CN106149018A - A kind of process for pcb board electro-coppering - Google Patents
A kind of process for pcb board electro-coppering Download PDFInfo
- Publication number
- CN106149018A CN106149018A CN201610648970.1A CN201610648970A CN106149018A CN 106149018 A CN106149018 A CN 106149018A CN 201610648970 A CN201610648970 A CN 201610648970A CN 106149018 A CN106149018 A CN 106149018A
- Authority
- CN
- China
- Prior art keywords
- washing
- copper
- electroplating
- plating
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Abstract
The present invention provides a kind of process for pcb board electro-coppering, and process is largely divided into following steps: 1) deburring, including enter plate, nog plate, high-pressure washing, dry ejecting plate again；2) copper is sunk, including upper plate, bulk, for the first time washing, desmearing, second time washing, preneutralization, third time washing, neutralization, ultrasonic wave water washing, oil removing, rear oil removing, wash for the 4th time, gently erosion, the 5th washing, preimpregnation, activation, acceleration, the 6th washing, electroless copper plating, pickling, wash for the 7th time；3) copper is thickeied, including upper plate, oil removing, washing, acidleach, thickening plating, high-order washing, lower plate.The present invention, by adding shaking device in heavy copper, can be obviously improved the situation of Kong Wutong；It simultaneously in the link thickening copper, by the particular design of electroplating cell body, is possible not only to ensure the activity of electroplating liquid medicine, is additionally favorable for the uniformity of plating, the synergy of liquid medicine and electroplating bath simultaneously, optimal electroplating evenness and electroplating efficiency can be obtained.
Description
Technical field
The present invention relates to the plating link in pcb board manufacturing process, be specifically related to a kind of technique for pcb board electro-coppering
Method.
Background technology
PCB (Printed Circuit Board), Chinese is printed wiring board, for electricity in electronic devices and components
Form the connection of predetermining circuit between sub-parts, play the effect of relay transmission, be the critical electronic cross tie part of electronic product.With
The fast development of high-tech industry, world's printed wiring board (PCB) industry is also rapidly progressed.2011, PCB in China
The rate of increasing output value is 9.2%, accounts for the 39.8% of the global gross output value, reaches 23,000,000,000 dollars.Therefore the pcb board of China also has very
The big development rising space.
In the manufacturing process of pcb board, there is a lot of operation all can relate to plating, such as electroless copper, the plating of whole plate, image
Plating, thickening and being plated with and electrotinning etc., these electroplating process play very important effect in PCB production technology, affect PCB
The electric conductivity of plate.And electroplating process is to carry out in electroplating bath, therefore designs and meet technological requirement, environmental friendliness, and
Ensure by the electroplating bath of plating piece uniformly-coating it is very important.For current electroplating bath cell body, due to the size of plating piece
Size less than positive plate sometimes, accordingly, it is possible to cause electric field action uneven so that the thickness of plating piece upper and lower each several part coating
Spending uneven, the especially upper and lower two ends of workpiece and middle variable thickness causes, and plated item will be caused quality problem occur；Sometimes
Due to the difference of each electroplating site in electric field, thus electric field action also differs, it is possible to can cause electroplating non-uniform phenomenon
Generation, cause plating thickness uneven.
Content of the invention
The present invention is directed to the deficiencies in the prior art, provide a kind of process for pcb board electro-coppering.
The present invention can be achieved through the following technical solutions:
A kind of process for pcb board electro-coppering, process is largely divided into following steps: 1) use flash trimmer
Deburring, including enter plate, nog plate, high-pressure washing, dry ejecting plate again；2) sink copper, including upper plate, bulk, wash for the first time, go to bore
Dirty, second time washing, preneutralization, third time washing, neutralizations, ultrasonic wave water washing, oil removing, rear oil removing, wash for the 4th time, gently lose,
5th washing, preimpregnation, activation, acceleration, the 6th washing, electroless copper plating, pickling, the 7th washing；3) copper is thickeied, including on
Plate, oil removing, washing, acidleach, thickening plating, high-order washing, lower plate.
