CN205124125U - Metal base copper clad laminate - Google Patents
Metal base copper clad laminate Download PDFInfo
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- CN205124125U CN205124125U CN201520977830.XU CN201520977830U CN205124125U CN 205124125 U CN205124125 U CN 205124125U CN 201520977830 U CN201520977830 U CN 201520977830U CN 205124125 U CN205124125 U CN 205124125U
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Abstract
The utility model relates to a metal base copper clad laminate, including conducting layer, adhesive linkage and metal substrate, conducting layer, adhesive linkage are pasted in proper order with the metal substrate and are connected, the metal substrate is kept away from adhesive linkage one side and is equipped with thermal adhesive layer on the surface, thermal adhesive layer keeps away from and is equipped with the heat dissipation layer on metal substrate one side. As the utility model discloses a preferred technical scheme, the conducting layer is made for the copper foil material, the adhesive linkage is that fine particle form al_2O_3 and resin mixture are made, the metal substrate is that copper, aluminum plate or steel plate material make, thermal adhesive layer makes for boron nitride heat -conducting glue material, make for graphite material on the heat dissipation layer. The utility model discloses well thermal adhesive layer can improve the radiating rate of metal substrate, puies forward the high heat dissipating ability, and the heat dissipation layer can in time be gived off the heat that thermal adhesive layer derived simultaneously, and the radiating effect is good, ensures the normal work of components and parts.
Description
Technical field
The utility model relates to circuit board technology field, particularly relates to a kind of Metal Substrate copper clad laminate.
Background technology
Copper-clad plate-----has another name called base material.By supporting material leaching with resin, one or both sides, coated with Copper Foil, through a kind of board-like material of hot pressing, are called copper clad laminate.It is the stock being PCB, is often base material.When it is produced for multi-layer sheet, be also central layer (CORE).A, be divided into rigidity copper-clad plate and flexibility coat copper plate by the mechanical rigid of copper-clad plate; B, be divided into the copper-clad plate of organic resin class, metal-based copper-clad plate, ceramic base copper-clad plate by the insulating material of copper-clad plate, structure; C, to be divided into slab (thickness range is at 0.8 ~ 3.2mm (containing Cu)), thin plate (thickness range is less than 0.78mm (not containing Cu)) by the thickness of copper-clad plate; D, be divided into the copper-clad plate of glass fabricbase, paper-based copper-coated board, composite-based copper clad plate (CME-1, CME-2) by the reinforcing material of copper-clad plate; E, be divided into flame-retardant board and non-flame resistant plate according to flame retardant rating; F, to be divided into high Tg plate (Tg >=170 DEG C), high dielectric property plate, high CTI plate (CTI >=600V), environment friendly CCL (Halogen, without antimony), the copper-clad plate of ultraviolet light shielded type by some performance of copper-clad plate.
Existing Metal Substrate copper clad laminate, due to adhesive linkage or title composite layer, it is glass fibre, pottery powder box polytetrafluoroethylene/resin mixed material layer, cause thermal resistance large, the deficiencies such as heat dispersion, it is found that this laminated sheet is used as modular power source plate simultaneously, LED illumination plate and electronic igniter for gasoline engine plate etc., often because its heat dispersion is poor, and produce Copper Foil with adhesive linkage and be separated, especially LED illumination substrate is used as, because substrate is overheated, light decay can be caused to exhaust, even burn out the luminous two-stage pipe of LED, so the heat dispersion of existing laminated sheet is difficult to meet the demands.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of Metal Substrate copper clad laminate.
The utility model is achieved through the following technical solutions:
A kind of Metal Substrate copper clad laminate, comprise conductive layer, adhesive linkage and metal substrate, described conductive layer, adhesive linkage and metal substrate are pasted successively and are connected, described metal substrate is provided with heat conduction glue-line on the surface away from adhesive linkage side, and described heat conduction glue-line is provided with heat dissipating layer away from metal substrate side.
As optimal technical scheme of the present utility model, described conductive layer is that Copper Foil material is made, described adhesive linkage is that subparticle shape alundum (Al2O3) and resin compound are made, described metal substrate is that copper coin, aluminium sheet or steel plate materials are made, described heat conduction glue-line is that boron nitride heat-conducting glue material is made, and described heat dissipating layer is that graphite material is made.
