CN104902699A - Electroplating method of backboard comprising high thickness-diameter ratio through hole - Google Patents
Electroplating method of backboard comprising high thickness-diameter ratio through hole Download PDFInfo
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- CN104902699A CN104902699A CN201510221060.0A CN201510221060A CN104902699A CN 104902699 A CN104902699 A CN 104902699A CN 201510221060 A CN201510221060 A CN 201510221060A CN 104902699 A CN104902699 A CN 104902699A
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- backboard
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- heavy copper
- liquid medicine
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Abstract
The invention discloses an electroplating method of a backboard comprising a high thickness-diameter ratio through hole, and belongs to the field of a production manufacturing process of a circuit board. The backboard electroplating method comprises the following steps: A), performing desmearing on the through hole of the backboard by use of a plasma scrubbing method; B), aslant fixing the desmeared backboard on a copper precipitation frame for immersing into a copper precipitation liquid medicine for copper precipitation, wherein the included angle between the backboard and a horizontal direction is 70 to 80 DEG, and the width of copper precipitation liquid medicine areas at the two sides of the back board is more than 20mm; C), after the copper precipitation, performing panel electroplating on the backboard to a needed copper thickness by use of current density of 0.6-0.8ASD, wherein the backboard needs to be turned upside down at an angle of 180 DEG at least once in a panel electroplating process. According to the invention, through adjusting current parameters of the panel electroplating, performing beveling in the electroplating process and increasing the panel swing amplitude and the frequency, the uniformity of panel coating is effectively enhanced, the electroplating uniformity of the board surface of the large backboard and in the through hole is improved, and the backboard quality is improved.
Description
Technical field
The invention belongs to wiring board manufacturing process field, particularly relate to a kind of backboard electro-plating method containing high thickness to diameter ratio through hole.
Background technology
In printed circuit board industry, conventional is that chemistry is dirty except boring except boring dirty mode, namely adopts (KMnO
4+ NaOH) solution, erosion is stung to the hole wall removing residual glue slag that machine drilling causes, for heavy copper process creates bright and clean smooth hole wall environment.
After boring dirt, enter heavy copper process, for common product, heavy process for copper is comparatively ripe, and vertically inserted in by wiring board in heavy copper frame, not separate slot, makes adjacent lines distance between plates 10-12mm, and heavy copper 1 time often shakes 15s in heavy copper process and stops 20s.
Wiring board sinks after copper and enters whole plate electroplating technology, the whole plate electroplating technological parameter of common product: 1.3ASD × (30 ~ 45min), and electroplating process is bevelling not, and amplitude of fluctuation is 5cm, and the frequency of swing is 10 ~ 20 beats/min.
Because high multilayer back plate thickness is large, the number of plies is many, especially employ the backboard of high-frequency high-speed sheet material and the mixed pressure of epoxy-resin systems sheet material, according to traditional chemistry except boring dirty method (KMnO
4+ NaOH) erosion is stung to the glue slag in high thickness to diameter ratio (radius-thickness ratio is greater than 10:1) through hole, easily producing epoxy resin sheet material, to sting erosion fast, and it is slow that erosion stung by the weak sheet material of high-frequency high-speed isoreactivity, and hole wall is very coarse.In heavy copper process, in high thickness to diameter ratio through hole, easily remain bubble, if bubble can not be discharged in time, exchange and the reaction of liquid medicine will be hindered, the bad problems such as follow-up easy generation Kong Wutong, hole copper are thin.In whole plate electroplating work procedure, due to the restriction of backboard size and pressing thickness, the uniformity also more difficult control of plating.
Summary of the invention
For the problem in above-mentioned high multilayer backboard electroplate technology, the invention provides the high multilayer backboard through hole of a kind of raising except boring dirty uniformity, solve residual bubble in high thickness to diameter ratio through hole, liquid medicine exchange is insufficient and cause heavy copper bad, improve because uneven backboard electro-plating method electroplated by the whole plate of backboard.Concrete scheme is as follows:
Containing a backboard electro-plating method for high thickness to diameter ratio through hole, described backboard electro-plating method comprises the following steps:
A) adopt plasma abatement method to remove in backboard through hole and bore dirt;
B) be fixed on by the inclined back plate after decontamination on heavy copper frame and immerse heavy copper in heavy copper liquid medicine, described backboard and horizontal direction angle are 70-80 °, and the width in the heavy copper liquid medicine region on backboard both sides is more than 20mm;
C) adopt the whole plate of the current density of 0.6-0.8ASD to be electroplated to required copper after heavy copper thick, need in whole plate electroplating process backboard to be turned upside down 180 ° (i.e. bevellings) at least one times.
