CN108055774A - A kind of selectivity thick copper circuit production method - Google Patents
A kind of selectivity thick copper circuit production method Download PDFInfo
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- CN108055774A CN108055774A CN201711094324.6A CN201711094324A CN108055774A CN 108055774 A CN108055774 A CN 108055774A CN 201711094324 A CN201711094324 A CN 201711094324A CN 108055774 A CN108055774 A CN 108055774A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of selective thick copper circuit production methods, include the following steps：Pressing, drilling, prepare circuit and subsequent processing at ink silk screen printing；The present invention can not have to the special copper foil of circuit board, thus solves the problems, such as the difficult purchase in thick copper coin market, it can solve line side when thick copper coin makes and seriously gather oil, the abnormal problems such as oil are not played between line and line, it is and not high to equipment requirement, general wiring board manufacturing firm can make, therefore work flow can be reduced, reduce production cost, also it is avoided that the generation of bubbles of ink, thick copper drilling and the drilling of resin ink are considered the problems of simultaneously, divide three sections of drillings, prevent hole edge resin cracks, and also according to different brill nozzle diameters during drilling, adjust suitable resin drilling and thick copper drilling rotating speed, terminal-velocity, the factors such as hole count and time speed, further prevent hole edge resin cracks.
Description
Technical field
The present invention relates to circuit board production techniques fields, are specially a kind of selective thick copper circuit production method.
Background technology
Thick copper circuit board bonds one layer of copper foil usually on glass epoxy substrate, the thickness of copper foil usually have 18 μm, 35 μm,
55 μm and 70 μm 4 kinds.Most common copper thickness is 35 μm.The copper thickness that the country uses is generally 35-50 μm, with automobile
The fast development of electronics, printed circuit board will not only provide electric appliance electrical connection and mechanical support for electronic component, simultaneously
It integrated with power supply, provide high current etc. also as the additional function of wiring board.So requirement of the product design to copper thickness is also got over
Come higher, have reached 350 μm or more.There are following problem points for the thick copper coin of 350 μm of making of industry or more at present：It is right
In the thick requirement of copper at 350 μm and more than plate, market can not buy, manufacturing factory generally using thickening copper by the way of electroplating,
And directly electroplating thickening can cause copper thickness uniformity bad, and harmful effect is caused to follow-up quality.Due to copper thickness super thick, it is necessary to lose
The amount at quarter is relatively large, then lateral erosion effect is serious, and line width is relatively difficult to guarantee after etching.Copper foil is too thick to cause welding resistance that can cause line when making
Side, which is seriously gathered, does not play oil etc. abnormal between oil, line and line, while super thick copper circuit board refers to that outer layer finished product copper thickness is not less than 210
The wiring board of micron (6OZ).In the prior art, the resistance welding processing method of super thick copper circuit board is exactly the silk according to common line plate
Print or the technique of spraying, copper face and substrate surface are covered in a manner that multiple welding resistance exposes by ink.However, this method
Work flow is long, and production cost is high, can also because between super-thick copper and base material difference in height it is larger, sky can not be drained in silk-screen printing process
Gas so as to the bubbles of ink problem generated, and in drilling operating, due to the mismatch of resin drilling and thick copper drilling, easily causes
Bore edges resin cracks.
So how to design a kind of selective thick copper circuit production method, becoming us will currently solve the problems, such as.
The content of the invention
The present invention provides a kind of selective thick copper circuit production method, can not have to the special copper foil of circuit board, thus solves
The problem of difficult purchase in thick copper coin market, can solve line side when thick copper coin makes and seriously gather between oil, line and line not playing the oil etc. different
Chang Wenti, and it is not high to equipment requirement, general wiring board manufacturing firm can make, therefore can reduce work flow, drop
Low production cost, is also avoided that the generation of bubbles of ink, while considers the problems of thick copper drilling and the drilling of resin ink, divides three sections
Drilling also according to different brill nozzle diameters when preventing hole edge resin cracks and drilling, adjusts suitable resin drilling and thick copper
Drill the factors such as rotating speed, terminal-velocity, hole count and time speed, further prevents hole edge resin cracks, can effectively solve above-mentioned background
The problem of in technology.
