CN107580429A - A kind of manufacture craft of super thick copper coin - Google Patents
A kind of manufacture craft of super thick copper coin Download PDFInfo
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- CN107580429A CN107580429A CN201710817221.1A CN201710817221A CN107580429A CN 107580429 A CN107580429 A CN 107580429A CN 201710817221 A CN201710817221 A CN 201710817221A CN 107580429 A CN107580429 A CN 107580429A
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- copper coin
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Abstract
The invention discloses a kind of manufacture craft of super thick copper coin, comprise the following steps that：Step 1, copper coin etching；Step 2, print a resin；Step 3, one step press；Step 4, internal layer make；Step 5, secondary print resin；Step 6, second pressing；Step 7, drilling；Step 8, sink copper plate electric；Step 9, the etching of outer layer dry film；Step 10, anti-welding processing；Step 11, turmeric character gong plate.Present invention process is reasonable in design, optimized by the material to selection and manufacture craft etc., solve the making difficult point of the processes such as etching in this kind of plate manufacturing process, pressing, drilling, effectively increase the qualitative reliability of super-thick copper multilayer board, prospect of the application is wide.
Description
Technical field
The present invention relates to copper coin production field, specifically a kind of manufacture craft of super thick copper coin.
Background technology
The thickness of usual copper is referred to as super thick copper coin, super-thick copper multilayer board not less than 350um (10OZ) Above Transmission Lines plate
It is a kind of printed circuit board of special defects, the main feature of such printed circuit board：The general number of plies has good in 4-12 layers
Current capacity and excellent thermal diffusivity are carried, qualitative reliability requires high, is mainly used in network energy, communication, automobile, high-power
Power supply, clean energy resource solar energy etc., therefore there is wide market development prospect.It is rapid with this kind of product demand
Increase, following super thick copper coin will necessarily turn into one of another trend of PCB development.Super thick copper coin is because copper thickness is thicker, during making
All there is certain difficulty in internal layer, this just makes super thick copper plate/strip for people and come not without processes such as copper area filler, drilling, etchings
Just.
The content of the invention
It is an object of the invention to provide a kind of manufacture craft of super thick copper coin, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the present invention provides following technical scheme：
A kind of manufacture craft of super thick copper coin, is comprised the following steps that：
Step 1, copper coin etching：Sawing sheet is carried out to copper coin, the copper coin after sawing sheet is subjected to nog plate, pasted after nog plate roughening dry
Film, then it is exposed and develops, copper coin is etched to half；
Step 2, print a resin：Brown is carried out to copper coin, the circuit surface potting resin of copper coin is fabricated to 36T nets, is used
The big board of torsion carries out thickness to copper coin and scrapes offset printing twice, horizontal positioned two hours after having printed, then under 80-120 degrees Celsius
Roasting 30-45 minutes；
Step 3, one step press：Two layers of copper coin and PP are riveted together and centre is using the high TG of high gel content
7628RC54% 3 films pressing, is first vacuumized 10 minutes before pressing；
Step 4, internal layer make：The glue on copper coin surface is removed, nog plate and roughening treatment is carried out, hand is used under 6kg pressure
With 0.6m/min speed pressing once, then pneumatics once, the film of copper coin is carried out dynamic laminator down normal again
One side is exposed, and then copper coin is carried out just anti-etching four times in different directions with 3OZ speed, is adjusted further according to actual conditions
Etching；
Step 5, secondary print resin：Brown twice is carried out to the positive and negative of copper coin, by the circuit surface potting resin system of copper coin
36T nets are made, carrying out thickness to copper coin with the big board of torsion scrapes offset printing twice, horizontal positioned two hours after having printed, then 80
Bake 450 minutes, the first face is baked 15 minutes at one hundred and twenty degrees centigrade, then the second face is baked 30 points at one hundred and twenty degrees centigrade under degree Celsius
Clock；
Step 6, second pressing：Second pressing is carried out according to the order of resin bed, dielectric layer, resin bed and dielectric layer；
Step 7, drilling：Monolithic copper coin is placed on board and is stamped phenolic resin with following above copper coin
Plate, drilled with the big rig of torsion；
Step 8, sink copper plate electric：High-pressure washing, bay dividing plate bay first are carried out to copper coin, then sunk copper twice, second
Secondary to be put into from preimpregnation cylinder, backlight up to more than 9 grade, normal positive counter plate electricity is carried out to copper coin and is used twice, then to copper coin during heavy copper twice
Positive and negative folder carries out 15ASF*75 minute plates electricity twice to copper coin；
Step 9, the etching of outer layer dry film：After carrying out normal nog plate to copper coin, negative film is carried out to copper coin and directly lost, by copper coin table
Face carries out pad pasting after being cooled to 28-32 degrees Celsius, and one is pressed with manual laminator with 0.6m/min speed under 6kg pressure
Secondary, then pneumatics once, the film of copper coin is carried out down normal one side exposure, then carry out normal acid etching again；
Step 10, anti-welding processing：Copper coin is being subjected to nog plate with volcanic ash using 2/3rds times of normal speed, then
First with the first bottoming printing of sub- color oil once, it is pre-baked 15 minutes at 75 degrees Celsius, second of polish oil printing is done after cooling and carries out hand
Dynamic contraposition exposure and normal development, then copper coin is handled according to jack panel using the roasting mode of segmentation and temperature formula；
Step 11, turmeric character gong plate：Carry out turmeric, character and the processing of gong plate successively to copper coin, then product is carried out
Test, FQC and FOA, are then packed, you can obtain finished product.
As the further scheme of the present invention：Thick frictioning and copper coin are in 30 degree in step 2 and step 5, the pressure with copper coin
Power angle is 15-20 degree.
As the further scheme of the present invention：Drilling is first drilled using reaming is distributed with bradawl nozzle in step 7, then
Drilled with wammel nozzle.
As the further scheme of the present invention：Roller for sticking dust binding dust is used before being printed in step 10.
Compared with prior art, the beneficial effects of the invention are as follows：Present invention process is reasonable in design, passes through the material to selection
And manufacture craft etc. optimizes, the making for solving the processes such as etching in this kind of plate manufacturing process, pressing, drilling is difficult
Point, effectively increases the qualitative reliability of super-thick copper multilayer board, and prospect of the application is wide.
Brief description of the drawings
Fig. 1 is that the 1.15mm pitch-rows that thermal stress is tested three times after five Reflow Solderings are used in the manufacture craft of super thick copper coin
Product schematic diagram.
Fig. 2 is that the 1.35mm pitch-rows that thermal stress is tested three times after five Reflow Solderings are used in the manufacture craft of super thick copper coin
Product schematic diagram.
Fig. 3 is that the 1.5mm pitch-rows that thermal stress is tested three times after five Reflow Solderings are used in the manufacture craft of super thick copper coin
Product schematic diagram.
Fig. 4 is that the 1.4mm pitch-rows that thermal stress is tested three times after five Reflow Solderings are used in the manufacture craft of super thick copper coin
Product schematic diagram.
Embodiment
The technical scheme of this patent is described in more detail with reference to embodiment.
Embodiment 1
A kind of manufacture craft of super thick copper coin, is comprised the following steps that：
Step 1, copper coin etching：Sawing sheet is carried out to copper coin, the copper coin after sawing sheet is subjected to nog plate, pasted after nog plate roughening dry
Film, then it is exposed and develops, copper coin is etched to half；
Step 2, print a resin：Brown is carried out to copper coin, the circuit surface potting resin of copper coin is fabricated to 36T nets, is used
The big board of torsion carries out thickness to copper coin and scrapes offset printing twice, and the big board of torsion can ensure that printing process will not pause, and ensures
Lower oil mass thickness frictioning is in 30 degree with copper coin, and the pressure angle with copper coin is 20 degree, and both sides are padded slightly thicker 0.1mm than copper coin, printed
Horizontal positioned two hours afterwards, easy to exhaust bubble, then baked 35 minutes under 90 degrees Celsius；
Step 3, one step press：Two layers of copper coin and PP are riveted together and centre is using the high TG of high gel content
7628RC54% 3 films pressing, is first vacuumized 10 minutes, it is possible to reduce bubble before pressing；
Step 4, internal layer make：The glue on copper coin surface is removed, nog plate and roughening treatment is carried out, hand is used under 6kg pressure
With 0.6m/min speed pressing once, then pneumatics once, the film of copper coin is carried out dynamic laminator down normal again
One side is exposed, and then copper coin is carried out just anti-etching four times in different directions with 3OZ speed, is adjusted further according to actual conditions
Etching；
Step 5, secondary print resin：Brown twice is carried out to the positive and negative of copper coin, by the circuit surface potting resin system of copper coin
36T nets are made, the big board of torsion can ensure that printing process will not pause, and ensure that lower oil mass thickness frictioning and copper coin are in 30 degree,
Pressure angle with copper coin is 18 degree, and both sides are padded slightly thicker 0.1mm than copper coin, horizontal positioned two hours after having printed, easy to exhaust
Bubble, then bake 450 minutes, the first face is baked 15 minutes at one hundred and twenty degrees centigrade, then the second face is taken the photograph 120 at 80 degrees celsius
Baked 30 minutes under family name's degree；
Step 6, second pressing：Second pressing is carried out according to the order of resin bed, dielectric layer, resin bed and dielectric layer；
Step 7, drilling：Monolithic copper coin is placed on board and is stamped phenolic resin with following above copper coin
Plate, drilled with the big rig of torsion；
Step 8, sink copper plate electric：High-pressure washing, bay dividing plate bay first are carried out to copper coin, then sunk copper twice, second
Secondary to be put into from preimpregnation cylinder, backlight up to more than 9 grade, normal positive counter plate electricity is carried out to copper coin and is used twice, then to copper coin during heavy copper twice
Positive and negative folder carries out 15ASF*75 minute plates electricity twice to copper coin, flies target two and presss from both sides a width of 100mm, flies target and uses length and copper coin etc.
Long has copper vacation plate；
Step 9, the etching of outer layer dry film：After carrying out normal nog plate to copper coin, negative film is carried out to copper coin and directly lost, by copper coin table
Face carries out pad pasting after being cooled to 28-32 degrees Celsius, and one is pressed with manual laminator with 0.6m/min speed under 6kg pressure
Secondary, then pneumatics once, the film of copper coin is carried out down normal one side exposure, then carry out normal acid etching again；
Step 10, anti-welding processing：Copper coin is being subjected to nog plate with volcanic ash using 2/3rds times of normal speed, then
First with the first bottoming printing of sub- color oil once, it is pre-baked 15 minutes at 75 degrees Celsius, second of polish oil printing is done after cooling and carries out hand
Dynamic contraposition exposure and normal development, then copper coin is handled according to jack panel using the roasting mode of segmentation and temperature formula；
Step 11, turmeric character gong plate：Carry out turmeric, character and the processing of gong plate successively to copper coin, then product is carried out
Test, FQC and FOA, are then packed, you can obtain finished product.
Embodiment 2
A kind of manufacture craft of super thick copper coin, is comprised the following steps that：
Step 1, copper coin etching：Sawing sheet is carried out to copper coin, the copper coin after sawing sheet is subjected to nog plate, pasted after nog plate roughening dry
Film, then it is exposed and develops, copper coin is etched to half；
Step 2, print a resin：Brown is carried out to copper coin, the circuit surface potting resin of copper coin is fabricated to 36T nets, is used
The big board of torsion carries out thickness to copper coin and scrapes offset printing twice, and the big board of torsion can ensure that printing process will not pause, and ensures
Lower oil mass thickness frictioning is in 30 degree with copper coin, and the pressure angle with copper coin is 20 degree, and both sides are padded slightly thicker 0.2mm than copper coin, printed
Horizontal positioned two hours afterwards, easy to exhaust bubble, then baked 35 minutes under 90 degrees Celsius；
Step 3, one step press：Two layers of copper coin and PP are riveted together and centre is using the high TG of high gel content
7628RC54% 3 films pressing, is first vacuumized 10 minutes, it is possible to reduce bubble before pressing；
Step 4, internal layer make：The glue on copper coin surface is removed, nog plate and roughening treatment is carried out, hand is used under 6kg pressure
With 0.6m/min speed pressing once, then pneumatics once, the film of copper coin is carried out dynamic laminator down normal again
One side is exposed, and then copper coin is carried out just anti-etching four times in different directions with 3OZ speed, is adjusted further according to actual conditions
Etching；
Step 5, secondary print resin：Brown twice is carried out to the positive and negative of copper coin, by the circuit surface potting resin system of copper coin
36T nets are made, the big board of torsion can ensure that printing process will not pause, and ensure that lower oil mass thickness frictioning and copper coin are in 30 degree,
Pressure angle with copper coin is 20 degree, and both sides are padded slightly thicker 0.15mm than copper coin, horizontal positioned two hours after having printed, easy to exhaust
Bubble, then bake 450 minutes at 80 degrees celsius, the first face is baked 15 minutes at one hundred and twenty degrees centigrade, then the second face is Celsius 12
Degree is lower roasting 30 minutes；
Step 6, second pressing：Second pressing is carried out according to the order of resin bed, dielectric layer, resin bed and dielectric layer；
Step 7, drilling：Monolithic copper coin is placed on board and is stamped phenolic resin with following above copper coin
Plate, drilled with the big rig of torsion, drilling is first drilled, then carried out with wammel nozzle using distribution reaming with bradawl nozzle
Drilling；
Step 8, sink copper plate electric：High-pressure washing, bay dividing plate bay first are carried out to copper coin, then sunk copper twice, second
Secondary to be put into from preimpregnation cylinder, backlight up to more than 9 grade, normal positive counter plate electricity is carried out to copper coin and is used twice, then to copper coin during heavy copper twice
Positive and negative folder carries out 15ASF*75 minute plates electricity twice to copper coin, flies target two and presss from both sides a width of 100mm, flies target and uses length and copper coin etc.
Long has copper vacation plate；
Step 9, the etching of outer layer dry film：After carrying out normal nog plate to copper coin, negative film is carried out to copper coin and directly lost, by copper coin table
Face carries out pad pasting after being cooled to 28-32 degrees Celsius, and one is pressed with manual laminator with 0.6m/min speed under 6kg pressure
Secondary, then pneumatics once, the film of copper coin is carried out down normal one side exposure, then carry out normal acid etching again；
Step 10, anti-welding processing：Copper coin is being subjected to nog plate with volcanic ash using 2/3rds times of normal speed, with gluing
Dirt roller binding dust, then first printed once with the first bottoming of sub- color oil, it is pre-baked 15 minutes at 75 degrees Celsius, second of light is done after cooling
Mimeograph brush carries out Manual-alignment exposure and normal development, and then copper coin is entered according to jack panel using the roasting mode of segmentation and temperature formula
Row processing；
Step 11, turmeric character gong plate：Carry out turmeric, character and the processing of gong plate successively to copper coin, then product is carried out
Test, FQC and FOA, are then packed, you can obtain finished product.
Fig. 1-4 is to carry out the product figure that thermal stress is tested three times after five Reflow Solderings, and the condition of Reflow Soldering is 260*
5cycle carries out unleaded backflow, it is desirable to which more than 217 times were 120-150s, and more than 255 times were 20-30s, thermal stress test
Condition is 288*10s*3cycle, without discovery hole every separation, resin shrinkage and dielectric layer layering, the product quality of making
It is good.
The manufacture difficulty of the copper coin is mainly in three etching, pressing and drilling processes.Etching uses dry film and acid etching,
Etched more than in four times, change different directions every time, etch at twice, once lose 1/2；Etching is using two-sided etching and presses twice
Close, make smaller line width line-spacing.Pressing use carries out riveted after filling out resin, then is pressed twice, controls heating rate
And upper pressure point, reduce thickness of slab uneven, filler deficiency, in plate the problems such as bubble.Drilling is folded using one piece one and underlay on copper coin
Phenolic resin plate, drilling are solved the problems, such as chip removal, are mitigated equipment torsion problem using segmentation brill mode.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (4)
1. a kind of manufacture craft of super thick copper coin, it is characterised in that comprise the following steps that：
Step 1, copper coin etching：Sawing sheet is carried out to copper coin, the copper coin after sawing sheet is subjected to nog plate, pastes dry film after nog plate roughening, so
After carry out exposed and developed, copper coin is etched to half；
Step 2, print a resin：Brown is carried out to copper coin, the circuit surface potting resin of copper coin is fabricated to 36T nets, uses torsion
Big board carries out thickness to copper coin and scrapes offset printing twice, and horizontal positioned two hours after having printed, 30- is then baked under 80-120 degrees Celsius
45 minutes；
Step 3, one step press：Two layers of copper coin and PP are riveted together and centre is using the high TG of high gel content
7628RC54% 3 films pressing, is first vacuumized 10 minutes before pressing；
Step 4, internal layer make：The glue on copper coin surface is removed, carries out nog plate and roughening treatment, with patch manually under 6kg pressure
With 0.6m/min speed pressing once, then the film of copper coin once, is carried out normal one side to film machine by pneumatics down again
Exposure, then copper coin is carried out just anti-etching four times in different directions with 3OZ speed, erosion is adjusted further according to actual conditions
Carve；
Step 5, secondary print resin：Brown twice is carried out to the positive and negative of copper coin, the circuit surface potting resin of copper coin is fabricated to
36T nets, thickness is carried out to copper coin with torsion big board and scrapes offset printing twice, it is then Celsius 80 horizontal positioned two hours after having printed
Degree is lower roasting 450 minutes, the first face is baked 15 minutes at one hundred and twenty degrees centigrade, then the second face is baked 30 minutes under 12 degrees Celsius；
Step 6, second pressing：Second pressing is carried out according to the order of resin bed, dielectric layer, resin bed and dielectric layer；
Step 7, drilling：Monolithic copper coin is placed on board and is stamped phenolic resin plate with following above copper coin, is used
