CN104152875A - PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method - Google Patents
PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method Download PDFInfo
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- CN104152875A CN104152875A CN201410422868.0A CN201410422868A CN104152875A CN 104152875 A CN104152875 A CN 104152875A CN 201410422868 A CN201410422868 A CN 201410422868A CN 104152875 A CN104152875 A CN 104152875A
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Abstract
The invention discloses a PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method. The device comprises a hole conditioning or activation solution tank, an ultrasonic generator, a wire and an ultrasonic host, wherein the ultrasonic generator is mounted in the activation solution tank, and the ultrasonic generator is connected with the ultrasonic host via the wire. The PCB-PTH line hole conditioning and activation flow comprises the steps of charging, bulking, recovery, double water washing, glue residue removal, recovery, high neutralization water washing, high double water washing, neutralization, double water washing, hole conditioning, hot water washing, double water washing, microetching, double water washing and the like. According to the invention, ultrasonic energy with the capabilities of compression and expansion can effectively penetrate through fine gaps and small holes due to inertial thrust of liquid, and liquidity of solution in the holes is improved; the difference between colloid particle numbers on a liquid level and at the bottom of the tank can be reduced; palladium colloid molecular dispersion is good; the uniformity of activation of points of a plated board in the tank is improved; the ultrasonic energy generates a micro-stirring force and a temperature difference driving potential which contribute to improving Brownian movement of colloids; and adhesion of hole walls is increased.
Description
Technical field
The invention belongs to wiring board print field, relate in particular to the whole hole of a kind of PCB-PTH line and activation ultrasonic unit and method.
Background technology
In traditional whole hole of PTH line and activated bath, liquid medicine flows and mainly relies on PCB hanger vertical tremor and vacillate now to the left, now to the right, this mode of production has following several shortcomings: 1. liquid medicine is poor in the perforation ability of aperture and the cleaning capacity of finedraw, easily causes palladium colloid to adhere in some areas bad; 2. activator leaves standstill and easily makes the integrated large colloid of glue derivative, causes in processing solution tank his skewness of palladium glue.3. be adsorbed under equipoise and must use higher tin palladium colloid concentration, to increase collision probability.
Summary of the invention
The object of the present invention is to provide the whole hole of a kind of PCB-PTH line and activation ultrasonic unit and method, be intended to solve the mobile main dependence PCB hanger vertical tremor of the interior liquid medicine of traditional whole hole of PTH line and activated bath and vacillate now to the left, now to the right, easily cause palladium colloid to adhere in some areas bad, his skewness of palladium glue in processing solution tank, needs to use the problem of higher tin palladium colloid concentration.
The present invention realizes like this, a kind of whole hole of PCB-PTH line and activation ultrasonic unit, comprise whole hole or activation processing solution tank, excusing from death wave producer, wire, excusing from death ripple main frame, described ultrasonic generator is arranged in activation processing solution tank, and ultrasonic generator is connected with ultrasonic wave main frame by wire, and ultrasonic wave main frame is connected to device control panel by signal wire, pass through program setting, in the time having item number to drop into, ultrasonic wave main frame will be received signal, starts to send ultrasonic wave; Ultrasonic wave is the same with other sound wave, is a series of pressure spot, is the ripple that a kind of compression and expansion replaces, if acoustic energy is enough strong, activation solution was open in the expansion stages of ripple, produced thus bubble; And at the compression stage of ripple, these bubbles are moment implosion in liquid, produce a very effective surging force, moment impact ripple in its explosion can be rapidly to external irradiation, can rapidly tin palladium colloid be smashed, make tin palladium colloidal particle remain on minimum colloidal particle size, can effectively solve traditional activator and leave standstill the derivative puzzlement of the integrated large colloid of easy glue, accelerate the adsorptive power of tin palladium colloid; In addition the compression of ultrasonic energy and expansion can make liquid produce the thrust of coherence, make liquid medicine can effectively penetrate trickle gap and aperture, strengthen liquid medicine penetrability and the cleaning capacity of aperture, improve the homogeneity of PCBization copper, prevent hole and break.