To achieve the above object, the present invention provides following technical solution：A kind of selectivity thick copper circuit production method, including
Following steps：
1) press：Photopolymer substrate and copper plate are first prepared respectively using plate shearing machine, then in the photopolymer substrate and the red copper
One layer of prepreg is added between plate to be pressed, so that the photopolymer substrate is bonded together with the copper plate, wherein, it is described
The line pattern of copper plate is towards the photopolymer substrate；
2) drill：It is drilled using digital control drilling machine and runs through predetermined level, specially divide 3 sections of drillings, every section of ratio is
1:0.9-1.1:0.9-1.1；The brill nozzle used in the drilling：If a diameter of 0.1mm, rotating speed 115-126krpm, terminal-velocity is
19-22ipm, Hui Su 500ipm, institute's hole number are up to 200；If a diameter of 0.15mm, rotating speed 110-125krpm, terminal-velocity
For 20-24ipm, institute's hole number is up to 300, Hui Su 500ipm；If a diameter of 0.20mm, rotating speed 110-125krpm, fall
Speed is 22-26ipm, and institute's hole number is up to 500, Hui Su 500ipm；If a diameter of 0.25mm, rotating speed 110-120krpm,
Terminal-velocity is 23-27ipm, and institute's hole number is up to 500, Hui Su 500ipm；
3) ink silk screen printing：Using the mode of aerial spraying, first time whole plate spraying is carried out on the super thick copper circuit board
Ink；First time prebake is carried out to the super thick copper circuit board；Then using the egative film with predetermined pattern to the super thick
Copper circuit board is exposed, and first time windowing is carried out among the copper sheet upper surface of the super thick copper circuit board；To the copper sheet
Side and substrate surface carry out for the first time filling ink；Second of whole plate spraying ink is carried out on super thick copper circuit board；
Second of prebake is carried out to the super thick copper circuit board；Second is carried out among the copper sheet upper surface of the super thick copper circuit board
Secondary windowing；Side and substrate surface to the copper sheet carry out second of filling ink；The super thick copper circuit board is carried out
Precuring；Welding resistance exposure is carried out to the super thick copper circuit board；
4) circuit is prepared：Using the mode of chemical deposition by hole wall and plate electricity surface metalation, the side electroplated using whole plate
Hole copper and face copper are thickeied 5-8um by formula；Last layer photosensitive dry film will be pasted on treated plate, be selected using the figure film
Selecting property exposes, and forms required figure, then is developed by alkalescent liquid medicine；Using the mode of plating, to treated
Plate carries out electro-coppering thickening, then electroplates last layer resist layer, and resist layer is tin；With highly basic liquid medicine by the photosensitive dry
Film removes, and is removed the copper exposed using the liquid medicine of strong oxidizing property, reuses the tin for removing resist layer with acid liquid medicine,
Ultimately form circuit；
5) subsequent processing：Subsequent processing is carried out to plate, is surveyed including silk-screen character, surface treatment, sharp processing, electrical property
The processes such as examination and Surface testing.
According to above-mentioned technical proposal, first time prebake and second of prebake is specially at 75 DEG C in the step 3)
Under, continue 40 minutes.
According to above-mentioned technical proposal, precuring temperature is 160-190 DEG C in the step 3), time 50-75min.
Preparing photopolymer substrate using plate shearing machine according to above-mentioned technical proposal, in the step 1) is specially：It is opened using plate shearing machine
Copper-clad plate is simultaneously formed in the copper-clad plate for the first registration holes, then again etches away the copper carried in copper-clad plate to form light
Substrate then forms one layer of fine and close brown film to promote the combination power subsequently pressed on photopolymer substrate.
According to above-mentioned technical proposal, it is specially to open red copper using plate shearing machine that the step 1) prepares copper plate using plate shearing machine
Plate simultaneously forms the second registration holes aligned with the first registration holes on the copper plate, and then one layer of patch is photosensitive on copper plate
Property dry film and expose to develop after forming required figure using making choice property of the figure film, will then expose
Copper etches away and etch depth is the 2/3 of red copper plate thickness, then removes the dry film as resist layer to form one side as line map
Shape, the copper plate that another side is complete copper face；Then one layer of brown organic metal film, organic metal are formed on the surface of copper plate
The surface of film insertion copper plate simultaneously forms one layer of latticed conversion coating to enhance copper plate and resin in pressing plate between resin
Between combination power.
According to above-mentioned technical proposal, if a diameter of 0.30mm in the step 2), rotating speed 95-100krpm, terminal-velocity are
25-29ipm, institute's hole number are up to 500, Hui Su 500ipm；If a diameter of 0.35mm, rotating speed 76-85krpm, terminal-velocity is
30-31ipm, institute's hole number are up to 800, Hui Su 500ipm；If a diameter of 0.40mm, rotating speed 70-76krpm, terminal-velocity is
30-32ipm, institute's hole number are up to 800, Hui Su 500ipm.