The big rig of torsion is drilled；
Step 8, sink copper plate electric：High-pressure washing, bay dividing plate bay first are carried out to copper coin, then sunk copper twice, second from
Preimpregnation cylinder is put into, sink twice copper when backlight up to more than 9 grades, normal positive counter plate electricity is carried out to copper coin twice, then to copper coin with positive and negative
Folder carries out 15ASF*75 minute plates electricity twice to copper coin；
Step 9, the etching of outer layer dry film：After carrying out normal nog plate to copper coin, negative film is carried out to copper coin and directly lost, copper coin surface is cold
But to carrying out pad pasting after 28-32 degrees Celsius, under 6kg pressure with manual laminator with 0.6m/min speed pressing once, so
Pneumatics once, the film of copper coin is carried out down normal one side exposure, then carry out normal acid etching again afterwards；
Step 10, anti-welding processing：Copper coin is being subjected to nog plate using 2/3rds times of normal speed with volcanic ash, then first used
The sub- first bottoming printing of color oil is once, pre-baked 15 minutes at 75 degrees Celsius, and it is right manually that second of polish oil printing progress is done after cooling
Position exposure and normal development, then copper coin is handled according to jack panel using the roasting mode of segmentation and temperature formula；
Step 11, turmeric character gong plate：Carry out turmeric, character and the processing of gong plate successively to copper coin, then product is tested,
FQC and FOA, is then packed, you can obtains finished product.
2. the manufacture craft of super thick copper coin according to claim 1, it is characterised in that thick in the step 2 and step 5
Frictioning is in 30 degree with copper coin, and the pressure angle with copper coin is 15-20 degree.
3. the manufacture craft of super thick copper coin according to claim 1 or 2, it is characterised in that drilling is adopted in the step 7
With distribution reaming, first drilled with bradawl nozzle, then drilled with wammel nozzle.
4. the manufacture craft of super thick copper coin according to claim 1, it is characterised in that used before being printed in the step 10
Roller for sticking dust binding dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817221.1A CN107580429A (en) | 2017-09-12 | 2017-09-12 | A kind of manufacture craft of super thick copper coin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817221.1A CN107580429A (en) | 2017-09-12 | 2017-09-12 | A kind of manufacture craft of super thick copper coin |
Publications (1)
| Publication Number | Publication Date |
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| CN107580429A true CN107580429A (en) | 2018-01-12 |
Family
ID=61036334
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| CN201710817221.1A Pending CN107580429A (en) | 2017-09-12 | 2017-09-12 | A kind of manufacture craft of super thick copper coin |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248503A (en) * | 2019-06-11 | 2019-09-17 | 深圳市星河电路股份有限公司 | A kind of novel compression method of super thick copper circuit board production |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN111575752A (en) * | 2020-05-14 | 2020-08-25 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
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| CN105407643A (en) * | 2015-12-15 | 2016-03-16 | 皆利士多层线路版(中山)有限公司 | Method for making 6OZ&12OZ thick copper circuit board attached with cooling fins |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110248503A (en) * | 2019-06-11 | 2019-09-17 | 深圳市星河电路股份有限公司 | A kind of novel compression method of super thick copper circuit board production |
| CN110831350A (en) * | 2019-11-14 | 2020-02-21 | 四会富仕电子科技股份有限公司 | Method for manufacturing bottomless copper circuit board |
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| CN111575752A (en) * | 2020-05-14 | 2020-08-25 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN111575752B (en) * | 2020-05-14 | 2021-10-12 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
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Address after: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to the Arts crafts emporium Technology Park Chong Building 13 layer D Applicant after: Guangdong Chuanghui Xinluo Science and Technology Co., Ltd. Address before: 518000 Guangdong Province, Shenzhen city Baoan District manhole street after Mao Ting Zhoushan Industrial Park to the Arts crafts emporium Technology Park Chong Building 13 layer D Applicant before: Guangdong create new material technology Co., Ltd. |
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Application publication date: 20180112 |