As optimal technical scheme of the present utility model, the material thickness of described heat conduction glue-line is 1-2.5 μm.
As optimal technical scheme of the present utility model, the material thickness of described heat dissipating layer is 2-2.5 μm.
Compared with prior art, the beneficial effects of the utility model are: the utility model structure is simple, reasonable in design, in the utility model, heat conduction glue-line can improve the radiating rate of metal substrate, improve heat dispersion, the heat that heat conduction glue-line is derived can distribute by heat dissipating layer in time simultaneously, and good heat dissipation effect, guarantees the normal work of components and parts.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
A kind of Metal Substrate copper clad laminate, comprise conductive layer 1, adhesive linkage 2 and metal substrate 3, described conductive layer 1, adhesive linkage 2 are pasted successively with metal substrate 3 and are connected, described metal substrate 3 is provided with heat conduction glue-line 4 on the surface away from adhesive linkage 2 side, wherein be fixedly connected with between metal substrate 3 with heat conduction glue-line 4, described heat conduction glue-line 4 is provided with heat dissipating layer 5 away from metal substrate 3 side, described heat dissipating layer 5 with between heat conduction glue-line 4 for being fixedly connected with.
Described conductive layer 1 is made for Copper Foil material, described adhesive linkage 2 is that subparticle shape alundum (Al2O3) and resin compound are made, described metal substrate 3 is made for copper coin, aluminium sheet or steel plate materials, described heat conduction glue-line 4 is made for boron nitride heat-conducting glue material, described heat dissipating layer 5 is made for graphite material, the material thickness of wherein said heat conduction glue-line 4 is 1-2.5 μm, and the material thickness of described heat dissipating layer 5 is 2-2.5 μm.Such heat conduction glue-line 4 can improve the radiating rate of metal substrate 3, improves heat dispersion, and the heat that heat conduction glue-line 4 is derived can distribute by heat dissipating layer 5 in time simultaneously, and good heat dissipation effect, guarantees the normal work of components and parts.
In description of the present utility model, it will be appreciated that, term " orientation or the position relationship of the instruction such as " center ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the utility model and simplified characterization for convenience of description; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. a Metal Substrate copper clad laminate, comprise conductive layer (1), adhesive linkage (2) and metal substrate (3), described conductive layer (1), adhesive linkage (2) are pasted successively with metal substrate (3) and are connected, it is characterized in that: described metal substrate (3) is provided with heat conduction glue-line (4) on the surface away from adhesive linkage (2) side, described heat conduction glue-line (4) is provided with heat dissipating layer (5) away from metal substrate (3) side.
2. Metal Substrate copper clad laminate according to claim 1, it is characterized in that: described conductive layer (1) is made for Copper Foil material, described adhesive linkage (2) is that subparticle shape alundum (Al2O3) and resin compound are made, described metal substrate (3) is copper coin, aluminium sheet or steel plate materials are made, described heat conduction glue-line (4) is made for boron nitride heat-conducting glue material, and described heat dissipating layer (5) is made for graphite material.
3. Metal Substrate copper clad laminate according to claim 1, is characterized in that: the material thickness of described heat conduction glue-line (4) is 1-2.5 μm.
4. Metal Substrate copper clad laminate according to claim 1, is characterized in that: the material thickness of described heat dissipating layer (5) is 2-2.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977830.XU CN205124125U (en) | 2015-11-30 | 2015-11-30 | Metal base copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520977830.XU CN205124125U (en) | 2015-11-30 | 2015-11-30 | Metal base copper clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205124125U true CN205124125U (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520977830.XU Active CN205124125U (en) | 2015-11-30 | 2015-11-30 | Metal base copper clad laminate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407634A (en) * | 2015-11-30 | 2016-03-16 | 惠州市博宇科技有限公司 | Metal-based copper-clad laminated board |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
-
2015
- 2015-11-30 CN CN201520977830.XU patent/CN205124125U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407634A (en) * | 2015-11-30 | 2016-03-16 | 惠州市博宇科技有限公司 | Metal-based copper-clad laminated board |
| WO2020133965A1 (en) * | 2018-12-29 | 2020-07-02 | 广东生益科技股份有限公司 | Metal base copper foil-coated laminate and preparation method therefor |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |