CN104411106B - A kind of preparation method of printed circuit board fine-line - Google Patents
A kind of preparation method of printed circuit board fine-line Download PDFInfo
- Publication number
- CN104411106B CN104411106B CN201410650334.3A CN201410650334A CN104411106B CN 104411106 B CN104411106 B CN 104411106B CN 201410650334 A CN201410650334 A CN 201410650334A CN 104411106 B CN104411106 B CN 104411106B
- Authority
- CN
- China
- Prior art keywords
- fine
- line
- dry film
- circuit board
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Abstract
The invention provides a kind of preparation method of printed circuit board fine-line, belong to printed circuit board production field.The present invention is by pasting dry film and exposure imaging formation fine-line groove, then deposited copper seed layer, patch dry film are carried out again, are electroplated and are filled out the processing such as copper, striping, fast-etching, obtain fine-line, the line width and line-spacing of circuit can not only be greatly reduced using the inventive method, moreover it is possible to effectively avoid removing lateral erosion problem caused by copper seed layer.The inventive method is easy to operate, and cost is low, avoids using equipment costly；And the fine-line groove shapes that this method is formed are regular, the irregular problem of groove shapes of laser ablation formation is overcome, obtained circuit shape is complete, is matched with the line width of design, meets resistance requirements.
Description
Technical field
The invention belongs to printed circuit board production field, and in particular to a kind of making side of printed circuit board fine-line
Method.
Background technology
With the miniaturization of electronic equipment, the volume of electronic component is less and less, arranging density more and more higher, and this is required
Wiring board as carriers for electronic components has smaller line width line-spacing；The transmission of high-frequency signal simultaneously and complete to transmission signal
Line impedance design of the requirement of degree to circuit board proposes higher requirement, and corresponding line pattern should have smaller side
The defects of losing, be less, more preferable integrity degree.
The preparation method of circuit board fine-line mainly has three kinds at present：Subtractive process, semi-additive process, fully-additive process.Subtract into
Method is current most widely used method, but it exposes, developed, etching work procedure has a variety of limitations when making fine-line,
Such as：Resolution ratio, the adhesion of dry film, the resolution ratio of the film, the resolution ratio of exposure machine, circuit lateral erosion, blind hole are filled out caused by etching
Fill influence of opposite copper thickness etc. and all limit its application in fine-line making.Fully-additive process needs to produce in material surface
Raw Catalytic Layer, there is special requirement to base material, and its use chemical method formed line layer, fill out blind hole etc. all have to plating solution it is high
Requirement, production cost is high, limits its application in fine-line making.Semi-additive process fine-line making in have compared with
It is widely applied, the integrity degree and cost of its fine-line made are all easier to receive.Traditional semi-additive process is thin
Layers of copper (Seed Layer) patch photosensitive dry film, exposure, development form plating barrier layer, then graphic plating forms circuit, and last full plate subtracts
Copper etches, and removes Seed Layer and obtains electroplating caused figure circuit.When removing Seed Layer, etching solution may flow to this method
Fine-line figure side, cause circuit bottom and side inwardly to produce etchback, fine-line generation lateral erosion, so as to get it is fine
Circuit is imperfect.
The Chinese patent of Application No. 201310460513.6 discloses " a kind of printed circuit board blind hole and fine-line
Processing method ".This method forms line groove by laser ablation, then in one layer of seed copper of plate face and groove surfaces chemical plating
Layer, then paste photosensitive dry film and expose, formation plating barrier layer of developing, line groove and blind hole are filled out by plating, most retreat film, erosion
Quarter forms fine-line.This method is that ablation goes out line groove on substrate, and circuit is then made in groove, passes through this method
It can effectively avoid the lateral erosion problem of circuit, but material difference due to substrate surface and the energy of laser ablation are difficult to control,
The fine-line groove of complete rule is hardly resulted in, and laser ablation is time-consuming, cost is high, efficiency is low, is difficult to high-volume work
Industry metaplasia is produced.
The content of the invention
A kind of the defects of present invention exists for background technology, it is proposed that preparation method of printed circuit board fine-line.
This method is simple to operate, and cost is low, efficiency high, efficiently solves the problems, such as the lateral erosion of fine-line, obtained fine-line have compared with
Good integrality and regular shape.
Technical scheme is as follows：
A kind of preparation method of printed circuit board fine-line, comprises the following steps：
Step 1：The first dry film 111 is pasted on the surface of base material 110 of not cupric, is then exposed, development treatment, obtains essence
Fine rule road groove 113；
Step 2：Copper plating treatment is carried out in the substrate surface after step 1 processing, makes upper surface and the essence of the first dry film 111
The inner surface of fine rule road groove 113 forms copper seed layer 210；
Step 3：The second dry film 112 is pasted on the copper seed layer surface obtained after step 2 processing, is then exposed, shows
Shadow processing, exposes fine-line groove 113；
Step 4：Plating is carried out to the base material after step 3 processing and fills out Copper treatment, fine-line groove 113 is filled full；
Step 5：Film process is carried out to the base material after step 4 processing, removes the second dry film 112, is then carried out quick
Etching, the copper seed layer on the first dry film 111 is removed, then carry out film process, remove the first dry film 111, complete fine-line
Making.
Further, the base material described in step 1 is by one kind in epoxy resin, phenolic resin, polytetrafluoroethylene (PTFE) or several
Kind forms with glass fabric.
Further, above-mentioned first dry film 111 is acid resistance dry film against corrosion, and its thickness is 30~50 μm；Above-mentioned second is dry
Film 112 is acid resistance dry film against corrosion, and its thickness is 10~30 μm.
Further, in step 2 substrate surface carry out copper plating treatment before, first base material is deoiled, is roughened, is presoaked and
Activation process.
Further, the copper seed layer 210 described in step 2 is obtained using the method for electroless copper, and the copper seed layer
Thickness be 1~3 μm.
Further, the plating solution used in step 2 when substrate surface carries out copper plating treatment is acidic bath.
Further, H in the plating solution used when carrying out to base material in step 4 and electroplate and fill out Copper treatment2SO4Mass concentration be
40~60g/L, CuSO4·5H2O mass concentration is 180~210g/L；Plating fill out the electroplating time of Copper treatment for 30~
60min, current density are 1.0~1.2A/dm2。
Further, it is NaOH solution that the film liquid of going used in film process is gone in step 5.Fast-etching is used in step 5
Etching solution be H2SO4-H2O2Etching solution.
Beneficial effects of the present invention are：
1st, the preparation method of printed circuit board fine-line provided by the invention is by pasting dry film and exposure imaging is formed
Fine-line groove, deposited copper seed layer, patch dry film are then carried out again, electroplates and fills out the processing such as copper, striping, fast-etching, is used
The inventive method can not only greatly reduce the line width and line-spacing of circuit, moreover it is possible to effectively avoid removing lateral erosion caused by copper seed layer
Problem.
2nd, the preparation method of fine-line provided by the invention is easy to operate, and cost is low, avoids using setting costly
It is standby；And the fine-line groove shapes that this method is formed are regular, the groove shapes for overcoming laser ablation formation irregular are asked
Topic, obtained circuit shape is complete, is matched with the line width of design, meets resistance requirements.
Brief description of the drawings
Fig. 1 is the signal of the present invention that the fine-line groove obtained after dry film and exposure imaging is pasted in substrate surface
Figure.
Fig. 2 is the structural representation of the base material after substrate surface copper plating treatment described in step 2 of the present invention.
Fig. 3 is the structural representation of the present invention that the base material that dry film and exposure imaging obtain is pasted on copper seed layer surface.
Fig. 4 is the structural representation of the present invention that plating is carried out to base material and is filled out after Copper treatment.
Fig. 5 is the schematic diagram for the printed circuit board fine-line for making to obtain using the inventive method.
Wherein, 110 be base material, and 111 be the first dry film, and 112 be the second dry film, and 113 be fine-line groove, and 210 be copper
Seed Layer, 310 be copper electroplating layer.
Embodiment
The present invention is further described with reference to the accompanying drawings and examples.
Embodiment
A kind of preparation method of printed circuit board fine-line, comprises the following steps：
Step 1：The first dry film 111 is pasted on the surface of base material 110 of not cupric, is then exposed, development treatment, obtains essence
Fine rule road groove 113, as shown in Figure 1；
Step 2：Copper plating treatment is carried out in the substrate surface after step 1 processing, makes upper surface and the essence of the first dry film 111
The inner surface of fine rule road groove 113 forms copper seed layer 210, as shown in Figure 2；
Step 3：The second dry film 112 is pasted on the copper seed layer surface obtained after step 2 processing, is then exposed, shows
Shadow processing, exposes fine-line groove 113, as shown in Figure 3；
Step 4：Plating is carried out to the base material after step 3 processing and fills out Copper treatment, fine-line groove 113 is filled completely,
As shown in Figure 4；
Step 5：Film process is carried out to the base material after step 4 processing, removes the second dry film 112, is then carried out quick
Etching, the copper seed layer on the first dry film 111 is removed, then carry out film process, remove the first dry film 111, complete fine-line
Making, as shown in Figure 5.
Further, described in step 1 not the base material 110 of cupric by epoxy resin, phenolic resin, polytetrafluoroethylene (PTFE)
One or more of to be formed with glass fabric, the base material 110 of the not cupric can be one side not cupric, i.e. one in not cupric
Face makes fine-line or two-sided not cuprics, then can make fine-line on two sides.
To guarantee the electroless copper plating in acidity, first dry film 111 is acid resistance dry film against corrosion, to ensure that circuit is recessed
Groove depth, the thickness of the first dry film is 30~50 μm.
Exposure-processed described in step 1 is completed using laser direct imaging system.Specifically, in the base material 110 of not cupric
After the first dry film 111 is pasted on surface, make the first dry film of substrate surface that exposure chemical reaction occur using laser direct imaging method,
Removed after development and photochemically reactive dry film does not occur, so as to expose fine-line groove 113.
Described in step 2 before substrate surface carries out copper plating treatment, first base material is deoiled, be roughened, presoaked and activated
Processing, the thickness for the copper seed layer that the electroless copper plating obtains is 1~3 μm.It is equal for the stability of guarantee dry film, its all technique
Carried out under acid or neutral system.
The second dry film 112 described in step 3 is acid resistance dry film against corrosion, and to ensure to expose circuit precision, its thickness is
10~30 μm.
Exposure-processed described in step 3 is completed using laser direct imaging system.Specifically, handled by step 2
After the second dry film is pasted on the copper seed layer surface obtained afterwards, it is exposed using laser direct imaging method, makes logicalnot circuit part surface
Dry film photochemical reaction occurs, the dry film that does not react of fine-line groove part is removed after development, it is fine so as to expose
Line groove 113.
H in the plating solution used when carrying out to base material in step 4 and electroplate and fill out Copper treatment2SO4Mass concentration be 40~60g/L,
CuSO4·5H2O mass concentration is 180~210g/L；The electroplating time that Copper treatment is filled out in plating is 30~60min, current density
For 1.0~1.2A/dm2。
Further, it is NaOH solution that the film liquid of going used in film process is gone in step 5, and fast-etching is used in step 5
Etching solution be H2SO4-H2O2Etching solution.
Claims (9)
1. a kind of preparation method of printed circuit board fine-line, comprises the following steps：
Step 1：The first dry film (111) is pasted on base material (110) surface of not cupric, is then exposed, development treatment, obtains essence
Fine rule road groove (113)；
Step 2：Copper plating treatment is carried out in the substrate surface after step 1 processing, makes the upper surface of the first dry film (111) and fine
The inner surface of line groove (113) forms copper seed layer (210)；
Step 3：The second dry film (112) is pasted on the copper seed layer surface obtained after step 2 processing, is then exposed, develops
Processing, exposes fine-line groove (113)；
Step 4：Plating is carried out to the base material after step 3 processing and fills out Copper treatment, fine-line groove (113) is filled full；
Step 5：Film process is carried out to the base material after step 4 processing, the second dry film (112) is removed, is then quickly lost
Carve, remove the copper seed layer on the first dry film (111), then carry out film process, remove the first dry film (111), complete fine lines
The making on road.
2. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that first dry film
(111) it is acid resistance dry film against corrosion, thickness is 30~50 μm.
3. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that second dry film
(112) it is acid resistance dry film against corrosion, thickness is 10~30 μm.
4. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that in base in step 2
Before material surface carries out copper plating treatment, first base material is deoiled, is roughened, is presoaked and activation process.
5. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that described in step 2
Copper seed layer (210) is obtained using the method for electroless copper, and thickness is 1~3 μm.
6. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that described in step 1
Base material be made up of the one or more in epoxy resin, phenolic resin, polytetrafluoroethylene (PTFE) with glass fabric.
7. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that in base in step 2
The plating solution that material surface used during copper plating treatment is acidic bath.
8. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that to base in step 4
Material carries out plating and fills out H in the plating solution used during Copper treatment2SO4Mass concentration be 40~60g/L, CuSO4·5H2O quality is dense
Spend for 180~210g/L；The electroplating time that Copper treatment is filled out in plating is 30~60min, and current density is 1.0~1.2A/dm2。
9. the preparation method of printed circuit board fine-line according to claim 1, it is characterised in that striping in step 5
Processing film liquid of going used is NaOH solution, and etching solution used in fast-etching is H2SO4-H2O2Etching solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650334.3A CN104411106B (en) | 2014-11-14 | 2014-11-14 | A kind of preparation method of printed circuit board fine-line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650334.3A CN104411106B (en) | 2014-11-14 | 2014-11-14 | A kind of preparation method of printed circuit board fine-line |
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| CN104411106A CN104411106A (en) | 2015-03-11 |
| CN104411106B true CN104411106B (en) | 2017-11-17 |
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| CN105392302B (en) * | 2015-11-24 | 2018-10-12 | 安捷利电子科技（苏州）有限公司 | A kind of preparation method of buried capacitor circuit board |
| CN108513445A (en) * | 2018-04-24 | 2018-09-07 | 朱元昊 | A kind of novel semi-additive process 3D fine circuitry manufacture crafts |
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| CN110571157B (en) * | 2019-08-12 | 2020-12-18 | 广东佛智芯微电子技术研究有限公司 | Method for manufacturing fine circuit capable of preventing lateral etching |
| CN112584622A (en) * | 2019-09-27 | 2021-03-30 | 睿明科技股份有限公司 | Thin circuit manufacturing method |
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| CN113161227B (en) * | 2021-02-05 | 2021-12-24 | 广东工业大学 | Fan-out packaging system and method based on maskless photoetching and rewiring method |
| CN114190002A (en) * | 2021-12-09 | 2022-03-15 | 上达电子（深圳）股份有限公司 | Forming method of semi-embedded thick copper fine circuit of flexible packaging substrate |
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| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004335807A (en) * | 2003-05-08 | 2004-11-25 | Nitto Denko Corp | Manufacturing method of wiring circuit substrate |
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|---|---|---|---|---|
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
| CN102523689A (en) * | 2011-12-26 | 2012-06-27 | 深圳市星河电路有限公司 | Method for manufacturing circuit board with high copper thickness |
| CN103491728A (en) * | 2013-09-30 | 2014-01-01 | 电子科技大学 | Method for processing blind holes and fine lines of printed circuit board |
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