TW201635600A - Led element substrate, led-mounted module and led display device using these - Google Patents

Abstract

The purpose of the present invention is to provide an LED-mounted module which can be optimally used as a backlight in large LED display devices and which can improve heat dissipation and productivity of LED display devices, etc. This LED element substrate 1 is provided with a resin substrate 11 comprising a flexible resin film and a metal wiring unit 13 which is laminated on the resin substrate 11 for conducting between electrodes of LEDs elements 2 and on which an insulation unit is formed. The thermal conductivity [lambda] of the metal configuring the metal wiring unit 13 is 300-500 W/(m*K), the electrical resistivity R of the metal configuring the metal wiring unit 13 is 2.50 x 10<SP>-8</SP> [Omega]m or less, and the metal wiring unit 13 covers 95% or more of one surface of the resin substrates 11.

Description

LED element substrate, LED package module, and use of the same LED display device

The present invention relates to a substrate for an LED element, an LED package module, and an LED display device using the same. More specifically, the present invention relates to a substrate for an LED element, an LED package module using the same, and an LED display device. The LED element substrate can be used by arranging a plurality of light emitting diodes (LEDs). It constitutes a large-sized LED display device and contributes to improving the productivity and heat dissipation of the LED display device.

In recent years, LED display devices such as liquid crystal televisions and liquid crystal displays that use LED elements as backlights can be used as displays that replace the conventional image tube type display and can meet the requirements of low power consumption and large size and thinness of devices. The popularity has been rapidly progressing.

In order to mount an LED as a light source in these display devices, various substrates for LED elements composed of a support substrate and a line portion are generally used. Further, a laminated body in which LED elements are mounted on these substrates (hereinafter referred to as "LED assembly modules" in the present specification) is used as an LED backlight which is a light source of various display devices such as the liquid crystal television. It is widely used.

In these display devices, it is required to increase the brightness of the light source in order to improve the image quality. However, the increase in the amount of heat generated from the LED elements accompanying the increase in brightness causes an increase in power consumption and a decrease in the light-emitting ability of the LED elements. Therefore, the LED package module is strongly required to increase brightness and improve heat dissipation. In recent years, in order to increase the heat dissipation performance, it has become a particularly urgent problem in displays such as liquid crystal televisions that continue to increase in size.

As an aspect of the configuration of the LED element for improving the heat dissipation property, for example, a method has been proposed in which an LED element is directly mounted on a metal surface of a metal base substrate (see Patent Document 1). However, this method, since the metal substrate is plate-shaped, lacks design freedom, and is batch-produced for one sheet at a time, and thus productivity is also low.

On the other hand, a circuit board (Patent Document 3) is proposed, which is a flexible substrate in which a metal circuit is formed on a resin substrate, and a metal layer (Patent Document 2) or a thermal connection portion is additionally formed on the circuit substrate. The metal layer is provided separately from the conduction circuit only for the purpose of exhibiting heat dissipation performance, and the thermal connection portion is a portion divided from the circuit for conduction. However, in these flexible substrates, the following disadvantages cannot be avoided: the risk of the additional burden on the work step and the short circuit between the circuits increases with the formation of the heat dissipation structure portion made of metal.

Further, in the above-described substrate for an LED element, in particular, when a large-sized display device having a screen size of 65 Å or more is required to be mounted on one or more LED elements, a plurality of LED elements are connected by a connector. The substrate, thereby forming a backlight; At the manufacturing site of the display device or the like, it is difficult to arrange the plurality of substrates in the backlight with high positional accuracy, which also hinders further improvement in productivity.

[Previous Technical Literature] (Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-81194

Patent Document 2: Japanese Laid-Open Patent Publication No. 2012-59867

Patent Document 3: Japanese Patent Publication No. 2013-522893

The present invention has been made in view of the above circumstances, and an object of the invention is to provide a substrate for an LED element, an LED module, and an LED display device using the same, which can be suitably used as an LED The backlight of the display device is used, and heat dissipation and productivity of the LED display device and the like can be improved.

As a result of the intensive research, the present inventors have found that the above problem can be solved by setting the substrate for an LED element as follows. In other words, the present inventors have found that a metal wiring portion is formed on the resin film, and the metal wiring portion can be configured with a plurality of LED elements. Further, a majority of the surface of the resin film can be formed at a specific ratio or more. The structure in which the metal line portion is covered, thereby being able to be compared with the past The method more significantly improves the heat dissipation and productivity of an LED display device or the like, thereby completing the present invention. In particular, the present invention provides the following techniques.

(1) A substrate for an LED element, comprising: a resin substrate comprising a flexible resin film; and a metal wiring portion laminated on the resin substrate and used to make two LED elements The electrodes are electrically connected to each other and have an insulating portion formed therein; wherein the metal constituting the metal wiring portion has a thermal conductivity λ of 300 W/(m‧K) or more and 500 W/(m ‧ K) or less, and the metal constituting the metal wiring portion The specific resistance R is 2.50 × 10 ^-8 Ωm or less, and the metal wiring portion covers a range of 95% or more of the surface of one of the resin substrates.

