CN103650647B - The manufacture method of installation base plate radiating stacking material - Google Patents
The manufacture method of installation base plate radiating stacking material Download PDFInfo
- Publication number
- CN103650647B CN103650647B CN201280035203.3A CN201280035203A CN103650647B CN 103650647 B CN103650647 B CN 103650647B CN 201280035203 A CN201280035203 A CN 201280035203A CN 103650647 B CN103650647 B CN 103650647B
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- China
- Prior art keywords
- mass
- base plate
- installation base
- stacking material
- radiating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Abstract
The present invention provides the lightweight for coping with electronic equipment, miniaturization and slimming and also can more effectively spread the manufacture method of the hot installation base plate radiating stacking material produced by the electronic component even if the big electronic component of caloric value is installed.The set layers of copper (20) on a side surface of resin film (10), by being optionally etched to layers of copper (20), form circuit pattern layer (21), after circuit pattern layer (21) is formed, the set aluminium foil (30) on the surface of side opposite with a side surface of resin film (10).
Description
Technical field
The present invention relates generally to manufacture method of the installation base plate with radiating stacking material, especially relate to be used to heating be installed
Measure the manufacture method of the installation base plate radiating stacking material of big electronic component, for example for installing light emitting diode (LED)
Deng the manufacture method of the installation base plate radiating stacking material of light-emitting component.
Background technology
The installation base plate that circuit is formed with the single or double of insulating barrier is used for extensive field.Circuit by copper,
The paper tinsel or paste composite of aluminium are formed.Electronic component is installed on the circuit of formation.As the electronic component of installation, it can enumerate：
Resistive element, capacitor, transistor, various power components；The high density integrated circuits such as MPU, CPU；Light emitting diode (LED),
The light-emitting components such as laser diode and their array element.
In recent years, to the performance more and more higher required by electronic equipment, in above-mentioned electronic component, there is power component and height
The tendency of the consumption electric power increase of density integrated circuit.In addition, developing the light-emitting component of more high brightness.But, power member
The increase of caloric value, right caused by the raising of the increase of the consumption electric power of part and high density integrated circuit and the brightness of light-emitting component
The electronic component of heating itself produces harmful effect with other electronic components.For example it is believed that the electronic component itself of heating
With other electronic components because heat and operate error, Yin Re and performance reduction, Yin Re and shorten life-span etc..Therefore, it is proposed to various
For efficiently removing, spreading the hot structure produced by electronic component.
On the other hand, in recent years, for the pockets such as mobile phone, digital camera, audio player, recorder, game machine electricity
Sub- equipment, in addition to lightweight and miniaturization, also requires slimming.If can be by the installation base for installing electronic component
Plate is directly laminated in the supporter of portable electronic device or framework, then effective to being thinned.That is, to installation base plate
It is required that bendability.
In addition, there is more and more large-scale tendency in recent years in the slim TV such as LCD TV.However, for slim TV
For, expect while making picture maximize, TV body lightweight and slimming are made as far as possible.In order to be thinned and disappear
The reduction of power consumption power, as the light source of LCD backlight source device, uses LED.LED is directly mounted on insulated substrate.
In order to tackle such technology sexual orientation, needed to be diffused into and installed with stacking material by installation base plate by the LED heat produced
The surface of the LED opposite side in surface.Particularly the LCD backlight source device of side-light type in its structure in order in per unit area
Multiple LED are installed, higher thermal diffusivity is required with stacking material for installation base plate.
Thus, for example in Japanese Unexamined Patent Publication 2010-98246 publications (patent document 1), as effectively discharging by LED
Deng electronic unit produce it is hot, slim, light weight is excellent and can be formed as the gold of desired stereochemical structure by plastic working
Belong to substrate, disclose the layer using copper as principal component formed on the one side of stainless steel foil and clip insulating barrier and circuit formation use
The gluing metal substrate of copper foil.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2010-98246 publications
The content of the invention
Invent problem to be solved
However, as the method as described above that circuit is formed on the mounting surface of metal substrate, as patent document 1 is remembered
Carry, generally using the method being optionally etched to copper foil.Now, metal foil (being stainless steel foil in patent document 1)
Copper foil is etched selectively to after upper copper foil.