Preferably, in described steps A, plasma abatement method is removed brill dirt in backboard through hole and is comprised the following steps:
S1, first, using the mist of nitrogen and oxygen as intensified gas molecule process 15-20min, the gas flow of nitrogen is 200sccm, and the gas flow of oxygen is 1800sccm, and it is 8000w that electric field intensifies power;
S2, then, using the mist of nitrogen, oxygen and carbon tetrafluoride as intensified gas molecule process 25-30min, the gas flow of nitrogen is 160sccm, and the gas flow of oxygen is 1260sccm, the gas flow of carbon tetrafluoride is 1260sccm, and it is 8000w that electric field intensifies power.
Preferably, in described step B, backboard immerses heavy copper in heavy copper liquid medicine and comprises the following steps:
A, backboard is immersed in heavy copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second vibrations 20-25s, then leave standstill 15-20s;
B, backboard taken out from heavy copper liquid medicine drain;
C, repetition 2-3 above-mentioned steps a, b.
Preferably, in described step C, need when the whole plate of backboard is electroplated to swing along perpendicular to direction, backboard plate face, amplitude of fluctuation is 6-8cm, and frequency is 15 ~ 25 beats/min.
The present invention adopts plasma to remove and bores the traditional (KMnO of dirty replacement
4+ NaOH) chemistry is dirty except boring, and avoids the material of chemical medicinal liquid to different system and stings erosion speed and degree varies causes, improve through hole in backboard except bore dirty after the uniformity of hole wall, decrease because of except boring that dirt is uneven, hole wall coarse cause follow-uply to scrap.
By changing the number of times of heavy copper, adjust vibration frequency when sinking copper, time and link plate mode, solve the problem of the gas bubbles left in through hole, liquid medicine poor fluidity, improve the heavy copper effect of high thickness to diameter ratio through hole, avoid that through hole leaks heavy copper, hole inwall causes without the problem such as copper, breach scraps.
By adjusting bevelling in the current parameters of whole plate plating and electroplating process, and strengthening amplitude of fluctuation and the frequency of whole plate, effectively improving the uniformity of whole plate coating, improve the electroplating evenness in large backboard plate face and through hole, improve the quality of backboard.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment 1
The product of the present embodiment is 21 layers of backboard, size 455 × 607mm, thickness of slab 4.1mm, and finished product minimum-value aperture 0.35mm, through hole radius-thickness ratio is 12:1.Adopt high frequency sheet material, high TG sheet material and the mixed pressure of PP epoxy resin sheet material.Electroplating technology is as follows:
1) adopting plasma abatement method to remove through hole bores dirty.Plasma abatement method is removed brill dirt in backboard through hole and is comprised first stage and two stages of second stage, and the mixed gas composition of first stage and the intensified gas molecule of second stage, gas flow, electric field intensify power, processing time parameter is as shown in table 1:
Table 1
Plasma abatement method, by electric field exciting gas molecule, forms ion or energetic free radical, collides and react, Drill dirt cleaning with hole wall surface material.Plasma, except boring dirty mode to the even action of different kind of material, bores dirty better effects if to removing of different qualities sheet material mixed pressure structure.
2) be fixed on by the inclined back plate after decontamination on heavy copper frame (i.e. link plate), backboard and horizontal direction angle are 75 °, and the spacing between every two pieces of backboards is 20 ~ 24mm; Then backboard is immersed in heavy copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second vibrations 25s, then leave standstill 15s; Again backboard is taken out from heavy copper liquid medicine and drain; Repeat above-mentioned immersion and sink copper process 3 times.
Adopt inclination link plate, when each backboard immerses heavy copper liquid medicine, liquid medicine more easily enriches in hole, is discharged by bubble in hole smoothly, ensure that the exchange of heavy copper liquid medicine and contact with the reaction of hole wall; This distance can effectively avoid the excessive liquid medicine circulation caused in plate face to be obstructed problem; Meanwhile, proper extension vibrations time, the adjustment vibrations cycle; Through hole is avoided to leak heavy copper, hole inwall without the problem such as copper, breach.
