TWI616123B - Method for manufacturing heat dissipation laminated material for mounted substrate - Google Patents
Method for manufacturing heat dissipation laminated material for mounted substrate Download PDFInfo
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- TWI616123B TWI616123B TW101125274A TW101125274A TWI616123B TW I616123 B TWI616123 B TW I616123B TW 101125274 A TW101125274 A TW 101125274A TW 101125274 A TW101125274 A TW 101125274A TW I616123 B TWI616123 B TW I616123B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- Insulated Metal Substrates For Printed Circuits (AREA)
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Abstract
本發明係提供能因應電子機器的輕量化、小型化及薄型化,且即便安裝較大發熱量的電子元件,仍可將由該電子元件所產生熱更有效率散逸的安裝基板用放熱積層材之製造方法。在樹脂薄膜(10)之一側的表面上固接銅層(20),藉由對銅層(20)施行選擇性蝕刻而形成電路圖案層(21),在形成電路圖案層(21)之後,於與樹脂薄膜(10)之一側的表面為相反側的表面上,固接鋁箔(30)。 The present invention provides an exothermic laminate for mounting substrates that can respond to the weight reduction, miniaturization, and thickness reduction of electronic equipment and can mount heat generated by the electronic component more efficiently even if an electronic component with a large amount of heat is installed. method. A copper layer (20) is fixed on a surface of one side of the resin film (10), and a circuit pattern layer (21) is formed by selective etching of the copper layer (20). After the circuit pattern layer (21) is formed An aluminum foil (30) is fixed on a surface opposite to a surface on one side of the resin film (10).
Description
本發明係關於一般的安裝基板用放熱積層材之製造方法,特定而言,係關於用於安裝較大發熱量之電子元件的安裝基板用放熱積層材之製造方法,例如用於安裝發光二極體(LED)等發光元件的安裝基板用放熱積層材之製造方法。 The present invention relates to a method for manufacturing a general exothermic laminate for mounting substrates, and in particular, it relates to a method for producing an exothermic laminate for mounting substrates for mounting electronic components with large heat generation, for example, for mounting light emitting diodes A method for producing an exothermic laminate for mounting substrates of light emitting elements such as (LED).
在絕緣層的單面或雙面上已形成電路的安裝基板被利用於廣泛領域。電路係由銅、鋁的箔、或糊膏組成物所形成。在所形成之電路上安裝電子元件。所安裝的電子元件可舉例如:電阻元件、電容器、電晶體、各種功率元件;MPU、CPU等高密度積體電路;發光二極體(LED)、雷射二極體等發光元件及該等的陣列元件。 Mounting substrates having circuits formed on one or both sides of the insulating layer are used in a wide range of fields. The circuit is formed of a copper or aluminum foil or a paste composition. Electronic components are mounted on the formed circuit. The electronic components to be installed include, for example: resistance elements, capacitors, transistors, various power elements; high-density integrated circuits such as MPU, CPU; light-emitting elements such as light-emitting diodes (LEDs) and laser diodes; Array elements.
近年,對電子機器所要求的性能越益提高,上述電子元件中,功率元件、高密度積體電路的消耗電力亦有增加的傾向。又,於發光元件更進一步開發了高輝度物。然而,隨著功率元件、高密度積體電路的消耗電力增加、或發光元件的輝度提升而造成的發熱量增加,會對發熱的電子元件本身及其他電子元件造成不良影響。例如發熱的電子元件本身或其他電子元件會有因熱而出現錯誤作動、因熱而造成性能降低、因熱而縮短壽命等情形。所以,提案了用於將電子元件所產生的熱效率佳地去除、散逸之構造。 In recent years, the performance required for electronic devices has been increasing, and among the above-mentioned electronic components, power consumption of power components and high-density integrated circuits also tends to increase. Furthermore, high-brightness objects have been developed for light-emitting devices. However, with the increase in power consumption of power elements and high-density integrated circuits, or the increase in heat generation caused by the increase in brightness of light-emitting elements, the heat-generating electronic components themselves and other electronic components will be adversely affected. For example, heat-generating electronic components or other electronic components may malfunction due to heat, decrease performance due to heat, or shorten life due to heat. Therefore, a structure has been proposed for removing and dissipating the heat generated by the electronic component with high efficiency.