Further, step 2) in electroless copper plating when any one or two kinds that shake with electroshock, gas shock both.
Further, the thickening plating in step (3) is to carry out in electroplating bath, and the upper end of electroplating cell body is anode, negative electrode
Vertical range with anode is 240mm.
Further, the area of described electroplating bath negative electrode and anode can adjust.
Further, adding electroplating liquid medicine in described electroplating bath, liquid medicine composition includes copper sulphate, dilute sulfuric acid, dilute salt
Acid, brightener and activator Pd.
Further, described brightener is PM-501, any one or two kinds of in permanent emigrant's ST-2000 series.
Further, copper sulphate in described liquid medicine composition: the mol ratio of dilute sulfuric acid: watery hydrochloric acid: brightener: Pd is 2:1:
3:0.5:0.5。
What the present invention obtained has the beneficial effect that 1) deburring in pre-treatment can ensure that the smooth of plate face, after being conducive to
The carrying out of continuous technological operation；2) adding shaking device in heavy copper, vibrations strengthen being obviously improved the situation of Kong Wutong, are beneficial to sink
Copper is more uniform；3) in the link thickening copper, by the particular design of electroplating cell body, adjustable anode and cathode area, not only may be used
It to ensure the activity of electroplating liquid medicine, is additionally favorable for the uniformity of plating；4) adjustment of electroplating liquid medicine and anode and cathode area is passed through, it is thus achieved that
Optimal electroplating evenness and electroplating efficiency.
Detailed description of the invention
Made an explanation by the detailed description of the invention to the present invention for the embodiment below.
Embodiment
A kind of process for pcb board electro-coppering, uses vertical continuous formula electroplating operations, and process is main
It is divided into following steps: 1) use flash trimmer deburring, to ensure the smooth of plate face, beneficially the carrying out of later processing operation,
The process of deburring includes into plate, nog plate, high-pressure washing, dries ejecting plate again；2) heavy copper, first upper plate, then resin, fall in bulk hole
Bonded energy between low resinous polymer so that it is form open structure, be beneficial to potassium permanganate and sting the surface losing into micro-rough, connect
For the first time washing and go the removal of impurity, wiping Drill dirt cleaning, carry out that second time is washed, preneutralization, third time are washed, neutralize, entered again
One step ultrasonic wave water washing makes foreign material remove thoroughly, and oil removing, with cleaner plate face, adjusts the electronegative group of hole wall resin residue, removes afterwards
Oil, the 4th washing, utilize dilute sulfuric acid by light for end copper eating away 0.7um, make that end copper is rough, surface area increases, thus strengthens end copper
With the adhesion of chemistry layers of copper, wash for the 5th time, presoak, activate, accelerate the palladium group to dissipate unreal and palladium ion and atom etc.,
Carry out the 6th washing again, then open shaking device, make vibration frequency slowly increase, then carry out electroless copper plating, pickling, the 7th
Secondary washing；3) copper is thickeied, including upper plate, oil removing, washing, acidleach, the vertical range with negative electrode and anode are 240mm and permissible
The liquid medicine that the electroplating bath of the area of regulation anode of electrolytic cell and negative electrode adds in carrying out thickening plating, electroplating bath according to actual needs
In copper sulphate containing 0.2mol, the dilute sulfuric acid of 0.1mol, the watery hydrochloric acid of 0.3mol and brightener PM-5010.05mol and
The Pd activator of 0.05mol, the removal of impurity, last lower plate are gone in then high-order washing.
Copper facing uniformity can be made to reach 93% by said method.
The foregoing is only highly preferred embodiment of the present invention, not in order to limit the present invention, all essences in the present invention
Any modification, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (7)
1. the process for pcb board electro-coppering, uses vertical continuous formula electroplating operations, it is characterised in that work
Process is largely divided into following steps: 1) use flash trimmer deburring, including enter plate, nog plate, high-pressure washing, drying go out again
Plate；2) sink copper, including upper plate, bulk, for the first time washing, desmearing, second time washing, preneutralization, third time are washed, neutralization,
Ultrasonic wave water washing, oil removing, rear oil removing, the 4th washing, light erosion, the 5th washing, preimpregnation, activation, accelerate, the 6th washing,
Electroless copper plating, pickling, the 7th washing；3) thicken copper, including upper plate, oil removing, washing, acidleach, thickening plating, high-order washing, under
Plate.
2. a kind of process for pcb board electro-coppering according to claim 1, it is characterised in that step 2) in
During electroless copper plating with electroshock, gas shock one or both.
3. a kind of process for pcb board electro-coppering according to claim 1, it is characterised in that in step (3)
Thickening plating is to carry out in electroplating bath, and the upper end of electroplating cell body is anode, and negative electrode is 240mm with the vertical range of anode.
4. a kind of process for pcb board electro-coppering according to claim 3, it is characterised in that described plating
The area of groove negative electrode and anode can adjust.
5. a kind of process for pcb board electro-coppering according to claim 3, it is characterised in that described plating
Adding electroplating liquid medicine in groove, liquid medicine composition includes copper sulphate, dilute sulfuric acid, watery hydrochloric acid, brightener and activator Pd.
6. a kind of process for pcb board electro-coppering according to claim 5, it is characterised in that described light
Agent is PM-501, and perseverance resides abroad one or both in ST-2000 series.
7. a kind of process for pcb board electro-coppering according to claim 5, it is characterised in that described liquid medicine
The mol ratio of copper sulphate in composition: dilute sulfuric acid: watery hydrochloric acid: brightener: Pd is 2:1:3:0.5:0.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648970.1A CN106149018A (en) | 2016-08-09 | 2016-08-09 | A kind of process for pcb board electro-coppering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610648970.1A CN106149018A (en) | 2016-08-09 | 2016-08-09 | A kind of process for pcb board electro-coppering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106149018A true CN106149018A (en) | 2016-11-23 |
Family
ID=57329457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610648970.1A Pending CN106149018A (en) | 2016-08-09 | 2016-08-09 | A kind of process for pcb board electro-coppering |
Country Status (1)
| Country | Link |
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| CN (1) | CN106149018A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413873A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Ameliorative way of the high aspect ratio PCB aperture without copper |
| CN112566389A (en) * | 2020-11-10 | 2021-03-26 | 深圳市昶东鑫线路板有限公司 | Multilayer circuit board manufacturing method with high aspect ratio blind hole and multilayer circuit board |
| CN113710010A (en) * | 2021-08-23 | 2021-11-26 | 广州广合科技股份有限公司 | Processing method for preventing copper deposition and copper surface of PCB from being rough |
| CN115058749A (en) * | 2021-12-22 | 2022-09-16 | 江苏本川智能电路科技股份有限公司 | Electroplating processing method with high thickness-diameter ratio |
| CN117241478A (en) * | 2023-11-15 | 2023-12-15 | 深圳市宇通瑞特科技有限公司 | Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413873A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Ameliorative way of the high aspect ratio PCB aperture without copper |
| CN112566389A (en) * | 2020-11-10 | 2021-03-26 | 深圳市昶东鑫线路板有限公司 | Multilayer circuit board manufacturing method with high aspect ratio blind hole and multilayer circuit board |
| CN113710010A (en) * | 2021-08-23 | 2021-11-26 | 广州广合科技股份有限公司 | Processing method for preventing copper deposition and copper surface of PCB from being rough |
| CN115058749A (en) * | 2021-12-22 | 2022-09-16 | 江苏本川智能电路科技股份有限公司 | Electroplating processing method with high thickness-diameter ratio |
| CN117241478A (en) * | 2023-11-15 | 2023-12-15 | 深圳市宇通瑞特科技有限公司 | Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) |
| CN117241478B (en) * | 2023-11-15 | 2024-02-23 | 深圳市宇通瑞特科技有限公司 | Horizontal electroplating process for double-sided and multi-layer PCB (printed circuit board) |
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Application publication date: 20161123 |