CN103687341B - A kind of disconnected hole preparation method of printed circuit board - Google Patents
A kind of disconnected hole preparation method of printed circuit board Download PDFInfo
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- CN103687341B CN103687341B CN201310638569.6A CN201310638569A CN103687341B CN 103687341 B CN103687341 B CN 103687341B CN 201310638569 A CN201310638569 A CN 201310638569A CN 103687341 B CN103687341 B CN 103687341B
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Abstract
The present invention relates to the disconnected hole preparation method of a kind of printed circuit board, its process is: first print protection ink on the line pattern of target central layer, then through normal pressing and boring flow process, for avoiding during follow-up hole metallization, chemical copper and electro-coppering in the hole wall deposition print protection ink, use organic solvent, first protection ink is divested totally before electroless copper plating, the activator adsorbed in protection ink pellet surface will together be removed, and organic solvent will not destroy the activator on resin and glass fibre, the most whole perforation, in addition to cavity portion, one layer of chemical copper as plating seed layer all can be deposited on hole wall, and it is positioned at the material surface at hole because adhering to without activator, chemical copper will not be deposited, thus conductive layer cannot be formed.Processing procedure of the present invention is simple, with low cost, low to material requirements, easily realizes batch production, and resistance plating effect can reach 100%.
Description
Technical field
The present invention relates to printed circuit board field, be specifically related to the disconnected hole preparation method of a kind of printed circuit board.
Background technology
Along with communication and the development of network technology, signal transmission rate is the highest, and high-frequency circuit is widely used in design of electronic products.For meeting high-frequency signal normal transmission in printed circuit board (Printed Circuit Board, PCB), the design to PCB proposes the most harsh requirement with manufacturing.PCB uses the mode of through hole, buried via hole or blind hole to be electrically connected at present, it is achieved interconnection and interflow between layers.Under existing PCB manufacturing technology, when using electroplating ventilating hole to serve as transmission medium between layers, the signal of telecommunication passes through a certain layer conductor of PCB, electroplated through hole is transferred on another layer conductor, the signal of telecommunication may only need a part in electroplated through hole to be transmitted, and unnecessary part electroplating ventilating hole is referred to as short-term (stub).
During the signal of telecommunication transmits, every short-term can produce stray inductance and parasitic capacitance, when transmitting low frequency signal, the integrality of signal transmission will not be caused significantly negative effect；But when transmitting high-frequency signal, but signal attenuation can cause geometry level rises, while the most also can the integrality of extreme influence signal.Its middle short line is the longest, and stray inductance and the parasitic capacitance of generation are the biggest, the biggest on signal integrity impact.Therefore, in high-frequency circuit product, traditional electroplating ventilating hole design cannot meet the demand of signal transmission.
In order to avoid the short-term impact on high frequency signal transmission integrality, disclosed in the Chinese invention patent application (calling application 1 in the following text) of Application No. 201110460708.1, a kind of method for manufacturing printed circuit board can solve the problem that the problems referred to above.The method flow of application 1 is: boring → consent → polishing → row/pressing plate → boring → hole wall removing glue → hole metallization; the plating protection ink for preventing from plating conductive material is filled in perforation; the hydrophobicity utilizing material itself reaches the effect of resistance plating; but; there is following defect in this PCB: 1. the requirement to plating protection ink is high; extremely difficult searching, and material cost is high；2. plating protection ink is stayed in PCB, affects the reliability of PCB；3. plating protection ink and hole wall are in approximately the same plane, and the flowing of liquid can reduce the resistance plating effect of material itself, low qualified.
Summary of the invention
It is an object of the invention to propose the disconnected hole preparation method of a kind of printed circuit board, it can solve high to ink requirements and hinder the problems such as plating poor effect.
In order to achieve the above object, the technical solution adopted in the present invention is as follows:
A kind of disconnected hole preparation method of printed circuit board, it comprises the following steps:
Step 1, on target central layer formed line pattern；
Printing protection ink on the position that step 2, at least one preset hole on the line pattern of target central layer are corresponding, the radius of described protection ink is more than described preset hole, and wherein, described preset hole is to need not the hole at interlayer transmitting telecommunication number；
Step 3, the lamination treatment that carries out prepreg and central layer, form multilayer printed circuit board, and wherein, the part or all of central layer carrying out lamination treatment is described target central layer；
Step 4, described multilayer printed circuit board is carried out boring process, drill the preset hole in described target central layer, form perforation；
Step 5, described multilayer printed circuit board perforation hole wall deposition one layer of activator；
Step 6, protection ink to described multilayer printed circuit board move back film and process, the described protection ink and be positioned at the activator on described protection ink of decorporating；
Step 7, hole wall to the perforation of described multilayer printed circuit board carry out electroless copper plating process.
Preferably, in step 1, the copper foil layer of the single or double of target central layer forms line pattern.It is further preferred that in step 2, on the line pattern of the single or double that described protection ink is printed on target central layer.
Preferably, described boring processes one or more included in laser drill, machine drilling or punching.
Preferably, in step 2, use mould printing mode to print protection ink on line pattern, or use screen printing mode to print protection ink on line pattern.
Preferably, in steps of 5, before hole wall one layer of activator of deposition of the perforation of described multilayer printed circuit board, first described multilayer printed circuit board is carried out removing glue process.
There is advantages that
Line pattern is printed protection ink; organic solvent is used to remove described protection ink before electroless copper plating; thus the activator on the most described protection ink is also removed; form a little hole (for monoblock PCB, be equivalent to disconnect perforation, form disconnected hole); hole is caused to cannot be carried out in subsequent openings metallization; reaching the effect of resistance plating, and process step is less, cost is relatively low.
1. the requirement of pair ink is low, and material can be found at home, and material cost is relatively low；
2. use stripping process to peel off ink in hole, do not affect the reliability of PCB；
3. in peelling off hole, the activator on ink peelled off by ink simultaneously, forms a hole, without activator in hole, makes hole metallization cannot be carried out, it is ensured that resistance plating effect can reach 100%.
Accompanying drawing explanation
Fig. 1 is the flow chart of the disconnected hole preparation method of the printed circuit board of present pre-ferred embodiments；
Fig. 2 is the structural representation that step S01 of Fig. 1 is corresponding with step S02；
Fig. 3 is the structural representation that step S03 of Fig. 1 is corresponding；
Fig. 4 is the structural representation that step S04 of Fig. 1 is corresponding；
Fig. 5 is the structural representation that step S06 of Fig. 1 is corresponding；
Fig. 6 is the structural representation that step S07 of Fig. 1 is corresponding.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, the present invention is described further.
As shown in Figures 1 to 6, the disconnected hole preparation method of a kind of printed circuit board, it comprises the following steps:
Step S01, through pad pasting, expose, etch, the two-sided copper foil layer 102 of target central layer 10 is formed line pattern；Described target central layer 10 includes insulating barrier 101 and the two-sided copper foil layer 102 being positioned on insulating barrier 101, and described line pattern is positioned on copper foil layer 102.
Protection ink 20 is printed on the position that step S02, at least one preset hole on the two-sided line pattern of target central layer 10 are corresponding; the radius of described protection ink 20 is more than described preset hole; wherein, described preset hole is to need not the hole at interlayer transmitting telecommunication number；Mould printing mode can be used to print protection ink 20 on line pattern, or use screen printing mode to print protection ink 20 on line pattern.
Step S03, the lamination treatment that carries out prepreg and central layer, form multilayer printed circuit board, and wherein, the part or all of central layer carrying out lamination treatment is described target central layer 10.The multilayer printed circuit board of the present embodiment is made up of central layer 30, prepreg 50, target central layer 10, prepreg 60 and central layer 40 lamination the most successively.Central layer 30 includes insulating barrier 301 and copper foil layer 302.Central layer 40 includes insulating barrier 401 and copper foil layer 402.
Step S04, described multilayer printed circuit board is carried out boring process, drill the preset hole in described target central layer 10, form perforation 70.It is to say, multilayer printed circuit board is drilled monoblock multilayer printed circuit board in the preset hole position of target central layer 10, owing to protection ink 20 is corresponding with preset hole position, therefore, the most also protection ink 20 is drilled.
Step S05, first described multilayer printed circuit board is carried out PLASAM removing glue process or chemistry removing glue process; to remove the glue slag of perforated wall residual; then hole activation flow process is carried out; hole wall one layer of activator of deposition in the perforation 70 of described multilayer printed circuit board; after activation process, the hole wall of perforation 70 and protection ink 20 all can there is one layer of activator；Owing to protection ink has good acidproof, alkaline-resisting and non-oxidizability, will not be destroyed in removing glue and activation process.
Step S06, protection ink 20 to described multilayer printed circuit board move back film and process, the described protection ink 20 and be positioned at the activator on described protection ink 20 of decorporating, thus form hole 80；Can use organic solvent and move back film device and divested by protection ink, meanwhile, the activator being deposited on protection ink pellet surface also together divests with protection ink, makes one hole 80 of formation in perforation 70.
Step S07, hole wall to the perforation 70 of described multilayer printed circuit board carry out electroless copper plating process, hole wall deposition has the region of activator can deposit one layer of chemical copper 90, and be stripped because of activator at hole 80, chemical copper 90 cannot be at this area deposition, so that perforation 70 in position, hole 80 for separating, thus formed break hole.
The boring of the present embodiment processes can use one or more in laser drill, machine drilling or punching.
The principle forming disconnected hole in the perforation of transmission signal is: first print protection ink on line pattern, then through normal pressing and boring flow process, for avoiding during follow-up hole metallization, chemical copper and electro-coppering in the hole wall deposition print protection ink, use organic solvent, first protection ink is divested totally before electroless copper plating, the activator adsorbed in protection ink pellet surface will together be removed, and organic solvent will not destroy the activator on resin and glass fibre, the most whole perforation, in addition to cavity portion, one layer of chemical copper as plating seed layer all can be deposited on hole wall, and it is positioned at the material surface at hole because adhering to without activator, chemical copper will not be deposited, thus conductive layer cannot be formed.