另一方面,近年行動電話、數位相機、音樂播放器、語音錄音機、遊戲機等行動式電子機器,除了要求輕量化與小型化之外,尚要求薄型化。若能將用於安裝電子元件的安裝基板直接積層於攜帶式電子機器的支撐體或框體上,則對薄型化便具有效果。即,對安裝基板要求彎曲性。 On the other hand, in recent years, mobile electronic devices such as mobile phones, digital cameras, music players, voice recorders, and game consoles require thinness and thinness in addition to weight reduction and miniaturization. If a mounting substrate for mounting an electronic component can be directly laminated on a support or a frame of a portable electronic device, it will be effective in reducing the thickness. That is, the mounting substrate is required to be flexible.
再者,液晶電視機等薄型電視機中,近年有更加大型化的傾向。然而,在對於薄型電視機期待畫面大型化的同時,亦希望使電視機本體盡可能地輕量化及薄型化。為求薄型化與降低消耗電力,開始使用LED作為液晶背光裝置的光源。LED係直接安裝於絕緣基板上。為了因應此種技術傾向,從LED所產生的熱必須散逸於與經由安裝基板用積層材而安裝有LED之面的相反側之面。特別係側光式液晶背光裝置因為在構造上係每單位面積安裝有多數LED,因而要求較安裝基板用積層材更高的放熱性。 Furthermore, thin TVs such as LCD TVs have tended to become larger in recent years. However, while expecting a larger screen for a thin TV, it is also desirable to reduce the weight and thickness of the TV body as much as possible. In order to reduce thickness and reduce power consumption, LEDs have been used as light sources for liquid crystal backlight devices. The LED is directly mounted on an insulating substrate. In order to cope with such a technical tendency, it is necessary to dissipate heat generated from the LED to a surface opposite to the surface on which the LED is mounted via the laminate for mounting substrates. In particular, an edge-lit liquid crystal backlight device has a structure in which a large number of LEDs are mounted per unit area, and therefore requires higher heat dissipation than a laminated material for mounting a substrate.
此處,例如日本專利特開2010-98246號公報(專利文獻1)揭示有作為能將由LED等電子零件所產生的熱效率佳地釋放出,薄型、輕量優異,且可利用塑性加工作成所需之立體構造的金屬基板,係使在不銹鋼箔單面上所形成之以銅為主成分的層,經由絕緣層接著於電路形成用銅箔上。 Here, for example, Japanese Patent Application Laid-Open No. 2010-98246 (Patent Document 1) discloses that it can release heat generated by electronic components such as LEDs with high efficiency, is thin and lightweight, and can use plastic addition to work. The three-dimensionally structured metal substrate is a copper-based layer formed on one surface of a stainless steel foil, and is then bonded to a copper foil for circuit formation through an insulating layer.
但是,在如上述的金屬基板之安裝面上形成電路的方法, 一般採用如專利文獻1所記載般,對銅箔施行選擇性蝕刻的方法。此情況,係在金屬箔(專利文獻1中係不銹鋼箔)上貼合銅箔之後再對銅箔施行選擇性蝕刻。 However, the method of forming a circuit on the mounting surface of a metal substrate as described above, Generally, as described in Patent Document 1, a method of selectively etching a copper foil is used. In this case, a copper foil is bonded to a metal foil (a stainless steel foil in Patent Document 1), and then the copper foil is subjected to selective etching.
然而,在與安裝面側為相反側之金屬箔的強度較低、厚度較薄時,在安裝面上所形成之電路的凹凸被押入於與安裝面側為相反側之金屬箔側,並轉印於金屬箔表面上而導致浮出凹凸、平滑性降低。又,若將已出現凹凸的金屬箔之面黏貼於攜帶式電子機器的支撐體或框體上使用,則有發生空隙而熱導率降低的問題。 However, when the strength and thickness of the metal foil on the opposite side from the mounting surface side are low, the unevenness of the circuit formed on the mounting surface is pushed into the metal foil side on the opposite side from the mounting surface side, and the Printed on the surface of metal foil, causing unevenness and smoothness. In addition, if the surface of the metal foil on which the unevenness has been formed is adhered to a support or a frame of a portable electronic device and used, there is a problem that voids occur and the thermal conductivity decreases.
緣是,本發明目的在於提供一種因應電子機器的輕量化、小型化及薄型化,且即便安裝較大發熱量的電子元件,仍可將由該電子元件所產生熱更有效率地散逸的安裝基板用放熱積層材之製造方法。 The reason is that the object of the present invention is to provide a mounting substrate that can more efficiently dissipate the heat generated by the electronic component even if an electronic component with a large amount of heat is mounted in response to the reduction in weight, size, and thickness of the electronic device. Manufacturing method of exothermic laminated material.
本發明的安裝基板用放熱積層材之製造方法,係具備有以下的步驟:(A)在絕緣性薄膜之一側的表面上固接導電層的步驟;(B)藉由對導電層施行選擇性蝕刻而形成電路圖案層的步驟;以及(C)在形成電路圖案層之後,在與絕緣性薄膜之一側的表面為相反側的表面上,固接鋁箔的步驟。 The method for manufacturing an exothermic laminate for mounting substrates of the present invention includes the following steps: (A) a step of fixing a conductive layer to a surface on one side of an insulating film; (B) selecting the conductive layer (C) a step of forming a circuit pattern layer by means of an etching process; and (C) a step of fixing an aluminum foil to a surface on the side opposite to a surface on one side of the insulating film after the circuit pattern layer is formed.
本發明之安裝基板用放熱積層材之製造方法中,鋁箔係含 有:錳0.5質量%以上且3.0質量%以下、鉻0.0001質量%以上且未滿0.2質量%、鎂0.2質量%以上且1.8質量%以下、鈦0.0001質量%以上且0.6質量%以下、銅超過0質量%且0.005質量%以下、矽超過0質量%且0.1質量%以下、鐵超過0質量%且0.2質量%以下,其餘係由鋁與不可避免的雜質構成。 In the manufacturing method of the exothermic laminated material for mounting substrate of the present invention, the aluminum foil contains Available: 0.5% by mass to 3.0% by mass of manganese, 0.0001% by mass to 0.2% by mass of chromium, 0.2% by mass to 1.8% by mass of magnesium, 0.0001% by mass to 0.6% by mass of titanium, and more than 0 by copper Mass% to 0.005 mass%, silicon exceeds 0 mass% to 0.1 mass%, iron exceeds 0 mass% to 0.2 mass%, and the rest is composed of aluminum and unavoidable impurities.
再者,本發明之安裝基板用放熱積層材之製造方法中,絕緣性薄膜較佳係含有從聚醯亞胺、聚萘二甲酸乙二酯、聚對苯二甲酸乙二酯及聚四氟乙烯所構成群組中選擇之1種。 Furthermore, in the method for manufacturing an exothermic laminate for mounting substrates of the present invention, the insulating film preferably contains polyimide, polyethylene naphthalate, polyethylene terephthalate, and polytetrafluoro One of the groups selected by ethylene.
因為依照本發明所製造的安裝基板用放熱積層材,係具備有輕量性、放熱性(熱導性)及彎曲性均優異的鋁箔,因而可因應電子機器的輕量化、小型化及薄型化。又,根據本發明,在形成電路圖案層後,於與絕緣性薄膜之一側的表面為相反側的表面上,固接既定強度與硬度的鋁箔,因而鋁箔表面不致發生凹凸。藉此,即便將依本發明所製造的安裝基板用放熱積層材黏貼於攜帶式電子機器的支撐體或框體使用,仍不致有發生空隙而熱導率降低的情況。所以,可製造即便安裝較大發熱量的電子元件,仍能將該電子元件所產生熱有效率散逸的安裝基板用放熱積層材。 Since the exothermic laminate for mounting substrates manufactured in accordance with the present invention is provided with aluminum foil which is excellent in lightness, heat release (thermal conductivity), and bendability, it can respond to the weight reduction, miniaturization, and thickness reduction of electronic equipment. . Furthermore, according to the present invention, after the circuit pattern layer is formed, an aluminum foil having a predetermined strength and hardness is fixed to a surface on the side opposite to the surface on one side of the insulating film, so that the aluminum foil surface does not have unevenness. Thereby, even if the exothermic laminated material for a mounting substrate manufactured according to the present invention is adhered to a support or a frame of a portable electronic device and used, there is no possibility that voids occur and the thermal conductivity is reduced. Therefore, even if an electronic component having a large amount of heat is mounted, a heat-generating laminate for a mounting substrate capable of efficiently dissipating heat generated by the electronic component can be manufactured.
