CN201524803U - Copper recovery and reuse system in chemical copper precipitation waste liquid - Google Patents
Copper recovery and reuse system in chemical copper precipitation waste liquid Download PDFInfo
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- CN201524803U CN201524803U CN201020112247XU CN201020112247U CN201524803U CN 201524803 U CN201524803 U CN 201524803U CN 201020112247X U CN201020112247X U CN 201020112247XU CN 201020112247 U CN201020112247 U CN 201020112247U CN 201524803 U CN201524803 U CN 201524803U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 94
- 239000010949 copper Substances 0.000 title claims abstract description 94
- 239000007788 liquid Substances 0.000 title claims abstract description 49
- 239000002699 waste material Substances 0.000 title claims abstract description 45
- 238000001556 precipitation Methods 0.000 title abstract description 22
- 238000011084 recovery Methods 0.000 title abstract description 22
- 239000000126 substance Substances 0.000 title abstract description 19
- 230000004913 activation Effects 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims 5
- 206010013647 Drowning Diseases 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 7
- 229910001431 copper ion Inorganic materials 0.000 abstract description 7
- 238000002791 soaking Methods 0.000 abstract description 6
- 238000004065 wastewater treatment Methods 0.000 abstract description 5
- 238000009388 chemical precipitation Methods 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000002351 wastewater Substances 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 25
- 238000005238 degreasing Methods 0.000 description 12
- 229910052763 palladium Inorganic materials 0.000 description 12
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
本实用新型公开了一种化学沉铜废液中铜的回收再利用系统，包括：除油单元、微蚀单元、预浸/活化单元、沉铜槽以及沉铜废液回收槽。本实用新型通过在化学沉铜槽的旁边安装一个化学沉铜废液回收槽，使化学沉铜废液进入该回收槽中，然后在回收槽内加入每次清槽后残留的铜粉，使其充分反应，逐渐消耗掉废液中的铜离子，达到去除的目的，同时又可回收废液，待废液颜色变清后将清液排入废水处理部进行处理。与现有技术相比，本实用新型在沉铜废液回收槽中对废液做进一步处理，使废水中铜含量达到排放标准。
The utility model discloses a copper recovery and reuse system in chemical copper precipitation waste liquid, which comprises: an oil removal unit, a micro-etching unit, a pre-soaking/activation unit, a copper precipitation tank and a copper precipitation waste liquid recovery tank. The utility model installs a chemical precipitation copper waste liquid recovery tank next to the chemical precipitation copper tank, so that the chemical copper precipitation waste liquid enters the recovery tank, and then adds the residual copper powder after each tank cleaning in the recovery tank, so that It fully reacts and gradually consumes the copper ions in the waste liquid to achieve the purpose of removal. At the same time, the waste liquid can be recovered. After the color of the waste liquid becomes clear, the clear liquid is discharged into the waste water treatment unit for treatment. Compared with the prior art, the utility model further processes the waste liquid in the copper sinking waste liquid recovery tank, so that the copper content in the waste water reaches the discharge standard.
Description
技术领域technical field
本实用新型涉及一种化学沉铜废液中铜的回收再利用系统。The utility model relates to a recovery and reuse system for copper in chemical copper precipitation waste liquid.
