CN104902699B - A kind of backboard electro-plating method of the through-hole containing high thickness to diameter ratio - Google Patents
A kind of backboard electro-plating method of the through-hole containing high thickness to diameter ratio Download PDFInfo
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- CN104902699B CN104902699B CN201510221060.0A CN201510221060A CN104902699B CN 104902699 B CN104902699 B CN 104902699B CN 201510221060 A CN201510221060 A CN 201510221060A CN 104902699 B CN104902699 B CN 104902699B
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- backboard
- heavy copper
- liquid medicine
- hole
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Abstract
The invention discloses a kind of backboard electro-plating methods of through-hole containing high thickness to diameter ratio, belong to wiring board manufacturing process field.The backboard electro-plating method includes the following steps：A it) uses in plasma abatement method removal backboard through-hole and bores dirt；B) inclined back plate after decontamination is fixed on heavy copper frame and immerses heavy copper in heavy copper liquid medicine, the backboard and horizontal direction angle are 70 80 °, and the width in the heavy copper liquid medicine region on backboard both sides is 20mm or more；C required copper thickness) is electroplated to using the current density whole plate of 0.6 0.8ASD after heavy copper, needs backboard turning upside down 180 ° at least once in whole plate electroplating process.Bevelling in current parameters and electroplating process that the present invention is electroplated by adjusting whole plate, and the amplitude of fluctuation and frequency of whole plate are increased, the uniformity of whole plate coating is effectively improved, the electroplating evenness in big backboard plate face and through-hole is improved, improves the quality of backboard.
Description
Technical field
The invention belongs to a kind of plating of the backboard of wiring board manufacturing process field more particularly to through-hole containing high thickness to diameter ratio
Method.
Background technology
It is common dirty except boring for chemistry except dirty mode is bored in printed circuit board industry, i.e., using (KMnO4+ NaOH) solution,
Hole wall residual glue residue caused by machine drilling is carried out stinging erosion, bright and clean smooth hole wall environment is created for heavy copper process.
Except heavy copper process is entered after brill dirt, for common product, the process for copper that sinks is more mature, and wiring board is vertically inserted in
In heavy copper frame, separate slot, does not make adjacent lines plate spacing 10-12mm, heavy copper 1 time, and often vibrations 15s stops 20s during heavy copper.
Enter whole plate electroplating technology, the whole plate electroplating technological parameter of common product after the heavy copper of wiring board：1.3ASD × (30~
45min), the frequency of electroplating process not bevelling, amplitude of fluctuation 5cm, swing is 10~20 beats/min.
Since high multilayer back plate thickness is big, the feature more than the number of plies, especially with high-frequency high-speed plank and epoxy resin
The backboard of system plank mixed pressure, according to traditional chemistry except the dirty method (KMnO of brill4+ NaOH) to high thickness to diameter ratio, (radius-thickness ratio is big
In 10:1) glue residue in through-hole carries out stinging erosion, is also easy to produce epoxy resin plank and stings erosion soon, the weak plank of high-frequency high-speed isoreactivity
It is slow to sting erosion, hole wall is very coarse.In heavy copper process, bubble is easily remained in high thickness to diameter ratio through-hole, if bubble cannot be discharged in time,
The exchange and reaction of liquid medicine will be hindered, is subsequently also easy to produce the bad problems such as Kong Wutong, hole copper is thin.In whole plate electroplating work procedure, due to
Backboard size and the limitation for pressing thickness, the uniformity of plating are also more difficult to control.
Invention content
For the problems in above-mentioned high multilayer backboard electroplate technology, it is logical that the present invention provides a kind of high multilayer backboard of raising
Hole solves residual bubble, liquid medicine in high thickness to diameter ratio through-hole and exchanges insufficient and cause heavy copper bad except dirty uniformity is bored, improve because
Non-uniform backboard electro-plating method is electroplated in backboard whole plate.Concrete scheme is as follows：
A kind of backboard electro-plating method of the through-hole containing high thickness to diameter ratio, the backboard electro-plating method include the following steps：
A it) uses in plasma abatement method removal backboard through-hole and bores dirt；
B) inclined back plate after decontamination is fixed on heavy copper frame and immerses in heavy copper liquid medicine copper, the backboard and the level of sinking
Angular separation is 70-80 °, and the width in the heavy copper liquid medicine region on backboard both sides is 20mm or more；
C required copper thickness) is electroplated to using the current density whole plate of 0.6-0.8ASD after heavy copper, is needed in whole plate electroplating process
Backboard is turned upside down into 180 ° (i.e. bevellings) at least once.
