CN102510668B - Super thick copper PCB plate production method and its circuit board - Google Patents
Super thick copper PCB plate production method and its circuit board Download PDFInfo
- Publication number
- CN102510668B CN102510668B CN201110350214.8A CN201110350214A CN102510668B CN 102510668 B CN102510668 B CN 102510668B CN 201110350214 A CN201110350214 A CN 201110350214A CN 102510668 B CN102510668 B CN 102510668B
- Authority
- CN
- China
- Prior art keywords
- circuit
- copper
- etching
- epoxy resin
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a super thick copper PCB plate production method and its circuit board. The method comprises the following steps: dividing a plate substrate with a bottom copper; suspending and placing the PCB plate to be processed into an electroplating jar in a way of positive, negative clamping plates to electroplate the PCB plate for four times, until the thickness of the electroplating layer is more than 350-400Mum; etching the PCB plate; performing silk-screen printing using epoxy resin, leveling up circuit clearances by the epoxy resin and roasting the plate to solidify the epoxy resin; grinding the solidified epoxy resin and removing the residual resin layer on the surface of the circuit; drilling the plate, depositing the copper and electroplating the whole plate; performing the second time pattern electroplating and circuit etching on the plate to accomplish the circuit pattern. The super thick copper PCB plate production method and its circuit board use the multiple electroplating way and the epoxy resin leveling-up way between circuits, so as to realize the practical production technology of the super thick copper PCB plate, the copper on the circuit of the circuit board is uniform to satisfy the basis requirement of the circuit board.
Description
Technical field
The present invention relates to a kind of manufacture craft and circuit board thereof of pcb board, especially design is a kind of pcb board manufacture method and circuit board arrangement of super thick copper.
Background technology
In prior art, along with development and the maturation in consumer electronics product market, the upper integrated function element number of PCB is more and more, to the current lead-through ability of circuit and bearing capacity, also requires very high; Wherein most of heat will (approximately 70%) entry-line plate in, these heats will discharge by wiring board itself, so the difficult point of the super thick Copper Foil printed panel technical development of high reliability.
In industry, copper is thick is at present generally about 200UM, there is no the appearance of higher thick copper coin product, and this class wiring board is when making, difference in height between base material and circuit copper is when surface printing welding resistance green oil, must adopt the repeatedly mode of printing, and use conventional manual alignment operation during contraposition, and just cause conforming product rate and reliability poor, the product of super thick copper pcb board does not reach actual requirement substantially.
Specifically, pcb board manufacture craft defect of the prior art comprises:
1, owing to adopting sensitization green oil to carry out the repeatedly printing on circuit surface, because cumulative thickness is high, while carrying out thermal endurance test after finished product, easily cause surperficial sensitization green oil shrinkage cracking, affect the reliability of pcb board.
2, in routine, adopt manual alignment mode, level to level alignment degree is poor, interlayer deviation > 50um.
3, current existing method batch production is confined to the thick copper circuit board of 200UM, and the process technology that industry there is no super 400UM thickness product occurs.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
The object of the present invention is to provide a kind of super thick copper pcb board manufacture method and circuit board thereof, for the defect of above-mentioned prior art, realize a kind of practical super thick copper pcb board manufacture craft and circuit board thereof.
Technical scheme of the present invention is as follows:
A manufacture method for super thick copper pcb board, it comprises the following steps:
The sheet material substrate that A, employing have end copper carries out sawing sheet;
B, minute electroplate for four times, adopt positive and negative clamping plate mode to hang to put into and electroplate cylinder and electroplate, until after electrodeposited coating to more than 350-400um;
C, pcb board is carried out to etching;
D, employing epoxy resin carry out silk screen printing, fill and lead up circuit gap, and pass through baking-curing;
E, the epoxy resin after solidifying is ground, and remove the unnecessary resin bed in circuit surface;
F, hole, sink copper and the plating of whole plate;
G, carry out graphic plating and circuit etching for the second time, complete the making of line pattern.
Described manufacture method, wherein, also comprises step after described step G:
H, printing welding resistance ink, form solder mask layer.
Described manufacture method, wherein, the each plating in described step B is electroplated 75 minutes by 18 amperes/square feet.
Described manufacture method, wherein, described step C also comprises: resist layer is selected the photosensitive dry film of 50um thickness, and adopts hinge-type alignment mode.