3) backboard after heavy copper adopts the current density of 0.65ASD whole plate plating 180min, it (be the crossbeam by flying bar and link plate that backboard whole plate needs along swinging perpendicular to direction, backboard plate face when electroplating, the swing of plate is driven) along production line swing, amplitude of fluctuation is 7cm, frequency is 25 beats/min, when being electroplated to 90min, backboard is turned upside down 180 °.
Electric plating of whole board uses the long-time method of small area analysis to make, and can prevent back plate surface copper facing copper thickness ununiformity.At electroplating time mid point, backboard is turned upside down 180 ° (i.e. bevellings), be more conducive to the uniformity that riser face copper is thick.Similar heavy copper principle, increases vibration frequency and vibration amplitude, is convenient to liquid medicine in hole and exchanges.
Embodiment 2
The product of the present embodiment is 21 layers of backboard, size 455 × 607mm, thickness of slab 4.1mm, and finished product minimum-value aperture 0.35mm, through hole radius-thickness ratio is 12:1.Adopt high frequency sheet material, high TG sheet material and the mixed pressure of PP epoxy resin sheet material.Electroplating technology is as follows:
1) adopting plasma abatement method to remove through hole bores dirty.Plasma abatement method is removed brill dirt in backboard through hole and is comprised first stage and two stages of second stage, and the mixed gas composition of first stage and the intensified gas molecule of second stage, gas flow, electric field intensify power, processing time parameter is as shown in table 2:
Table 2
Plasma abatement method, by electric field exciting gas molecule, forms ion or energetic free radical, collides and react, Drill dirt cleaning with hole wall surface material.Plasma, except boring dirty mode to the even action of different kind of material, bores dirty better effects if to removing of different qualities sheet material mixed pressure structure.
2) be fixed on by the inclined back plate after decontamination on heavy copper frame (i.e. link plate), backboard and horizontal direction angle are 70 °, and the spacing between every two pieces of backboards is 20 ~ 24mm; Then backboard is immersed in heavy copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second vibrations 20s, then leave standstill 20s; Again backboard is taken out from heavy copper liquid medicine and drain; Repeat above-mentioned immersion and sink copper process 2 times.
Adopt inclination link plate, when each backboard immerses heavy copper liquid medicine, liquid medicine more easily enriches in hole, is discharged by bubble in hole smoothly, ensure that the exchange of heavy copper liquid medicine and contact with the reaction of hole wall; This distance can effectively avoid the excessive liquid medicine circulation caused in plate face to be obstructed problem; Meanwhile, proper extension vibrations time, the adjustment vibrations cycle; Through hole is avoided to leak heavy copper, hole inwall without the problem such as copper, breach.
3) backboard after heavy copper adopts the current density of 0.7ASD whole plate plating 180min, and need when the whole plate of backboard is electroplated to swing along perpendicular to direction, backboard plate face, amplitude of fluctuation is 7cm, and frequency is 20 beats/min, when being electroplated to 90min, backboard is turned upside down 180 °.
Electric plating of whole board uses the long-time method of small area analysis to make, and can prevent back plate surface copper facing copper thickness ununiformity.At electroplating time mid point, backboard is turned upside down 180 ° (i.e. bevellings), be more conducive to the uniformity that riser face copper is thick.Similar heavy copper principle, increases vibration frequency and vibration amplitude, is convenient to liquid medicine in hole and exchanges.
Embodiment 3
The product of the present embodiment is 21 layers of backboard, size 455 × 607mm, thickness of slab 4.1mm, and finished product minimum-value aperture 0.35mm, through hole radius-thickness ratio is 12:1.Adopt high frequency sheet material, high TG sheet material and the mixed pressure of PP epoxy resin sheet material.Electroplating technology is as follows:
1) adopting plasma abatement method to remove through hole bores dirty.Plasma abatement method is removed brill dirt in backboard through hole and is comprised first stage and two stages of second stage, and the mixed gas composition of first stage and the intensified gas molecule of second stage, gas flow, electric field intensify power, processing time parameter is as shown in table 3:
Table 3
Plasma abatement method, by electric field exciting gas molecule, forms ion or energetic free radical, collides and react, Drill dirt cleaning with hole wall surface material.Plasma, except boring dirty mode to the even action of different kind of material, bores dirty better effects if to removing of different qualities sheet material mixed pressure structure.
2) be fixed on by the inclined back plate after decontamination on heavy copper frame (i.e. link plate), backboard and horizontal direction angle are 80 °, and the spacing between every two pieces of backboards is 24mm; Then backboard is immersed in heavy copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second vibrations 25s, then leave standstill 20s; Again backboard is taken out from heavy copper liquid medicine and drain; Repeat above-mentioned immersion and sink copper process 3 times.
Adopt inclination link plate, when each backboard immerses heavy copper liquid medicine, liquid medicine more easily enriches in hole, is discharged by bubble in hole smoothly, ensure that the exchange of heavy copper liquid medicine and contact with the reaction of hole wall; This distance can effectively avoid the excessive liquid medicine circulation caused in plate face to be obstructed problem; Meanwhile, proper extension vibrations time, the adjustment vibrations cycle; Through hole is avoided to leak heavy copper, hole inwall without the problem such as copper, breach.
3) backboard after heavy copper adopts the current density of 0.7ASD whole plate plating 180min, backboard whole plate needs along swinging perpendicular to direction, backboard plate face when electroplating, amplitude of fluctuation is 8cm, frequency is 15 beats/min, when being electroplated to 45min, 90min, 135min, backboard is respectively turned upside down 180 ° once.
Electric plating of whole board uses the long-time method of small area analysis to make, and can prevent back plate surface copper facing copper thickness ununiformity.At electroplating time mid point, backboard is turned upside down 180 ° (i.e. bevellings), be more conducive to the uniformity that riser face copper is thick.Similar heavy copper principle, increases vibration frequency and vibration amplitude, is convenient to liquid medicine in hole and exchanges.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (4)
1., containing a backboard electro-plating method for high thickness to diameter ratio through hole, it is characterized in that, described backboard electro-plating method comprises the following steps:
A) adopt plasma abatement method to remove in backboard through hole and bore dirt;
B) be fixed on by the inclined back plate after decontamination on heavy copper frame and immerse heavy copper in heavy copper liquid medicine, described backboard and horizontal direction angle are 70-80 °, and the width in the heavy copper liquid medicine region on backboard both sides is more than 20mm;
C) adopt the whole plate of the current density of 0.6-0.8ASD to be electroplated to required copper after heavy copper thick, need in whole plate electroplating process backboard to be turned upside down 180 ° at least one times.
2. the backboard electro-plating method containing high thickness to diameter ratio through hole according to claim 1, is characterized in that, in described steps A, plasma abatement method is removed brill dirt in backboard through hole and comprised the following steps:
S1, first, using the mist of nitrogen and oxygen as intensified gas molecule process 15-20min, the gas flow of nitrogen is 200sccm, and the gas flow of oxygen is 1800sccm, and it is 8000W that electric field intensifies power;
S2, then, using the mist of nitrogen, oxygen and carbon tetrafluoride as intensified gas molecule process 25-30min, the gas flow of nitrogen is 160sccm, and the gas flow of oxygen is 1260sccm, the gas flow of carbon tetrafluoride is 1260sccm, and it is 8000w that electric field intensifies power.
3. the backboard electro-plating method containing high thickness to diameter ratio through hole according to claim 2, is characterized in that, in described step B, backboard immerses heavy copper in heavy copper liquid medicine and comprises the following steps:
A, backboard is immersed in heavy copper liquid medicine, first with the frequency of vibration amplitude >=30mm per second vibrations 20-25s, then leave standstill 15-20s;
B, backboard taken out from heavy copper liquid medicine drain;
C, repetition 2-3 above-mentioned steps a, b.
4. the backboard electro-plating method containing high thickness to diameter ratio through hole according to claim 1, is characterized in that, in described step C, need when the whole plate of backboard is electroplated to swing along perpendicular to direction, backboard plate face, amplitude of fluctuation is 6-8cm, and frequency is 15 ~ 25 beats/min.
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Cited By (5)
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| CN105682376A (en) * | 2016-03-17 | 2016-06-15 | 惠州市星之光科技有限公司 | Manufacturing process for thick-copper high-aspect-ratio and small-pore-diameter main board |
| CN108174533A (en) * | 2017-12-29 | 2018-06-15 | 柏承科技(昆山)股份有限公司 | Anti- holes Rigid Flex electroplating technology |
| CN110248476A (en) * | 2019-06-12 | 2019-09-17 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process based on the discontinuous mesh of tomography |
| CN113271727A (en) * | 2021-05-14 | 2021-08-17 | 惠州中京电子科技有限公司 | PCB manufacturing method for improving through hole rate and preventing copper-free hole |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113271727B (en) * | 2021-05-14 | 2023-03-14 | 惠州中京电子科技有限公司 | PCB manufacturing method for improving through hole rate and preventing copper-free hole |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
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