CN105163521B - Aperture hole metallization processing method - Google Patents
Aperture hole metallization processing method Download PDFInfo
- Publication number
- CN105163521B CN105163521B CN201510530611.1A CN201510530611A CN105163521B CN 105163521 B CN105163521 B CN 105163521B CN 201510530611 A CN201510530611 A CN 201510530611A CN 105163521 B CN105163521 B CN 105163521B
- Authority
- CN
- China
- Prior art keywords
- printed board
- aperture
- processing method
- aperture hole
- plate face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of aperture hole metallization processing method, after printed board is drilled out and handled before some 0.2 millimeter of apertures of φ are made, first using high pressure water washing printed board plate face, and the aperture hole wall of printed board is soaked, bubble in printed board aperture is washed out simultaneously, makes to be full of moisture in aperture hole；Then printed board plate face moisture is removed, while retains moisture full state in printed board aperture, then electroless copper plating process is sent into printed board.The aperture hole metallization processing method scrappage of hole without copper when metallizing aperture is decreased obviously.To 0.2 millimeter of aperture of φ, when thickness of slab/aperture ratio reaches 8:1 and during the above, scrappage≤0.08% of its having no copper in the holes has saved the scrap cost of product, while substantially increases the reliability of printed board, substantially reduces the potential risk that the product missing inspection for having having no copper in the holes defect is dispatched from the factory.
Description
Technical field
The present invention relates to a kind of hole metallization processing method, more particularly to a kind of aperture hole metallization processing method.
Background technology
In printed board manufacture, there is one of critically important process, be hole metallization.When aperture is less than 0.3 millimeter of φ, particularly
Aperture is 0.2 millimeter of φ, and aspect ratio is more than 6:When 1, hole metallization difficulty is very big, and caused having no copper in the holes scrappage reaches
More than 0.9%.Such scrappage, in addition to increasing the cost of manufacture of product, there is very serious dive to the reliability of product
In risk.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of aperture hole metallization processing method, reduces nothing in aperture hole
The defects of copper, product rejection loss can be both reduced, it is often more important that substantially reducing influences the potential risk of product reliability.
The present invention in order to solve its technical problem used by technical scheme be：A kind of aperture hole metallization processing method,
After printed board is drilled out and handled before some 0.2 millimeter of apertures of φ are made, first using high pressure water washing printed board plate face, and print is soaked
The aperture hole wall of making sheet, while bubble in printed board aperture is washed out, make to be full of moisture in aperture hole；Then printed board plate face is removed
Moisture, while retain moisture full state in printed board aperture, then electroless copper plating process is sent into printed board, make electroless copper plating medicine
Water is smoothly penetrated into aperture, and chemical reaction generation layers of copper is produced in hole wall.
As a further improvement on the present invention, in the heavy copper process, vibration mode is moved to print using electrical equipment vibrations aerating
Making sheet is vibrated.
As a further improvement on the present invention, the pneumatic shock of the printed board is vertical vibration, and its amplitude is 7-9cm,
Frequency is 8-12 times/second.
As a further improvement on the present invention, the printed board is waved for inclination, and the folder of the printed board and vertical direction
Angle is 30 °.
When as a further improvement on the present invention, using high pressure water washing printed board plate face, the pressure of the water under high pressure is
15kg/cm2~20kg/cm2。
As a further improvement on the present invention, the printed board plate face deburring and with after high pressure water washing, using water suction
Sponge sops up printed board plate face moisture, retains moisture full state in printed board aperture and is processed into electroless copper plating line.
The beneficial effects of the invention are as follows：The aperture hole metallization processing method scrappage of hole without copper when metallizing aperture
It is decreased obviously.To 0.2 millimeter of aperture of φ, when thickness of slab/aperture ratio reaches 8:1 and during the above, the scrappage of its having no copper in the holes≤
0.08%, the scrap cost of product has been saved, while the reliability of printed board is substantially increased, make the production for having having no copper in the holes defect
The potential risk that product missing inspection is dispatched from the factory substantially reduces.
Embodiment
With reference to embodiments, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments,
The simple equivalent changes and modifications made in every case with scope of the present invention patent and description, all still belong to the present invention
Within patent covering scope.
A kind of aperture hole metallization processing method, processing deburring before some 0.2 millimeter of apertures of φ are made is drilled out in printed board
Afterwards, pressure is used first as 15kg/cm2~20kg/cm2High-pressure washing pump impulse developing and printing making sheet plate face, soak the aperture of printed board
Hole wall, while bubble in printed board aperture is washed out, make to be full of moisture in aperture hole；Then printed board plate face is sopped up with water-absorbing sponge
Moisture, not by the way of drying and drying, make the state that moisture is full of in printed board aperture, then chemistry is sent into printed board and sunk
Copper process is processed.
When carrying out heavy copper process processing to printed board, vibration mode is moved using electrical equipment vibrations aerating printed board is shaken
It is dynamic.Pneumatic shock is vertical direction vibrations, and in 7-9cm, FREQUENCY CONTROL was printed with increasing in 8-12 time/second for the amplitude controlling of vibration
Liquid medicine exchanges in making sheet aperture, and will likely entrapped air pockets effusion.
When carrying out heavy copper process processing to printing, it can also change swingable manner, for example make the heavy copper basket of printed board by hanging down
Straight swingable manner changes into the mode that 30 ° of overturning angles are waved, and makes solution exchange efficiency in printed board aperture more preferable, so that printing
Copper deposits evenly in plate aperture.
Thus, the aperture hole metallization processing method scrappage of hole without copper when metallizing aperture is decreased obviously.To φ
0.2 millimeter of aperture, when thickness of slab/aperture ratio reaches 8:1 and during the above, scrappage≤0.08% of its having no copper in the holes, save production
The scrap cost of product, while the reliability of printed board is substantially increased, the product missing inspection for making to have having no copper in the holes defect is dispatched from the factory latent
Substantially reduced in risk.
Claims (6)
- A kind of 1. aperture hole metallization processing method, it is characterised in that：Drill out before some 0.2 millimeter of apertures of φ are made and locate in printed board After reason, first using high pressure water washing printed board plate face, and the aperture hole wall of printed board is soaked, while wash out in printed board aperture Bubble, make to be full of moisture in aperture hole；Then printed board plate face moisture is removed, while retains moisture in printed board aperture and is full of shape State, then electroless copper plating process is sent into printed board.
- 2. aperture hole metallization processing method according to claim 1, it is characterised in that：In the electroless copper plating process, Vibration mode is moved using electrical equipment vibrations aerating to vibrate printed board.
- 3. aperture hole metallization processing method according to claim 2, it is characterised in that：The pneumatic shock of the printed board For vertical vibration, its amplitude is 7-9cm, and frequency is 8-12 times/second.
- 4. aperture hole metallization processing method according to claim 2, it is characterised in that：The printed board is shaken for inclination Pendulum, and the angle of the printed board and vertical direction is 30 °.
- 5. aperture hole metallization processing method according to claim 1, it is characterised in that：Using high pressure water washing printed board During plate face, the pressure of the water under high pressure is 15kg/cm2~20kg/cm2。
- 6. aperture hole metallization processing method according to claim 1, it is characterised in that：The printed board drills out some φ 0.2 millimeter of aperture makees the pre-treatment of plate face deburring and with after high pressure water washing, and printed board plate face water is sopped up using water-absorbing sponge Point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510530611.1A CN105163521B (en) | 2015-08-26 | 2015-08-26 | Aperture hole metallization processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510530611.1A CN105163521B (en) | 2015-08-26 | 2015-08-26 | Aperture hole metallization processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105163521A CN105163521A (en) | 2015-12-16 |
| CN105163521B true CN105163521B (en) | 2017-11-17 |
Family
ID=54804246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510530611.1A Active CN105163521B (en) | 2015-08-26 | 2015-08-26 | Aperture hole metallization processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163521B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535503A (en) * | 2016-11-18 | 2017-03-22 | 深圳崇达多层线路板有限公司 | Gold immersion method of pressure welding hole in PCB thick plate |
| CN107231754B (en) * | 2017-06-29 | 2019-10-22 | 深圳崇达多层线路板有限公司 | It is a kind of to improve the undesirable method of plated through-hole generated in assist side manufacturing process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077530A (en) * | 1999-09-01 | 2001-03-23 | Matsushita Electric Ind Co Ltd | Resin mold circuit board and manufacture of it |
| CN101845622A (en) * | 2010-06-01 | 2010-09-29 | 深南电路有限公司 | Immersion Ni/Au method of blind hole plate |
| TW201105201A (en) * | 2009-07-22 | 2011-02-01 | Synpower Co Ltd | Method of improving quality of plated holes of printed circuit board |
| CN202022988U (en) * | 2011-04-19 | 2011-11-02 | 惠州中京电子科技股份有限公司 | Micropore coppering device of HDI (High Density Interconnect) circuit board |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN203984780U (en) * | 2014-05-22 | 2014-12-03 | 深圳市富翔科技有限公司 | A kind of wiring board hole wall process for producing line |
-
2015
- 2015-08-26 CN CN201510530611.1A patent/CN105163521B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001077530A (en) * | 1999-09-01 | 2001-03-23 | Matsushita Electric Ind Co Ltd | Resin mold circuit board and manufacture of it |
| TW201105201A (en) * | 2009-07-22 | 2011-02-01 | Synpower Co Ltd | Method of improving quality of plated holes of printed circuit board |
| CN101845622A (en) * | 2010-06-01 | 2010-09-29 | 深南电路有限公司 | Immersion Ni/Au method of blind hole plate |
| CN202022988U (en) * | 2011-04-19 | 2011-11-02 | 惠州中京电子科技股份有限公司 | Micropore coppering device of HDI (High Density Interconnect) circuit board |
| CN103228112A (en) * | 2013-04-03 | 2013-07-31 | 深圳崇达多层线路板有限公司 | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios |
| CN203984780U (en) * | 2014-05-22 | 2014-12-03 | 深圳市富翔科技有限公司 | A kind of wiring board hole wall process for producing line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105163521A (en) | 2015-12-16 |
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