背景技术Background technique
化学镀铜(Eletcroless Plating Copper)通常也叫沉铜或孔化(PTH)是一种自身催化性氧化还原反应。首先用活化剂处理，使绝缘基材表面吸附上一层活性的粒子通常用的是金属钯粒子，铜离子首先在这些活性的金属钯粒子上被还原，而这些被还原的金属铜晶核本身又成为铜离子的催化层，使铜的还原反应继续在这些新的铜晶核表面上进行。化学镀铜在PCB制造业中得到了广泛的应用，目前最多的是用化学镀铜进行PCB的孔金属化。PCB孔金属化工艺流程如下：钻孔→磨板去毛刺→上板→整孔清洁处理→双水洗→微蚀化学粗化→双水洗→预浸处理→胶体钯活化处理→双水洗→解胶处理(加速)→双水洗→沉铜→双水洗→下板→上板→浸酸→一次铜→水洗→下板→烘干。Eletcroless Plating Copper (Eletcroless Plating Copper), also known as sinking copper or porosity (PTH), is an autocatalytic redox reaction. First, it is treated with an activator to make a layer of active particles adsorb on the surface of the insulating substrate. Usually, metal palladium particles are used. Copper ions are first reduced on these active metal palladium particles, and these reduced metal copper crystal nuclei themselves It becomes the catalytic layer of copper ions again, so that the reduction reaction of copper continues on the surface of these new copper crystal nuclei. Electroless copper plating has been widely used in the PCB manufacturing industry. At present, electroless copper plating is used for PCB hole metallization. The PCB hole metallization process is as follows: Drilling → Grinding and deburring → Upper plate → Hole cleaning treatment → Double washing → Micro-etching chemical roughening → Double washing → Pre-soaking treatment → Colloidal palladium activation treatment → Double washing → Degumming Treatment (acceleration) → double water washing → copper sinking → double water washing → lower board → upper board → pickling → primary copper → water washing → lower board → drying.
而在化学沉铜过程中伴随着物料的添加与排放，会有大量的化学沉铜废液产生，由于这些废液中含有结合剂EDTA或酒石酸盐，因此需要进行破络处理。但是目前对于化学沉铜废液的常规处理方法是通过结合废水排放管道进入废水处理部，按照结合废水处理方法进行处理。由于化学沉铜废液中含有结合剂，因此很难处理，经常会出现外排废水中铜含量偏高的现象。In the chemical copper precipitation process, along with the addition and discharge of materials, a large amount of chemical copper precipitation waste liquid will be produced. Since these waste liquids contain binder EDTA or tartrate, they need to be treated by deconsolidation. However, the current conventional treatment method for chemical copper precipitation waste liquid is to enter the waste water treatment department through the combined waste water discharge pipeline, and treat it according to the combined waste water treatment method. Because the electroless copper precipitation waste liquid contains binders, it is difficult to handle, and the phenomenon of high copper content in the effluent often occurs.
发明内容Contents of the invention
有鉴于此，本实用新型的目的在于提供一种化学沉铜废液中铜的回收再利用系统，以解决目前外排废水中铜含量偏高的问题。In view of this, the purpose of this utility model is to provide a copper recovery and reuse system in the chemical copper precipitation waste liquid, so as to solve the problem of high copper content in the current external wastewater.
为实现上述目的，本实用新型主要采用以下技术方案：In order to achieve the above object, the utility model mainly adopts the following technical solutions:
一种化学沉铜废液中铜的回收再利用系统，包括：除油单元、微蚀单元、预浸/活化单元、沉铜槽以及沉铜废液回收槽，其中除油单元用于除去PCB板面油污，并对PCB板孔壁基材进行极性调整；微蚀单元，用于除去通过除油单元处理后的PCB板面氧化物，对PCB板面进行粗化；预浸/活化单元，用于对经过微蚀单元处理后的PCB板进行活化，沉铜槽，对PCB板进行沉铜处理；化学沉铜废液回收槽与沉铜槽连接，以收集来自沉铜槽的废液。A copper recovery and reuse system in chemical copper deposition waste liquid, including: degreasing unit, micro-etching unit, pre-soaking/activation unit, copper deposition tank and copper deposition waste liquid recovery tank, wherein the degreasing unit is used to remove PCB Oil stains on the board surface, and adjust the polarity of the base material of the PCB hole wall; the micro-etch unit is used to remove the oxides on the PCB surface after the degreasing unit, and roughen the PCB surface; the pre-preg/activation unit is used to For activating the PCB board after the micro-etching unit treatment, the copper sinking tank is used to carry out copper sinking treatment on the PCB board; the chemical copper deposition waste liquid recovery tank is connected to the copper sinking tank to collect the waste liquid from the copper sinking tank.
所述除油单元和微蚀单元之间还设有二或三级逆流漂洗单元。A second or third stage countercurrent rinsing unit is also arranged between the degreasing unit and the micro-etching unit.
