CN112752446A - Broken hole manufacturing process - Google Patents
Broken hole manufacturing process Download PDFInfo
- Publication number
- CN112752446A CN112752446A CN202011483601.4A CN202011483601A CN112752446A CN 112752446 A CN112752446 A CN 112752446A CN 202011483601 A CN202011483601 A CN 202011483601A CN 112752446 A CN112752446 A CN 112752446A
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- Prior art keywords
- pattern
- dry film
- manufacturing
- copper
- outer layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a broken hole manufacturing process, which comprises the following steps: the method comprises the steps of inner layer graph manufacturing and outer layer manufacturing; manufacturing an inner layer pattern: and (4) core board pattern manufacturing, which comprises dry film pattern, etching and film stripping. The resin treatment of the pattern cover of the core plate comprises the steps of core plate laser and plating-resistant material coating, wherein when the upper and lower interlayer through holes of the copper-clad core plate need to be separated: filling an electroplating-resistant material in the laser hole after drilling; when the through holes between the copper-clad core plates need to be isolated: and uniformly coating an anti-electroplating material on the surface of the signal layer of the inner-layer core board after the inner-layer pattern is manufactured. And (5) laminating and pressing the plates. Manufacturing an outer layer: drilling and hole metallization & outer layer patterning. The invention has the advantages that the electroplating-resistant material is used for separating the effective copper columns from the ineffective copper columns in the via holes, and the signal integrity of the finished PCB can be completely free from the influence of the ineffective copper columns.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a broken hole manufacturing process.
Background
The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
The creator of the PCB was oshi, paul, aisler, and in 1936 he first used a printed circuit board in a radio. In 1943, americans have mostly applied this technology to military radios, and in 1948, the united states has formally recognized that the invention is useful for commercial use. Printed wiring boards have begun to be widely used since the mid-50 s of the 20 th century. Printed circuit boards are found in almost every electronic device. If there are electronic components in a device, they are also mounted on PCBs of different sizes. The main function of the PCB is to connect various electronic components to form a predetermined circuit, which plays a role of relay transmission, and is a key electronic interconnection of electronic products, called "the mother of the electronic products".
In the PCB manufacturing process, customers only need to communicate among the signal hole parts at times, and the signal passing invalid section influences the transmission and influences the integrity of signals, so the industry develops a back drilling process to solve the problem, uses back drilling to remove the invalid copper columns in the holes, but is influenced by the processing precision, the invalid copper columns cannot be completely removed, and the Stub problem still exists in the back drilling process.
Disclosure of Invention
The invention aims to provide a broken hole manufacturing process which has the advantages of using electroplating-resistant materials to manufacture PCB broken holes, solving the problem that invalid copper columns influence the integrity of signals, solving the problem that the invalid copper columns cannot be completely removed due to the influence of processing precision, and remaining invalid copper columns still have great influence on the integrity of the signals in a high-frequency state.
In order to achieve the purpose, the invention provides the following technical scheme: a broken hole manufacturing process comprises the following process design: the method comprises the steps of inner layer graph manufacturing and outer layer manufacturing;
manufacturing an inner layer pattern: core board pattern making, including dry film pattern, etching and film stripping; performing resin treatment on the core plate pattern cover, wherein the resin treatment comprises core plate laser and plating-resistant material coating; laminating and pressing plates;
manufacturing an outer layer: drilling and hole metallization & outer layer patterning.
A broken hole manufacturing process comprises the following manufacturing flows:
manufacturing an inner layer pattern:
s1, when the through holes between the copper-clad core plates need to be isolated: attaching the dry film to two sides of the copper-clad core plate; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern; printing electroplating-resistant materials on the inner layer patterns;
s2, when the through holes between the upper layer and the lower layer of the copper-clad core plate need to be cut off: laser drilling is carried out on the copper-clad core plate; filling an anti-electroplating material in the laser hole; attaching dry films to two sides of the copper-clad core plate filled with the electroplating-resistant material; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern;
s3, when the through holes between the copper-clad core plates need to be separated and the through holes between the upper layer and the lower layer of the copper-clad core plates need to be separated: laser drilling is carried out on the copper-clad core plate; filling an anti-electroplating material in the laser hole; attaching dry films to two sides of the copper-clad core plate filled with the electroplating-resistant material; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern; printing electroplating-resistant materials on the inner layer patterns;
manufacturing an outer layer:
the core board is pressed, the outer layer of the pressed core board is drilled, hole metallization processing is conducted on the drilled holes, the outer layer of the core board is manufactured through conventional PCB outer layer pattern manufacturing equipment, silk-screen printing solder mask operation is conducted after the outer layer pattern is manufactured, silk-screen printing solder mask ink is added, the solder mask ink is attached to the board, silk-screen printing character operation is conducted, then the board is sent into a board routing machine to conduct shape-entering board routing operation, and finally surface processing is conducted, and the outer layer is manufactured.
Compared with the prior art, the invention has the following beneficial effects: when the via holes between the upper layer and the lower layer of the copper-clad core plate need to be cut off: filling an electroplating-resistant material in the laser hole after drilling;
when the through holes between the copper-clad core plates need to be isolated: and uniformly coating an anti-electroplating material on the surface of the signal layer of the inner-layer core board after the inner-layer pattern is manufactured.
The inner core board is processed by using the electroplating-resistant material and then pressed, holes are metallized after mechanical drilling, a through hole without invalid copper columns is directly formed, the effective and invalid copper columns in the through hole are separated by using the electroplating-resistant material, and the signal integrity of the finished PCB is completely free from the influence of the invalid copper columns.
Drawings
FIG. 1 is a schematic view of the L2/3 flow path of the present invention;
FIG. 2 is a schematic view of the L4/5 flow path of the present invention;
FIG. 3 is a schematic view of the L6/7 flow path of the present invention;
FIG. 4 is a schematic diagram of an outer layer manufacturing process according to the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown herein, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
Referring to fig. 1 to 4, an embodiment of the present invention includes: a broken hole manufacturing process comprises the following process design: the method comprises the steps of inner layer graph manufacturing and outer layer manufacturing; manufacturing an inner layer pattern: core board pattern making, including dry film pattern, etching and film stripping; performing resin treatment on the core plate pattern cover, wherein the resin treatment comprises core plate laser and plating-resistant material coating; and (5) laminating and pressing the plates. Manufacturing an outer layer: drilling and hole metallization & outer layer patterning.
The inner core board is processed by using the electroplating-resistant material and then pressed, holes are metallized after mechanical drilling, a through hole without invalid copper columns is directly formed, the effective and invalid copper columns in the through hole are separated by using the electroplating-resistant material, and the signal integrity of the finished PCB is completely free from the influence of the invalid copper columns.
Example 2
The embodiment provided by the invention comprises the following steps: a broken hole manufacturing process comprises the following steps of:
s1, manufacturing an inner layer graph by using conventional PCB inner layer graph manufacturing equipment;
s2, manufacturing a dry film pattern on the copper-clad core plate through dry film pattern manufacturing equipment;
s3, etching the copper-clad core board, and etching the area of the copper-clad core board which is not protected by the dry film pattern;
and S4, removing the dry film from the etched copper-clad core board to obtain an inner layer pattern.
And (3) carrying out resin treatment on the core plate pattern cover:
s1, when the through holes between the upper layer and the lower layer of the copper-clad core plate need to be cut off: manufacturing laser holes on the inner core board after the inner layer patterns are manufactured through a laser device, drilling the laser holes from the back of the signal layer of the inner core board to the signal layer, and drilling through the dielectric layer of the inner core board but not drilling through the signal layer copper sheet of the inner core board; filling an electroplating-resistant material in the laser hole after drilling;
s2, when the through holes between the copper-clad core plates need to be isolated: uniformly coating an anti-electroplating material on the surface of the signal layer of the inner-layer core board after the inner-layer pattern is manufactured;
and the PCB broken hole is made of an anti-electroplating material, so that the influence of an invalid copper column on the integrity of the signal is solved.
And (5) carrying out combined pressing on the prepared core plate.
Example 3
The embodiment provided by the invention comprises the following steps: a broken hole manufacturing process comprises the following steps of:
s1, pressing the core board;
s2, drilling holes in the outer layer of the pressed core plate, and performing hole metallization on the drilled holes;
s3, manufacturing an outer layer pattern of the core board by using conventional PCB outer layer pattern manufacturing equipment, performing silk-screen solder mask operation after the outer layer pattern is manufactured, adding silk-screen solder mask ink, attaching the solder mask ink on a board, and performing silk-screen character operation;
and S4, feeding the silk-screen printed core board into a board routing machine for carrying out shape routing operation, and finally carrying out surface treatment to obtain an outer layer.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (2)
1. A broken hole manufacturing process is characterized by comprising the following steps: the process design comprises the following steps: the method comprises the steps of inner layer graph manufacturing and outer layer manufacturing;
manufacturing an inner layer pattern: core board pattern making, including dry film pattern, etching and film stripping; performing resin treatment on the core plate pattern cover, wherein the resin treatment comprises core plate laser and plating-resistant material coating; laminating and pressing plates;
manufacturing an outer layer: drilling and hole metallization & outer layer patterning.
2. The broken hole manufacturing process according to claim 1, characterized in that: the manufacturing process comprises the following steps:
manufacturing an inner layer pattern:
s1, when the through holes between the copper-clad core plates need to be isolated: attaching the dry film to two sides of the copper-clad core plate; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern; printing electroplating-resistant materials on the inner layer patterns;
s2, when the through holes between the upper layer and the lower layer of the copper-clad core plate need to be cut off: laser drilling is carried out on the copper-clad core plate; filling an anti-electroplating material in the laser hole; attaching dry films to two sides of the copper-clad core plate filled with the electroplating-resistant material; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern;
s3, when the through holes between the copper-clad core plates need to be separated and the through holes between the upper layer and the lower layer of the copper-clad core plates need to be separated: laser drilling is carried out on the copper-clad core plate; filling an anti-electroplating material in the laser hole; attaching dry films to two sides of the copper-clad core plate filled with the electroplating-resistant material; making a dry film pattern on the dry film; etching the area which is not protected by the dry film; removing the dry film to obtain an inner layer pattern; printing electroplating-resistant materials on the inner layer patterns;
manufacturing an outer layer:
the core board is pressed, the outer layer of the pressed core board is drilled, hole metallization processing is conducted on the drilled holes, the outer layer of the core board is manufactured through conventional PCB outer layer pattern manufacturing equipment, silk-screen printing solder mask operation is conducted after the outer layer pattern is manufactured, silk-screen printing solder mask ink is added, the solder mask ink is attached to the board, silk-screen printing character operation is conducted, then the board is sent into a board routing machine to conduct shape-entering board routing operation, and finally surface processing is conducted, and the outer layer is manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483601.4A CN112752446A (en) | 2020-12-15 | 2020-12-15 | Broken hole manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483601.4A CN112752446A (en) | 2020-12-15 | 2020-12-15 | Broken hole manufacturing process |
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| Publication Number | Publication Date |
|---|---|
| CN112752446A true CN112752446A (en) | 2021-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011483601.4A Pending CN112752446A (en) | 2020-12-15 | 2020-12-15 | Broken hole manufacturing process |
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| CN (1) | CN112752446A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687342A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Printed circuit board with break hole and production method of printed circuit board |
| CN103687341A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Method for forming breakage holes in printed circuit board |
| CN108770244A (en) * | 2018-08-06 | 2018-11-06 | 重庆科技学院 | A kind of production method of compound pcb plates |
| CN108848630A (en) * | 2018-07-24 | 2018-11-20 | 北大方正集团有限公司 | Circuit board processing method and electronic equipment |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
-
2020
- 2020-12-15 CN CN202011483601.4A patent/CN112752446A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687342A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Printed circuit board with break hole and production method of printed circuit board |
| CN103687341A (en) * | 2013-12-02 | 2014-03-26 | 广州美维电子有限公司 | Method for forming breakage holes in printed circuit board |
| CN108848630A (en) * | 2018-07-24 | 2018-11-20 | 北大方正集团有限公司 | Circuit board processing method and electronic equipment |
| CN108770244A (en) * | 2018-08-06 | 2018-11-06 | 重庆科技学院 | A kind of production method of compound pcb plates |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
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Application publication date: 20210504 |