以下,針對本發明一實施形態,根據圖式進行說明。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
首先,如圖1所示,在絕緣性薄膜一例的樹脂薄膜10之一側之表面上,介存接著劑層(未圖示)使導電層一例的銅層20固接。 First, as shown in FIG. 1, an adhesive layer (not shown) is interposed on a surface on one side of a resin film 10 as an example of an insulating film, and a copper layer 20 as an example of a conductive layer is fixedly bonded.
其次,藉由對銅層20施行選擇性蝕刻,如圖2所示般形成電路圖案層21。 Next, by selectively etching the copper layer 20, a circuit pattern layer 21 is formed as shown in FIG. 2.
然後,形成電路圖案層21後,在與樹脂薄膜10之一側的表面為相反側的表面上,介存接著劑層(未圖示)而固接鋁箔30。 Then, after the circuit pattern layer 21 is formed, an adhesive layer (not shown) is interposed on the surface opposite to the surface on one side of the resin film 10 to fix the aluminum foil 30.
此處,鋁箔30係含有:錳0.5質量%以上且3.0質量%以下、鉻0.0001質量%以上且未滿0.2質量%、鎂0.2質量%以上且1.8質量%以下、鈦0.0001質量%以上且0.6質量%以下、銅超過0質量%且0.005質量%以下、矽超過0質量%且0.1質量%以下、鐵超過0質量%且0.2質量%以下,其餘則由鋁與不可避免的雜質構成。該鋁箔30係藉由含有上述組成,而呈現高強度與高硬度,例如170Hv的硬度。 Here, the aluminum foil 30 contains: 0.5 mass% to 3.0 mass% of manganese, 0.0001 mass% to 0.2 mass% of chromium, 0.2 mass% to 1.8 mass% of magnesium, 0.0001 mass% to 0.6 mass of titanium % Or less, copper exceeding 0% by mass and 0.005% by mass or less, silicon exceeding 0% by mass and 0.1% by mass, iron exceeding 0% by mass and 0.2% by mass, and the remainder being composed of aluminum and unavoidable impurities. The aluminum foil 30 has a high strength and a high hardness by containing the above composition, for example, a hardness of 170 Hv.
如上述所製造的本發明安裝基板用放熱積層材,因為具備有輕量性、放熱性(熱導性)及彎曲性均優異的鋁箔30,因而能因應電子機器的輕量化、小型化及薄型化。又,在形成電路圖案層21之後,因為在與樹脂薄膜10之一側的表面為相反側的表面上,固接著具有既定強度與硬度的鋁箔30,因而鋁箔30的表面不產生凹凸。藉此,即便將由本發明所製造的安裝基板用放熱積層材黏貼於攜帶式電子機器的支撐 體或框體上,仍不致有發生空隙而熱導率降低的情形。所以,可製造即便安裝較大發熱量的電子元件,仍能將由該電子元件所產生熱更有效率散逸的安裝基板用放熱積層材。 Since the exothermic laminated material for a mounting substrate of the present invention manufactured as described above is provided with the aluminum foil 30 which is excellent in lightness, heat release (thermal conductivity), and bendability, it can respond to weight reduction, miniaturization, and thinness of an electronic device. Into. In addition, after the circuit pattern layer 21 is formed, an aluminum foil 30 having a predetermined strength and hardness is adhered to a surface opposite to the surface on one side of the resin film 10, so that the aluminum foil 30 has no unevenness on the surface. Thereby, even if the exothermic laminated material for a mounting substrate manufactured by the present invention is adhered to the support of a portable electronic device On the body or the frame, there is still no case where voids occur and the thermal conductivity decreases. Therefore, even if an electronic component having a large amount of heat is mounted, a heat-generating laminate for a mounting substrate that can more efficiently dissipate heat generated by the electronic component can be manufactured.