所述微蚀单元和预浸/活化单元之间还设有二级逆流漂洗单元。There is also a secondary countercurrent rinsing unit between the microetching unit and the presoaking/activation unit.
所述预浸/活化单元与沉铜槽之间设有解胶单元。A debonding unit is provided between the prepreg/activation unit and the sinking copper tank.
所述沉铜槽上还连接有水洗单元。A water washing unit is also connected to the sinking copper tank.
本实用新型通过在化学沉铜槽的旁边安装一个化学沉铜废液回收槽，使化学沉铜废液进入该回收槽中，然后在回收槽内加入每次清槽后残留的铜粉，使其充分反应，逐渐消耗掉废液中的铜离子，达到去除的目的，同时又可回收废液，待废液颜色变清后将清液排入废水处理部进行处理。与现有技术相比，本实用新型在沉铜废液回收槽中对废液做进一步处理，使废水中铜含量达到排放标准。The utility model installs a chemical precipitation copper waste liquid recovery tank next to the chemical precipitation copper tank, so that the chemical copper precipitation waste liquid enters the recovery tank, and then adds the residual copper powder after each tank cleaning in the recovery tank, so that It fully reacts and gradually consumes the copper ions in the waste liquid to achieve the purpose of removal. At the same time, the waste liquid can be recovered. After the color of the waste liquid becomes clear, the clear liquid is discharged into the waste water treatment unit for treatment. Compared with the prior art, the utility model further processes the waste liquid in the copper sinking waste liquid recovery tank, so that the copper content in the waste water reaches the discharge standard.
附图说明Description of drawings
图1为本实用新型的系统框图。Fig. 1 is a system block diagram of the utility model.
具体实施方式Detailed ways
为阐述本实用新型的思想和目的，下面将结合附图和具体实施例对本实用新型做进一步的说明。In order to illustrate the idea and purpose of the utility model, the utility model will be further described below in conjunction with the accompanying drawings and specific embodiments.
请参见图1所示，图1为本实用新型的系统框图。其中本实用新型提供的是一种化学沉铜废液中铜的回收再利用系统，包括：除油单元、微蚀单元、预浸/活化单元、沉铜槽以及沉铜废液回收槽，其中除油单元用于除去PCB板面油污，并对PCB板孔壁基材进行极性调整；微蚀单元，用于除去通过除油单元处理后的PCB板面氧化物，对PCB板面进行粗化；预浸/活化单元，用于对经过微蚀单元处理后的PCB板进行活化，沉铜槽，收集来自预浸/活化单元的废液；化学沉铜废液回收槽与沉铜槽连接。Please refer to shown in Fig. 1, Fig. 1 is a system block diagram of the present utility model. Among them, the utility model provides a copper recovery and reuse system in chemical copper precipitation waste liquid, including: degreasing unit, micro-etching unit, pre-soaking/activation unit, copper precipitation tank and copper precipitation waste liquid recovery tank, wherein The degreasing unit is used to remove oil stains on the PCB surface and adjust the polarity of the substrate of the PCB hole wall; the micro-etching unit is used to remove the oxides on the PCB surface treated by the degreasing unit and roughen the PCB surface; The prepreg/activation unit is used to activate the PCB boards treated by the microetching unit, and the copper deposition tank collects the waste liquid from the prepreg/activation unit; the chemical copper deposition waste liquid recovery tank is connected to the copper deposition tank.
其中除油单元主要为碱性除油，用于除去板面油污，指印，氧化物，孔内粉尘；对孔壁基材进行极性调整(使孔壁由负电荷调整为正电荷)便于后工序中胶体钯的吸附，以避免沉铜背光效果差，孔壁结合力差，板面除油不净，容易产生脱皮起泡现象。Among them, the degreasing unit is mainly alkaline degreasing, which is used to remove oil stains, fingerprints, oxides, and dust in the hole on the board surface; adjust the polarity of the hole wall substrate (make the hole wall change from negative charge to positive charge) to facilitate the subsequent process Adsorption of colloidal palladium to avoid poor backlight effect of sinking copper, poor bonding force of hole walls, unclean degreasing of board surface, prone to peeling and blistering.