(2) A substrate for an LED element, comprising: a resin substrate having a diagonal length of at least 65 Å and comprising a flexible single resin film; and a metal wiring portion laminated thereon The resin substrate is formed to electrically connect between the two electrodes of the LED element, and is formed with an insulating portion; wherein the metal line portion is formed to be able to electrically connect 1000 or more LED elements arranged in a matrix. Further, the metal wiring portion covers a range of 95% or more of the surface of one of the resin substrates.

(3) The substrate for an LED element according to the above aspect, wherein the metal wiring portion is made of copper.

(4) The element substrate for LED according to the above aspect, wherein the metal wiring portion has an average thickness of 5 μm or more and 50 μm or less.

(5) The element substrate for an LED according to the above aspect, wherein the insulating portion is formed in a slit shape having a width of 0.1 mm or more and 1.0 mm or less.

(6) The element substrate for an LED according to the above aspect, wherein the metal line portion is an electrolytic copper foil, and a surface roughness Rz on the layer side of the resin substrate is 1.0 or more and 10.0 or less. .

(7) The element substrate for LED according to (1) or (2), wherein the resin film for forming the resin substrate is polyethylene naphthalate, and the heat of the polyethylene naphthalate The shrinkage onset temperature is 100 ° C or more.

(8) A LED package module comprising at least 100 or more LED elements mounted on the LED element substrate according to any one of (1) to (7).

(9) The LED module is configured by arranging at least 1000 or more LED elements on the substrate for LED elements according to any one of (1) to (7).

(10) An LED display device comprising the LED package module according to (8) or (9) and a display area layer for display.

(11) An LED display device comprising the LED package module according to (8) or (9) as a backlight.

According to the present invention, it is possible to provide a substrate for an LED element, an LED module, and an LED display device using the same, which is, for example, a screen size of 65 Å or more. A backlight of a large-sized LED display device such as a LED display device can also be preferably used, and can improve heat dissipation and productivity of an LED display device, etc., and can provide a substrate for an LED element and an LED package module. It can be preferably used as a backlight, and is excellent in heat dissipation and productivity.

1‧‧‧Battery for LED components

2‧‧‧LED components

3‧‧‧ display

4‧‧‧heating structure

10‧‧‧LED Assembly Module

11‧‧‧Resin substrate

12‧‧‧Adhesive layer

13‧‧‧Metal Lines Department

14‧‧‧ solder layer

15‧‧‧Insulating protective film

16‧‧‧reflective layer

100‧‧‧LED display device

131‧‧‧conductive plate

132‧‧‧Insulated slit

133‧‧‧Connector line

134‧‧‧ terminals

Fig. 1 is a plan view schematically showing the arrangement of metal wiring portions of the LED element substrate of the present invention.

Fig. 2 is a partial enlarged view of Fig. 1 and is a view showing an arrangement of a metal wiring portion as a substrate for LED elements of the present invention.

Fig. 3 is a partial cross-sectional view showing the LED module of the present invention, and is a view showing a configuration of an LED element in the LED module of the present invention.

Fig. 4 is a plan view schematically showing an example of an LED module in which an LED element is mounted on a substrate for an LED element of the present invention.

Fig. 5 is a partially enlarged view of Fig. 4, and is a view showing a configuration of an LED element in the LED module of the present invention.

Fig. 6 is a perspective view schematically showing a layer configuration of an LED display device using the LED module of the present invention.

Hereinafter, each embodiment of the LED element substrate, the LED package module, and the LED display device of the present invention will be described. The invention is not at all The present invention is limited to the following embodiments, and can be implemented by appropriately changing the scope of the object of the present invention.

<Substrate for LED components>

As shown in FIG. 1 and FIG. 2, the LED element substrate 1 has a conductive metal wiring portion 13 formed on the surface of the resin substrate 11 via an adhesive layer 12 (see FIG. 3). 11 is composed of a flexible resin film, and the metal wiring portion 13 is made of a metal foil. The metal wiring portion 13 is formed on the resin substrate 11 in such a manner that the LED elements 2 arranged in a matrix can be electrically connected. Further, the resin substrate is preferably a single resin film even in a large resin substrate, and is not a resin substrate obtained by bonding a plurality of flexible resin films, and a resin film as a base material. In the invention, such a single resin film can be produced.

In the LED element substrate 1, as shown in FIGS. 3 and 5, an insulating protective film 15 is formed on the resin substrate 11 and the metal wiring portion 13, and the insulating protective film 15 is made of a thermosetting ink or the like. . In order to improve the migration resistance of the LED element substrate 1, the insulating protective film 15 is formed in such a manner that, in addition to the connection portion for arranging the LED element 2, the surface of the metal wiring portion 13 is covered. The entire surface and the almost entire surface of the portion of the surface of the resin substrate 11 where the metal wiring portion 13 is not formed.

Further, in the substrate 1 for LED elements, it is more preferable that, as shown in FIG. 3, a reflective layer 16 is further laminated on the insulating substrate 15 on the resin substrate 11 and the metal wiring portion 13, and the reflective layer 16 is composed of white It is composed of a resin or the like. In particular, when the LED package module 10 is used as a backlight of the LED display device 100 as shown in FIG. 6, in general, the reflective layer 16 must be disposed on the outermost surface of the LED package module. The LED package module 10 is obtained by mounting the LED element 2 on the LED element substrate 1. However, the insulating protective film 15 is provided with reflection performance, whereby the insulating property can be ensured by the insulating protective film without providing a reflective layer.

As shown in FIG. 3, the LED element substrate 1 is used as the LED package module 10, and the LED element 2 is mounted on the metal line portion 13 with the solder layer 14 interposed therebetween in a conductive manner. Further, the LED package module 10 can be preferably used for a large-sized LED display device or other various large-sized electronic devices equipped with LED elements.

Regarding the size of the substrate 1 for LED elements, the length of the diagonal d shown in FIG. 4 is at least 32 Å or more, and more preferably 65 Å or more. Moreover, the size of the LED element substrate 1 is a size in which 100 or more LED elements 2 can be arranged in a matrix, and it is preferable that 1000 or more LED elements 2 can be arranged in a matrix. 4 is an example of a configuration in which the LED element 2 is mounted on the substrate 1 for an LED element, and an example is shown in which 40 LED elements 2 are arranged in the X direction and 30 LED elements are arranged in the Y direction. 2. A total of 1200 LED elements 2 are mounted. Further, the planar shape of the substrate for an LED element of the present invention is not necessarily limited to a rectangular shape. In the present specification, the "diagonal length is 32 吋 or more". For example, when the substrate for an LED element is elliptical, it means the length of the long diameter. degree. For example, a substrate for an LED element having a long diameter of 32 Å and satisfying the elliptical shape of other constituent elements of the present invention is within the scope of the present invention.

[Resin substrate]

In the resin substrate 11, the length of the diagonal line d is at least 32 Å or more, more preferably 65 Å or more, in combination with the size of the LED element substrate 1, and it is preferable that the resin film of such a size is a single resin film. . In the present specification, the term "single resin film" means that the resin film is a resin sheet composed of a single sheet-like film, and is not an aggregate of a plurality of resin films or a bonding by such physical bonding. body. Such a single large film can be manufactured by a special extrusion molding apparatus capable of producing a film outside the specification range.

As a material of the resin substrate 11, a flexible resin film obtained by molding a thermoplastic resin into a sheet shape can be used. Here, the flaky shape refers to a concept including a film shape, and there is no difference between the two in the present invention.

Moreover, the thermoplastic resin used as the material of the resin substrate 11 is required to have high heat resistance and insulation properties. As such a resin, a polyimide resin (PI) can be used, which is excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability. Further, it is also possible to use various other thermoplastic resins which improve the heat resistance by applying an annealing treatment or the like to improve heat resistance and dimensional stability. For example, polyethylene naphthalate (PEN) or the like which is subjected to annealing treatment to impart sufficient heat resistance and dimensional stability required. Also, it is also possible to choose by adding no flame retardancy PET or the like which has improved flame retardancy by a machine filler or the like is used as a material resin of a resin substrate.

The thermoplastic resin for forming the resin substrate 11 is preferably a thermoplastic resin obtained by the above annealing treatment so that the heat shrinkage initiation temperature becomes the thermosetting ink for forming the insulating protective film 15. A thermoplastic resin having improved heat resistance in a manner other than the heat curing temperature. For example, when the insulating protective film 15 is formed of a thermosetting ink having a heat curing temperature of about 80 ° C, the heat shrinkage initiation temperature of PEN, which is generally about 80 ° C, is raised to 100 by annealing treatment. It can be around °C. By this, it is possible to form the insulating protective film 15 having sufficient heat resistance, strength, and insulation while avoiding fine thermal damage of the resin substrate 11.

In addition, the "heat shrinkage initiation temperature" in the present specification means that a sample sheet which is a measurement object, that is, a thermoplastic resin, is placed on a thermomechanical analysis (TMA) device, and a load is applied thereto. 1 g, and the temperature was raised to 120 ° C at a temperature increase rate of 2 ° C / min, and then the amount of shrinkage (in %) at this time was measured, and the data was output, and the temperature and the amount of shrinkage were recorded, and then the chart was recorded. To read the temperature leaving the 0% baseline due to shrinkage and set the temperature to the heat shrinkage onset temperature. In addition, the "thermosetting temperature" in the present specification refers to a temperature at which the start position of the thermosetting reaction is measured and calculated when the measurement target is a thermosetting resin, and then the temperature is the heat curing temperature.

When the insulating property of the resin substrate 11 is integrated into a backlight of an LED display device, for example, a resin having a volume resistivity capable of imparting insulation required for the LED element substrate 1 is required. In general, the volume resistivity of the resin substrate 11 is preferably 10 ¹⁴ Ω ‧ cm or more, more preferably 10 ¹⁸ Ω ‧ cm or more.

The thickness of the resin substrate 11 is not particularly limited, and is preferably about 10 μm or more and 100 μm or less from the viewpoint of balance between heat resistance, insulation properties, and production cost. Moreover, from the viewpoint of maintaining productivity in the production by roll to roll, it is preferable to be in the above thickness range.

[Adhesive layer]

The bonding of the metal wiring portion 13 to the surface of the LED element substrate 1 is preferably carried out by a dry lamination method via the adhesive layer 12. The adhesive for forming the pressure-sensitive adhesive layer 12 may be any known resin-based adhesive as long as it has heat resistance at the heat curing temperature of the heat-curable ink for forming the insulating protective film 15. Among these resin adhesives, a polyurethane-based, polycarbonate-based or epoxy-based adhesive can be preferably used.

[Metal line department]

As shown in FIG. 1 and FIG. 2, the metal wiring portion 13 is a wiring pattern formed of a conductive substrate on the surface of the LED element substrate 1. The metal line portion 13 has, for example, a function of conducting power by circulating between 1000 or more LED elements 2 and circulating a required current. also, The metal line portion 13 also serves as a heat radiating portion that discharges heat emitted from the LED element 2 to the outside of the LED display device or the like.

The arrangement of the metal line portion 13 is not limited to a specific arrangement as long as it is configured to be able to electrically connect the LED elements. However, in the LED element substrate 1, at least 95% or more of the surface of one of the resin substrates 11 is preferably in the range of 98% or more, and it is necessary to be covered by the metal wiring portion 13. Thereby, it is possible to impart better heat dissipation properties to the LED display device using the LED element substrate 1.

Further, in order to satisfy the above-described requirements for the conduction and the coverage ratio, the metal wiring portion 13 is preferably arranged such that, as shown in Fig. 1, the portion where the LED element 2 is bonded to the metal wiring portion 13 is also the basic unit of the package. , repeated on the matrix in both directions of XY. The basic unit of the structure refers to a basic constituent unit that is a structure. As shown in Fig. 2, the gap between the plurality of rectangular conductive plate portions 131 and the conductive plate portion 131 is The insulating slit portion 132 is formed. Further, the metal wiring portion 13 has a connector line 133 which is mainly connected between the conductive plate portions 131 arranged in different rows. Further, the metal line portion 13 has a terminal 134 at its end portion for performing electrical connection between the LED package module 10 and an external power source or the like. The LED element substrate 1 can be formed by using a single resin film as a substrate. Therefore, the arrangement of the conductive plate portion 13, the connector line 133, and the terminal 134 of the metal wiring portion 13 and the combination thereof are designed to have a degree of freedom in design. Extremely high, and the conductive form of a plurality of LED elements 2 can also be connected in series, in parallel, or the like. The connection of any of the complex combinations and the like is carried out. Thereby, by providing at least two power outlets (electric outlets), it is possible to conduct electricity with an external power source or the like, and it is possible to freely perform wiring in accordance with the requirements of the LED display device in accordance with the final product.

The width of the insulating slit portion (corresponding to the "insulating portion" of the present invention) 132 in the metal wiring portion 13 is preferably a slit shape of 0.1 mm or more and 1.0 mm or less, and more preferably 0.2 mm or more and 0.5 mm or less. Here, the slit shape means a slit shape as a whole, and is not necessarily limited to a simple linear shape (including a curve as a matter of course), and means that the slit shape is also included, for example, as a solder joint portion of the LED. The uneven portion is disposed in a part in plan view. In order to prevent short-circuiting between the conductive plate portions 131, the width of the insulating slit portion 132 is preferably 0.1 mm or more. Moreover, by making the width of the insulating slit portion 132 1.0 mm or less, it is possible to perform better heat transfer between the conductive plate portions 131.