2, the whole hole of a kind of PCB-PTH line and activation method, it is characterized in that, the described whole hole of PCB-PTH line and activation flow process comprise: material loading, raising agent, recovery, two washing, potassium permanganate, recovery, high-order neutralization are washed, high-order two washings, neutralization, two washing, sanitising agent, hot water wash, two washing, microetch, two washing, pickling, two washing, preimpregnation, activation, washing, two washing, speedization, two washing, chemical copper, two washing, blanking;
Reversing in Shi JiangPCB hole, whole hole is positive polarity; The static of the micro-electronegative property of epoxy resin base material itself, after boring, its electric charge transfers again micro-positive polarity of static to, but becomes again electronegativity after processing de-smear before PTH processing procedure again; And the periphery of the palladium colloid molecule existing in activated bath is to be electronegative group molecule with several chlorions, mutually repel, thus need be positive polarity by the reversing in hole by whole hole, could active adsorption palladium colloid molecule in hole when activation.
Activation is to utilize in hole differently from the palladium colloid electric property of molecule, forms the uniform palladium colloid of one deck molecule in hole, while changing copper, recycles inner hole deposition long-pending palladium colloid Journal of Molecular Catalysis electrolytic copper free and HCHO effect, and chemical copper is deposited in hole uniformly, formation conductive layer.
effect gathers
The compression of ultrasonic energy of the present invention and the thrust expanding because of liquid coherence, can effectively penetrate trickle gap and aperture, strengthens the circulation of liquid medicine in hole; Can reduce the gap of liquid level and bottom land colloidal particle number, make palladium colloid molecular dispersion good, improve the homogeneity of plating plate each point activation in groove; Ultrasonic energy produces micro-whipping force and the temperature difference drives gesture, the pedesis that contributes to improve colloid, the sticking power of increase hole wall.
Brief description of the drawings
Fig. 1 is the structural representation of the whole hole of PCB-PTH line that provides of the embodiment of the present invention and activation ultrasonic unit;
Fig. 2 is the pressurized schematic diagram of certain point in processing solution tank after the whole hole of installation PCB-PTH line that provides of the embodiment of the present invention and activation ultrasonic unit:
In figure: 1, whole hole or activation processing solution tank; 2, excusing from death wave producer; 3, wire; 4, excusing from death ripple main frame.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The present invention realizes like this, as shown in Figure 1, a kind of whole hole of PCB-PTH line and activation ultrasonic unit comprise whole hole or activation processing solution tank 1, excusing from death wave producer 2, wire 3, have children outside the state plan ripple main frame 4, described ultrasonic generator 2 is arranged in activation processing solution tank, and ultrasonic generator 2 is connected with ultrasonic wave main frame 4 by wire 3.
Ultrasonic wave main frame is connected to device control panel by signal wire, and by program setting, in the time having item number to drop into, ultrasonic wave main frame will be received signal, starts to send ultrasonic wave; Ultrasonic wave is the same with other sound wave, is a series of pressure spot, is the ripple that a kind of compression and expansion replaces, if acoustic energy is enough strong, activation solution was open in the expansion stages of ripple, produced thus bubble; And at the compression stage of ripple, these bubbles are moment implosion in liquid, produce a very effective surging force, moment impact ripple in its explosion can be rapidly to external irradiation, can rapidly tin palladium colloid be smashed, make tin palladium colloidal particle remain on minimum colloidal particle size, can effectively solve traditional activator and leave standstill the derivative puzzlement of the integrated large colloid of easy glue, accelerate the adsorptive power of tin palladium colloid; In addition the compression of ultrasonic energy and expansion can make liquid produce the thrust of coherence, make liquid medicine can effectively penetrate trickle gap and aperture, strengthen liquid medicine penetrability and the cleaning capacity of aperture, improve the homogeneity of PCBization copper, prevent hole and break.
