CN111278240A - Design product structure and method for manufacturing 5G circuit board - Google Patents
Design product structure and method for manufacturing 5G circuit board Download PDFInfo
- Publication number
- CN111278240A CN111278240A CN201911396599.4A CN201911396599A CN111278240A CN 111278240 A CN111278240 A CN 111278240A CN 201911396599 A CN201911396599 A CN 201911396599A CN 111278240 A CN111278240 A CN 111278240A
- Authority
- CN
- China
- Prior art keywords
- core plate
- copper foil
- foil layer
- pressing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000011889 copper foil Substances 0.000 claims abstract description 60
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000008646 thermal stress Effects 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a design product structure and a method for manufacturing a 5G circuit board, wherein the design product structure comprises an upper core board, a lower core board and a connecting curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece. By adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a design product structure and a method for manufacturing a 5G circuit board.
Background
The existing 5G product is designed by adopting a traditional process, and the process has certain defects in the aspects of pressing binding force, insulativity and filling property. To improve this drawback, the problems of lamination method and lamination program must be solved first. At present, the conventional copper foil plate (with the light facing outwards) is mainly adopted in the industry, and poor binding force can occur probabilistically after pressing, so that poor signal conduction and signal interference phenomena occur simultaneously when the plate is exploded and layered. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide a structure and a method for manufacturing a designed product for 5G circuit board, which can effectively solve the problems of the existing structure of the designed product that the press-fit bonding force and the signal conductivity of the finished product have certain defects.
In order to achieve the purpose, the invention adopts the following technical scheme:
a design product structure for manufacturing a 5G circuit board comprises an upper core plate, a lower core plate and a connecting curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece.
A design method for manufacturing a 5G circuit board sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
and pressing the upper core plate and the lower core plate by adopting a mode of pressing the upper core plate and the lower core plate, bonding the upper core plate and the lower core plate by using a connecting prepreg, pressing the upper core plate and the lower core plate into a plate by high temperature, wherein the first lower copper foil layer of the upper core plate and the second upper copper foil layer of the lower core plate are both reverse copper foils during pressing and are respectively attached to the upper surface and the lower surface of the connecting prepreg.
As a preferable scheme, the method comprises the following steps:
(1) browning: by a chemical principle, the surface of a first lower copper foil layer of an upper core plate and the surface of a second upper copper foil layer of a lower core plate are relatively roughened so as to increase the binding force between the copper foil layers and a connecting prepreg;
(2) combining: a connecting curing sheet is clamped between the upper core plate and the lower core plate;
(3) plate stacking: placing the combined upper core plate, lower core plate and connecting and solidifying sheet on a pressure plate;
(4) and (3) laminating: pressing the lattice boards arranged on the pressing plate;
(5) and (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
by adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of a finishing process according to a preferred embodiment of the present invention;
FIG. 2 is a schematic process flow diagram of a pressing process in a preferred embodiment of the present invention;
FIG. 3 is an exploded view of the preferred embodiment of the present invention.
The attached drawings indicate the following:
10. an upper core plate 11 and a first lower copper foil layer
12. First curing sheet 13, first upper copper foil layer
20. Lower core board 21, second lower copper foil layer
22. Second upper copper foil layer of second cured sheet 23
30. And connecting the curing sheets.
Detailed Description
The invention discloses a design product structure for manufacturing a 5G circuit board, which comprises an upper core board 10, a lower core board 20 and a connecting curing sheet 30, as shown in figure 3.
The upper core plate 10 comprises a first lower copper foil layer 11, a first curing sheet 12 and a first upper copper foil layer 13 which are overlapped and fixed together from bottom to top; the lower core plate 20 comprises a second lower copper foil layer 21, a second curing sheet 22 and a second upper copper foil layer 23 which are overlapped and fixed together from bottom to top; the connection curing sheet 30 is sandwiched between the upper core board 10 and the lower core board 20, and the first lower copper foil layer 11 and the second upper copper foil layer 23 are both reverse copper foils and are respectively attached and fixed to the upper and lower surfaces of the connection curing sheet 30.
As shown in fig. 1, the invention also discloses a design method for manufacturing a 5G circuit board, which sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
the upper core board 10 and the lower core board 20 are pressed, the connection prepreg 30 is used for bonding between the upper core board 10 and the lower core board 20, the upper core board 10 and the lower core board 20 are pressed into a board through high temperature, and the first lower copper foil layer 11 of the upper core board 10 and the second upper copper foil layer 23 of the lower core board 20 are both reverse copper foils and are respectively attached to the upper surface and the lower surface of the connection prepreg 30 during pressing. As shown in fig. 2, the method comprises the following steps:
(1) browning: by the chemical principle, the surface of the first lower copper foil layer 11 of the upper core board 10 and the surface of the second upper copper foil layer 23 of the lower core board 20 are relatively roughened, so as to increase the bonding force between the copper foil layers and the connection prepreg 30.
(2) Combining: a joint curing sheet 30 is sandwiched between the upper core sheet 10 and the lower core sheet 20.
(3) Plate stacking: the assembled upper core plate 10, lower core plate 20 and joint curing sheet 30 are placed on a platen.
(4) And (3) laminating: and pressing the discharge qualified plates on the pressing plate.
(5) And (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
The specific process flow of the pressing procedure is shown in the following table:
the design of the invention is characterized in that: by adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (3)
1. A design product structure for 5G circuit board manufacturing, its characterized in that: comprises an upper core plate, a lower core plate and a connecting and curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece.