But, in the case of the low intensity, thickness of thin in the metal foil of side opposite with installing surface side, formed on mounting surface
Circuit concavo-convex press-in side opposite with installing surface side metal foil side, be transferred on the surface of metal foil, it is concavo-convex to protrude so that
Reduce flatness.Moreover, the face with concavo-convex metal foil is pasted on the supporter or framework of portable electronic device
Space is produced so that the problem of thermal conductivity is reduced in use, existing.
Therefore, it is an object of the present invention to provide a kind of installation base plate manufacture method of radiating stacking material, the radiating
Stacking material copes with the lightweight, miniaturization and slimming of electronic equipment, even and if the big electronics member of installation caloric value
Part, also can more effectively spread the heat produced by the electronic component.
Method for solving problem
According to manufacture method of the installation base plate of the present invention with radiating stacking material, possesses following process.
(A) on a side surface of insulating film set conductive layer process
(B) by being optionally etched the process to form circuit pattern layer to conductive layer
(C) after circuit pattern layer is formed, the set aluminium foil on the surface of side opposite with a side surface of insulating film
Process
In manufacture method of the installation base plate of the present invention with radiating stacking material, aluminium foil contains manganese：More than 0.5 mass % and
Below 3.0 mass %, chromium：0.0001 mass % is less than 0.2 mass %, magnesium：More than 0.2 mass % and below 1.8 mass %,
Titanium：More than 0.0001 mass % and below 0.6 mass %, copper：More than 0 mass % and below 0.005 mass %, silicon：More than 0 mass %
And 0.1 below mass % and iron：More than 0 mass % and below 0.2 mass %, surplus is made up of aluminium and inevitable impurity.
In addition, in manufacture method of the installation base plate of the present invention with radiating stacking material, preferably insulating film is included and is selected from
One in the group being made up of polyimides, PEN, polyethylene terephthalate and polytetrafluoroethylene (PTFE)
Kind.
Invention effect
Possess light weight, thermal diffusivity (thermal conductivity) and bending by installation base plate radiating stacking material produced by the present invention
Property excellent aluminium foil, therefore, it is possible to tackle the lightweight of electronic equipment, miniaturization and be thinned.In addition, according to the present invention,
Formed after circuit pattern layer, set has defined intensity and hardness on the surface of side opposite with a side surface of insulating film
Aluminium foil, therefore, bumps will not be produced on the surface of aluminium foil.Thus, even if will be used by installation base plate produced by the present invention
Radiating stacking material pastes on the supporter and framework of portable electronic device to use, and will not also produce space and make heat conduction
Rate is reduced.Therefore, it can manufacture also can more effectively spread by the electronic component even if the big electronic component of caloric value is installed
The hot installation base plate of generation radiating stacking material.
Brief description of the drawings
Fig. 1 is the manufacture method for the installation base plate radiating stacking material for being denoted as an embodiment of the invention
The figure of the schematic cross-section structure of first process.
Fig. 2 is the manufacture method for the installation base plate radiating stacking material for being denoted as an embodiment of the invention
The figure of the schematic cross-section structure of second process.
Fig. 3 is the manufacture method for the installation base plate radiating stacking material for being denoted as an embodiment of the invention
The figure of the schematic cross-section structure of 3rd process.
Fig. 4 is installation base plate the first work of the manufacture method of radiating stacking material for being denoted as the comparative example of the present invention
The figure of the schematic cross-section structure of sequence.
Fig. 5 is installation base plate the second work of the manufacture method of radiating stacking material for being denoted as the comparative example of the present invention
The figure of the schematic cross-section structure of sequence.
Embodiment
Hereinafter, an embodiment of the invention is illustrated based on accompanying drawing.
First, as shown in figure 1, clipping gluing oxidant layer on the side surface as the resin film 10 of one of insulating film
(not shown) set as conductive layer the layers of copper 20 of one.
Then, layers of copper 20 is etched by selectivity, as shown in Fig. 2 forming circuit pattern layer 21.
In addition, after circuit pattern layer 21 is formed, glue is clipped on the surface of side opposite with a side surface of resin film 10
Adhesive layer (not shown) set aluminium foil 30.
Here, aluminium foil 30 contains manganese：More than 0.5 mass % and below 3.0 mass %, chromium：0.0001 mass % less than
0.2 mass %, magnesium：More than 0.2 mass % and below 1.8 mass %, titanium：More than 0.0001 mass % and below 0.6 mass %, copper：It is super
Cross 0 mass % and below 0.005 mass %, silicon：More than 0 mass % and below 0.1 mass % and iron：More than 0 mass % and 0.2 mass %
Hereinafter, surplus is made up of aluminium and inevitable impurity.The aluminium foil 30 is by with above-mentioned composition, showing that high intensity and height are hard
Degree, for example, show 170Hv hardness.