樹脂薄膜10係為了承受以約250℃焊錫進行之電子元件安裝,較佳係其玻璃轉移溫度(Tg)為250℃以上。又,樹脂薄膜10係為了擔保絕緣性,較佳係絕緣破壞電壓為5kV以上。又,樹脂薄膜10較佳係幾乎沒有熱收縮,即熱收縮率在0.1%以下。 The resin film 10 is intended to withstand the mounting of electronic components with solder at about 250 ° C, and preferably has a glass transition temperature (Tg) of 250 ° C or higher. In order to ensure the insulation, the resin film 10 preferably has a dielectric breakdown voltage of 5 kV or more. The resin film 10 preferably has almost no heat shrinkage, that is, the heat shrinkage rate is 0.1% or less.
樹脂薄膜10較佳係由含有聚醯亞胺、聚萘二甲酸乙二酯、聚對苯二甲酸乙二酯的薄膜形成,樹脂薄膜10的材料更佳係使用聚醯亞胺薄膜。 The resin film 10 is preferably formed of a film containing polyimide, polyethylene naphthalate, and polyethylene terephthalate. The material of the resin film 10 is more preferably a polyimide film.
樹脂薄膜10的厚度係為了發揮安定的絕緣性與放熱性,較佳係10μm以上且100μm以下、更佳係10~50μm。若樹脂薄膜10的厚度未滿10μm,便無法獲得安定的絕緣性效果。若樹脂薄膜10的厚度超過100μm,則成為放熱性降低的原因。 The thickness of the resin film 10 is 10 μm or more and 100 μm or less, and more preferably 10 to 50 μm in order to exhibit stable insulation and heat release properties. If the thickness of the resin film 10 is less than 10 μm, a stable insulating effect cannot be obtained. When the thickness of the resin film 10 exceeds 100 micrometers, it will become a cause of a decrease in heat radiation.
銅層20係為了利用蝕刻等形成電路(其係用於對安裝基板用放熱積層材上所安裝之電子元件施行佈線)而設置。雖可藉由在作為樹脂薄膜10的聚醯亞胺樹脂層上,利用蒸鍍形成作為銅層20的銅膜而構成,但較佳係在樹脂薄膜10 上介設接著劑層再積層作為銅層20的電解銅箔而構成。 The copper layer 20 is provided in order to form a circuit by etching etc. (it is used for wiring the electronic component mounted on the exothermic laminated material for mounting substrates). Although it can be formed by forming a copper film as the copper layer 20 on the polyimide resin layer as the resin film 10 by vapor deposition, it is preferable that the copper film is formed on the resin film 10 An electrolytic copper foil as the copper layer 20 is formed by interposing an adhesive layer and an additional layer thereon.
銅層20的厚度係為了利用蝕刻容易地形成電路、並在樹脂薄膜10上呈密接積層狀態,較佳係5μm以上且100μm以下、更佳係10~70μm。若銅層20的厚度未滿5μm,便難以順利(不出現起皺等)地密接積層於樹脂薄膜10上。若銅層20的厚度超過100μm,便難以利用蝕刻精密地施行電路形成。 The thickness of the copper layer 20 is in order to easily form a circuit by etching and to be in a close-packed state on the resin film 10, and is preferably 5 μm or more and 100 μm or less, and more preferably 10 to 70 μm. If the thickness of the copper layer 20 is less than 5 μm, it will be difficult to smoothly laminate the resin film 10 (without wrinkles or the like). When the thickness of the copper layer 20 exceeds 100 μm, it is difficult to precisely perform circuit formation by etching.
鋁箔30係為了將從安裝基板用放熱積層材的電路圖案層21上所安裝之電子元件產生的熱,予以散逸而設置。亦可依使鋁箔30的下面(與固接樹脂薄膜10之側的面為相反側的面)沿電子機器的支撐體或框體進行積層而固接方式,配置安裝基板用放熱積層材。 The aluminum foil 30 is provided in order to dissipate heat generated from the electronic components mounted on the circuit pattern layer 21 of the heat-dissipating laminated material for mounting substrates. An exothermic laminated material for mounting a substrate may be disposed by laminating and fixing the lower surface of the aluminum foil 30 (the surface opposite to the side on which the resin film 10 is fixed) along the support or frame of the electronic device.
鋁箔30較佳係由高熱導率之鋁材形成。將安裝基板用放熱積層材沿電子機器的支撐體或框體進行積層時,因為要求彎曲性良好,因而鋁箔30較佳係使用經適當調質的鋁材。 The aluminum foil 30 is preferably formed of an aluminum material having a high thermal conductivity. When the exothermic laminated material for mounting substrates is laminated along the support or frame of the electronic device, it is required to have good bendability. Therefore, the aluminum foil 30 is preferably an appropriately tempered aluminum material.
鋁箔30的厚度係為了有助於電子機器的輕量性、小型化、及薄型化,且使加工較為容易、能發揮安定放熱性,較佳係20μm以上且350μm以下、更佳係80μm以上且300μm以下、特佳係100μm以上且250μm以下。若鋁箔30的厚度未滿20μm,無法獲得安定的放熱性效果。若鋁箔30的厚度超過350μm,除了加工困難之外,亦妨礙輕量、小型、薄 型化。 The thickness of the aluminum foil 30 is in order to contribute to the lightness, miniaturization, and thickness reduction of the electronic device, and to facilitate processing and to exhibit stable heat radiation. It is preferably 20 μm or more and 350 μm or less, more preferably 80 μm or more and 300 μm or less, particularly preferably 100 μm or more and 250 μm or less. When the thickness of the aluminum foil 30 is less than 20 μm, a stable heat releasing effect cannot be obtained. If the thickness of the aluminum foil 30 exceeds 350 μm, in addition to processing difficulties, it also hinders light weight, small size, and thinness. Type.
接著劑層係為了擔保耐熱性,較佳係由通用環氧系接著劑形成。導電性填料雖提高放熱性,但使絕緣性降低,因而不使接著劑層中含有導電性填料。 In order to ensure heat resistance, the adhesive layer is preferably formed of a general-purpose epoxy-based adhesive. Although the conductive filler improves the heat release property, it reduces the insulating property, and therefore does not contain the conductive filler in the adhesive layer.
接著劑層的厚度係為了發揮良好密接性、不妨礙放熱,較佳係3μm以上且30μm以下。若接著劑層的厚度未滿3μm,容易引發密接不足、密接不均,導致成為放熱性降低的原因。若接著劑層的厚度超過30μm,鋁箔30與樹脂薄膜10間之積層、樹脂薄膜10與銅層20間之積層較為困難,因而成為放熱性降低的原因。 The thickness of the adhesive layer is preferably 3 μm or more and 30 μm or less in order to exhibit good adhesion and not prevent heat release. If the thickness of the adhesive layer is less than 3 μm, insufficient adhesion and uneven adhesion are likely to be caused, which may cause a decrease in heat release property. If the thickness of the adhesive layer exceeds 30 μm, the laminate between the aluminum foil 30 and the resin film 10 and the laminate between the resin film 10 and the copper layer 20 are difficult, and thus cause a decrease in heat release.
其次,針對本發明實施例進行具體說明。另外,以下所示實施例僅止於例示而已,本發明並不侷限於下述實施例。 Next, the embodiments of the present invention will be specifically described. It should be noted that the embodiments shown below are for illustration only, and the present invention is not limited to the following embodiments.
依照圖1~圖3所示步驟,製作安裝基板用放熱積層材之實施例的試料。又,為求比較,使用較本發明所用鋁箔更低硬度的鋁箔,依照圖1~圖3所示步驟,製作安裝基板用放熱積層材之比較例1的試料。又,依照圖4~圖5所示步驟,製作安裝基板用放熱積層材之比較例2的試料。 According to the steps shown in FIG. 1 to FIG. 3, a sample of an example of an exothermic laminate for mounting a substrate is prepared. In addition, for comparison, a sample of Comparative Example 1 of an exothermic laminated material for mounting a substrate was prepared by using an aluminum foil having a lower hardness than the aluminum foil used in the present invention and following the steps shown in FIGS. 1 to 3. In addition, according to the steps shown in FIGS. 4 to 5, a sample of Comparative Example 2 of an exothermic laminate for mounting substrates was prepared.
如圖1所示,樹脂薄膜10係使用厚度25μm的聚醯亞胺薄膜,在該薄膜的單面上介設環氧系接著劑,再依乾式積層 法接著作為銅層20的厚度35μm電解銅箔。接著劑層的厚度係15μm。 As shown in FIG. 1, a resin film 10 is a polyimide film having a thickness of 25 μm, and an epoxy-based adhesive is interposed on one side of the film, and then laminated in a dry manner. The method is a 35 μm thick electrolytic copper foil of the copper layer 20. The thickness of the adhesive layer was 15 μm.
