CN105282977A - Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio - Google Patents
Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio Download PDFInfo
- Publication number
- CN105282977A CN105282977A CN201510665931.8A CN201510665931A CN105282977A CN 105282977 A CN105282977 A CN 105282977A CN 201510665931 A CN201510665931 A CN 201510665931A CN 105282977 A CN105282977 A CN 105282977A
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- CN
- China
- Prior art keywords
- hole
- copper
- circuit board
- back drill
- drill hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0597—Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for improving copper missing of a metalized back drilling hole of a circuit board with a high thickness-to-diameter ratio. The method comprises the following steps: S1, a back drilling hole is drilled in the circuit board and the depth is controlled, the circuit board is rubbed, burrs are removed, and then chemical copper deposition is carried out; S2, a copper layer is added to the back drilling hole through electroplating; S3, a board surface dry film is attached to the surface of the circuit board, an outer-layer pattern is produced, pattern plating is carried out, and then the board surface dry film is removed; S4, a hole-covering dry film is produced on the surface of the circuit board; and S5, the circuit board is subjected to chemical etching, the hole-covering dry film is removed, and a protective tin layer is removed. The back drilling hole is shielded with the hole-covering dry film, so that the copper layer not plated with a tin layer in the back drilling hole is not etched by an etch solution in an alkali etching step, and the copper layer under the tin layer is protected. The hole-covering dry film is removed after etching and the tin layer is protected, so that a complete outer-layer pattern and the back drilling hole plated with the copper layer are obtained, thereby avoiding the situation that the copper layer is etched because the bottom of the hole with a high thickness-to-diameter ratio is not plated with tin.
Description
Technical field
The invention belongs to wiring board production technical field, relate in particular to a kind of method improving high thickness to diameter ratio producing circuit board metallized back drill hole having no copper in the holes.
Background technology
Along with the development of electronic product and electronic technology, the design concept of electronic product moves towards light gradually, thin, short, little, printed wiring board (PCB) is also constantly to small-bore, high density, multilayer number, fine rule road is developed, because the printed wiring board number of plies and thickness increase gradually, aperture constantly reduces, the radius-thickness ratio in circuit board with back-drilled hole is also in continuous increase, circuit board metallization back drill hole machined difficulty increases gradually, because high thickness to diameter ratio metallization back drill hole is deep, in manufacturing process, because after graphic plating, protective layer tin layers is difficult to be plated to bottom hole, layers of copper at the bottom of subsequent etch hole when is very easily caused to be protected without tin layers, there is the phenomenon without copper at the bottom of the etched hole of metallic copper in hole, wiring board is caused to scrap, and this bad being difficult to is found in visual examination, and if open short circuit electrical testing when circuit network is not disconnected to be also difficult to detect.
Summary of the invention
For this reason; technical problem to be solved by this invention is in prior art; because high thickness to diameter ratio metallization back drill hole is deep; after graphic plating, tin layers is difficult to be plated to bottom hole; cause protecting without tin layers, occurring the phenomenon without metallic copper in hole at the bottom of etching metapore; and then cause wiring board to be scrapped, thus propose a kind ofly to improve the method for high thickness to diameter ratio producing circuit board metallized back drill hole without copper.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of high thickness to diameter ratio producing circuit board metallized back drill hole of improving without the method for copper, comprise the steps:
S1, control deep drilling back drill hole, nog plate, deburring are carried out to wiring board after carry out electroless copper plating;
S2, filling perforation plating, plate thick copper layer in the back drill hole in step sl after electroless copper plating;
S3, PCB surface paste plate face dry film, make outer graphics, and carry out graphic plating, form protection tin layers, then return described plate face dry film in wiring board plate face and back drill hole;
S4, PCB surface make cover hole dry film;
S5, chemical etching wiring board, remove and cover hole dry film, removes protection tin layers.
As preferably, before hole dry film is covered in making, in described step S4, also comprise the step making and cover the hole film.
As preferably, described in cover the diameter hole film being covered hole pattern 0.3-0.4mm larger than the aperture in described back drill hole.
As preferably, in described step S3, after pasting plate face dry film, also comprise the step of exposure and development.
As preferably, in described step S1, the copper layer thickness that electroless copper plating is formed is 0.3-0.5 μm.