Described manufacture method, wherein, described step C also comprises: circuit etching adopts acid straight etching technique, with the speed of 0.8-1.2 m/min, carries out etching three times.
Described manufacture method, wherein, the baking temperature in described step D successively adopts 70 ℃ of * 36min, 85 ℃ of * 36min, 100 ℃ of * 24min, 120 ℃ of * 24min.
Described manufacture method, wherein, adopts ceramic polish-brush or heavy amary tape grinding machine to grind in described step e.
Described manufacture method, wherein, described step G comprises: the light-sensitive surface of selecting 40um thickness with exposure machine and the resist layer of automatic decimal alignment system exposes required line map by exposure and developing process.
Described manufacture method, wherein, described step G also comprises: adopt 18 amperes/square feet to electroplate 75 minutes once, and adopt the speed alkali etching technique of 2.8-3.5 m/min to carry out line pattern making.
The circuit board that arbitrary described super thick copper pcb board manufacture method forms is provided with end copper on base material, wherein, is provided with plating thickening layer more than 350-410um on end copper, is used for forming circuit; And between circuit by epoxy resin filling.
A kind of super thick copper pcb board manufacture method provided by the present invention and circuit board thereof, due to the mode that has adopted repeatedly plating mode and filled and led up with epoxy resin between circuit, realized the practical manufacture craft of super thick copper pcb board, and it is even that the circuit board line of its formation covers copper, can meet the basic demand of circuit board.
Accompanying drawing explanation
Fig. 1 is the circuit board cross-sectional view of the super thick copper pcb board manufacture method of the present invention.
Embodiment
Below in conjunction with accompanying drawing, will be described in more detail each preferred embodiment of the present invention.
Super thick copper pcb board manufacture method disclosed in this invention and circuit board thereof, as shown in Figure 1, it has formed a kind of super thick pcb board, specifically, and on substrate substrate layer 110, original cover copper layer as end copper layer 120 thickness at 200um, by continuous plating, need to be repeated multiple times, form and electroplate thickening layer 130, the thickness that its circuit covers copper surpasses 350um, more than 350-410um.Circuit cover copper above form line layer 150 and green oil layer 140, meanwhile, must be between circuit filling epoxy resin 160, practical to guarantee the production technology of wiring board.
The basic processing process step of the super thick copper pcb board manufacture method of the present invention is:
1, sawing sheet: can adopt the substrate of copper thickness 210um at the bottom of plate, select automatic cutting machine to carry out sawing sheet;
2, whole plate is electroplated for the first time: after sawing sheet, direct whole plate is electroplated thickening to more than 350-400um.Divide and electroplate for 4 times, it is each that by 18 amperes of/square feet of plating in * 75 minutes, (" * " represents the time of continuous operation, with expression mode in following explanation with), meanwhile, during electroplating clamp plate, PCB circuit board plate face to be processed adopts positive and negative clamping plate mode to hang to put into and electroplates cylinder and electroplate.Positive and negative clamping plate mode adopts the mode of at every turn overturning to carry out, and has prevented like this accumulated error of different sides electroplating thickness inequality after repeatedly electroplating, so that the even thickness of line layer.
3, circuit etching for the first time: can adopt resist layer to select the photosensitive dry film of 50um thickness, adopt traditional hinge-type alignment mode to carry out contraposition during contraposition; Circuit etching adopts acid straight etching technique, and the speed that is etched with 0.8-1.2 m/min is carried out etching three times.
4, resin is filled and led up: due to the super heavy copper circuit board of the present invention, space between its circuit is darker, in follow-up printing treatment, by being inconvenient to, operate, for example, while being coated with green oil, can embed space, therefore, for the practical course of processing, simplified processing process, the course of processing of circuit board of the present invention must adopt epoxy resin to utilize silk screen to carry out circuit printing and fill and lead up, be preferably, can adopt 100% pure solids content, molecular weight is minimum, the epoxy resin of pure thermohardening type, because it is not containing other filler, solvent, toner and and photonasty composition, after filling, do not exist and shrink and fission problem, reliability is high, because epoxy resin is the known material of prior art, do not repeat them here.After filling and leading up, resin also needs to toast, particularly, baking temperature can adopt 70 ℃ of * 36min+85 ℃ * 36min+100 ℃ * 24min+120 ℃ * 24min, adopts successively 24 minutes, 120 ℃ bakings of 36 minutes, 100 ℃ bakings of 36 minutes, 85 ℃ bakings of 70 ℃ of bakings 24 minutes.
5, resin ground: can adopt ceramic polish-brush or heavy amary tape grinding machine to grind to the resin after solidifying, and remove the unnecessary resin bed in circuit top layer.
6, pcb board is holed: 1 one is folded, uses 12.5 ten thousand boards that turn, and electroplating hole is used to new cutter operation, a hole, life-span≤800 of cutter/.
7, heavy copper/whole plate is electroplated: adopt normal heavy copper same as the prior art, whole plate electroplating parameter to process.
8, circuit and graphic plating/circuit etching for the second time: circuit is used the exposure machine of automatic decimal alignment system for the second time, and resist layer is selected the light-sensitive surface of 40um thickness, through overexposure, by developing process, exposes required line map.In described graphic plating/circuit etching process, during electroplating clamp plate, adopt the positive and negative clamping plate mode of pcb board plate face to hang to put into and electroplate cylinder and electroplate, adopt 18 amperes/square feet to electroplate 75 minutes once, etching process adopts the speed alkali etching technique of 2.8-3.5 m/min, completes the making of line pattern.
9, anti-welding: because of substrate surface printing resin, circuit surface and base material do not have height of formation poor, while therefore printing welding resistance ink, adopt normal mode to process.
10, gong plate and electrical measurement: adopt normal parameter operation, by testing the complete product of rear formation.
The super thick copper pcb board manufacture method of the present invention and circuit board thereof have following benefit:
First, adopt epoxy resin to fill and lead up technique, because epoxy resin shrinkage is minimum, thermal endurance is strong, and finished product reliability is high, can make higher level heavy copper circuit board product; Secondly, for the circuit board of the thick demand 411um of copper, owing to buying without existing circuit board material, the mode that adopts the present invention to electroplate several times thickening gets final product the processing of completing circuit plate, guarantees the thick uniformity of circuit copper; Again, when circuit is made, different light-sensitive surface against corrosion and the automatic exposure technique of counterpoint of twice employing in front and back, has guaranteed the requirement to precision of line width and interlayer.
Should be understood that, the above-mentioned description for each preferred embodiment of the present invention is comparatively concrete, can not therefore think the restriction to scope of patent protection of the present invention, and scope of patent protection of the present invention should be as the criterion with claims.
Claims (6)
1. a manufacture method for super thick copper pcb board, it comprises the following steps:
The sheet material substrate that A, employing have end copper carries out sawing sheet;
B, minute electroplate for four times, adopt positive and negative clamping plate mode to hang to put into and electroplate cylinder and electroplate, until electroplate bed thickness to 350-400um;
C, pcb board is carried out to etching;
D, employing epoxy resin carry out silk screen printing, the circuit gap causing while filling and leading up etching, and pass through baking-curing;
E, the epoxy resin after solidifying is ground, and remove the unnecessary resin bed in circuit surface;
F, hole, sink copper and the plating of whole plate;
G, carry out graphic plating and circuit etching for the second time, complete the making of line pattern;
Described step C also comprises: resist layer is selected the photosensitive dry film of 50um thickness, and adopts hinge-type alignment mode; Circuit etching adopts acid straight etching technique, with the speed of 0.8-1.2 m/min, carries out etching three times;
Described step G comprises: the light-sensitive surface of selecting 40um thickness with exposure machine and the resist layer of automatic decimal alignment system exposes required line map by exposure and developing process;
After described step G, also comprise step: H, printing welding resistance ink, form solder mask layer.
2. manufacture method according to claim 1, is characterized in that, the each plating in described step B is electroplated 75 minutes by 18 amperes/square feet.
3. manufacture method according to claim 1, is characterized in that, the baking temperature in described step D successively adopts 70 ℃ of * 36min, 85 ℃ of * 36min, 100 ℃ of * 24min, 120 ℃ of * 24min.
4. manufacture method according to claim 1, is characterized in that, adopts ceramic polish-brush or heavy amary tape grinding machine to grind in described step e.
5. manufacture method according to claim 1, is characterized in that, described step G also comprises: adopt 18 amperes/square feet to electroplate 75 minutes once, and adopt the speed alkali etching technique of 2.8-3.5 m/min to carry out line pattern making.