2. A design method for manufacturing a 5G circuit board is characterized by comprising the following steps: the method sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
and pressing the upper core plate and the lower core plate by adopting a mode of pressing the upper core plate and the lower core plate, bonding the upper core plate and the lower core plate by using a connecting prepreg, pressing the upper core plate and the lower core plate into a plate by high temperature, wherein the first lower copper foil layer of the upper core plate and the second upper copper foil layer of the lower core plate are both reverse copper foils during pressing and are respectively attached to the upper surface and the lower surface of the connecting prepreg.
3. The design method for 5G circuit board manufacture according to claim 2, wherein: the method comprises the following steps:
(1) browning: by a chemical principle, the surface of a first lower copper foil layer of an upper core plate and the surface of a second upper copper foil layer of a lower core plate are relatively roughened so as to increase the binding force between the copper foil layers and a connecting prepreg;
(2) combining: a connecting curing sheet is clamped between the upper core plate and the lower core plate;
(3) plate stacking: placing the combined upper core plate, lower core plate and connecting and solidifying sheet on a pressure plate;
(4) and (3) laminating: pressing the lattice boards arranged on the pressing plate;
(5) and (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396599.4A CN111278240A (en) | 2019-12-30 | 2019-12-30 | Design product structure and method for manufacturing 5G circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396599.4A CN111278240A (en) | 2019-12-30 | 2019-12-30 | Design product structure and method for manufacturing 5G circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111278240A true CN111278240A (en) | 2020-06-12 |
Family
ID=71000147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911396599.4A Pending CN111278240A (en) | 2019-12-30 | 2019-12-30 | Design product structure and method for manufacturing 5G circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111278240A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533360A (en) * | 2020-12-07 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Hot-press bonding method of high-frequency circuit board and processing method of circuit board |
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291952A (en) * | 2011-08-05 | 2011-12-21 | 奥士康精密电路（惠州）有限公司 | Method for preparing multi-layer PCB (printed circuit board) |
| CN106255351A (en) * | 2016-08-24 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of twin-core plate four laminate compression method |
| CN106255348A (en) * | 2016-08-09 | 2016-12-21 | 江门崇达电路技术有限公司 | The process for pressing of precise circuit board |
| CN108449890A (en) * | 2018-03-27 | 2018-08-24 | 广东生益科技股份有限公司 | A kind of production method of the multi-layer PCB containing PTFE |
| CN109219257A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子有限公司 | A kind of copper-clad plate and its production technology of application reversion copper foil material |
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
-
2019
- 2019-12-30 CN CN201911396599.4A patent/CN111278240A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291952A (en) * | 2011-08-05 | 2011-12-21 | 奥士康精密电路（惠州）有限公司 | Method for preparing multi-layer PCB (printed circuit board) |
| CN106255348A (en) * | 2016-08-09 | 2016-12-21 | 江门崇达电路技术有限公司 | The process for pressing of precise circuit board |
| CN106255351A (en) * | 2016-08-24 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of twin-core plate four laminate compression method |
| CN108449890A (en) * | 2018-03-27 | 2018-08-24 | 广东生益科技股份有限公司 | A kind of production method of the multi-layer PCB containing PTFE |
| CN109219257A (en) * | 2018-11-23 | 2019-01-15 | 开平依利安达电子有限公司 | A kind of copper-clad plate and its production technology of application reversion copper foil material |
| CN109600940A (en) * | 2018-11-29 | 2019-04-09 | 广东骏亚电子科技股份有限公司 | Multi-layer board compression method |
Non-Patent Citations (1)
| Title |
|---|
| 张庆云: "反面处理铜箔在覆铜箔层压板中的应用", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114286494A (en) * | 2020-09-27 | 2022-04-05 | 华为技术有限公司 | PCB structure, manufacturing method thereof and electronic equipment |
| CN112533360A (en) * | 2020-12-07 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Hot-press bonding method of high-frequency circuit board and processing method of circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104582325B (en) | Rigid-flex combined board and preparation method thereof, circuit board module | |
| US9706669B2 (en) | Rigid-flexible circuit board having flying-tail structure and method for manufacturing same | |
| CN109688736B (en) | Multilayer circuit board and manufacturing method thereof | |
| WO2013097480A1 (en) | Fabrication process of stepped circuit board | |
| CN111278240A (en) | Design product structure and method for manufacturing 5G circuit board | |
| CN107041082A (en) | The PCB process for pressing of dissymmetrical structure | |
| CN104640375A (en) | Method for manufacturing soft-hard combination board | |
| CN110996565A (en) | Pressing method for 5G circuit board | |
| CN113825306A (en) | Circuit board and preparation method thereof | |
| CN104183567B (en) | Thin encapsulation substrate and its processing technology | |
| CN101460013A (en) | Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same | |
| CN103144378B (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN201797646U (en) | Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board | |
| CN104185363A (en) | Composite type ultra-thin non-core substrate and manufacturing method thereof | |
| CN110493978A (en) | A kind of thickness and angularity control method of printed circuit board | |
| CN110944452A (en) | Impedance control method for high-performance fine line flexible circuit board | |
| JP2014027125A (en) | Manufacturing method of printed wiring board | |
| CN103717016A (en) | Layered prevention technology of multilayer high-frequency electrosilvering circuit board | |
| CN209517628U (en) | A kind of rigidity is without glass photoelectricity printed board | |
| CN109348610A (en) | A kind of PCB preparation method and its PCB | |
| CN110366330A (en) | FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen | |
| JP2009246146A (en) | Method of manufacturing for circuit board | |
| CN209787555U (en) | Single-side double-layer copper substrate | |
| CN104955277B (en) | A kind of heavy copper circuit board preparation method | |
| CN206533603U (en) | A kind of thickening type MULTILAYER COMPOSITE circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200612 |