其次,如圖2所示,使用光學微影法對銅層20施行選擇性蝕刻,而形成具有任意電路形狀的電路圖案層21。 Next, as shown in FIG. 2, the copper layer 20 is selectively etched by using an optical lithography method to form a circuit pattern layer 21 having an arbitrary circuit shape.
然後,如圖3所示,在樹脂薄膜10的另一側之面上,介設環氧系接著劑,並利用乾式積層法接著由含有:錳0.5質量%以上且3.0質量%以下、鉻0.0001質量%以上且未滿0.2質量%、鎂0.2質量%以上且1.8質量%以下、鈦0.0001質量%以上且0.6質量%以下、銅超過0質量%且0.005質量%以下、矽超過0質量%且0.1質量%以下、鐵超過0質量%且0.2質量%以下,其餘則由鋁與不可避免的雜質構成,厚度100μm的鋁箔30(硬度170Hv)。接著劑層的厚度係15μm。 Then, as shown in FIG. 3, an epoxy-based adhesive is interposed on the other surface of the resin film 10, and then, by using a dry lamination method, the content is 0.5% by mass to 3.0% by mass of manganese, and 0.0001 of chromium. Mass% or more and less than 0.2% by mass, magnesium 0.2% or more and 1.8% by mass, titanium 0.0001% or more and 0.6% by mass or less, copper exceeding 0% by mass and 0.005% by mass or less, silicon exceeding 0% by mass and 0.1 Mass% or less, iron exceeding 0% by mass and 0.2% by mass or less, and the rest consisting of aluminum and unavoidable impurities, aluminum foil 30 (hardness: 170 Hv) with a thickness of 100 μm. The thickness of the adhesive layer was 15 μm.
除了取代實施例所使用之厚度100μm的鋁箔30,改為使用厚度150μm的鋁箔(材質1N30、H、硬度:50Hv)之外,其餘均與實施例同樣地依照圖1~圖3所示步驟製作安裝基板用放熱積層材。 Except that instead of the aluminum foil 30 with a thickness of 100 μm used in the embodiment, the aluminum foil with a thickness of 150 μm (material 1N30, H, hardness: 50 Hv) was used. Exothermic laminate for mounting substrates.
如圖4所示,樹脂薄膜10係使用厚度25μm的聚醯亞胺薄膜,在該薄膜的單面上介設環氧系接著劑,再依乾式積層法接著作為銅層20的厚度35μm電解銅箔。接著劑層的厚度係15μm。又,在樹脂薄膜10另一側的面上介設環氧系接 著劑,並利用乾式積層法接著厚度150μm的鋁箔(材質:1N30、H、硬度:50Hv)。 As shown in FIG. 4, the resin film 10 is a polyimide film having a thickness of 25 μm. An epoxy-based adhesive is interposed on one side of the film, and then a copper layer 20 having a thickness of 35 μm is prepared by dry lamination. Foil. The thickness of the adhesive layer was 15 μm. An epoxy-based connection is provided on the other surface of the resin film 10 The adhesive is applied, and an aluminum foil (material: 1N30, H, hardness: 50 Hv) with a thickness of 150 μm is adhered by a dry lamination method.
其次,如圖5所示,藉由使用光學微影法對銅層20施行選擇性蝕刻,而與實施例同樣地形成具有任意電路形狀的電路圖案層21。 Next, as shown in FIG. 5, by selectively etching the copper layer 20 using an optical lithography method, a circuit pattern layer 21 having an arbitrary circuit shape is formed in the same manner as in the embodiment.
於所獲得實施例、比較例1及比較例2的安裝基板用放熱積層材,目視確認鋁箔30的面上有無凹凸。 In the obtained exothermic laminates for mounting substrates in the obtained Examples, Comparative Examples 1 and 2, the presence or absence of unevenness on the surface of the aluminum foil 30 was visually confirmed.
凹凸的評價係從鋁箔30側進行目視觀察,將在電路圖案層21上所形成之電路圖案的輪廓之一部分呈浮雕狀浮出者,評為「有凹凸」,將電路圖案輪廓沒有浮出而呈平坦者評為「無凹凸」。 The evaluation of the unevenness is visually observed from the aluminum foil 30 side, and a part of the outline of the circuit pattern formed on the circuit pattern layer 21 is embossed, and is rated as "having unevenness." Those who were flat were rated as "no bumps".