6. the circuit board that as described in as arbitrary in claim 1 to 5, super thick copper pcb board manufacture method forms is provided with end copper on base material, it is characterized in that, is provided with the plating thickening layer of 350-410um on end copper, on described plating thickening layer, forms line layer; And the circuit gap that use epoxy resin filling plating thickening layer and the end cause when copper layer is due to etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110350214.8A CN102510668B (en) | 2011-11-08 | 2011-11-08 | Super thick copper PCB plate production method and its circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110350214.8A CN102510668B (en) | 2011-11-08 | 2011-11-08 | Super thick copper PCB plate production method and its circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102510668A CN102510668A (en) | 2012-06-20 |
| CN102510668B true CN102510668B (en) | 2014-02-19 |
Family
ID=46222711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110350214.8A Active CN102510668B (en) | 2011-11-08 | 2011-11-08 | Super thick copper PCB plate production method and its circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102510668B (en) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103266336B (en) * | 2013-04-26 | 2016-06-01 | 胜宏科技（惠州）股份有限公司 | A kind of thick copper circuit board copper face thickening method |
| CN104178786A (en) * | 2013-05-21 | 2014-12-03 | 北大方正集团有限公司 | Electroplating method for making printed circuit board (PCB) |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
| CN104918419B (en) * | 2014-03-11 | 2018-03-20 | 深南电路有限公司 | Heavy copper circuit board processing method |
| CN105578799B (en) * | 2014-10-08 | 2019-02-05 | 深南电路有限公司 | A kind of printed circuit board and print circuit plates making method |
| CN104902699B (en) * | 2015-05-04 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of backboard electro-plating method of the through-hole containing high thickness to diameter ratio |
| CN105007683B (en) * | 2015-07-03 | 2018-04-03 | 深圳市景旺电子股份有限公司 | A kind of method of no glass cloth ceramics frequency PCB plate edges of boards metallization |
| CN105072827A (en) * | 2015-07-17 | 2015-11-18 | 深圳崇达多层线路板有限公司 | Thick copper plate manufacturing method |
| CN105163525A (en) * | 2015-08-19 | 2015-12-16 | 深圳市迅捷兴电路技术有限公司 | Method for fabricating inner-layer ultra-thick copper circuit board |
| CN105208796B (en) * | 2015-09-14 | 2018-08-03 | 上海美维电子有限公司 | The production method and super thick copper circuit board of super thick copper circuit board |
| CN105188269B (en) * | 2015-10-28 | 2018-03-13 | 广州杰赛科技股份有限公司 | Super thick copper circuit board and preparation method thereof |
| CN105458945B (en) * | 2015-12-30 | 2017-08-29 | 中国有色桂林矿产地质研究院有限公司 | It is a kind of that there is flexible grinding belt of diamond of grade abrasion structure and preparation method thereof |
| CN106304665A (en) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | The manufacture method of 10 ounce's copper printed circuit board (PCB)s |
| CN107580429A (en) * | 2017-09-12 | 2018-01-12 | 广东创辉鑫材科技有限公司 | A kind of manufacture craft of super thick copper coin |
| CN108012431A (en) * | 2017-10-31 | 2018-05-08 | 惠州市金百泽电路科技有限公司 | A kind of manufacture craft of the circuit printed wiring board concordant with base material |
| CN108315782A (en) * | 2018-01-15 | 2018-07-24 | 江西芯创光电有限公司 | Improve the method for uniformity in a kind of plating |
| CN108990262B (en) * | 2018-03-20 | 2021-07-09 | 东莞市若美电子科技有限公司 | Manufacturing process of double-sided thick copper circuit board |
| CN108718480B (en) * | 2018-06-07 | 2024-07-12 | 江门荣信电路板有限公司 | Inner and outer 6OZ ultra-thick copper PCB and manufacturing method thereof |
| CN108521726B (en) * | 2018-06-19 | 2020-06-19 | 惠州中京电子科技有限公司 | Manufacturing method of super-thick copper PCB (printed circuit board) multilayer board |
| CN109587961A (en) * | 2018-12-01 | 2019-04-05 | 四会富仕电子科技股份有限公司 | A kind of method that copper is thinned in outer layer |
| CN109640529A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of manufacture craft of two-sided super thick copper sheet |
| CN110402033B (en) * | 2019-07-18 | 2022-10-04 | 大连崇达电路有限公司 | Circuit processing method of 10oz thick copper circuit board |
| CN110944456A (en) * | 2019-12-16 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board solder mask process |
| CN112074077A (en) * | 2020-08-18 | 2020-12-11 | 鹤山市中富兴业电路有限公司 | Thick copper circuit board inlayer resin filling structure and circuit board thereof |
| CN114126260A (en) * | 2021-11-02 | 2022-03-01 | 大连崇达电路有限公司 | Manufacturing method of ultra-thick copper PCB with 6oz inner layer and 12oz outer layer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1318708B1 (en) * | 1995-10-23 | 2004-10-20 | Ibiden Co., Ltd. | Resin filler and multilayer printed wiring board |
| KR100756873B1 (en) * | 2007-06-28 | 2007-09-07 | 안복만 | The thick copper printed circuit board enhanced adhesive strength and the manufacturing method of it |
| CN101616549A (en) * | 2009-07-21 | 2009-12-30 | 东莞康源电子有限公司 | The method of manufacturing single-side thick copper stepped plate by electroplating addition |
| CN102056413A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE602005022650D1 (en) * | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Improved plating process |
-
2011
- 2011-11-08 CN CN201110350214.8A patent/CN102510668B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1318708B1 (en) * | 1995-10-23 | 2004-10-20 | Ibiden Co., Ltd. | Resin filler and multilayer printed wiring board |
| KR100756873B1 (en) * | 2007-06-28 | 2007-09-07 | 안복만 | The thick copper printed circuit board enhanced adhesive strength and the manufacturing method of it |
| CN101616549A (en) * | 2009-07-21 | 2009-12-30 | 东莞康源电子有限公司 | The method of manufacturing single-side thick copper stepped plate by electroplating addition |
| CN102056413A (en) * | 2010-12-23 | 2011-05-11 | 北大方正集团有限公司 | Method for manufacturing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102510668A (en) | 2012-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102510668B (en) | Super thick copper PCB plate production method and its circuit board | |
| CN102917542B (en) | Method for manufacturing copper PCB (Printed Circuit Board) circuit | |
| KR100683097B1 (en) | Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board | |
| CN104080275B (en) | A kind of preparation method of ladder wiring board | |
| CN103547081B (en) | Resistance welding processing method, system and the circuit board of a kind of super thick copper foil circuit board | |
| CN101146407A (en) | Graph transfer shaping technology for carrier board circuit of printed circuit board | |
| CN108617104A (en) | The production method that the local figure copper thickness of printed circuit board thickeies | |
| CN110366323B (en) | Manufacturing method of circuit board solder mask layer | |
| CN106341950A (en) | Circuit board manufacturing method adopting resin plugging | |
| EP3557957B1 (en) | Wiring substrate, multilayer wiring substrate, and method for manufacturing wiring substrate | |
| CN102056413B (en) | Method for manufacturing printed circuit board | |
| CN104661446A (en) | Circuit board processing method | |
| CN106783554A (en) | The preparation method and electronic component of a kind of electronic component electrode | |
| US4645733A (en) | High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates | |
| CN104883820A (en) | Manufacturing method for external layer line of asymmetric backboard with warped structure | |
| CN105992463A (en) | Method for manufacturing step circuit board and step circuit board | |
| CN105430925A (en) | Fabrication method of thick copper circuit board | |
| CN104684265A (en) | Method for electroplating surface of circuit board | |
| CN103974541A (en) | Metal circuit manufacturing method and printed circuit board | |
| CN104735926B (en) | A kind of filling holes with resin method for circuit board | |
| CN112188732A (en) | Manufacturing method of medical instrument detection plate | |
| JP2001347529A (en) | Stamper for manufacturing circuit board and method for manufacturing stamper | |
| KR20140037635A (en) | Circuit board produced filled with a conductive paste | |
| CN102638948B (en) | Manufacturing method of printed circuit board | |
| JP2008302567A (en) | Metal mask for printing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 518000, Guangdong, Shenzhen province Baoan District Xixiang iron Gang Reservoir Road No. 166 Applicant after: Shenzhen Kinwong Electronic Co., Ltd. Address before: 518000, Guangdong, Shenzhen province Baoan District Xixiang iron Gang Reservoir Road No. 166 Applicant before: Kinwong Electronic (Shenzhen) Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: KINGWONG ELECTRONICS (SHENZHEN) CO., LTD. TO: SHENZHEN KINWONG ELECTRONICCO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |