printed circuit board of present embodiment comprises: metal-based layer 1; The PI(polyimides) insulating barrier 2, and surface thereof adheres to this metal-based layer 1; Copper layer line road 3, it is formed at another surface of PI insulating barrier 2; Solder mask 4, it also is formed at another surface of PI insulating barrier 2, offers window on this solder mask 4, thus described copper layer line road 3 exposed formation that are positioned at the window place are electrically connected the zone, are used for connecting electronic devices and components.Wherein, offer V-type groove 5 on another surface that described metal-based layer 1 does not adhere to described PI insulating barrier 2.The degree of depth of described V-type groove 5 is less than the thickness of described metal-based layer 1.
Described metal-based layer 1 is the thin plate with certain toughness that is prepared from by aluminium, copper or stainless steel and other metal materials, and its thickness can be between 0.5-2.0mm.
The degree of depth of V-type groove 5 is preferably the 1/3-2/3 of metal-based layer 1 thickness.
The angle of V-type groove 5 and the degree of depth can design according to the material of metal-based layer 1 and the angle of bend of thickness and metal base printed circuit board needs, preferably the drift angle of V-type groove 5 is greater than 30 °, and satisfies the angle of bend greater than described metal base printed circuit board needs simultaneously.
Because metal substrate 1 can be along the 5 places bending of V-type groove, and PI insulating barrier 2 is fit to carry out bending process, therefore metal base printed circuit board can be as shown in Figure 2 along V-type groove 5 to a lateral bending song opposite with described copper layer line road 3, thereby realize the bending of metal base printed circuit board.
Because metal-based layer 1 thickness at described V-type groove 1 place is less, therefore when metal-based layer 1 is crooked, the bending resistance at V-type groove 5 places is little than the metal-based layer 1 at unslotted place, and metal-based layer 1 is easy to carry out bending at these V-type groove 5 places, makes described V-type groove 5 play the effect of location bending position; On the other hand, V-type groove 5 can reduce the stress that metal base printed circuit board produces when crooked, avoids bending position stress excessive and cause metal base printed circuit board to damage.
Embodiment two:
As shown in Figure 3, the described a kind of novel metal base printed circuit board of present embodiment and embodiment one described metal base printed circuit board structure proximate, difference is: what offer on the side surface that the metal-based layer 10 of present embodiment does not adhere to PI insulating barrier 20 is U-shaped groove 50.
Compare with the V-type groove, it is littler to offer the metal base printed circuit board of U-shaped groove 50 resistance when crooked, therefore metal base printed circuit board is easier to carry out bending operation, in addition, the stress that produces when crooked than the V-type groove when U-shaped groove 50 is crooked is little, is conducive to guarantee the electric property of metal base printed circuit board.
The width of described U-shaped groove and the degree of depth can be set as the case may be, and preferably, the degree of depth of U-shaped groove is 1/4 to 3/4 of these metal-based layer 10 thickness, and the width of U-shaped groove is 1.0-5.0mm.
Should be understood that, the groove of offering on the metal-based layer of a kind of novel metal base printed circuit board of the utility model is not limited to V-type groove, the U-shaped groove in above-mentioned two execution modes, in fact, the shape of groove can not be restricted, as long as it makes the thickness of bending position of metal base printed circuit board be thinned, for example can also offer deep-slotted chip breaker, dovetail groove etc.; Also can offer multiple difform groove at the metal-based layer of same metal base printed circuit board, to satisfy the different bending needs of metal base printed circuit board different piece.
Embodiment three:
Present embodiment provides a kind of led light source module of Application Example two described metal base printed circuit boards, and as shown in Figure 4, this led light source module comprises: metal-based layer 10; The PI(polyimides) insulating barrier 20, and surface thereof adheres to this metal-based layer 10; Copper layer line road 30, it is formed at another surface of described PI insulating barrier 20; Solder mask 40, it also is formed at another surface of PI insulating barrier 20, offers window on this solder mask 40, and copper layer line road 30 exposed formation that are positioned at the window place are electrically connected the zone, and described electrical connection zone comprises the LED pad 70 for assembled LED lamp pearl; LED lamp pearl 60, it is fixed on the described LED pad 70 and with described LED pad 70 by welding or other modes and is electrically connected.Wherein, offer U-shaped groove 50 on the side surface that does not adhere to described PI insulating barrier 20 of described metal-based layer 10.
As shown in Figure 5, described U-shaped groove 50 is divided into first area 80 and second area 90 with described led light source module, the led light source module can be along this U-shaped groove 50 to a lateral bending song relative with described LED lamp pearl 60 so that first area 80 and second area 90 form certain angle.
Understand easily, can be as required at the metal-based layer 10 of led light source module a plurality of U-shaped grooves 50 be set, thereby can make the led light source module form predetermined 3D shape along these U-shaped groove 50 bendings, to satisfy the LED lighting device to the diversified demand of led light source module shape.
Understand easily, the led light source module of the utility model is not limited to embodiment three described technical schemes, for example: described U-shaped groove can also be substituted by embodiment one described V-type groove, deep-slotted chip breaker or dovetail groove etc., also can offer multiple difform groove at the metal-based layer of same led light source module, to satisfy the different bending needs of led light source module different piece.
Claims (6)
1. novel metal base printed circuit board, it is characterized in that: it comprises:
Metal-based layer;
PI insulating barrier, surface thereof adhere to described metal-based layer;
Copper layer line road, it is formed at another surface of described PI insulating barrier;
Solder mask, another surface that it also is formed at described PI insulating barrier offers window on this solder mask, thus exposed formation the in described copper layer line road that is positioned at the window place is electrically connected the zone;
Offer at least one groove on another surface that does not adhere to described PI insulating barrier of described metal-based layer, the degree of depth of described groove is less than the thickness of described metal-based layer.
2. a kind of novel metal base printed circuit board according to claim 1, it is characterized in that: described metal-based layer is the thin plate with toughness that is prepared from by aluminium, copper or stainless steel, and its thickness is between 0.5-2.0mm.
3. a kind of novel metal base printed circuit board according to claim 1 and 2, it is characterized in that: described groove is V-type groove, U-shaped groove, deep-slotted chip breaker or dovetail groove.
4. a kind of novel metal base printed circuit board according to claim 3, it is characterized in that: the degree of depth of described V-type groove is the 1/3-2/3 of the thickness of described metal-based layer.
5. a kind of novel metal base printed circuit board according to claim 4, it is characterized in that: the drift angle of described V-type groove 5 is greater than 30 °.
6. a kind of novel metal base printed circuit board according to claim 3, it is characterized in that: the degree of depth of described U-shaped groove is 1/4 to 3/4 of described metal-based layer thickness, and its width is 1.0-5.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101403 CN203219609U (en) | 2013-03-06 | 2013-03-06 | Novel metal core printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320101403 CN203219609U (en) | 2013-03-06 | 2013-03-06 | Novel metal core printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203219609U true CN203219609U (en) | 2013-09-25 |
Family
ID=49209109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320101403 Expired - Fee Related CN203219609U (en) | 2013-03-06 | 2013-03-06 | Novel metal core printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203219609U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987186A (en) * | 2014-04-30 | 2014-08-13 | 美的集团武汉制冷设备有限公司 | Circuit board, display component and air conditioner |
-
2013
- 2013-03-06 CN CN 201320101403 patent/CN203219609U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103987186A (en) * | 2014-04-30 | 2014-08-13 | 美的集团武汉制冷设备有限公司 | Circuit board, display component and air conditioner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |