CN105430925A - Fabrication method of thick copper circuit board - Google Patents
Fabrication method of thick copper circuit board Download PDFInfo
- Publication number
- CN105430925A CN105430925A CN201510962814.8A CN201510962814A CN105430925A CN 105430925 A CN105430925 A CN 105430925A CN 201510962814 A CN201510962814 A CN 201510962814A CN 105430925 A CN105430925 A CN 105430925A
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- Prior art keywords
- copper
- plate
- copper plate
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- film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a fabrication method of a thick copper circuit board. The method comprises the following steps: a first sub-process, namely etching away copper on a copper-clad plate to form an optical substrate, and forming a compact brownification film on the optical substrate to improve subsequent pressing adhesion; a second sub-process, namely pasting a photosensitive dry film on a red copper plate, carrying out selective exposure by a graph film to form a required graph, carrying out developing, etching away the exposed copper at the etching depth which is 2/3 thickness of the red copper plate, and then removing a dry film as a resistant layer to form the red copper plate with a circuit graph on one surface and a complete copper surface on the other surface; and a third sub-process, namely adding a prepreg for pressing between the optical substrate and the red copper plate to bond the optical substrate and the red copper plate together, wherein the circuit graph of the red copper plate is toward the optical substrate. According to the fabrication plate of the thick copper circuit board, the abnormal problems that a thick copper plate is difficult to purchase in the market, the lateral erosion amount is large due to the thick copper, oil is seriously accumulated in circuit sides when the thick copper plate is fabricated, and the oil does not infiltrate between circuits are solved.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly a kind of thick copper circuit board manufacturing method.
Background technology
Along with the fast development of automotive electronics, printed circuit board not only will for electronic devices and components provide electrical equipment be electrically connected and mechanical support, have simultaneously power supply integrated, provide big current etc. also to become the additional function of wiring board.So product design is also more and more higher to the requirement that copper is thick, more than 350 μm are reached.
There is following problem points in the thick copper coin of the making more than 350 μm of current industry: 1. for the thick requirement of copper at 350 μm and above sheet material, market cannot be bought, manufacturing factory generally adopts the mode of plating to thicken copper, and Direct Electroplating thickening can cause the thick uniformity of copper not good, harmful effect is caused to follow-up quality.2. due to the thick super thick of copper, need the amount of etching relatively large, then lateral erosion effect is serious, and after etching, live width is comparatively difficult to ensure card.3. Copper Foil is too thick can cause when causing welding resistance to make line limit seriously poly-oil, not descend wet goods exception between line and line.
Summary of the invention
The invention provides a kind of not high to equipment requirement, do not need to use special Copper Foil, the problem that the side etching quantity that causes because copper is thick can be avoided large, thick copper coin when making line limit seriously poly-oil, do not descend the thick copper circuit board manufacturing method of wet goods abnormal problem between line and line.
For solving the problem, as one aspect of the present invention, provide a kind of thick copper circuit board manufacturing method, comprise: the first sub-process: use plate shearing machine open copper-clad plate and formed in this copper-clad plate for the first registration holes, and then the copper that copper-clad plate carries is etched away to form photopolymer substrate, on photopolymer substrate, then form the brown film of one deck densification to promote the adhesion of follow-up pressing; Second sub-process: use plate shearing machine open copper plate and formed for the second registration holes with the first registration holes contraposition on this copper plate, then on copper plate, paste one deck photosensitive dry film and use the figure film to carry out selectivity exposure and develop after forming required figure, then the copper exposed to be etched away and etch depth is 2/3 of copper plate thickness, then remove the dry film copper plate that one side is line pattern to be formed, another side is complete copper face as resist layer; Then form the brown organic metal film of one deck on the surface of copper plate, organic metal film embeds the surface of copper plate and when pressing plate and between resin, forms the latticed conversion coating of one deck to strengthen the adhesion between copper plate and resin; 3rd sub-process: add one deck prepreg between the copper plate that the photopolymer substrate obtained in the first sub-process and the second sub-process obtain and carry out pressing, to make photopolymer substrate and copper plate be bonded together, wherein, the line pattern of copper plate is towards photopolymer substrate.
Preferably, also comprise after the 3rd sub-process: step 1, use digital control drilling machine hole and run through predetermined level; Step 2, use the mode of chemical deposition by hole wall and plate electricity surface metalation, hole copper and face copper are thickeied 5-8um by the mode using whole plate to electroplate; Step 3, the plate after step 2 being processed sticks one deck photosensitive dry film, uses the figure film to carry out selectivity exposure, the figure required for formation, then is developed by alkalescent liquid medicine; Step 4, uses the mode of plating, carries out electro-coppering thickening, then electroplate last layer resist layer, and resist layer is tin to the plate after step 3 processes; Step 5, removes photosensitive dry film with highly basic liquid medicine, and uses the liquid medicine of strong oxidizing property to be removed by the copper exposed, and re-uses the tin that the acid liquid medicine of band removes resist layer, finally forms circuit.
Preferably, also comprise after step 5: step 6, making plate whole plate after nog plate pre-treatment stamp solder mask, then being removed needing the ink in surface treatment place by exposure imaging, then at baking box, solder mask is solidified, form the final welding resistance figure needed; Step 7, carries out subsequent treatment to plate, comprises the operations such as silk-screen character, surface treatment, sharp processing, electric performance test and Surface testing.
Thus method in the present invention without the special Copper Foil of circuit board, can solve the problem that thick copper coin market difficulty is bought.In addition, also solve because of the large problem of the thick side etching quantity caused of copper, the quality of live width can be ensured accurately.Finally, this method can solve line limit when thick copper coin makes and seriously gather oil, do not descend wet goods abnormal problem between line and line, and not high to equipment requirement, and general wiring board manufacturing firm can make.
Embodiment
Below embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
The invention provides a kind of thick copper (refer to especially and be greater than more than 350 μm) method for manufacturing circuit board, comprising:
First sub-process: use plate shearing machine open copper-clad plate and formed in this copper-clad plate for the first registration holes, and then use alkalescence or acid liquid medicine to be etched away to form photopolymer substrate by the copper that described copper-clad plate carries, on described photopolymer substrate, then form the brown film of one deck densification to promote the adhesion of follow-up pressing; Preferably, brown film is formed by oxidant, utilizes the surface of this oxidant clear light substrate during concrete operations, forms brown film on photopolymer substrate simultaneously;
Second sub-process: use plate shearing machine open copper plate and formed for the second registration holes with described first registration holes contraposition on this copper plate, then on described copper plate, paste one deck photosensitive dry film and use the figure film to carry out selectivity exposure to utilize after forming required figure alkalescent liquid medicine to carry out to develop, (there is subsides dry film on the two sides of copper coin, the side of exposure imaging/etching is circuit surface afterwards, although what one side was pasted in addition has dry film but does not expose), then the liquid medicine of strong oxidizing property is used to be etched away by the copper exposed and etch depth is 2/3 of copper plate thickness, re-use the described dry film of alkaline liquid medicine removing as resist layer to form one side for line pattern, another side is the copper plate (namely this face is completely smooth) of complete copper face, then form the brown organic metal film of one deck on the surface of described copper plate, described organic metal film embeds the surface of copper plate and when pressing plate and between resin, forms the latticed conversion coating of one deck to strengthen the adhesion between copper plate and resin,
3rd sub-process: add one deck prepreg between the copper plate that the photopolymer substrate obtained in described first sub-process and described second sub-process obtain and carry out pressing, at the environment of HTHP and vacuum, prepreg is made to complete transformation from semi-cured state-liquid-solid, be bonded together to make described photopolymer substrate and described copper plate, wherein, the line pattern of described copper plate is towards described photopolymer substrate.Preferably, this brown organic metal film is generated by a kind of oxidant.
The main cause that quality problem of the prior art produces is because the layers of copper of leaking outside is too thick, and the above-mentioned technological process in this patent, should be embedded in the inside by 2/3 thickness copper outside by prior art, the thickness be exposed is made to only have 1/3, because this eliminating these quality problem.Visible, owing to have employed technique scheme, thus the method in the present invention without the special Copper Foil of circuit board, can solve the problem that thick copper coin market difficulty is bought.In addition, also solve because of the large problem of the thick side etching quantity caused of copper, the quality of live width can be ensured accurately.Finally, this method can solve line limit when thick copper coin makes and seriously gather oil, do not descend wet goods abnormal problem between line and line, and not high to equipment requirement, and general wiring board manufacturing firm can make.
Preferably, also comprise after described 3rd sub-process:
Step 1, uses digital control drilling machine hole and run through predetermined level;
Step 2, uses the mode of chemical deposition by hole wall and electric plating of whole board surface metalation, and hole copper and face copper are thickeied 5-8um by the mode using whole plate to electroplate;
Step 3, the plate after step 2 being processed sticks one deck photosensitive dry film, uses the figure film to carry out selectivity exposure, the figure required for formation, then is developed by alkalescent liquid medicine;
Step 4, uses the mode of plating, carries out electro-coppering thickening, then electroplate last layer resist layer, and resist layer is tin to the plate after step 3 processes;
Step 5, removes described photosensitive dry film with highly basic liquid medicine, and uses the liquid medicine of strong oxidizing property to be removed by the copper exposed, and re-uses the tin that the acid liquid medicine of band removes resist layer, finally forms circuit.
Preferably, also comprise after described step 5:
Step 6, is made plate whole plate after nog plate pre-treatment stamp solder mask, then being removed needing the ink in surface treatment place by exposure imaging, then being solidified by solder mask at baking box, forms the final welding resistance figure needed;
Step 7, carries out subsequent treatment to plate, comprises the operations such as silk-screen character, surface treatment, sharp processing, electric performance test and Surface testing.