Above-described embodiment processing procedure is simple, with low cost, low to material requirements, easily realizes batch production, and resistance plating effect can reach 100%.
Additionally, on the copper foil layer of the line pattern of above-described embodiment one side that can only be formed at target central layer, protection ink also can be printed on the line pattern of one side of target central layer, depending on this can be according to design requirement.
For a person skilled in the art, can technical scheme as described above and design, make other various corresponding changes and deformation, and within all these changes and deformation all should belong to the protection domain of the claims in the present invention.
Claims (6)
1. the disconnected hole preparation method of a printed circuit board, it is characterised in that comprise the following steps:
Step 1, on target central layer formed line pattern；
Printing protection ink on the position that step 2, at least one preset hole on the line pattern of target central layer are corresponding, the radius of described protection ink is more than described preset hole, and wherein, described preset hole is to need not the hole at interlayer transmitting telecommunication number；
Step 3, the lamination treatment that carries out prepreg and central layer, form multilayer printed circuit board, and wherein, the part or all of central layer carrying out lamination treatment is described target central layer；
Step 4, described multilayer printed circuit board is carried out boring process, drill the preset hole in described target central layer, form perforation；
Step 5, described multilayer printed circuit board perforation hole wall deposition one layer of activator；
Step 6, protection ink to described multilayer printed circuit board move back film and process, the described protection ink and be positioned at the activator on described protection ink of decorporating；
Step 7, hole wall to the perforation of described multilayer printed circuit board carry out electroless copper plating process.
2. the disconnected hole preparation method of printed circuit board as claimed in claim 1, it is characterised in that in step 1, forms line pattern on the copper foil layer of the single or double of target central layer.
3. the disconnected hole preparation method of printed circuit board as claimed in claim 2, it is characterised in that in step 2, on the line pattern of the single or double that described protection ink is printed on target central layer.
4. the disconnected hole preparation method of printed circuit board as claimed in claim 1, it is characterised in that described boring processes one or more included in laser drill, machine drilling or punching.
5. the disconnected hole preparation method of printed circuit board as claimed in claim 1, it is characterised in that in step 2, uses mould printing mode to print protection ink on line pattern, or uses screen printing mode to print protection ink on line pattern.
6. the disconnected hole preparation method of printed circuit board as claimed in claim 1, it is characterised in that in steps of 5, before hole wall one layer of activator of deposition of the perforation of described multilayer printed circuit board, first carries out removing glue process to described multilayer printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310638569.6A CN103687341B (en) | 2013-12-02 | 2013-12-02 | A kind of disconnected hole preparation method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310638569.6A CN103687341B (en) | 2013-12-02 | 2013-12-02 | A kind of disconnected hole preparation method of printed circuit board |
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| Publication Number | Publication Date |
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| CN103687341A CN103687341A (en) | 2014-03-26 |
| CN103687341B true CN103687341B (en) | 2016-08-24 |
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| CN201310638569.6A Active CN103687341B (en) | 2013-12-02 | 2013-12-02 | A kind of disconnected hole preparation method of printed circuit board |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770200A (en) * | 2018-06-14 | 2018-11-06 | 生益电子股份有限公司 | A kind of PCB |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
| CN109890149B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | Manufacturing method of double-sided compression-joint PCB and PCB |
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
| CN109862719B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | PCB manufacturing method for realizing one-hole multi-network and PCB |
| CN110996526B (en) * | 2019-12-27 | 2020-11-03 | 生益电子股份有限公司 | Method for manufacturing signal via hole |
| CN112752446A (en) * | 2020-12-15 | 2021-05-04 | 广州添利电子科技有限公司 | Broken hole manufacturing process |
| CN114340232A (en) * | 2022-03-17 | 2022-04-12 | 梅州市志浩电子科技有限公司 | Manufacturing method of selective copper deposition and circuit board |
| CN114867207A (en) * | 2022-04-29 | 2022-08-05 | 梅州市志浩电子科技有限公司 | Circuit board back drilling stub control method and circuit board |
| CN116940002B (en) * | 2023-06-13 | 2024-03-29 | 湖北龙腾电子科技股份有限公司 | Manufacturing method of circuit board |
| CN116669333A (en) * | 2023-06-19 | 2023-08-29 | 昆山沪利微电有限公司 | Through hole sectional conduction type PCB and manufacturing method thereof |
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| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN103188886A (en) * | 2011-12-31 | 2013-07-03 | 北大方正集团有限公司 | Printing circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| CN103188886A (en) * | 2011-12-31 | 2013-07-03 | 北大方正集团有限公司 | Printing circuit board and manufacturing method thereof |
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| CN103687341A (en) | 2014-03-26 |
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