Installation base plate of the invention manufactured as above radiating stacking material, possess light weight, thermal diffusivity (thermal conductivity) and
The excellent aluminium foil 30 of bendability, therefore, it is possible to tackle the lightweight, miniaturization and slimming of electronic equipment.In addition, forming electricity
After road patterned layer 21, set has the aluminium of defined intensity and hardness on the surface of side opposite with a side surface of resin film 10
Paper tinsel 30, therefore, will not produce bumps on the surface of aluminium foil 30.Thus, even if will be used by installation base plate produced by the present invention
Radiating stacking material pastes on the supporter and framework of portable electronic device to use, and will not also produce space and make heat conduction
Rate is reduced.Therefore, it can manufacture also can more effectively spread by the electronic component even if the big electronic component of caloric value is installed
The hot installation base plate of generation radiating stacking material.
(resin film)
In order to be resistant to the installation of the electronic component carried out by about 250 DEG C of welding, the glass of optimum resin membrane 10
It is more than 250 DEG C to change transition temperature (Tg).Moreover, in order to ensure insulating properties, the breakdown voltage of optimum resin membrane 10 for 5kV with
On.Also, it is preferred that it is less than 0.1% that thermal contraction, i.e. percent thermal shrinkage, which hardly occur, for resin film 10.
Resin film 10 is preferably by including polyimides, PEN, polyethylene terephthalate
Film is formed, as the material of resin film 10, particularly preferably using polyimide film.
For the insulating properties and thermal diffusivity played stably, the thickness of resin film 10 is preferably more than 10 μm and less than 100 μm,
More preferably 10~50 μm.When the thickness of resin film 10 is less than 10 μm, it is impossible to the insulating properties effect stablized.Resin film 10
When thickness is more than 100 μm, the reason for being reduced as thermal diffusivity.
(layers of copper)
Layers of copper 20 be in order to by etch etc. formed for be installed on installation base plate radiating stacking material on electronics
Circuit that element is connected up and set.Can be by being deposited on the polyimide resin layer as resin film 10 as copper
Layer 20 copper film and constitute, but preferably by resin film 10 across adhesive layer stackup as the electrolytic copper foil of layers of copper 20 come
Constitute.
In order to easily form circuit by etching, and it is laminated in closely sealed mode on resin film 10, the thickness of layers of copper 20
Degree is preferably more than 5 μm and less than 100 μm, more preferably 10~70 μm.When the thickness of layers of copper 20 is less than 5 μm, it is difficult to aesthetically
(in the way of not producing fold) is closely sealed on resin film 10 and is laminated.When the thickness of layers of copper 20 is more than 100 μm, it is difficult to pass through erosion
Carve and form accurate circuit.
(aluminium foil)
In order to spread by being produced in installation base plate with the electronic component installed in the circuit pattern layer 21 of radiating stacking material
Heat, set aluminium foil 30.Can be with by the lower surface of aluminium foil 30 (face of side opposite with the face of the side of the set of resin film 10)
The mode of the stacking of supporter or framework and set along electronic equipment configures installation base plate radiating stacking material.
Aluminium foil 30 is preferably formed by the high aluminium of thermal conductivity.Branch by installation base plate with radiating stacking material along electronic equipment
When support body or framework stacking, it is desirable to the good aluminium foil of bendability, therefore, aluminium foil 30 preferably use it is appropriate it is quenched after aluminium.
For the thickness of aluminium foil 30, in order to contribute to the light weight of electronic equipment, miniaturization, slimming, and hold
Easy processing, the thermal diffusivity played stably, preferably more than 20 μm and less than 350 μm, more preferably more than 80 μm and 300 μm
Hereinafter, more preferably more than 100 μm and less than 250 μm.When the thickness of aluminium foil 30 is less than 20 μm, it is impossible to the thermal diffusivity stablized
Effect.When the thickness of aluminium foil 30 is more than 350 μm, not only it is difficult to, and light weight, small-sized, slimming obstacle can be hindered.
(gluing oxidant layer)
In order to ensure heat resistance, gluing oxidant layer is preferably formed by wide variety of epoxies adhesive.Electroconductive stuffing is carried
High-cooling property, but insulating properties is reduced, therefore, electroconductive stuffing is free of in gluing oxidant layer.