The thermal conductivity λ of the metal constituting the metal wiring portion 13 is preferably 200 W/(m‧K) or more and 500 W/(m ‧ K) or less, more preferably 300 W/(m ‧ K) or more and 500 W/(m ‧ K) below. The specific resistance R of the metal constituting the metal wiring portion 13 is preferably 3.00 × 10 ^-8 Ωm or less, more preferably 2.50 × 10 ^-8 Ωm or less. Here, as the measurement of the thermal conductivity λ, for example, a thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd., and a measurement of the specific resistance R can be used, and for example, a Model 6517B Electrometer manufactured by Keithley Co., Ltd. can be used. According to this, for example, in the case of copper, the thermal conductivity λ is 403 W/(m‧K), and the specific resistance R is 1.55 × 10 ^-8 Ωm. Thereby, heat dissipation and electrical conductivity can be achieved. More specifically, since the heat dissipation property from the LED element is stabilized and the resistance is prevented from increasing, the variation in the light emission between the LEDs can be made small, and the LED can be stably illuminated, and the LED life can be prolonged. Further, it is also possible to prevent deterioration of peripheral members such as a substrate due to heat, and thus it is possible to extend the life of the display device itself, and the display device is equipped with a substrate for an LED element as a backlight.

Further, the surface resistance value of the metal wiring portion 13 is preferably 500 Ω/□ or less, more preferably 300 Ω/□ or less, further preferably 100 Ω/□ or less, and particularly preferably 50 Ω/□ or less. The lower limit is about 0.005 Ω/□ or less. For the measurement of the surface resistance value, a Model 6517B Electrometer manufactured by Keithley Co., Ltd. can be used.

As the metal satisfying the above range, a metal foil such as gold, silver or copper can be exemplified. On the other hand, for example, aluminum is a metal outside the above range. The thickness of the metal line portion 13 is not particularly limited as long as it is appropriately set in accordance with the magnitude of the current resistance required for the LED element substrate 1 and the like, and examples thereof include a thickness of 10 μm to 50 μm. The thickness of the metal wiring portion 13 is preferably 10 μm or more from the viewpoint of improving heat dissipation. In addition, when the thickness of the metal layer cannot satisfy the above lower limit value, the influence of heat shrinkage of the resin substrate 11 is large, and the warpage after the treatment is likely to be large during the solder reflow processing. Therefore, from this viewpoint, the metal The thickness of the line portion 13 is preferably 10 μm or more. On the other hand, when the same thickness is 50 μm or less, sufficient flexibility of the LED element substrate can be maintained, and deterioration in handleability due to an increase in weight can be prevented.

Further, the metal wiring portion 13 is preferably an electrolytic copper foil, and the surface roughness Rz on the layer side of the resin substrate 11 is 1.0 or more and 10.0 or less. Here, Rz is a ten-point average roughness prescribed by Japanese Industrial Standards (JIS) B0601. From the viewpoint of heat dissipation, by setting the surface roughness within the above range, it is possible to particularly increase the surface area on the layer side of the resin substrate 11, and it is possible to further improve heat dissipation. Moreover, since the adhesion to the resin substrate 11 can be improved by the surface unevenness, the heat dissipation can be improved. As the copper foil surface having such a surface roughness Rz, the rough surface side (matte side) of the electrolytic copper foil can be effectively utilized.

[solder layer]

In the LED element substrate 1, the bonding between the metal wiring portion 13 and the LED element 2 is performed via the solder layer 14. The details of the bonding method performed by the solder are generally performed in either of a reflow method or a laser method as described later, and are carried out by any of these methods.

[Insulation Protective Film]

As described above, the insulating protective film 15 mainly serves to improve the migration resistance of the LED element substrate 1 on the other portions of the surface of the metal wiring portion 13 and the resin substrate 11 where electrical bonding is required. , formed by a thermosetting ink.

As the thermosetting ink, a thermosetting ink having a heat curing temperature of about 100 ° C or lower can be suitably and preferably used. Specifically, as a representative example of the ink that can be preferably used, Insulating inks each having a resin as a base resin are exemplified by a polyester resin, an epoxy resin, an epoxy resin, a phenol resin, an epoxy acrylate resin, a fluorene resin, and the like. In addition, among these inks, a material which is an insulating protective film 15 for forming the LED element substrate 1 is particularly preferable as a polyester-based thermosetting insulating ink.

Further, the thermosetting ink for forming the insulating protective film 15 may be, for example, a white ink further containing an inorganic white pigment such as titanium dioxide. By whitening the insulating protective film 15, it is possible to improve the design properties.

In addition, the formation of the insulating protective film 15 by the above-described insulating thermosetting ink can be carried out by a known method such as screen printing.

[reflective layer]

The reflective layer 16 is intended to improve the light-emitting capability of the LED package module 10, and in the present embodiment, it is laminated on the light-emitting surface side of the LED element substrate other than the component of the LED element 2. The outermost surface. The member having a reflecting surface for reflecting the light emission of the LED element and guiding it in a specific direction is not particularly limited, and a white polyester foam type white polyester can be suitably used in accordance with the use of the final product and the required specifications thereof. , white polyethylene resin, silver-deposited polyester, etc.