A kind of whole hole of PCB-PTH line and activation flow process comprise: material loading, raising agent, recovery, two washing, potassium permanganate, recovery, high-order neutralization are washed, high-order two washings, neutralization, two washing, sanitising agent, hot water wash, two washing, microetch, two washing, pickling, two washing, preimpregnation, activation, washing, two washing, speedization, two washing, chemical copper, two washing, blanking.
The described whole hole of PCB-PTH line and activation flow process comprise: material loading, bulk, recovery, two washing, de-smear, recovery, high-order neutralization washing, high-order two washings, neutralization, two washing, whole hole, hot water wash, two washing, microetch, two washing, pickling, two washing, preimpregnation, activation, washing, two washing, speedization, two washing, chemical copper, two washing, blanking;
Material loading: in pcb board intron basket, then by female basket, PCB is hung in to PTH line.
Fluffy: utilize leavening agent that the resin in hole is expanded, the sting erosion of potassium permanganate to it while being beneficial to follow-up de-smear, and reduce orifice surface tension force, run through in order to liquid.
Reclaim: reclaim residual leavening agent by washing.
Washing: prevent that residual liquid medicine from entering follow-up processing solution tank, pollute tank liquor.
De-smear: the strong oxidizing property of utilizing potassium permanganate, under the condition of high temperature and highly basic, with resin generation chemical reaction, and the glue slag of removing internal layer Copper Foil place in multi-ply wood hole wall and hole is (at front processing procedure, when boring, due to high temperature and high speed, Epoxy fusing, attaches on internal layer Copper Foil and hole wall,) to change being connected of copper and hole wall, realize the conducting of S-C face and hole copper and internal layer copper, circuit.
Reaction principle:
4MnO4
-+ organic resin+4OH
-=4MnO4
2-+ CO2+2H
2o
Reclaim: reclaim residual potassium permanganate and Manganse Dioxide by washing.
Neutralization: utilize acid strong reduction neutralizing agent, the Manganse Dioxide or the permanganate neutralization that remain in plate face or hole wall dead angle place are removed.
Reversing in Shi JiangPCB hole, whole hole is positive polarity; The static of the micro-electronegative property of epoxy resin base material itself, after boring, its electric charge transfers again micro-positive polarity of static to, but becomes again electronegativity after processing de-smear before PTH processing procedure again; And the periphery of the palladium colloid molecule existing in activated bath is to be electronegative group molecule with several chlorions, mutually repel, thus need be positive polarity by the reversing in hole by whole hole, could active adsorption palladium colloid molecule in hole when activation.
Microetch: by the oxide compound on pcb board copper face and other foreign material, peel off together with accompanying whole hole interfacial agent, make in this metallization process, allow being plated in hole that expensive palladium and chemical copper try one's best, and needn't be wasted on vast plate face copper layer; And vast copper face is given to further alligatoring after removing the agent of whole hole again, make palladium and chemical copper afterwards on coarse surface, have better sticking power, and the unlikely situation that allows copper electroplating layer float off in successive process.
Pickling: remove pcb board face oxide compound.
Preimpregnation: in order not allow any impurity dirt of plank band enter in expensive palladium activated bath, also prevent from bringing the too many water yield into, and the part meeting accident hydrolysis, to maintain the balance of its activated bath exquisiteness.So the content of preimpregnation tank liquor is almost completely identical with activation tank liquor, does not just add expensive palladium salt.
Activation: utilize differently from the palladium colloid electric property of molecule in the hole in, form the uniform palladium colloid of one deck molecule in hole, recycle inner hole deposition long-pending palladium colloid Journal of Molecular Catalysis electrolytic copper free and HCHO effect when change copper, chemical copper is deposited in hole uniformly, formation conductive layer.Activation liquid medicine is the stable colloidal solutions (at least the ratio of tin and palladium is greater than more than 3) that SnCl2 (excessive), chlorion and palladium ion form.That is:
PdCl2+SnCl2 → PdSnCl4 (intermediate state)
PdSnCl4+6PdCl2 → SnPd7Cl16 (catalyzer)
Exquisite balance between sub-tin and palladium in palladium groove is very important, when operating item, never can inflate, once because the sub-tin of part is oxidized to after tetravalent tin, will disequilibrate, may make the palladium colloid of part be reduced into metal and emersion liquid level, forms the bright top layer of one deck.After main priming reaction; Bivalent Tin is lost two electronics to palladium ion; make it be reduced into metal; Bivalent Tin self has but become tetravalent tin; this kind of tetravalent tin only just can be stabilized under the protection of acid solution and chlorion; get involved the tank liquor of part once there be water; will cause this place's tetravalent tin hydrolysis; form another kind of Alpha stannic acid; and then develop into the gathering center of palladium colloid; making has particle to occur and precipitation generation in tank liquor, and why Here it is must do preactivated sacrifice hit, and ten thousand can not enter with water the major cause of palladium groove:
3pd
++Sn
+→3Pd+Sn
4+
Sn
4++9H2O→H2SnO3.6H2O+4H
+
Speedization: the part adhesion layer that palladium colloid is attached on epithelium and the copper face on hole wall base material is peeled off, and the palladium at colloid center is exposed, enables to carry out catalyzed reaction with the chemical copper of the next stop.Can accelerate the deposition without electrolytic copper, therefore this action of peeling off is referred to as to speedization reaction.Activation processing procedure drops on ground palladium colloid and through speedization reaction, glue shell is peeled off to the hydrogen that exposes palladium shell and periphery again, to accelerate the long-pending reaction in Shen of chemical copper.
Chemical copper: utilize the long-pending Pd catalysis electrolytic copper free of inner hole deposition and HCHO effect, make chemical copper deposition, and the chemical copper layer of separating out can be used as self-catalysis Cu
2+again at this continuous metallic copper that is reduced on base of catalysis.
Blanking: pcb board is taken out from PTH line.
As shown in Figure 2, ultrasonic wave is the same with other sound wave principle, is a series of pressure spot, and it is the sound wave that a kind of compression and expansion replaces.If acoustic wave energy is enough strong, PTH line activation liquid medicine will be open in the expansion stages of excusing from death ripple, and can produce bubble; And at the compression stage of having children outside the state plan ripple, produce bubble in liquid by moment implosion, and produce a very effective surging force, moment impact ripple in its explosion can be rapidly to external irradiation, can rapidly tin palladium colloid be smashed, make tin palladium colloidal particle remain on minimum colloidal particle size, can effectively solve traditional activator time of repose long, the derivative puzzlement of the integrated large colloid of glue.
The compression of ultrasonic energy of the present invention and the thrust expanding because of liquid coherence, can effectively penetrate trickle gap and aperture, strengthens the circulation of liquid medicine in hole; Can reduce the gap of liquid level and bottom land colloidal particle number, make palladium colloid molecular dispersion good, improve the homogeneity of plating plate each point activation in groove; Ultrasonic energy produces micro-whipping force and the temperature difference drives gesture, the pedesis that contributes to improve colloid, the sticking power of increase hole wall.
By reference to the accompanying drawings the specific embodiment of the present invention is described although above-mentioned; but not limiting the scope of the invention; one of ordinary skill in the art should be understood that; on the basis of technical scheme of the present invention, those skilled in the art do not need to pay various amendments that performing creative labour can make or distortion still within protection scope of the present invention.
Claims (5)
1. the whole hole of PCB-PTH line and activation ultrasonic unit, it is characterized in that, the described whole hole of PCB-PTH line and activation ultrasonic unit comprise whole hole or activation processing solution tank, have children outside the state plan wave producer, wire, excusing from death ripple main frame, described ultrasonic generator is arranged in activation processing solution tank, ultrasonic generator is connected with ultrasonic wave main frame by wire, ultrasonic wave main frame is connected to device control panel by signal wire, pass through program setting, in the time having item number to drop into, ultrasonic wave main frame will be received signal, starts to send ultrasonic wave.
2. the whole hole of PCB-PTH line and activation method, it is characterized in that, the described whole hole of PCB-PTH line and activation flow process comprise: material loading, bulk, recovery, two washing, de-smear, recovery, high-order neutralization washing, high-order two washings, neutralization, two washing, whole hole, hot water wash, two washing, microetch, two washing, pickling, two washing, preimpregnation, activation, washing, two washing, speedization, two washing, chemical copper, two washing, blanking;
Material loading: in pcb board intron basket, then by female basket, PCB is hung in to PTH line;
Fluffy: utilize leavening agent that the resin in hole is expanded, the sting erosion of potassium permanganate to it while being beneficial to follow-up de-smear, and reduce orifice surface tension force, run through in order to liquid;
Reclaim: reclaim residual leavening agent by washing;
Washing: prevent that residual liquid medicine from entering follow-up processing solution tank, pollute tank liquor;
De-smear: the strong oxidizing property of utilizing potassium permanganate, under the condition of high temperature and highly basic, with resin generation chemical reaction, and remove the glue slag at internal layer Copper Foil place in multi-ply wood hole wall and hole, so that change copper is connected with hole wall, realize the conducting of S-C face and hole copper and internal layer copper, circuit;
Reclaim: reclaim residual potassium permanganate and Manganse Dioxide by washing;
Neutralization: utilize acid strong reduction neutralizing agent, the Manganse Dioxide or the permanganate neutralization that remain in plate face or hole wall dead angle place are removed;
Reversing in Shi JiangPCB hole, whole hole is positive polarity;
Microetch: by the oxide compound on pcb board copper face and other foreign material, peel off together with accompanying whole hole interfacial agent;
Pickling: remove pcb board face oxide compound;
Preimpregnation: in order not allow any impurity dirt of plank band enter in expensive palladium activated bath, also prevent from bringing the too many water yield into, and the part meeting accident hydrolysis, to maintain the balance of its activated bath exquisiteness;
Activation: utilize differently from the palladium colloid electric property of molecule in the hole in, form the uniform palladium colloid of one deck molecule in hole, recycle inner hole deposition long-pending palladium colloid Journal of Molecular Catalysis electrolytic copper free and HCHO effect when change copper, chemical copper is deposited in hole uniformly, formation conductive layer;
Speedization: the part adhesion layer that palladium colloid is attached on epithelium and the copper face on hole wall base material is peeled off, and the palladium at colloid center is exposed, enables to carry out catalyzed reaction with the chemical copper of the next stop;
Chemical copper: utilize the long-pending Pd catalysis electrolytic copper free of inner hole deposition and HCHO effect, make chemical copper deposition, and the chemical copper layer of separating out can be used as self-catalysis Cu
2+again at this continuous metallic copper that is reduced on base of catalysis;
Blanking: pcb board is taken out from PTH line.
3. the whole hole of PCB-PTH line as claimed in claim 1 and activation method, is characterized in that, the reaction principle of de-smear:
4MnO4
-+ organic resin+4OH
-=4MnO4
2-+ CO2+2H
2o.
4. the whole hole of PCB-PTH line as claimed in claim 1 and activation method, is characterized in that, the reversing in Shi JiangPCB hole, whole hole is positive polarity; The static of the micro-electronegative property of epoxy resin base material itself, after boring, its electric charge transfers again micro-positive polarity of static to, but becomes again electronegativity after processing de-smear before PTH processing procedure again; And the periphery of the palladium colloid molecule existing in activated bath is to be electronegative group molecule with several chlorions, mutually repel, thus need be positive polarity by the reversing in hole by whole hole, could active adsorption palladium colloid molecule in hole when activation.
5. the whole hole of PCB-PTH line as claimed in claim 1 and activation method, is characterized in that, chemical drug water is the stable colloidal solutions that SnCl2, chlorion and palladium ion form, that is:
PdCl2+SnCl2 → PdSnCl4 (intermediate state)
PdSnCl4+6PdCl2 → SnPd7Cl16 (catalyzer)
Exquisite balance between sub-tin and palladium in palladium groove is very important, when operating item, never can inflate, once because the sub-tin of part is oxidized to after tetravalent tin, will disequilibrate, makes the palladium colloid of part be reduced into metal and emersion liquid level, forms the bright top layer of one deck; After main priming reaction; Bivalent Tin is lost two electronics to palladium ion; make it be reduced into metal; Bivalent Tin self has but become tetravalent tin, and this kind of tetravalent tin only just can be stabilized under the protection of acid solution and chlorion, once there be water to get involved the tank liquor of part; will cause this place's tetravalent tin hydrolysis; form another kind of Alpha stannic acid, and then develop into the gathering center of palladium colloid, making has particle to occur and precipitation generation in tank liquor.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422868.0A CN104152875A (en) | 2014-08-25 | 2014-08-25 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410422868.0A CN104152875A (en) | 2014-08-25 | 2014-08-25 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
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|---|---|
| CN104152875A true CN104152875A (en) | 2014-11-19 |
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|---|---|---|---|
| CN201410422868.0A Pending CN104152875A (en) | 2014-08-25 | 2014-08-25 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
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Cited By (10)
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| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN105887053A (en) * | 2016-05-06 | 2016-08-24 | 广东利尔化学有限公司 | Chemical copper plating pretreatment process for printed wiring board |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN110324977A (en) * | 2018-03-29 | 2019-10-11 | 欣强电子（清远）有限公司 | A kind of pcb board sonify silver slot and its change silver-colored method |
| CN113133225A (en) * | 2021-04-13 | 2021-07-16 | 广州皓悦新材料科技有限公司 | Horizontal copper deposition process for multilayer board and HDI board |
| CN113652677A (en) * | 2021-07-30 | 2021-11-16 | 江门市浩远电子科技有限公司 | Horizontal copper deposition and photoresist removal process for circuit board |
| CN114071890A (en) * | 2020-08-05 | 2022-02-18 | 深南电路股份有限公司 | Circuit board and copper deposition method thereof |
| CN114411130A (en) * | 2021-12-29 | 2022-04-29 | 广东利尔化学有限公司 | Thick electroless copper plating solution with good ductility |
| CN114828451A (en) * | 2022-04-29 | 2022-07-29 | 奥士康精密电路（惠州）有限公司 | Method for reducing copper-free scrap of acid etching electroplating hole |
| CN115216117A (en) * | 2022-09-21 | 2022-10-21 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582332A (en) * | 2015-01-21 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Fine circuit packaging substrate and manufacturing method thereof |
| CN105887053A (en) * | 2016-05-06 | 2016-08-24 | 广东利尔化学有限公司 | Chemical copper plating pretreatment process for printed wiring board |
| CN110324977A (en) * | 2018-03-29 | 2019-10-11 | 欣强电子（清远）有限公司 | A kind of pcb board sonify silver slot and its change silver-colored method |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
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| CN113133225A (en) * | 2021-04-13 | 2021-07-16 | 广州皓悦新材料科技有限公司 | Horizontal copper deposition process for multilayer board and HDI board |
| CN113652677A (en) * | 2021-07-30 | 2021-11-16 | 江门市浩远电子科技有限公司 | Horizontal copper deposition and photoresist removal process for circuit board |
| CN114411130A (en) * | 2021-12-29 | 2022-04-29 | 广东利尔化学有限公司 | Thick electroless copper plating solution with good ductility |
| CN114828451A (en) * | 2022-04-29 | 2022-07-29 | 奥士康精密电路（惠州）有限公司 | Method for reducing copper-free scrap of acid etching electroplating hole |
| CN114828451B (en) * | 2022-04-29 | 2024-08-30 | 奥士康科技股份有限公司 | Method for reducing copper-free scrapping of acid etched electroplating hole |
| CN115216117A (en) * | 2022-09-21 | 2022-10-21 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
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Application publication date: 20141119 |
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