In order to play good adaptation, without prejudice to radiates, and the thickness of gluing oxidant layer is preferably less than 3 more than μ and 30 μm.
When the thickness of gluing oxidant layer is less than 3 μm, easily cause closely sealed not enough or closely sealed inequality, therefore, the reason for being reduced as thermal diffusivity.
When the thickness of gluing oxidant layer is more than 30 μm, it is difficult to be laminated aluminium foil 30 with resin film 10, resin film 10 and layers of copper 20, therefore, into
The reason for being reduced for thermal diffusivity.
Then, embodiments of the invention are specifically explained.It should be noted that embodiments illustrated below is one
Example, the invention is not restricted to following embodiments.
Embodiment
Process according to Fig. 1~Fig. 3, the sample of the fabrication and installation substrate embodiment of radiating stacking material.In addition,
In order to compare, the hardness aluminium foil lower than the aluminium foil used in the present invention, the process according to Fig. 1~Fig. 3, fabrication and installation are used
The sample of the substrate comparative example 1 of radiating stacking material.In addition, the process according to Fig. 4~Fig. 5, fabrication and installation substrate is used
The sample of the comparative example 2 of radiating stacking material.
(embodiment)
As shown in figure 1, as resin film 10, using the polyimide film that thickness is 25 μm, by dry type layered manner, at this
The electrolytic copper foil that the gluing thickness as layers of copper 20 of epoxies adhesive is 35 μm is clipped on the one side of film.The thickness of gluing oxidant layer
For 15 μm.
Then, as shown in Fig. 2 being optionally etched by using photoetching process to layers of copper 20, being formed has arbitrarily
The circuit pattern layer 21 of circuitry shapes.
Then, as shown in figure 3, by dry type layered manner, it is gluing on the face of the opposite side of resin film 10 to clip epoxies
The gluing thickness of agent is 100 μm of aluminium foil 30 (hardness 170Hv), and the aluminium foil 30 contains manganese：More than 0.5 mass % and 3.0 mass % with
Under, chromium：0.0001 mass % is less than 0.2 mass %, magnesium：More than 0.2 mass % and below 1.8 mass %, titanium：0.0001 matter
Measure more than % and below 0.6 mass %, copper：More than 0 mass % and below 0.005 mass %, silicon：More than 0 mass % and 0.1 mass % with
Lower and iron：More than 0 mass % and below 0.2 mass %, surplus is made up of aluminium and inevitable impurity.The thickness of gluing oxidant layer is
15μm。
(comparative example 1)
Except using aluminium foil (material 1N30, H, the hardness that thickness is 150 μm：50Hv) the thickness instead of being used in embodiment
Beyond 100 μm of aluminium foil 30, the process fabrication and installation substrate heat dissipating layer in the same manner as embodiment according to Fig. 1~Fig. 3
Laminate materials.
(comparative example 2)
As shown in figure 4, as resin film 10, using the polyimide film that thickness is 25 μm, by dry type layered manner at this
The electrolytic copper foil that the gluing thickness as layers of copper 20 of epoxies adhesive is 35 μm is clipped on the one side of film.The thickness of gluing oxidant layer
For 15 μm.In addition, clipping the gluing thickness of epoxies adhesive on the face of the opposite side of resin film 10 by dry type layered manner and being
150 μm of aluminium foil (material：1N30, H, hardness：50Hv).
Then, as shown in figure 5, being optionally etched by using photoetching process to layers of copper 20, in the same manner as embodiment
Form the circuit pattern layer 21 with arbitrary circuitry shapes.
In the installation base plate use radiating stacking material of obtained embodiment, comparative example 1 and comparative example 2, visually confirm
Whether there is the bumps in the face of aluminium foil 30.
Concavo-convex evaluation is as follows：From the side of aluminium foil 30 visually from, the circuit diagram that will be formed in circuit pattern layer 21
The situation that a part for the profile of case protrudes into relief-type has been evaluated as bumps, and the profile of circuit pattern is flat without protruding
Situation be evaluated as no concave-convex.
For no generation is concavo-convex on the face of aluminium foil 30 in embodiment, in the face of aluminium foil 30 in comparative example 1,2
It is upper to produce bumps.
It will be understood that embodiment of disclosure and embodiment are to illustrate in all respects, do not constitute and limit.This
The embodiment and embodiment of the scope of invention not above, but shown by claims, also include and claim
All changes and deformation in the equal implication of book and scope.