According to above-mentioned technical proposal, if a diameter of 0.45mm in the step 2), rotating speed 63-67krpm, terminal-velocity 31-
33ipm, institute's hole number are up to 800, Hui Su 500ipm；If a diameter of 0.50mm, rotating speed 55-60krpm, terminal-velocity 33-
35ipm, institute's hole number are up to 800, return speed 500ipm；If a diameter of 0.55mm, rotating speed 50-55krpm, terminal-velocity 33-
35ipm, institute's hole number are up to 800, Hui Su 700ipm；If a diameter of 0.60mm, rotating speed 45-50krpm, terminal-velocity 68-
72ipm, institute's hole number are up to 1200, Hui Su 700ipm；If a diameter of 0.65mm, rotating speed 42-46krpm, terminal-velocity is
68-72ipm, institute's hole number are up to 1200, Hui Su 700ipm；If a diameter of 0.70mm, rotating speed 40-45krpm, terminal-velocity
For 36-38ipm, institute's hole number is up to 1200, Hui Su 700ipm；If a diameter of 0.75mm, rotating speed 35-40krpm, fall
Speed is 37-40ipm, and institute's hole number is up to 1200, Hui Su 700ipm.
Compared with prior art, beneficial effects of the present invention：It can not have to the special copper foil of circuit board, thus solve thick copper
The problem of plate market hardly possible purchase, can solve line side when thick copper coin makes and seriously not play the abnormal problems such as oil between poly- oil, line and line,
And it is not high to equipment requirement, general wiring board manufacturing firm can make, therefore can reduce work flow, and reduction is produced into
This, is also avoided that the generation of bubbles of ink, while considers the problems of thick copper drilling and the drilling of resin ink, and point three sections of drillings are prevented
Only hole edge resin cracks and during drilling also according to different brill nozzle diameters, adjust suitable resin drilling and thick copper drilling turn
The factors such as speed, terminal-velocity, hole count and time speed, further prevent hole edge resin cracks.
Description of the drawings
Attached drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Example is applied together for explaining the present invention, is not construed as limiting the invention.
In the accompanying drawings：
Fig. 1 is the production process figure of the present invention.
Specific embodiment
The preferred embodiment of the present invention is illustrated below in conjunction with attached drawing, it should be understood that preferred reality described herein
It applies example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Embodiment：As shown in Figure 1, the present invention provides a kind of selective thick copper circuit production method, include the following steps：
1) press：Photopolymer substrate and copper plate are first prepared respectively using plate shearing machine, then in the photopolymer substrate and the red copper
One layer of prepreg is added between plate to be pressed, so that the photopolymer substrate is bonded together with the copper plate, wherein, it is described
The line pattern of copper plate is towards the photopolymer substrate；
2) drill：It is drilled using digital control drilling machine and runs through predetermined level, specially divide 3 sections of drillings, every section of ratio is
1:0.9-1.1:0.9-1.1；The brill nozzle used in the drilling：If a diameter of 0.1mm, rotating speed 115-126krpm, terminal-velocity is
19-22ipm, Hui Su 500ipm, institute's hole number are up to 200；If a diameter of 0.15mm, rotating speed 110-125krpm, terminal-velocity
For 20-24ipm, institute's hole number is up to 300, Hui Su 500ipm；If a diameter of 0.20mm, rotating speed 110-125krpm, fall
Speed is 22-26ipm, and institute's hole number is up to 500, Hui Su 500ipm；If a diameter of 0.25mm, rotating speed 110-120krpm,
Terminal-velocity is 23-27ipm, and institute's hole number is up to 500, Hui Su 500ipm；
3) ink silk screen printing：Using the mode of aerial spraying, first time whole plate spraying is carried out on the super thick copper circuit board
Ink；First time prebake is carried out to the super thick copper circuit board；Then using the egative film with predetermined pattern to the super thick
Copper circuit board is exposed, and first time windowing is carried out among the copper sheet upper surface of the super thick copper circuit board；To the copper sheet
Side and substrate surface carry out for the first time filling ink；Second of whole plate spraying ink is carried out on super thick copper circuit board；
Second of prebake is carried out to the super thick copper circuit board；Second is carried out among the copper sheet upper surface of the super thick copper circuit board
Secondary windowing；Side and substrate surface to the copper sheet carry out second of filling ink；The super thick copper circuit board is carried out
Precuring；Welding resistance exposure is carried out to the super thick copper circuit board；
4) circuit is prepared：Using the mode of chemical deposition by hole wall and plate electricity surface metalation, the side electroplated using whole plate
Hole copper and face copper are thickeied 5-8um by formula；Last layer photosensitive dry film will be pasted on treated plate, be selected using the figure film
Selecting property exposes, and forms required figure, then is developed by alkalescent liquid medicine；Using the mode of plating, to treated
Plate carries out electro-coppering thickening, then electroplates last layer resist layer, and resist layer is tin；With highly basic liquid medicine by the photosensitive dry
Film removes, and is removed the copper exposed using the liquid medicine of strong oxidizing property, reuses the tin for removing resist layer with acid liquid medicine,
Ultimately form circuit；
5) subsequent processing：Subsequent processing is carried out to plate, is surveyed including silk-screen character, surface treatment, sharp processing, electrical property
The processes such as examination and Surface testing.
According to above-mentioned technical proposal, first time prebake and second of prebake is specially at 75 DEG C in the step 3)
Under, continue 40 minutes.
According to above-mentioned technical proposal, precuring temperature is 160-190 DEG C in the step 3), time 50-75min.
Preparing photopolymer substrate using plate shearing machine according to above-mentioned technical proposal, in the step 1) is specially：It is opened using plate shearing machine
Copper-clad plate is simultaneously formed in the copper-clad plate for the first registration holes, then again etches away the copper carried in copper-clad plate to form light
Substrate then forms one layer of fine and close brown film to promote the combination power subsequently pressed on photopolymer substrate.
According to above-mentioned technical proposal, it is specially to open red copper using plate shearing machine that the step 1) prepares copper plate using plate shearing machine
Plate simultaneously forms the second registration holes aligned with the first registration holes on the copper plate, and then one layer of patch is photosensitive on copper plate
Property dry film and expose to develop after forming required figure using making choice property of the figure film, will then expose
Copper etches away and etch depth is the 2/3 of red copper plate thickness, then removes the dry film as resist layer to form one side as line map
Shape, the copper plate that another side is complete copper face；Then one layer of brown organic metal film, organic metal are formed on the surface of copper plate
The surface of film insertion copper plate simultaneously forms one layer of latticed conversion coating to enhance copper plate and resin in pressing plate between resin
Between combination power.
According to above-mentioned technical proposal, if a diameter of 0.30mm in the step 2), rotating speed 95-100krpm, terminal-velocity are
25-29ipm, institute's hole number are up to 500, Hui Su 500ipm；If a diameter of 0.35mm, rotating speed 76-85krpm, terminal-velocity is
30-31ipm, institute's hole number are up to 800, Hui Su 500ipm；If a diameter of 0.40mm, rotating speed 70-76krpm, terminal-velocity is
30-32ipm, institute's hole number are up to 800, Hui Su 500ipm.
According to above-mentioned technical proposal, if a diameter of 0.45mm in the step 2), rotating speed 63-67krpm, terminal-velocity 31-
33ipm, institute's hole number are up to 800, Hui Su 500ipm；If a diameter of 0.50mm, rotating speed 55-60krpm, terminal-velocity 33-
35ipm, institute's hole number are up to 800, return speed 500ipm；If a diameter of 0.55mm, rotating speed 50-55krpm, terminal-velocity 33-
35ipm, institute's hole number are up to 800, Hui Su 700ipm；If a diameter of 0.60mm, rotating speed 45-50krpm, terminal-velocity 68-
72ipm, institute's hole number are up to 1200, Hui Su 700ipm；If a diameter of 0.65mm, rotating speed 42-46krpm, terminal-velocity is
68-72ipm, institute's hole number are up to 1200, Hui Su 700ipm；If a diameter of 0.70mm, rotating speed 40-45krpm, terminal-velocity
For 36-38ipm, institute's hole number is up to 1200, Hui Su 700ipm；If a diameter of 0.75mm, rotating speed 35-40krpm, fall
Speed is 37-40ipm, and institute's hole number is up to 1200, Hui Su 700ipm.
Based on above-mentioned, it is an advantage of the current invention that the special copper foil of circuit board can not had to, thus solves thick copper coin market
The problem of hardly possible purchase, can solve line side when thick copper coin makes and seriously can gathering the abnormal problems such as oil between oil, line and line, and pair set
Standby of less demanding, general wiring board manufacturing firm can make, therefore can reduce work flow, reduce production cost,
It is avoided that the generation of bubbles of ink, while considers the problems of thick copper drilling and the drilling of resin ink, point three sections of drillings prevent hole edge
Also according to different brill nozzle diameters when resin cracks and drilling, adjust suitable resin drilling and thick copper drilling rotating speed, fall
The factors such as speed, hole count and time speed, further prevent hole edge resin cracks.
Finally it should be noted that：The foregoing is merely the preferred embodiments of the present invention, are not intended to limit the invention, to the greatest extent
Pipe is with reference to the foregoing embodiments described in detail the present invention, still can be with for the technology patient of this field
It modifies to the technical solution recorded in foregoing embodiments or equivalent substitution is carried out to which part technical characteristic.It is all
Within the spirit and principles in the present invention, any modifications, equivalent replacements and improvements are made should be included in the guarantor of the present invention
Within the scope of shield.
Claims (7)
1. a kind of selectivity thick copper circuit production method, it is characterised in that：Include the following steps：
1) press：First prepare photopolymer substrate and copper plate respectively using plate shearing machine, then the photopolymer substrate and the copper plate it
Between add in one layer of prepreg and pressed so that the photopolymer substrate is bonded together with the copper plate, wherein, the red copper
The line pattern of plate is towards the photopolymer substrate；
2) drill：It is drilled using digital control drilling machine and runs through predetermined level, specially divide 3 sections of drillings, every section of ratio is 1:
0.9-1.1:0.9-1.1；The brill nozzle used in the drilling：If a diameter of 0.1mm, rotating speed 115-126krpm, terminal-velocity is
19-22ipm, Hui Su 500ipm, institute's hole number are up to 200；If a diameter of 0.15mm, rotating speed 110-125krpm, terminal-velocity
For 20-24ipm, institute's hole number is up to 300, Hui Su 500ipm；If a diameter of 0.20mm, rotating speed 110-125krpm, fall
Speed is 22-26ipm, and institute's hole number is up to 500, Hui Su 500ipm；If a diameter of 0.25mm, rotating speed 110-120krpm,
Terminal-velocity is 23-27ipm, and institute's hole number is up to 500, Hui Su 500ipm；
3) ink silk screen printing：Using the mode of aerial spraying, first time whole plate spraying ink is carried out on the super thick copper circuit board；
First time prebake is carried out to the super thick copper circuit board；Then using the egative film with predetermined pattern to the super thick copper wire
Plate is exposed, and first time windowing is carried out among the copper sheet upper surface of the super thick copper circuit board；To the side of the copper sheet
And substrate surface carries out filling ink for the first time；Second of whole plate spraying ink is carried out on super thick copper circuit board；To described
Super thick copper circuit board carries out second of prebake；It is opened for the second time among the copper sheet upper surface of the super thick copper circuit board
Window；Side and substrate surface to the copper sheet carry out second of filling ink；The super thick copper circuit board is carried out pre- solid
Change；Welding resistance exposure is carried out to the super thick copper circuit board；
4) circuit is prepared：Using the mode of chemical deposition by hole wall and plate electricity surface metalation, the mode electroplated using whole plate is incited somebody to action
Hole copper and face copper thicken 5-8um；Last layer photosensitive dry film will be pasted on treated plate, and use making choice property of the figure film
Exposure, forms required figure, then is developed by alkalescent liquid medicine；Using the mode of plating, to treated plate
Electro-coppering thickening is carried out, then electroplates last layer resist layer, and resist layer is tin；The photosensitive dry film is gone with highly basic liquid medicine
Fall, and removed the copper exposed using the liquid medicine of strong oxidizing property, reuse the tin for removing resist layer with acid liquid medicine, finally
Form circuit；
5) subsequent processing：To plate carry out subsequent processing, including silk-screen character, surface treatment, sharp processing, electric performance test,
And the processes such as Surface testing.
2. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：In the step 3)
Prebake and second of prebake are specially at 75 DEG C, continue 40 minutes.
3. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：It is pre- in the step 3)
Solidification temperature is 160-190 DEG C, time 50-75min.
4. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：Make in the step 1)
Preparing photopolymer substrate with plate shearing machine is specially：Copper-clad plate is opened using plate shearing machine and is formed in the copper-clad plate for the first registration holes,
Then the copper carried in copper-clad plate is etched away again to form photopolymer substrate, one layer of fine and close brown film is then formed on photopolymer substrate
To promote the combination power subsequently pressed.
5. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：The step 1) uses
Plate shearing machine prepare copper plate be specially using plate shearing machine open copper plate and on the copper plate formed for the first registration holes pair
Then second registration holes of position are pasted one layer of photosensitive dry film on copper plate and are exposed using making choice property of the figure film with shape
Develop after into required figure, then the copper exposed is etched away and etch depth is the 2/3 of red copper plate thickness, then
Remove as the dry film of resist layer using formed on one side for line pattern, another side as complete copper face copper plate；Then in red copper
The surface of plate forms one layer of brown organic metal film, and organic metal film is embedded in the surface of copper plate and in pressing plate between resin
One layer of latticed conversion coating is formed to enhance the combination power between copper plate and resin.
6. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：If in the step 2)
A diameter of 0.30mm, rotating speed 95-100krpm, terminal-velocity 25-29ipm, institute's hole number are up to 500, Hui Su 500ipm；
If a diameter of 0.35mm, rotating speed 76-85krpm, terminal-velocity 30-31ipm, institute's hole number are up to 800, Hui Su 500ipm；
If a diameter of 0.40mm, rotating speed 70-76krpm, terminal-velocity 30-32ipm, institute's hole number are up to 800, Hui Su 500ipm.
7. a kind of selective thick copper circuit production method according to claim 1, it is characterised in that：If in the step 2)
A diameter of 0.45mm, rotating speed 63-67krpm, terminal-velocity 31-33ipm, institute's hole number are up to 800, Hui Su 500ipm；If
A diameter of 0.50mm, rotating speed 55-60krpm, terminal-velocity 33-35ipm, institute's hole number are up to 800, return speed 500ipm；It is if straight
Footpath is 0.55mm, rotating speed 50-55krpm, terminal-velocity 33-35ipm, and institute's hole number is up to 800, Hui Su 700ipm；It is if straight
Footpath is 0.60mm, rotating speed 45-50krpm, terminal-velocity 68-72ipm, and institute's hole number is up to 1200, Hui Su 700ipm；If
A diameter of 0.65mm, rotating speed 42-46krpm, terminal-velocity 68-72ipm, institute's hole number are up to 1200, Hui Su 700ipm；
If a diameter of 0.70mm, rotating speed 40-45krpm, terminal-velocity 36-38ipm, institute's hole number are up to 1200, Hui Suwei
700ipm；If a diameter of 0.75mm, rotating speed 35-40krpm, terminal-velocity 37-40ipm, institute's hole number are up to 1200, Hui Su
For 700ipm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094324.6A CN108055774A (en) | 2017-11-09 | 2017-11-09 | A kind of selectivity thick copper circuit production method |
| PCT/CN2017/112928 WO2019090860A1 (en) | 2017-11-09 | 2017-11-24 | Method for selectively manufacturing thick copper circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094324.6A CN108055774A (en) | 2017-11-09 | 2017-11-09 | A kind of selectivity thick copper circuit production method |
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| Publication Number | Publication Date |
|---|---|
| CN108055774A true CN108055774A (en) | 2018-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711094324.6A Pending CN108055774A (en) | 2017-11-09 | 2017-11-09 | A kind of selectivity thick copper circuit production method |
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| CN (1) | CN108055774A (en) |
| WO (1) | WO2019090860A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
| CN105430925A (en) * | 2015-12-21 | 2016-03-23 | 深圳市迅捷兴电路技术有限公司 | Fabrication method of thick copper circuit board |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7476422B2 (en) * | 2002-05-23 | 2009-01-13 | Delphi Technologies, Inc. | Copper circuit formed by kinetic spray |
| JP4480693B2 (en) * | 2006-05-29 | 2010-06-16 | 京セラ株式会社 | Wiring board and manufacturing method thereof |
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2017
- 2017-11-09 CN CN201711094324.6A patent/CN108055774A/en active Pending
- 2017-11-24 WO PCT/CN2017/112928 patent/WO2019090860A1/en active Application Filing
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|---|---|---|---|---|
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
| CN105430925A (en) * | 2015-12-21 | 2016-03-23 | 深圳市迅捷兴电路技术有限公司 | Fabrication method of thick copper circuit board |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
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| WO2019090860A1 (en) | 2019-05-16 |
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Application publication date: 20180518 |