As preferably, the copper layer thickness that the plating of filling perforation described in described step S2 is formed is 13-15 μm.
As preferably, filling perforation electroplating current density described in described step S2 is 6-12ASF, and electroplating time is 65-80min.
As preferably, the radius-thickness ratio in described back drill hole is not less than 0.8:1.
Technique scheme of the present invention has the following advantages compared to existing technology, of the present inventionly improve the method for high thickness to diameter ratio producing circuit board metallized back drill hole without copper, board falling face dry film is retreated at graphic plating, then plate face is pasted and is covered hole dry film, the boring of exposure imaging back is covered hole dry film and is sheltered from, boring for back of the body hole dry film of covering is sheltered from, in the step of alkali etching, the layers of copper not plating protection tin layers in back drill hole would not be etched away by etching solution, hole dry film is covered in etching retrogressing, protection tin layers, obtain intact outer graphics and be coated with the back drill hole of layers of copper, effectively prevent and do not cause layers of copper to be etched because plating tin at the bottom of radius-thickness ratio height hole, significantly improve the phenomenon of high thickness to diameter ratio producing circuit board metallized having no copper in the holes.
Embodiment
In order to make content of the present invention be more likely to be clearly understood, the present invention is further detailed explanation according to a particular embodiment of the invention below.
Embodiment
The present embodiment provides a kind of high thickness to diameter ratio producing circuit board metallized back drill hole of improving without the method for copper, comprises the steps:
S1, control deep drilling back drill hole, nog plate, deburring are carried out to wiring board after carry out electroless copper plating, in PCB surface and back drill hole, obtained thickness is the layers of copper of 0.3-0.5 μm, and copper layer thickness described in the present embodiment is 0.4 μm; The radius-thickness ratio in described back drill hole is not less than 0.8:1, and the radius-thickness ratio in the hole of back drill described in the present embodiment is 1:1;
S2, carry out under current density is 6-12ASF filling perforation plating 65-80min, plate the thick copper layer that thickness is 13-15 μm in back drill hole in step sl after electroless copper plating, in the present embodiment, current density is 9ASF, electroplating time is 70min, and the thick copper layer obtained is 14 μm;
S3, PCB surface paste plate face dry film, and then, exposure, development, produce outer graphics, then carry out graphic plating, forms protection tin layers in wiring board plate face and back drill hole, then adopts organic basic to move back film liquid and return described plate face dry film;
The hole film is covered in S4, making, then paste dry film, after exposure, development, produce in PCB surface and cover hole dry film, cover the diameter hole film being covered hole pattern 0.3-0.4mm larger than the aperture in back drill hole, in the present embodiment, cover the diameter 0.4mm larger than back of the body boring aperture of hole pattern;
S5, employing alkaline etching liquid etched circuit board, remove unwanted copper, then adopts organic basic to move back the removal of film liquid and cover hole dry film, adopts routine to move back the removal of tin liquid medicine and protect tin layers.
Improvement high thickness to diameter ratio producing circuit board metallized back drill hole described in the present embodiment is without the method for copper; boring for back of the body hole dry film of covering is sheltered from; in the step of alkali etching; the layers of copper not plating protection tin layers in back drill hole would not be etched away by etching solution; thus protect layers of copper; hole dry film, protection tin layers are covered in etching retrogressing; obtain intact outer graphics and be coated with the back drill hole of layers of copper; effectively prevent and do not cause layers of copper to be etched because plating tin at the bottom of radius-thickness ratio height hole, solve the technical problem of high thickness to diameter ratio producing circuit board metallized back drill having no copper in the holes.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (8)
1. improve high thickness to diameter ratio producing circuit board metallized back drill hole without a method for copper, it is characterized in that, comprise the steps:
S1, control deep drilling back drill hole, nog plate, deburring are carried out to wiring board after carry out electroless copper plating;
S2, filling perforation plating, plate thick copper layer in the back drill hole in step sl after electroless copper plating;
S3, PCB surface paste plate face dry film, make outer graphics, and carry out graphic plating, form protection tin layers, then return described plate face dry film in wiring board plate face and back drill hole;
S4, PCB surface make cover hole dry film;
S5, chemical etching wiring board, remove and cover hole dry film, removes protection tin layers.
2. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 1 is without the method for copper, it is characterized in that, also comprises the step making and cover the hole film in described step S4 before hole dry film is covered in making.
3. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 2 is without the method for copper, it is characterized in that, described in cover the diameter hole film being covered hole pattern 0.3-0.4mm larger than the aperture in described back drill hole.
4. the improvement high thickness to diameter ratio producing circuit board metallized back drill hole according to any one of claim 1-3, without the method for copper, is characterized in that, in described step S3, also comprises the step of exposure and development after pasting plate face dry film.
5. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 4 is without the method for copper, it is characterized in that, in described step S1, the copper layer thickness that electroless copper plating is formed is 0.3-0.5 μm.
6. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 5 is without the method for copper, it is characterized in that, the copper layer thickness that the plating of filling perforation described in described step S2 is formed is 13-15 μm.
7. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 6 is without the method for copper, and it is characterized in that, filling perforation electroplating current density described in described step S2 is 6-12ASF, and electroplating time is 65-80min.
8. high thickness to diameter ratio producing circuit board metallized back drill hole of improving according to claim 7 is without the method for copper, and it is characterized in that, the radius-thickness ratio in described back drill hole is not less than 0.8:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510665931.8A CN105282977A (en) | 2015-10-15 | 2015-10-15 | Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510665931.8A CN105282977A (en) | 2015-10-15 | 2015-10-15 | Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105282977A true CN105282977A (en) | 2016-01-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510665931.8A Pending CN105282977A (en) | 2015-10-15 | 2015-10-15 | Method for improving copper missing of metalized back drilling hole of circuit board with high thickness-to-diameter ratio |
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| CN (1) | CN105282977A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358385A (en) * | 2016-08-31 | 2017-01-25 | 开平依利安达电子第三有限公司 | Printed circuit board processing method adopting etching process for forming backdrilled holes |
| CN106535501A (en) * | 2016-10-17 | 2017-03-22 | 奥士康精密电路（惠州）有限公司 | Hole metallizing method for circuit board with high ratio of thickness to radial dimension |
| CN106793507A (en) * | 2016-12-19 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method in high thickness to diameter ratio producing circuit board metallized back drill hole |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN113347810A (en) * | 2021-05-27 | 2021-09-03 | 珠海杰赛科技有限公司 | Method for processing metalized blind hole with high thickness-diameter ratio |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080217052A1 (en) * | 2007-03-07 | 2008-09-11 | Fujitsu Limited | Wiring board and method of manufacturing wiring board |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| CN102523702A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
| JP2012222187A (en) * | 2011-04-11 | 2012-11-12 | Nec Corp | Manufacturing method of printed circuit board and printed circuit board |
-
2015
- 2015-10-15 CN CN201510665931.8A patent/CN105282977A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080217052A1 (en) * | 2007-03-07 | 2008-09-11 | Fujitsu Limited | Wiring board and method of manufacturing wiring board |
| CN101977482A (en) * | 2010-11-09 | 2011-02-16 | 深圳崇达多层线路板有限公司 | Method for etching outer circuit of PCB product with high aspect ratio |
| JP2012222187A (en) * | 2011-04-11 | 2012-11-12 | Nec Corp | Manufacturing method of printed circuit board and printed circuit board |
| CN102523702A (en) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing process of circuit board with back-drilled blind hole |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358385A (en) * | 2016-08-31 | 2017-01-25 | 开平依利安达电子第三有限公司 | Printed circuit board processing method adopting etching process for forming backdrilled holes |
| CN106535501A (en) * | 2016-10-17 | 2017-03-22 | 奥士康精密电路（惠州）有限公司 | Hole metallizing method for circuit board with high ratio of thickness to radial dimension |
| CN106793507A (en) * | 2016-12-19 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of preparation method in high thickness to diameter ratio producing circuit board metallized back drill hole |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
| CN113347810A (en) * | 2021-05-27 | 2021-09-03 | 珠海杰赛科技有限公司 | Method for processing metalized blind hole with high thickness-diameter ratio |
| CN113347810B (en) * | 2021-05-27 | 2022-08-02 | 珠海杰赛科技有限公司 | Method for processing metalized blind hole with high thickness-diameter ratio |
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Application publication date: 20160127 |
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| RJ01 | Rejection of invention patent application after publication |