Industrial applicability
In accordance with the invention it is possible to manufacture the lightweight for coping with electronic equipment, miniaturization and be thinned, even and if pacifying
The big electronic component of dress caloric value also can more effectively spread the hot installation base plate heat dissipating layer produced by the electronic component
Laminate materials.
Label declaration
10：Resin film, 20：Layers of copper, 21：Circuit pattern layer, 30：Aluminium foil.
Claims (2)
1. a kind of installation base plate manufacture method of radiating stacking material, wherein, including：
The process of set conductive layer (20) on a side surface of insulating film (10)；
By being optionally etched the process to form circuit pattern layer (21) to the conductive layer (20)；With
It is solid on the surface of side opposite with a side surface of the insulating film (10) after the circuit pattern layer (21) is formed
The process for aluminium foil (30),
The aluminium foil (30) contains manganese：More than 0.5 mass % and below 3.0 mass %, chromium：0.0001 mass % is less than 0.2
Quality %, magnesium：More than 0.2 mass % and below 1.8 mass %, titanium：More than 0.0001 mass % and below 0.6 mass %, copper：More than 0
Quality % and below 0.005 mass %, silicon：More than 0 mass % and below 0.1 mass % and iron：More than 0 mass % and 0.2 mass % with
Under, surplus is made up of aluminium and inevitable impurity.
2. the installation base plate as claimed in claim 1 manufacture method of radiating stacking material, wherein, the insulating film (10)
Comprising selected from being made up of polyimides, PEN, polyethylene terephthalate and polytetrafluoroethylene (PTFE)
One kind in group.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-156985 | 2011-07-15 | ||
| JP2011156985A JP2013026284A (en) | 2011-07-15 | 2011-07-15 | Manufacturing method of heat radiation laminated material for mounting substrate |
| PCT/JP2012/067263 WO2013011845A1 (en) | 2011-07-15 | 2012-07-06 | Method for producing heat-dissipating multilayer material for mounting boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103650647A CN103650647A (en) | 2014-03-19 |
| CN103650647B true CN103650647B (en) | 2017-08-08 |
Family
ID=47558023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280035203.3A Active CN103650647B (en) | 2011-07-15 | 2012-07-06 | The manufacture method of installation base plate radiating stacking material |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2013026284A (en) |
| KR (1) | KR20140041454A (en) |
| CN (1) | CN103650647B (en) |
| TW (1) | TWI616123B (en) |
| WO (1) | WO2013011845A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105679905A (en) * | 2016-01-19 | 2016-06-15 | 上海万寅安全环保科技有限公司 | Semiconductor chip |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0746754B2 (en) * | 1986-10-28 | 1995-05-17 | 東芝コンポ−ネンツ株式会社 | Method for manufacturing printed wiring board |
| JPH0828559B2 (en) * | 1987-04-23 | 1996-03-21 | 松下電器産業株式会社 | Printed wiring board |
| JP2585643B2 (en) * | 1987-11-19 | 1997-02-26 | 電気化学工業株式会社 | Mass production method of metal base circuit board |
| JP2005096184A (en) * | 2003-09-24 | 2005-04-14 | Fuji Photo Film Co Ltd | Support for lithographic printing plate and original plate for lithographic printing plate |
| CN100483763C (en) * | 2007-11-02 | 2009-04-29 | 长春市北方电子有限责任公司 | Method for preparing copper film thicken copper-coating ceramic substrate |
| JP5517927B2 (en) * | 2008-05-29 | 2014-06-11 | 電気化学工業株式会社 | Metal base circuit board |
-
2011
- 2011-07-15 JP JP2011156985A patent/JP2013026284A/en active Pending
-
2012
- 2012-07-06 KR KR1020137025568A patent/KR20140041454A/en not_active Application Discontinuation
- 2012-07-06 WO PCT/JP2012/067263 patent/WO2013011845A1/en active Application Filing
- 2012-07-06 CN CN201280035203.3A patent/CN103650647B/en active Active
- 2012-07-13 TW TW101125274A patent/TWI616123B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103650647A (en) | 2014-03-19 |
| WO2013011845A1 (en) | 2013-01-24 |
| TWI616123B (en) | 2018-02-21 |
| KR20140041454A (en) | 2014-04-04 |
| JP2013026284A (en) | 2013-02-04 |
| TW201309137A (en) | 2013-02-16 |
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