经过除油单元处理后的板需要通过二或三级逆流漂洗单元进行水洗处理，以避免带入的铜离子污染后续微蚀单元处理液。The boards treated by the degreasing unit need to be washed through the second or third stage countercurrent rinsing unit to avoid the copper ions brought in from contaminating the treatment solution of the subsequent micro-etching unit.
微蚀单元的目的是除去板面的氧化物，粗化板面，保证后续沉铜层与基材底铜之间良好的结合力；使新生成的铜面具有很强的活性，可以很好吸附胶体钯；通常采用的是化学微蚀刻法，通过对铜表面进行浸蚀处理(蚀刻深度为2-3微米)，使铜表面产生凹凸不平的微观粗糙带活性的表面，从而保证化学镀铜层和铜箔基体之间有牢固的结合强度。The purpose of the micro-etching unit is to remove oxides on the surface of the board, roughen the surface of the board, and ensure a good bonding force between the subsequent copper deposition layer and the bottom copper of the substrate; make the newly formed copper surface have strong activity and can be well Adsorption of colloidal palladium; the chemical microetching method is usually used to etch the copper surface (etching depth is 2-3 microns), so that the copper surface has an uneven microscopic rough surface with active surface, so as to ensure electroless copper plating There is a strong bond strength between the layer and the copper foil substrate.
经过微蚀单元去氧化微蚀处理后的板通过二级逆流漂洗单元进行水洗，将板面携带的铜离子污染物质去除，以进行后续预浸/活化单元处理。After the micro-etching unit deoxidizes and micro-etches the board, it is washed by the secondary countercurrent rinsing unit to remove the copper ion pollutants carried on the board surface for subsequent pre-soaking/activation unit treatment.
预浸/活化单元：预浸主要是保护钯槽免受前处理槽液的污染，延长钯槽的使用寿命，主要成分除氯化钯外与钯槽成份一致，可有效润湿孔壁，便于后续活化液及时进入孔内活化使之进行足够有效的活化；经过前处理碱性除油极性调整后，带正电的孔壁可有效吸附足够带有负电荷的胶体钯颗粒，以保证后续沉铜的均匀性，连续性和致密性；活化液中的氯化钯以胶体形式存在，这种带负电的胶体颗粒可保证足够数量的亚锡离子和氯离子以防止胶体钯解胶。Pre-dipping/activation unit: pre-dipping is mainly to protect the palladium tank from the pollution of the pre-treatment tank liquid and prolong the service life of the palladium tank. Subsequent activation solution enters the pores in time for activation to achieve sufficient and effective activation; after the polarity adjustment of pre-treatment alkaline degreasing, the positively charged pore walls can effectively absorb enough negatively charged colloidal palladium particles to ensure subsequent The uniformity, continuity and compactness of copper precipitation; the palladium chloride in the activation solution exists in the form of colloid, and this negatively charged colloidal particle can ensure a sufficient number of stannous ions and chloride ions to prevent colloidal palladium from dissolving.
预浸/活化单元之后还要经过二级逆流漂洗单元进行水洗，之后在通过解胶单元进行解胶处理。After the pre-soaking/activation unit, it will go through the secondary countercurrent rinsing unit for water washing, and then go through the degumming unit for degumming treatment.