<Method for Manufacturing LED Element Substrate>

The LED element substrate 1 can be manufactured by one of the conventionally known methods of manufacturing an electronic substrate, that is, an etching step. Also, preferably: corresponding to The material resin is selected, and a heat resistance lifting treatment which is performed by annealing treatment is applied to the resin in advance.

[annealing treatment]

It is not necessary in the present invention, and the annealing treatment may use a heat treatment means known in the past. As an example of the annealing treatment temperature, when the thermoplastic resin for forming the resin substrate 11 is PEN, it is in the range of glass transition temperature to melting point, more specifically, in the range of 160 ° C to 260 ° C, more preferably It is in the range of 180 ° C to 230 ° C. The annealing treatment time can be exemplified by about 10 seconds to 5 minutes. According to such heat treatment conditions, the heat shrinkage temperature onset temperature of PEN, which is generally about 80 ° C, can be raised to about 100 ° C.

[etching step]

A metal wiring portion 13 such as a copper foil which is a material of the metal wiring portion 13 is laminated on the surface of the resin substrate 11 which has been annealed as necessary to obtain a laminate which is a material of the LED element substrate 1. As a lamination method, a method of adhering a metal foil to the surface of the resin substrate 11 by an adhesive; or a plating method or a vapor phase film formation method (sputtering, ion plating, electron beam evaporation) A method of directly depositing the metal wiring portion 13 on the surface of the resin substrate 11 by vacuum vapor deposition, chemical vapor deposition, or the like. From the viewpoint of cost or productivity, a method of adhering a metal foil to the surface of the resin substrate 11 by a polyurethane adhesive is advantageous.

Then, an etching mask is formed on the surface of the metal foil of the laminated body, and the etching mask is patterned into the metal wiring portion 13. The etch mask is provided to make the metal which becomes the metal wiring portion 13 later The portion of the foil that forms the line pattern is free of corrosion due to the etchant. The method of forming the etching mask is not particularly limited. For example, an etching mask can be formed on the surface of the laminated sheet by developing the photoresist or the dry film through the light mask; or by spraying Printing techniques such as inkjet printers are used to form an etch mask on the surface of the laminated sheet.

Then, the metal foil in the place where the etching mask is not covered is removed by the immersion liquid. Thereby, the portion other than the place where the metal line portion 13 is formed in the metal foil is removed.

Finally, an alkaline stripper is used to remove the etch mask. Thereby, the etching mask is removed from the surface of the metal wiring portion 13.

[Insulating protective film and reflective layer forming step]

After the metal wiring portion is formed, the insulating protective film 15 and the reflective layer 16 are further laminated as needed. These laminates can be carried out by a known method. It can be carried out by the following methods depending on the material to be used: a printing method such as screen printing; or various lamination processing methods such as dry lamination and thermal lamination.

<LED Assembly Module>

The LED component 2 can be obtained by directly arranging the LED element 2 on the metal wiring portion 13 of the LED element substrate 1.

The LED element 2 is a light-emitting element that emits light by a pn junction portion joined by a p-type semiconductor and an n-type semiconductor. The following structure has been proposed: a structure in which a p-type semiconductor and an n-type semiconductor are provided on the top surface and the bottom surface of the element; and a structure in which both a p-type semiconductor and an n-type semiconductor are provided on one surface of the element. Any of the LED elements 2 of any structure can be used in the LED package module 10 of the present invention. An LED element having a structure in which both a p-type semiconductor and an n-type semiconductor are provided on one side of the element.

As described above, the LED package module 10 directly mounts the LED element 2 on the metal wiring portion 13 by using a metal having a specific thermal conductivity and resistance value as the substrate 1 for the LED element. It is coated on an area of 95% or more of the substrate to exhibit high heat dissipation. Thereby, the heat generated when the LED element 2 is turned on is rapidly diffused to the entire metal wiring portion 13, and the heat dissipation of the large LED package module 10 is greatly improved.

Preferably, the LED package module 10 is based on the premise that 100 or more LED elements (preferably 1000 or more LED elements 2) are mounted, and is applied to a screen size of 32 吋 or more (preferably 65).吋 Above) display device. In the LED element substrate of the present invention, since the degree of freedom in circuit design is high, the arrangement interval of the LED elements 2 to be mounted can be freely adjusted, and it is possible to cope with a large image display device at a lower cost than in the past. Various required physical properties.

<Manufacturing method of LED package module>

A method of manufacturing the LED package module 10 using the LED element substrate 1 will be described. Bonding of the LED element 2 to the metal wiring portion 13 can be preferably performed by solder processing. The bonding performed by the solder can be performed by a reflow method or a laser method. The reflow method is a method in which the LED element 2 is mounted on the metal wiring portion 13 with solder interposed therebetween, and then the LED element substrate 1 is transported into the reflow furnace, and the metal wiring portion 13 is sprayed in the reflow furnace. Blowing hot air at a specific temperature, thereby making the solder The paste is melted to solder the LED element 2 to the metal wiring portion 13. Further, the laser method refers to a method of locally heating the solder by laser to solder the LED element 2 to the metal wiring portion 13.