Preferably, in the step A, in plasma abatement method removal backboard through-hole dirt is bored to include the following steps：
S1, first handles 15-20min, the gas of nitrogen using the mixed gas of nitrogen and oxygen as gas molecule is intensified
Body flow is 200sccm, and the gas flow of oxygen is 1800sccm, and it is 8000w that electric field, which intensifies power,；
S2, then handles 25- using the mixed gas of nitrogen, oxygen and carbon tetrafluoride as gas molecule is intensified
The gas flow of 30min, nitrogen are 160sccm, and the gas flow of oxygen is 1260sccm, and the gas flow of carbon tetrafluoride is
1260sccm, it is 8000w that electric field, which intensifies power,.
Preferably, in the step B, backboard immerses heavy copper in heavy copper liquid medicine and includes the following steps：
A, backboard is immersed in sinking copper liquid medicine, 20-25s is first shaken with the frequency of vibration amplitude >=30mm per second, then stand
15-20s；
B, backboard is taken out from heavy copper liquid medicine and is drained；
C, 2-3 above-mentioned steps a, b are repeated.
Preferably, it needs to swing along perpendicular to backboard board direction in the step C, when backboard whole plate is electroplated, amplitude of fluctuation
Degree is 6-8cm, and frequency is 15~25 beats/min.
The present invention is dirty instead of traditional (KMnO except boring using plasma4+ NaOH) it is chemical dirty except boring, avoid chemical medicinal liquid
Erosion rate is stung to the material of different systems and degree is inconsistent, through-hole in backboard is improved and subtracts except the uniformity of hole wall after brill dirt
Lack and has subsequently been scrapped caused by except brill dirt is uneven, hole wall is coarse.
By the number of the heavy copper of change, vibration frequency, time and the hanging plate mode when sinking copper are adjusted, is solved in through-hole
The problem of gas bubbles left, liquid medicine poor fluidity, improves the heavy copper effect of high thickness to diameter ratio through-hole, avoids the heavy copper of through-hole leakage, hole
The problems such as inner wall is without copper, notch is caused to be scrapped.
By adjusting bevelling in the current parameters and electroplating process of whole plate plating, and increase the amplitude of fluctuation and frequency of whole plate
Rate effectively improves the uniformity of whole plate coating, improves the electroplating evenness in big backboard plate face and through-hole, improves the back of the body
The quality of plate.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is further described and illustrates.
Embodiment 1
The product of the present embodiment be 21 layers of backboard, 455 × 607mm of size, plate thickness 4.1mm, finished product minimum-value aperture 0.35mm,
Through-hole radius-thickness ratio is 12:1.Using high frequency plank, high TG planks and PP epoxy resin plank mixed pressures.Electroplating technology is as follows：
1) plasma abatement method removal through-hole is used to bore dirty.Boring dirt in plasma abatement method removal backboard through-hole includes
In two stages of first stage and second stage, first stage and second stage are intensified the mixed gas composition of gas molecule, gas
It is as shown in table 1 that body flow, electric field intensify power, processing time parameter：
Table 1
Plasma abatement method forms ion or energetic free radical, with hole wall surface material by electric field exciting gas molecule
Material collides and reacts, Drill dirt cleaning.Plasma is except even action of the dirty mode to different kind of material is bored, to different characteristics
Plank mixed pressure structure it is more preferable except dirty effect is bored.
2) inclined back plate after decontamination is fixed on heavy copper frame (i.e. hanging plate), backboard and horizontal direction angle are 75 °, often
Spacing between two pieces of backboards is 20~24mm；Then backboard is immersed in sinking copper liquid medicine, first with vibration amplitude >=30mm per second
Frequency shake 25s, then stand 15s；Backboard is taken out from heavy copper liquid medicine again and is drained；Repeat the heavy copper process of above-mentioned immersion 3 times.
Using hanging plate is tilted, when each backboard immerses heavy copper liquid medicine, liquid medicine is more easy to enrich in hole, smoothly arranges bubble in hole
Go out, ensure that the exchange of heavy copper liquid medicine and is contacted with the reaction of hole wall；Medicine caused by the distance can effectively avoid plate face excessive
The logical problem of being obstructed of flow；Meanwhile the vibrations time is appropriately extended, the adjustment vibrations period；Avoid through-hole leakage sink copper, hole inner wall without copper,
The problems such as notch.
3) 180min is electroplated using the current density whole plate of 0.65ASD in the backboard after heavy copper, and backboard whole plate needs edge when being electroplated
It (is by the winged bar i.e. crossbeam of hanging plate, along pendulum of the production line swing with movable plate to be swung perpendicular to backboard board direction
It is dynamic), amplitude of fluctuation 7cm, frequency is 25 beats/min, and when being electroplated to 90min, backboard is turned upside down 180 °.
Electric plating of whole board is made using low current long-time method, can prevent back plate surface copper facing copper thickness ununiformity.In plating
Between midpoint backboard is turned upside down 180 ° (i.e. bevellings), be more advantageous to promoted plate face copper thickness uniformity.Similar heavy copper principle, increases
Add vibration frequency and vibration amplitude, is exchanged convenient for liquid medicine in hole.
Embodiment 2
The product of the present embodiment be 21 layers of backboard, 455 × 607mm of size, plate thickness 4.1mm, finished product minimum-value aperture 0.35mm,
Through-hole radius-thickness ratio is 12:1.Using high frequency plank, high TG planks and PP epoxy resin plank mixed pressures.Electroplating technology is as follows：
1) plasma abatement method removal through-hole is used to bore dirty.Boring dirt in plasma abatement method removal backboard through-hole includes
In two stages of first stage and second stage, first stage and second stage are intensified the mixed gas composition of gas molecule, gas
It is as shown in table 2 that body flow, electric field intensify power, processing time parameter：
Table 2
Plasma abatement method forms ion or energetic free radical, with hole wall surface material by electric field exciting gas molecule
Material collides and reacts, Drill dirt cleaning.Plasma is except even action of the dirty mode to different kind of material is bored, to different characteristics
Plank mixed pressure structure it is more preferable except dirty effect is bored.
2) inclined back plate after decontamination is fixed on heavy copper frame (i.e. hanging plate), backboard and horizontal direction angle are 70 °, often
Spacing between two pieces of backboards is 20~24mm；Then backboard is immersed in sinking copper liquid medicine, first with vibration amplitude >=30mm per second
Frequency shake 20s, then stand 20s；Backboard is taken out from heavy copper liquid medicine again and is drained；Repeat the heavy copper process of above-mentioned immersion 2 times.
Using hanging plate is tilted, when each backboard immerses heavy copper liquid medicine, liquid medicine is more easy to enrich in hole, smoothly arranges bubble in hole
Go out, ensure that the exchange of heavy copper liquid medicine and is contacted with the reaction of hole wall；Medicine caused by the distance can effectively avoid plate face excessive
The logical problem of being obstructed of flow；Meanwhile the vibrations time is appropriately extended, the adjustment vibrations period；Avoid through-hole leakage sink copper, hole inner wall without copper,
The problems such as notch.
3) 180min is electroplated using the current density whole plate of 0.7ASD in the backboard after heavy copper, need to be along vertical when backboard whole plate is electroplated
It is directly swung in backboard board direction, amplitude of fluctuation 7cm, frequency is 20 beats/min, and when being electroplated to 90min, backboard is run up and down
180 °.
Electric plating of whole board is made using low current long-time method, can prevent back plate surface copper facing copper thickness ununiformity.In plating
Between midpoint backboard is turned upside down 180 ° (i.e. bevellings), be more advantageous to promoted plate face copper thickness uniformity.Similar heavy copper principle, increases
Add vibration frequency and vibration amplitude, is exchanged convenient for liquid medicine in hole.
Embodiment 3
The product of the present embodiment be 21 layers of backboard, 455 × 607mm of size, plate thickness 4.1mm, finished product minimum-value aperture 0.35mm,
Through-hole radius-thickness ratio is 12:1.Using high frequency plank, high TG planks and PP epoxy resin plank mixed pressures.Electroplating technology is as follows：
1) plasma abatement method removal through-hole is used to bore dirty.Boring dirt in plasma abatement method removal backboard through-hole includes
In two stages of first stage and second stage, first stage and second stage are intensified the mixed gas composition of gas molecule, gas
It is as shown in table 3 that body flow, electric field intensify power, processing time parameter：
Table 3
Plasma abatement method forms ion or energetic free radical, with hole wall surface material by electric field exciting gas molecule
Material collides and reacts, Drill dirt cleaning.Plasma is except even action of the dirty mode to different kind of material is bored, to different characteristics
Plank mixed pressure structure it is more preferable except dirty effect is bored.