實施例係鋁箔30的面上沒有發生凹凸,相對地比較例1、2係在鋁箔30的面上發生凹凸。 The surface of the aluminum foil 30 of the example is free of irregularities, while the surfaces of the aluminum foil 30 of the comparative examples 1 and 2 are relatively uneven.
本次所揭示的實施形態與實施例全部均僅止於例示而已,不應認為其屬於限制。本發明範圍並非以上實施形態與實施例,而是由申請專利範圍所示,涵蓋在與申請專利範圍具均等含義與範圍內的所有修正與變化。 All the implementation forms and examples disclosed this time are only for illustration, and should not be considered as limiting. The scope of the present invention is not the above embodiments and examples, but is shown by the scope of the patent application, and covers all modifications and changes within the meaning and scope equivalent to the scope of the patent application.
根據本發明,可製造能因應電子機器的輕量化、小型化及薄型化,且即便安裝較大發熱量的電子元件,仍可將由該電子元件所產生熱有效率散逸的安裝基板用放熱積層材。 According to the present invention, it is possible to manufacture an exothermic laminate for a mounting substrate that can respond to the weight reduction, miniaturization, and thickness reduction of an electronic device, and that can efficiently dissipate heat generated by the electronic component even if an electronic component with a large amount of heat is mounted.
10‧‧‧樹脂薄膜 10‧‧‧resin film
20‧‧‧銅層 20‧‧‧ Copper
21‧‧‧電路圖案層 21‧‧‧Circuit pattern layer
30‧‧‧鋁箔 30‧‧‧ aluminum foil
圖1係表示本發明一實施形態,安裝基板用放熱積層材之製造方法的第1步驟之概略截面構造的圖。 FIG. 1 is a diagram showing a schematic cross-sectional structure of a first step of a method for manufacturing a heat-sinking laminate for mounting substrates according to an embodiment of the present invention.
圖2係表示本發明一實施形態,安裝基板用放熱積層材之製造方法的第2步驟之概略截面構造的圖。 FIG. 2 is a diagram showing a schematic cross-sectional structure of a second step of the method for manufacturing a heat-sinking laminate for mounting substrates according to an embodiment of the present invention.
圖3係表示本發明一實施形態,安裝基板用放熱積層材之製造方法的第3步驟之概略截面構造的圖。 FIG. 3 is a view showing a schematic cross-sectional structure of a third step of a method for manufacturing a heat-sinking laminate for mounting substrates according to an embodiment of the present invention.
圖4係表示本發明比較例,安裝基板用放熱積層材之製造方法的第1步驟之概略截面構造的圖。 FIG. 4 is a diagram showing a schematic cross-sectional structure of a first step of a method for manufacturing a heat-sinking laminate for mounting substrates according to a comparative example of the present invention.
圖5係本發明比較例,安裝基板用放熱積層材之製造方法的第2步驟概略截面構造圖。 FIG. 5 is a schematic cross-sectional structure diagram of the second step of the manufacturing method of the exothermic laminate for mounting substrates in the comparative example of the present invention.
10‧‧‧樹脂薄膜 10‧‧‧resin film
21‧‧‧電路圖案層 21‧‧‧Circuit pattern layer
30‧‧‧鋁箔 30‧‧‧ aluminum foil
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JPH01133395A (en) * | 1987-11-19 | 1989-05-25 | Denki Kagaku Kogyo Kk | Mass production of metal base circuit substrates |
JPH0746754B2 (en) * | 1986-10-28 | 1995-05-17 | 東芝コンポ−ネンツ株式会社 | Method for manufacturing printed wiring board |
CN1601382A (en) * | 2003-09-24 | 2005-03-30 | 富士胶片株式会社 | Support for lithographic printing plate and presensitized plate |
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WO2009145109A1 (en) * | 2008-05-29 | 2009-12-03 | 電気化学工業株式会社 | Metal base circuit board |
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JPH01133395A (en) * | 1987-11-19 | 1989-05-25 | Denki Kagaku Kogyo Kk | Mass production of metal base circuit substrates |
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