When solder bonding of the LED element 2 to the metal wiring portion 13 is performed, it is preferable to perform solder reflow by performing laser irradiation from the back side of the resin substrate 11. Thereby, it is possible to more reliably suppress the organic component of the ignition solder due to heating and the damage of the substrate accompanying this.

<LED display device>

Fig. 6 is a view schematically showing an outline of a layer configuration of the LED display device 100 obtained by using the LED package module 10. The LED display device 100 displays information (image) such as characters or images on the display 3 by driving (light-emitting) a plurality of LED elements 2 arranged in a matrix at a predetermined interval. The LED element 2 is mounted on the metal line portion 13 of the LED element substrate 1. Further, it is further preferred that the heat dissipation structure 4 is provided on the back side of the resin substrate 11 for further efficiently radiating heat radiated from the LED package module 10 to the outside. By using the LED module 10 of the present invention, it is possible to manufacture a large-sized LED display device having a screen size (diagonal length) of 65 Å or more in a manner that is lower in cost than in the past and improves the stability of quality. .

According to the LED element substrate, the LED package module, and the like of the present invention described above, the LED display device using the above can exhibit the following effects.

(1) The substrate for an LED element is covered with a metal line portion on a surface of a majority or more (95% or more) of a specific ratio of the resin substrate, and the thermal conductivity and specific resistance R of the metal constituting the metal wiring portion are further increased. , optimized to a specific range. Thereby, the heat dissipation required in the large-sized LED display device can be remarkably improved. Specific examples of the substrate for an LED element include a substrate for an LED element in which the coverage ratio is 95% on a PEN film having a thickness of 30 μm and having an annealing thickness of 30 μm. A metal wiring portion is formed which is formed of a copper foil by setting the width of the insulating slit portion between the adjacent conductive plate portions to 1.0 mm. On the LED element substrate, eight LED elements were mounted in the X direction, and 20 LED elements were mounted in the Y direction, and an LED package module in which a total of 160 LED elements were mounted was used to confirm the LED structure. The heat dissipation property of the module is significantly improved as compared with the case where the insulating slit portion in the Y direction for ensuring conduction is expanded to 2.0 mm, and the above-described coverage ratio is set to 90%, and specifications other than these are set. It is formed in exactly the same manner as described above.

(2) The resin substrate of the LED element substrate is composed of a large single resin film, and a part of the surface of the resin substrate is covered with a metal line portion. Thereby, the productivity of the LED package module constituting the large-sized LED display device can be remarkably improved, and the heat dissipation required in the large-sized LED display device can be remarkably improved.

Specific examples of such a substrate for an LED element include the following substrate for an LED element: an exposed portion having a size of 330 mm × 560 mm On the PEN film having a thickness of 50 μm, the metal line portion is formed so that the width of the insulating slit portion between the adjacent conductive plate portions is 1.0 mm, and the coverage ratio is 95%. Made of copper foil. On the LED element substrate, eight LED elements were mounted in the X direction, and 20 LED elements were mounted in the Y direction, and an LED package module in which a total of 160 LED elements were mounted was used to confirm the LED structure. The heat dissipation property of the module is significantly improved as compared with the case where the insulating slit portion in the Y direction for ensuring conduction is expanded to 2.0 mm, and the above-described coverage ratio is set to 90%, and specifications other than these are set. It is formed in exactly the same manner as described above.

(3) The metal wiring portion is a metal wiring portion made of copper. Thereby, the heat dissipation improving effect of the LED element substrate can be further stably exhibited.

(4) The average thickness of the metal wiring portion is set to 5 μm or more and 50 μm or less. Thereby, it is possible to maintain sufficient flexibility of the substrate for an LED element while enjoying the effect of improving heat dissipation.

(5) The insulating portion formed on the metal wiring portion is formed into a slit-shaped insulating portion having a width of 0.1 mm or less and 1.0 mm or more. Thereby, it is possible to prevent short-circuiting between the conductive plate portions, and it is also possible to perform better heat transfer between the conductive plate portions. As a specific example of preferable heat transfer, for example, when localized heat generation occurs in a large-sized LED backlight of a region dimming method (fine area control of LED light-emitting luminance), heat is relatively high-temperature. The portion of the conductive plate portion 131 moves toward the conductive portion 131 in a relatively low temperature state. borrow As a result, the local high temperature in the LED backlight is dissipated to the entire substrate for the LED element, and it is possible to prevent degradation or malfunction of the performance of each LED element due to a local temperature rise.