Be only the preferred embodiments of the present invention described in upper, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a thick copper circuit board manufacturing method, is characterized in that, comprising:
First sub-process: use plate shearing machine open copper-clad plate and formed in this copper-clad plate for the first registration holes, and then the copper that described copper-clad plate carries is etched away to form photopolymer substrate, on described photopolymer substrate, then form the brown film of one deck densification to promote the adhesion of follow-up pressing;
Second sub-process: use plate shearing machine open copper plate and formed for the second registration holes with described first registration holes contraposition on this copper plate, then on described copper plate, paste one deck photosensitive dry film and use the figure film to carry out selectivity exposure and develop after forming required figure, then the copper exposed to be etched away and etch depth is 2/3 of copper plate thickness, then remove the described dry film copper plate that one side is line pattern to be formed, another side is complete copper face as resist layer; Then form the brown organic metal film of one deck on the surface of described copper plate, described organic metal film embeds the surface of copper plate and when pressing plate and between resin, forms the latticed conversion coating of one deck to strengthen the adhesion between copper plate and resin;
3rd sub-process: add one deck prepreg between the copper plate that the photopolymer substrate obtained in described first sub-process and described second sub-process obtain and carry out pressing, be bonded together to make described photopolymer substrate and described copper plate, wherein, the line pattern of described copper plate is towards described photopolymer substrate.
2. thick copper circuit board manufacturing method according to claim 1, is characterized in that, also comprises after described 3rd sub-process:
Step 1, uses digital control drilling machine hole and run through predetermined level;
Step 2, use the mode of chemical deposition by hole wall and plate electricity surface metalation, hole copper and face copper are thickeied 5-8um by the mode using whole plate to electroplate;
Step 3, the plate after step 2 being processed sticks one deck photosensitive dry film, uses the figure film to carry out selectivity exposure, the figure required for formation, then is developed by alkalescent liquid medicine;
Step 4, uses the mode of plating, carries out electro-coppering thickening, then electroplate last layer resist layer, and resist layer is tin to the plate after step 3 processes;
Step 5, removes described photosensitive dry film with highly basic liquid medicine, and uses the liquid medicine of strong oxidizing property to be removed by the copper exposed, and re-uses the tin that the acid liquid medicine of band removes resist layer, finally forms circuit.
3. the thick copper circuit board manufacturing method according to claim 1 and 2, is characterized in that, also comprises after described step 5
Step 6, is made plate whole plate after nog plate pre-treatment stamp solder mask, then being removed needing the ink in surface treatment place by exposure imaging, then being solidified by solder mask at baking box, forms the final welding resistance figure needed;
Step 7, carries out subsequent treatment to plate, comprises the operations such as silk-screen character, surface treatment, sharp processing, electric performance test and Surface testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962814.8A CN105430925B (en) | 2015-12-21 | 2015-12-21 | Thick copper circuit board manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510962814.8A CN105430925B (en) | 2015-12-21 | 2015-12-21 | Thick copper circuit board manufacturing method |
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| Publication Number | Publication Date |
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| CN105430925A true CN105430925A (en) | 2016-03-23 |
| CN105430925B CN105430925B (en) | 2018-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510962814.8A Active CN105430925B (en) | 2015-12-21 | 2015-12-21 | Thick copper circuit board manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055774A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of selectivity thick copper circuit production method |
| CN111328217A (en) * | 2020-04-09 | 2020-06-23 | 江苏普诺威电子股份有限公司 | MEMS packaging carrier plate stack structure and manufacturing method thereof |
| CN113873748A (en) * | 2021-09-28 | 2021-12-31 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201608973U (en) * | 2010-01-22 | 2010-10-13 | 深圳市牧泰莱电路技术有限公司 | Thick copper PCB plate |
| WO2014075559A1 (en) * | 2012-11-13 | 2014-05-22 | 北大方正集团有限公司 | Multi-layer thick copper circuit board manufacturing method and dual-side thick copper circuit board manufacturing method |
| CN104582292A (en) * | 2013-10-18 | 2015-04-29 | 深南电路有限公司 | Thick copper circuit board processing method |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
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2015
- 2015-12-21 CN CN201510962814.8A patent/CN105430925B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201608973U (en) * | 2010-01-22 | 2010-10-13 | 深圳市牧泰莱电路技术有限公司 | Thick copper PCB plate |
| WO2014075559A1 (en) * | 2012-11-13 | 2014-05-22 | 北大方正集团有限公司 | Multi-layer thick copper circuit board manufacturing method and dual-side thick copper circuit board manufacturing method |
| CN104582292A (en) * | 2013-10-18 | 2015-04-29 | 深南电路有限公司 | Thick copper circuit board processing method |
| CN104684257A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of thick copper circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055774A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of selectivity thick copper circuit production method |
| WO2019090860A1 (en) * | 2017-11-09 | 2019-05-16 | 建业科技电子（惠州）有限公司 | Method for selectively manufacturing thick copper circuit |
| CN111328217A (en) * | 2020-04-09 | 2020-06-23 | 江苏普诺威电子股份有限公司 | MEMS packaging carrier plate stack structure and manufacturing method thereof |
| CN113873748A (en) * | 2021-09-28 | 2021-12-31 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
| CN113873748B (en) * | 2021-09-28 | 2022-05-10 | 广东合通建业科技股份有限公司 | Circuit board of transparent LED display screen and manufacturing process |
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| Publication number | Publication date |
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| CN105430925B (en) | 2018-06-01 |
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Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Applicant after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Applicant before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
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