通过解胶可有效除去胶体钯颗粒外面包围的亚锡离子，使胶体颗粒中的钯核暴露出来，以直接有效催化启动化学沉铜反应，由于锡是两性元素，它的盐既溶于酸又溶于碱，因此酸碱都可做解胶剂，但是碱对水质较为敏感，易产生沉淀或悬浮物，极易造成沉铜孔破；盐酸和硫酸是强酸，不仅不利与作多层板，因为强酸会攻击内层黑氧化层，而且容易造成解胶过度，将胶体钯颗粒从孔壁板面上解离下来；一般多使用氟硼酸做主要的解胶剂，因其酸性较弱，一般不造成解胶过度，且实验证明使用氟硼酸做解胶剂时，沉铜层的结合力和背光效果，致密性都有明显提高。The stannous ions surrounding the colloidal palladium particles can be effectively removed by dissolving, so that the palladium core in the colloidal particles is exposed to directly and effectively catalyze and start the electroless copper precipitation reaction. Since tin is an amphoteric element, its salt is both soluble in acid and Soluble in alkali, so acid and alkali can be used as debonding agent, but alkali is more sensitive to water quality, easy to produce sediment or suspended matter, which can easily cause sinking copper holes to break; hydrochloric acid and sulfuric acid are strong acids, not only unfavorable for multi-layer boards, Because the strong acid will attack the inner black oxide layer, and it is easy to cause excessive debonding, which will dissociate the colloidal palladium particles from the surface of the hole wall; generally, fluoroboric acid is used as the main debonding agent, because of its weak acidity, generally It does not cause excessive debonding, and the experiment proves that when fluoroboric acid is used as the debonding agent, the bonding force, backlight effect and compactness of the copper deposition layer are significantly improved.
解胶后经过二级逆流漂洗单元进行水洗，并将水洗后板放到沉铜槽中进行沉铜，其主要过程是通过钯核的活化诱发化学沉铜自催化反应，新生成的化学铜和反应副产物氢气都可以作为反应催化剂催化反应，使沉铜反应持续不断进行，通过该步骤处理后即可在板面或孔壁上沉积一层化学铜。After degumming, the two-stage countercurrent rinsing unit is used for water washing, and the washed board is placed in the copper precipitation tank for copper precipitation. The main process is to induce the self-catalytic reaction of electroless copper deposition through the activation of palladium nuclei. The newly generated chemical copper and The reaction by-product hydrogen can be used as a reaction catalyst to catalyze the reaction, so that the copper deposition reaction continues continuously. After this step, a layer of chemical copper can be deposited on the surface of the plate or the wall of the hole.
沉铜后将废液排放到化学沉铜废液回收槽中，然后在回收槽内加入每次清槽后残留的铜粉，使其充分反应，逐渐消耗掉废液中的铜离子，达到去除的目的，同时又可回收废液，待废液颜色变清后将清液排入废水处理部进行处理。After copper precipitation, the waste liquid is discharged into the chemical copper precipitation waste liquid recovery tank, and then the residual copper powder after each tank cleaning is added into the recovery tank to make it fully react and gradually consume the copper ions in the waste liquid to achieve the removal At the same time, the waste liquid can be recovered. After the color of the waste liquid becomes clear, the clear liquid is discharged into the waste water treatment department for treatment.
以上是对本实用新型所提供的一种化学沉铜废液中铜的回收再利用系统进行了详细的介绍，本文中应用了具体个例对本实用新型的结构原理及实施方式进行了阐述，以上实施例只是用于帮助理解本实用新型的方法及其核心思想；同时，对于本领域的一般技术人员，依据本实用新型的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本实用新型的限制。The above is a detailed introduction to the recovery and reuse system of copper in a chemical copper precipitation waste liquid provided by the utility model. In this paper, specific examples are used to illustrate the structural principle and implementation of the utility model. The above implementation Examples are only used to help understand the method of the present utility model and its core idea; meanwhile, for those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation and scope of application. In summary As stated above, the contents of this specification should not be construed as limiting the present utility model.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind hole conduction double-sided circuit board and processing method |
| CN103243316A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Preservation method of recycled copper deposition liquid |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN106572608A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Electroless plating copper technology for flexible circuit board of camera module group |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind hole conduction double-sided circuit board and processing method |
| CN103243316A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Preservation method of recycled copper deposition liquid |
| CN103243316B (en) * | 2013-04-22 | 2016-01-20 | 胜宏科技（惠州）股份有限公司 | A kind of store method reclaiming heavy copper liquid |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN104519670A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Production process of curved circuit board |
| CN104519670B (en) * | 2014-12-18 | 2019-11-29 | 深圳市五株科技股份有限公司 | Curved surface process for manufacturing circuit board |
| CN106572608A (en) * | 2016-10-31 | 2017-04-19 | 芜湖赋兴光电有限公司 | Electroless plating copper technology for flexible circuit board of camera module group |
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