(6) The metal wiring portion is formed by an electrolytic copper foil having a surface roughness Rz on the layer side of the resin substrate of 1.0 or more and 10.0 or less. Thereby, the surface area on the layer side of the resin substrate can be increased, and heat dissipation can be further improved. Further, since the surface unevenness can improve the adhesion to the resin substrate, the heat dissipation can be improved.

(7) The resin film for forming the resin substrate is polyethylene naphthalate which has been subjected to heat resistance enhancement treatment and has a heat shrinkage initiation temperature of 100 ° C or higher. Therefore, compared with the general case of the polyimide resin (PI) which is excellent in dimensional stability, mechanical strength, and durability when heat resistance and heating are used, it is possible to maintain the performance of the substrate for an LED element while maintaining the performance of the substrate for the LED element. Reduce the cost.

(8) An LED package module in which at least 100 or more LED elements are mounted on a substrate for an LED element. Thereby, since the LED display device can be configured by the single LED element substrate, the productivity and quality stability of the LED display device can be remarkably improved.

(9) An LED package module in which at least 1000 or more LED elements are mounted on a substrate for an LED element. Thereby, the large-sized LED display device can be configured by the single LED element substrate, so that the productivity and quality stability of the LED display device can be achieved. Significantly, the large LED display device was previously only formed by joining a plurality of LED package modules.

(10) An LED display device in which an LED module of the present invention having a screen size of 65 Å or more and a display screen are laminated. Thereby, a large-sized LED display device having a screen size of 65 Å or more can be provided with high productivity, and the LED display device has excellent quality stability.

(11) An LED display device comprising the LED package module of the present invention as a backlight. Compared with the edge-lit display device, the backlight display device needs to have a plurality of LEDs disposed on the substrate. Therefore, the amount of heat generated from the LED elements increases, which may cause a decrease in the light-emitting capability of the LED elements, or may result in The situation of increased power consumption. In addition, the peripheral member such as the substrate is expanded by heat dissipation, and the ON/OFF is further repeated, which causes the peripheral member to deteriorate due to warpage or cracking. By using the LED module of the present invention as a backlight, it is possible to suppress the power consumption of each LED element and reduce the variation in luminance of the light by utilizing its high heat dissipation and low resistance. Moreover, it is also possible to prevent deterioration of peripheral members such as a substrate due to heat, and to extend product life.

As described above, according to the present invention, it is possible to provide a substrate for an LED element, an LED module, and an LED display device with higher productivity and quality stability than in the past, and these are excellent in heat dissipation and productivity.

1‧‧‧Battery for LED components

11‧‧‧Resin substrate

13‧‧‧Metal Lines Department

131‧‧‧conductive plate

133‧‧‧Connector line

134‧‧‧ terminals

Claims (11)

A substrate for an LED element, comprising: a resin substrate comprising a flexible resin film; and a metal wiring portion laminated on the resin substrate and used to bridge between the two electrodes of the LED element The insulating portion is formed, and the thermal conductivity λ of the metal constituting the metal wiring portion is 300 W/(m‧K) or more and 500 W/(m ‧ K) or less, and the resistivity of the metal constituting the metal wiring portion R is 2.50 × 10 ^-8 Ωm or less, and the metal wiring portion covers a range of 95% or more of the surface of one of the resin substrates. A substrate for an LED element, comprising: a resin substrate having a diagonal length of at least 65 Å and comprising a flexible single resin film; and a metal wiring portion laminated on the resin substrate And forming an insulating portion between the two electrodes of the LED element, wherein the metal line portion is formed to be capable of electrically connecting 1000 or more LED elements arranged in a matrix, and The metal line portion covers a range of 95% or more of the surface of one of the resin substrates. The substrate for LED elements according to claim 1 or 2, wherein the metal wiring portion is made of copper. The element substrate for LED according to claim 1 or 2, wherein the metal line portion has an average thickness of 5 μm or more and 50 μm or less. The element substrate for LED according to claim 1 or 2, wherein the insulating portion is formed in a slit shape having a width of 0.1 mm or more and 1.0 mm or less. The element substrate for an LED according to claim 1 or 2, wherein the metal line portion is an electrolytic copper foil, and a surface roughness Rz on the layer side of the resin substrate is 1.0 or more and 10.0 or less. The element substrate for LED according to claim 1 or 2, wherein the resin film for forming the resin substrate is polyethylene naphthalate, and the heat shrinkage initiation temperature of the polyethylene naphthalate is Above 100 °C. An LED component module in which at least 100 or more LED elements are mounted on a substrate for an LED element according to any one of claims 1 to 7. An LED package module in which at least 1000 or more LED elements are mounted on a substrate for an LED element according to any one of claims 1 to 7. An LED display device comprising the LED package module according to claim 8 or 9 and a display area layer for display. An LED display device having the request item 8 The LED component module of claim 9 or 9 is used as a backlight.