2) inclined back plate after decontamination is fixed on heavy copper frame (i.e. hanging plate), backboard and horizontal direction angle are 80 °, often
Spacing between two pieces of backboards is 24mm；Then backboard is immersed in sinking copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second
Rate shakes 25s, then stands 20s；Backboard is taken out from heavy copper liquid medicine again and is drained；Repeat the heavy copper process of above-mentioned immersion 3 times.
Using hanging plate is tilted, when each backboard immerses heavy copper liquid medicine, liquid medicine is more easy to enrich in hole, smoothly arranges bubble in hole
Go out, ensure that the exchange of heavy copper liquid medicine and is contacted with the reaction of hole wall；Medicine caused by the distance can effectively avoid plate face excessive
The logical problem of being obstructed of flow；Meanwhile the vibrations time is appropriately extended, the adjustment vibrations period；Avoid through-hole leakage sink copper, hole inner wall without copper,
The problems such as notch.
3) 180min is electroplated using the current density whole plate of 0.7ASD in the backboard after heavy copper, need to be along vertical when backboard whole plate is electroplated
It is directly swung in backboard board direction, amplitude of fluctuation 8cm, frequency is 15 beats/min, is electroplated to 45min, 90min, 135min
When, backboard is respectively turned upside down to 180 ° once.
Electric plating of whole board is made using low current long-time method, can prevent back plate surface copper facing copper thickness ununiformity.In plating
Between midpoint backboard is turned upside down 180 ° (i.e. bevellings), be more advantageous to promoted plate face copper thickness uniformity.Similar heavy copper principle, increases
Add vibration frequency and vibration amplitude, is exchanged convenient for liquid medicine in hole.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (1)
1. a kind of backboard electro-plating method of through-hole containing high thickness to diameter ratio, which is characterized in that the backboard electro-plating method includes following
Step：
A it) uses in plasma abatement method removal backboard through-hole and bores dirt：First, using the mixed gas of nitrogen and oxygen as quilt
Exciting gas molecule handles 15-20min, and the gas flow of nitrogen is 200sccm, and the gas flow of oxygen is 1800sccm, electricity
It is 8000W that power is intensified in field；Then, it is handled using the mixed gas of nitrogen, oxygen and carbon tetrafluoride as gas molecule is intensified
The gas flow of 25-30min, nitrogen are 160sccm, and the gas flow of oxygen is 1260sccm, the gas flow of carbon tetrafluoride
For 1260sccm, it is 8000w that electric field, which intensifies power,；
B) inclined back plate after decontamination is fixed on heavy copper frame and immerses heavy copper, the backboard and horizontal direction in heavy copper liquid medicine
Angle is 70-80 °, and the width in the heavy copper liquid medicine region on backboard both sides is 20mm or more；Backboard immerses heavy copper-clad in heavy copper liquid medicine
Include following steps：A, backboard is immersed in sinking copper liquid medicine, 20-25s is first shaken with the frequency of vibration amplitude >=30mm per second, then quiet
Set 15-20s；B, backboard is taken out from heavy copper liquid medicine and is drained；C, 2-3 above-mentioned steps a, b are repeated；
C required copper thickness) is electroplated to using the current density whole plate of 0.6-0.8ASD after heavy copper, needs to carry on the back in whole plate electroplating process
Plate turns upside down 180 ° at least once；It needs to swing along perpendicular to backboard board direction when the backboard whole plate plating, amplitude of fluctuation
For 6-8cm, frequency is 15~25 beats/min.
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| CN105682376B (en) * | 2016-03-17 | 2018-10-19 | 惠州市星之光科技有限公司 | A kind of thickness copper high aspect ratio small-bore mainboard manufacture craft |
| CN108174533A (en) * | 2017-12-29 | 2018-06-15 | 柏承科技(昆山)股份有限公司 | Anti- holes Rigid Flex electroplating technology |
| CN110248476A (en) * | 2019-06-12 | 2019-09-17 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process based on the discontinuous mesh of tomography |
| CN113271727B (en) * | 2021-05-14 | 2023-03-14 | 惠州中京电子科技有限公司 | PCB manufacturing method for improving through hole rate and preventing copper-free hole |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
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| CN202226946U (en) * | 2011-09-23 | 2012-05-23 | 博敏电子股份有限公司 | Electroless copper board rack |
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