CN111278240A - Design product structure and method for manufacturing 5G circuit board - Google Patents

Design product structure and method for manufacturing 5G circuit board Download PDF

Info

Publication number
CN111278240A
CN111278240A CN201911396599.4A CN201911396599A CN111278240A CN 111278240 A CN111278240 A CN 111278240A CN 201911396599 A CN201911396599 A CN 201911396599A CN 111278240 A CN111278240 A CN 111278240A
Authority
CN
China
Prior art keywords
core plate
copper foil
foil layer
pressing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911396599.4A
Other languages
Chinese (zh)
Inventor
洪少鸿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Ruomei Electronic Technology Co ltd
Original Assignee
Dongguan Ruomei Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Ruomei Electronic Technology Co ltd filed Critical Dongguan Ruomei Electronic Technology Co ltd
Priority to CN201911396599.4A priority Critical patent/CN111278240A/en
Publication of CN111278240A publication Critical patent/CN111278240A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening

Abstract

The invention discloses a design product structure and a method for manufacturing a 5G circuit board, wherein the design product structure comprises an upper core board, a lower core board and a connecting curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece. By adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.

Description

Design product structure and method for manufacturing 5G circuit board
Technical Field
The invention relates to the technical field of circuit boards, in particular to a design product structure and a method for manufacturing a 5G circuit board.
Background
The existing 5G product is designed by adopting a traditional process, and the process has certain defects in the aspects of pressing binding force, insulativity and filling property. To improve this drawback, the problems of lamination method and lamination program must be solved first. At present, the conventional copper foil plate (with the light facing outwards) is mainly adopted in the industry, and poor binding force can occur probabilistically after pressing, so that poor signal conduction and signal interference phenomena occur simultaneously when the plate is exploded and layered. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide a structure and a method for manufacturing a designed product for 5G circuit board, which can effectively solve the problems of the existing structure of the designed product that the press-fit bonding force and the signal conductivity of the finished product have certain defects.
In order to achieve the purpose, the invention adopts the following technical scheme:
a design product structure for manufacturing a 5G circuit board comprises an upper core plate, a lower core plate and a connecting curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece.
A design method for manufacturing a 5G circuit board sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
and pressing the upper core plate and the lower core plate by adopting a mode of pressing the upper core plate and the lower core plate, bonding the upper core plate and the lower core plate by using a connecting prepreg, pressing the upper core plate and the lower core plate into a plate by high temperature, wherein the first lower copper foil layer of the upper core plate and the second upper copper foil layer of the lower core plate are both reverse copper foils during pressing and are respectively attached to the upper surface and the lower surface of the connecting prepreg.
As a preferable scheme, the method comprises the following steps:
(1) browning: by a chemical principle, the surface of a first lower copper foil layer of an upper core plate and the surface of a second upper copper foil layer of a lower core plate are relatively roughened so as to increase the binding force between the copper foil layers and a connecting prepreg;
(2) combining: a connecting curing sheet is clamped between the upper core plate and the lower core plate;
(3) plate stacking: placing the combined upper core plate, lower core plate and connecting and solidifying sheet on a pressure plate;
(4) and (3) laminating: pressing the lattice boards arranged on the pressing plate;
(5) and (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
by adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic diagram of a finishing process according to a preferred embodiment of the present invention;
FIG. 2 is a schematic process flow diagram of a pressing process in a preferred embodiment of the present invention;
FIG. 3 is an exploded view of the preferred embodiment of the present invention.
The attached drawings indicate the following:
10. an upper core plate 11 and a first lower copper foil layer
12. First curing sheet 13, first upper copper foil layer
20. Lower core board 21, second lower copper foil layer
22. Second upper copper foil layer of second cured sheet 23
30. And connecting the curing sheets.
Detailed Description
The invention discloses a design product structure for manufacturing a 5G circuit board, which comprises an upper core board 10, a lower core board 20 and a connecting curing sheet 30, as shown in figure 3.
The upper core plate 10 comprises a first lower copper foil layer 11, a first curing sheet 12 and a first upper copper foil layer 13 which are overlapped and fixed together from bottom to top; the lower core plate 20 comprises a second lower copper foil layer 21, a second curing sheet 22 and a second upper copper foil layer 23 which are overlapped and fixed together from bottom to top; the connection curing sheet 30 is sandwiched between the upper core board 10 and the lower core board 20, and the first lower copper foil layer 11 and the second upper copper foil layer 23 are both reverse copper foils and are respectively attached and fixed to the upper and lower surfaces of the connection curing sheet 30.
As shown in fig. 1, the invention also discloses a design method for manufacturing a 5G circuit board, which sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
the upper core board 10 and the lower core board 20 are pressed, the connection prepreg 30 is used for bonding between the upper core board 10 and the lower core board 20, the upper core board 10 and the lower core board 20 are pressed into a board through high temperature, and the first lower copper foil layer 11 of the upper core board 10 and the second upper copper foil layer 23 of the lower core board 20 are both reverse copper foils and are respectively attached to the upper surface and the lower surface of the connection prepreg 30 during pressing. As shown in fig. 2, the method comprises the following steps:
(1) browning: by the chemical principle, the surface of the first lower copper foil layer 11 of the upper core board 10 and the surface of the second upper copper foil layer 23 of the lower core board 20 are relatively roughened, so as to increase the bonding force between the copper foil layers and the connection prepreg 30.
(2) Combining: a joint curing sheet 30 is sandwiched between the upper core sheet 10 and the lower core sheet 20.
(3) Plate stacking: the assembled upper core plate 10, lower core plate 20 and joint curing sheet 30 are placed on a platen.
(4) And (3) laminating: and pressing the discharge qualified plates on the pressing plate.
(5) And (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
The specific process flow of the pressing procedure is shown in the following table:
the design of the invention is characterized in that: by adopting the upper core board and the lower core board and matching the lower copper foil layer of the upper core board and the upper copper foil layer of the lower core board to be the reversal copper foils, the surface is relatively rough, the bonding force of the pressing is greatly enhanced, meanwhile, the signal conductivity of a finished product can be enhanced, the signal interference problem is reduced, and the quality of the finished product is more guaranteed.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (3)

1. A design product structure for 5G circuit board manufacturing, its characterized in that: comprises an upper core plate, a lower core plate and a connecting and curing sheet; the upper core plate comprises a first lower copper foil layer, a first curing sheet and a first upper copper foil layer which are overlapped and fixed together from bottom to top; the lower core plate comprises a second lower copper foil layer, a second curing sheet and a second upper copper foil layer which are overlapped and fixed together from bottom to top; the connection curing piece is clamped between the upper core plate and the lower core plate, and the first lower copper foil layer and the second upper copper foil layer are both reverse copper foils and are respectively attached and fixed to the upper surface and the lower surface of the connection curing piece.
2. A design method for manufacturing a 5G circuit board is characterized by comprising the following steps: the method sequentially comprises the following steps: cutting, drying, inner layer circuit, pressing, drilling, chemical copper deposition, whole board electroplating, outer layer circuit, pattern electroplating, alkaline etching, solder mask, character, forming, electrical test and finished product inspection, wherein the pressing process comprises the following steps:
and pressing the upper core plate and the lower core plate by adopting a mode of pressing the upper core plate and the lower core plate, bonding the upper core plate and the lower core plate by using a connecting prepreg, pressing the upper core plate and the lower core plate into a plate by high temperature, wherein the first lower copper foil layer of the upper core plate and the second upper copper foil layer of the lower core plate are both reverse copper foils during pressing and are respectively attached to the upper surface and the lower surface of the connecting prepreg.
3. The design method for 5G circuit board manufacture according to claim 2, wherein: the method comprises the following steps:
(1) browning: by a chemical principle, the surface of a first lower copper foil layer of an upper core plate and the surface of a second upper copper foil layer of a lower core plate are relatively roughened so as to increase the binding force between the copper foil layers and a connecting prepreg;
(2) combining: a connecting curing sheet is clamped between the upper core plate and the lower core plate;
(3) plate stacking: placing the combined upper core plate, lower core plate and connecting and solidifying sheet on a pressure plate;
(4) and (3) laminating: pressing the lattice boards arranged on the pressing plate;
(5) and (3) detecting thermal stress: detection was performed as required by IPC-TM 650.
CN201911396599.4A 2019-12-30 2019-12-30 Design product structure and method for manufacturing 5G circuit board Pending CN111278240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911396599.4A CN111278240A (en) 2019-12-30 2019-12-30 Design product structure and method for manufacturing 5G circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911396599.4A CN111278240A (en) 2019-12-30 2019-12-30 Design product structure and method for manufacturing 5G circuit board

Publications (1)

Publication Number Publication Date
CN111278240A true CN111278240A (en) 2020-06-12

Family

ID=71000147

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911396599.4A Pending CN111278240A (en) 2019-12-30 2019-12-30 Design product structure and method for manufacturing 5G circuit board

Country Status (1)

Country Link
CN (1) CN111278240A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112533360A (en) * 2020-12-07 2021-03-19 惠州市特创电子科技股份有限公司 Hot-press bonding method of high-frequency circuit board and processing method of circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112533360A (en) * 2020-12-07 2021-03-19 惠州市特创电子科技股份有限公司 Hot-press bonding method of high-frequency circuit board and processing method of circuit board

Similar Documents

Publication Publication Date Title
CN104582325B (en) Rigid-flex combined board and preparation method thereof, circuit board module
US9706669B2 (en) Rigid-flexible circuit board having flying-tail structure and method for manufacturing same
WO2013097480A1 (en) Fabrication process of stepped circuit board
WO2013097549A1 (en) Process for manufacturing printed circuit board having high-frequency and low-frequency mixed board structure
CN111278240A (en) Design product structure and method for manufacturing 5G circuit board
CN110099523A (en) A kind of manufacture craft of multilayer circuit board
CN104640375A (en) Method for manufacturing soft-hard combination board
WO2016107059A1 (en) Coreless plate fabricating member, coreless plate and method for fabricating coreless plate
CN104183567B (en) Thin encapsulation substrate and its processing technology
CN103144378B (en) Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof
CN101460013A (en) Composite article for functional resin and metal foil and multilayered printed circuit board manufacturing method using the same
CN107041082A (en) The PCB process for pressing of dissymmetrical structure
CN110996565A (en) Pressing method for 5G circuit board
CN110113898A (en) A kind of PCB plate production method based on liquid resin
CN201797646U (en) Printed circuit board (PCB) structure capable for improving difference of dimensional stability of multilayer board
CN105216400A (en) High-thermal conductive metal base plate resin filler method, vacuum pressing-combining structure and metal substrate
JP2014027125A (en) Manufacturing method of printed wiring board
CN110366330A (en) FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen
CN104185363A (en) Composite type ultra-thin non-core substrate and manufacturing method thereof
CN103717016B (en) A kind of anti-hierarchical process of silver-plated circuit board of multilayer high-frequency electrical
CN104955277B (en) A kind of heavy copper circuit board preparation method
CN109526138A (en) A kind of rigidity is without the printed board of glass photoelectricity and its processing method
CN205291774U (en) High thermal conductive metal substrate
CN104768336A (en) Interlayer interconnection process
CN209517628U (en) A kind of rigidity is without glass photoelectricity printed board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination