CN105695964A - Copper deposition process - Google Patents

Abstract

The invention discloses a copper deposition process which is characterized by comprising the following steps: (1) plate grinding: removing oxides, stains, residual gum and other impurities on the surface of a plate to coarsen the surface of the plate and increase binding capacity, wherein if such defects as scratches and residual gum exist on the plate, the plate needs to be polished by fine sandpaper at first, and then the polished plate is fed to a plate grinder; (2) swelling; (3) degumming; (4) neutralizing; (5) oil removing: cleaning hole walls and adjusting the electrostatic charge on the substrate surfaces of the hole walls, so as to improve the colloidal palladium adsorption capability of the hole walls; (6) micro-etching: removing an oxidation layer, so as to improve the binding force between a copper foil surface and chemical copper; (7) acid pickling: cleaning copper surfaces, so as to reduce the pollution of copper ions to an activating cylinder; (8) pre-impregnation: preventing the fact that the concentration and the pH value of an activating solution are changed and the activating effect is influenced because the plate brings water into a follow-up activating tank; (9) activating; (10) acceleration: removing part of basic stannates surrounding a palladium core, so as to expose the palladium core completely and enhance the activity of colloidal palladium; and (11) copper deposition: achieving deposition of a fine copper layer on the hole walls and a small copper surface under the catalytic action, so as to enable the resin and glass fiber surfaces of the hole walls to be conductive.

Description

A kind of heavy process for copper

Technical field

The present invention relates to a kind of heavy process for copper。

Background technology

A kind of heavy process for copper is more complicated at present, also without unified specification, it does not have unified standard, cause heavy process for copper quality uneven, a lot of operations that repeat also make under production efficiency, increase the work burden of workman, make the competitiveness of product in market not high simultaneously。For some operators just entered a profession, it does not have a clear and definite method technique, cause, when operation, mistakes and omissions often occur, in some instances it may even be possible to cause serious consequence。Summary of the invention

Because the drawbacks described above of prior art, the technical problem to be solved is to provide a kind of heavy process for copper, and the method technique is simple, eliminates a lot of repeatability operation, improves work efficiency。

For achieving the above object, the invention provides a kind of heavy process for copper, it is characterised in that comprise the steps: 1) nog plate: the oxidation of cleaner plate face, spot, cull etc. make the alligatoring of plate face, increase adhesion。After Plate grinder after should first polishing with fine sandpaper if any the defect such as scratch, cull；

2) expand: make epoxy resin softening bulk, it is simple to KMnO4 stings erosion resin, to remove the chip dirt that boring produces；

3) removing glue: under the environment of high temperature highly basic, utilizes the strong oxidizing property of KMnO4 to sting the epoxy resin losing bulk softening；

4) neutralize: be used for reducing the MnO4 that multi-layer sheet takes out of, and completely remove MnO2, MnO42-of remaining in the hole in；

5) oil removing: cleaning hole wall, adjusts the electrostatic charge of hole wall substrate surface, improves the hole wall absorbability to colloid palladium；

6) microetch: remove oxide layer, improves the adhesion between copper foil surface and chemical copper；

7) pickling: cleaning copper face, reduces the copper ion pollution to active cylinder；

8) preimpregnation: for preventing sheet material from bringing water in activated bath subsequently, makes the concentration of activating solution and pH value change affect activation effect；

9) activation: adsorb one layer of metallic particles with catalytic capability on insulating body, make the matrix surface through overactivation have the ability of catalysis reducing metal, so that electroless copper reaction is smoothed out at the matrix surface of whole catalytic treatment；

10) accelerate: removing unit subpackage, round the alkali formula stannate compounds of palladium core, makes palladium core be completely exposed, strengthen the activity of colloid palladium；

11) heavy copper: deposit layers of copper one layer careful by catalytic action at hole wall and little copper face, make the resin of hole wall and fiberglass surfacing have electric conductivity。

The invention has the beneficial effects as follows: present invention process is simple, eliminate a lot of repeatability operation, improve work efficiency。

Detailed description of the invention

The technical scheme is that a kind of heavy process for copper, it is characterised in that comprise the steps: 1) nog plate: the oxidation of cleaner plate face, spot, cull etc. make the alligatoring of plate face, increase adhesion。After Plate grinder after should first polishing with fine sandpaper if any the defect such as scratch, cull；

2) expand: make epoxy resin softening bulk, it is simple to KMnO4 stings erosion resin, to remove the chip dirt that boring produces；

3) removing glue: under the environment of high temperature highly basic, utilizes the strong oxidizing property of KMnO4 to sting the epoxy resin losing bulk softening；

4) neutralize: be used for reducing the MnO4 that multi-layer sheet takes out of, and completely remove MnO2, MnO42-of remaining in the hole in；

5) oil removing: cleaning hole wall, adjusts the electrostatic charge of hole wall substrate surface, improves the hole wall absorbability to colloid palladium；

6) microetch: remove oxide layer, improves the adhesion between copper foil surface and chemical copper；

7) pickling: cleaning copper face, reduces the copper ion pollution to active cylinder；

8) preimpregnation: for preventing sheet material from bringing water in activated bath subsequently, makes the concentration of activating solution and pH value change affect activation effect；

9) activation: adsorb one layer of metallic particles with catalytic capability on insulating body, make the matrix surface through overactivation have the ability of catalysis reducing metal, so that electroless copper reaction is smoothed out at the matrix surface of whole catalytic treatment；

10) accelerate: removing unit subpackage, round the alkali formula stannate compounds of palladium core, makes palladium core be completely exposed, strengthen the activity of colloid palladium；

11) heavy copper: deposit layers of copper one layer careful by catalytic action at hole wall and little copper face, make the resin of hole wall and fiberglass surfacing have electric conductivity。

Present invention process is simple, eliminates a lot of repeatability operation, improves work efficiency。

The preferred embodiment of the present invention described in detail above。Should be appreciated that those of ordinary skill in the art just can make many modifications and variations according to the design of the present invention without creative work。Therefore, all technical staff in the art, all should in the protection domain being defined in the patent claims under this invention's idea on the basis of existing technology by the available technical scheme of logical analysis, reasoning, or a limited experiment。

Claims (1)

1. a heavy process for copper, it is characterised in that comprise the steps: 1) nog plate: the oxidation of cleaner plate face, spot, cull etc. make the alligatoring of plate face, increase adhesion；After Plate grinder after should first polishing with fine sandpaper if any the defect such as scratch, cull；

2) expand: make epoxy resin softening bulk, it is simple to KMnO4 stings erosion resin, to remove the chip dirt that boring produces；

3) removing glue: under the environment of high temperature highly basic, utilizes the strong oxidizing property of KMnO4 to sting the epoxy resin losing bulk softening；

4) neutralize: be used for reducing the MnO4 that multi-layer sheet takes out of, and completely remove the MnO remained in the hole in₂、MnO4^2-；

5) oil removing: cleaning hole wall, adjusts the electrostatic charge of hole wall substrate surface, improves the hole wall absorbability to colloid palladium；

6) microetch: remove oxide layer, improves the adhesion between copper foil surface and chemical copper；

7) pickling: cleaning copper face, reduces the copper ion pollution to active cylinder；

8) preimpregnation: for preventing sheet material from bringing water in activated bath subsequently, makes the concentration of activating solution and pH value change affect activation effect；

9) activation: adsorb one layer of metallic particles with catalytic capability on insulating body, make the matrix surface through overactivation have the ability of catalysis reducing metal, so that electroless copper reaction is smoothed out at the matrix surface of whole catalytic treatment；

10) accelerate: removing unit subpackage, round the alkali formula stannate compounds of palladium core, makes palladium core be completely exposed, strengthen the activity of colloid palladium；

11) heavy copper: deposit layers of copper one layer careful by catalytic action at hole wall and little copper face, make the resin of hole wall and fiberglass surfacing have electric conductivity。