CN108697008A - It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper - Google Patents
It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper Download PDFInfo
- Publication number
- CN108697008A CN108697008A CN201810842923.XA CN201810842923A CN108697008A CN 108697008 A CN108697008 A CN 108697008A CN 201810842923 A CN201810842923 A CN 201810842923A CN 108697008 A CN108697008 A CN 108697008A
- Authority
- CN
- China
- Prior art keywords
- copper
- concentration
- pcb board
- aspect ratio
- high aspect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
Electro-plating method of the high aspect ratio PCB aperture without copper is prevented the invention discloses a kind of, is included the following steps:S1, fluffy processing is carried out to pcb board using leavening agent;S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution;S3, preneutralization, ultrasonic wave neutralize;S4, ultrasonic wave water washing;S5, whole hole processing is carried out to the pcb board after washing using conditioner;Microetch processing is carried out to pcb board using micro-corrosion liquid after S6, pickling;S7, pcb board preimpregnation post activation is handled using prepreg solution;S8, the pcb board after activation is handled using fast agent;S9, heavy copper;S10, anti-oxidant treatment.The technique is under the cooperation of above-mentioned steps and related reagent, solve the problems, such as high aspect ratio PCB in electroplating process mesoporous bubble without copper, quality scrappage integrally reduces by 0.5%, in addition, anti-oxidation step is increased after heavy Copper fabrication, the problem of avoiding issuable oxidation sex chromosome mosaicism in heavy copper metapore, avoiding Kong Wutong indirectly.
Description
Technical field
The invention belongs to a kind of printed circuit board production technical fields, are related to a kind of electro-plating method of high aspect ratio PCB, tool
It says to body and is related to a kind of preventing electro-plating method of the high aspect ratio PCB aperture without copper.
Background technology
PCB (printed circuit board, also known as printed circuit board) is the critical electronic interconnection piece in electronic product, in electronic product
In connection for forming predetermining circuit between electronic component, play the role of relay transmission with electronic information technology
It continues to develop, printed circuit board is also rapidly developed towards high density, high-level direction therewith, and in design, printed circuit board is not
Disconnected more, plate thickness higher, the smaller direction in aperture towards the number of plies are developed, so as to cause printed circuit board aspect ratio (radius-thickness ratio,
The ratio of plate thickness and aperture) it is also increasing, this development trend brings great challenge to the manufacturing of printed circuit board.
Wherein, the plating of high aspect ratio printed circuit board is a key in multi-layer PCB manufacturing process, in length and breadth for height
Plate thickness more general than printed circuit board and aperture the ratio between be more than 5:1, so that PCB copper plates is equably all covered in hole wall
Difficulty is prodigious, since aperture is small, depth so that greatly layers of copper is extremely difficult to technological requirement in electroplating process mesoporous.High aspect ratio
Printed circuit board bubble hole present in electroplating process restrict always without copper technological progresses of the PCB on high-end product and
Development, these reliability qualifications problems once occur, in the case where not destroying product, can not by effective detection method into
Row identification, very big puzzlement is brought to quality control.
Invention content
For this purpose, technical problem to be solved by the present invention lies in high aspect ratio printed circuit board, there are gas in electroplating technology
The problem of bubble property hole is without copper, which is difficult to be detected directly, and great challenge is brought for quality management and control, to propose that one kind can
Prevent to lead to the problem of this prevents electro-plating method of the high aspect ratio PCB bubbles hole without copper.
In order to solve the above technical problems, the technical scheme is that:
The present invention, which provides, a kind of preventing electro-plating method of the high aspect ratio PCB aperture without copper comprising following steps:
S1, fluffy processing is carried out to pcb board using leavening agent;
S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution;
S3, preneutralization, ultrasonic wave neutralize;
S4, ultrasonic wave water washing;
S5, whole hole processing is carried out to the pcb board after washing using conditioner;
Microetch processing is carried out to pcb board using micro-corrosion liquid after S6, pickling;
S7, pcb board preimpregnation post activation is handled using prepreg solution;
S8, the pcb board after activation is handled using fast agent;
S9, heavy copper;
S10, anti-oxidant treatment.
Preferably, the anti-oxidant treatment process described in the step S10 is to soak the plank after heavy copper with oxidation resistance liquid
Bubble deposits one layer of oxidation-resistant film in plate surface, plank vibration, the speed of vibration is kept to be not less than during anti-oxidant treatment
20mm/s。
Preferably, heavy copper liquid is used during the heavy copper, containing a concentration of 1.8-2.2g/L in the heavy copper liquid
Cu2+, the NaOH of a concentration of 9-11g/L, a concentration of 5-7g/L HCHO, deposition rate is 0.38-0.5 μm/17min.
Preferably, the mass concentration of the leavening agent is 5-15%, the leavening agent includes NaOH, and the NaOH's is dense
Degree is 15-25g/L.
Preferably, de-smear solution described in the step S2 includes the KMnO of a concentration of 55-65g/L4, it is a concentration of
The NaOH of 30-40g/L, during de-smear, removing glue rate is 0.12-0.3mg/cm2。
Preferably, in the step S3 pre-neutralization process, the acid equivalent of the neutralizer used is described super for 0.5-1.5N
Sound wave neutralizes the neutralizer acid equivalent used as 1.9-2.2N, and ultrasonic power 28KHz, voltage is not less than 7mv;The step
In S4, hydraulic pressure is 0.2-0.8kg/cm during ultrasonic wave water washing2, ultrasonic power 28KHz, voltage is not less than 5mv.
Preferably, in the step S5, the alkali equivalent of the conditioner is 0.19-0.27N;In the step S6, acid
The mordant used in the process is washed as the H of concentration 1-3%2SO4Solution.
Preferably, in the step S6, the micro-corrosion liquid includes the H of a concentration of 2-4%2SO4Solution, a concentration of 2.5-
4.5% H2O2Solution, the microetch amount during microetch are 0.3-1.3 μm.
Preferably, in the step S7, the prepreg solution includes pre dip salt and H2SO4Solution, the H2SO4Solution
Equivalent concentration is 0.58-0.78N;The activation process uses activator, and the mass concentration of the activator is 60-100%.
Preferably, in the step S8, the mass concentration of the speed agent is 0.4-0.6%.
The above technical solution of the present invention has the following advantages over the prior art:
It is of the present invention to prevent electro-plating method of the high aspect ratio PCB aperture without copper, include the following steps:S1, using bulk
Agent carries out fluffy processing to pcb board;S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution;S3,
Preneutralization, ultrasonic wave neutralize;S4, ultrasonic wave water washing;S5, whole hole processing is carried out to the pcb board after washing using conditioner;S6,
Microetch processing is carried out to pcb board using micro-corrosion liquid after pickling;S7, pcb board preimpregnation post activation is handled using prepreg solution;S8, it adopts
The pcb board after activation is handled with fast agent;S9, heavy copper;S10, anti-oxidant treatment.The technique is in above-mentioned steps and correlation
Under the cooperation of reagent, solving the problems, such as high aspect ratio PCB, for bubble without copper, quality scrappage is whole in electroplating process mesoporous
0.5% is reduced, in addition, increasing anti-oxidation step after heavy Copper fabrication, avoids issuable oxidisability in heavy copper metapore
Problem, the problem of avoiding Kong Wutong indirectly.
Specific implementation mode
In order to make the content of the present invention more clearly understood, below according to specific embodiments of the present invention to this hair
It is bright to be described in further detail.
Embodiment 1
Electro-plating method of the high aspect ratio PCB aperture without copper is prevented the present embodiment provides a kind of comprising following steps:
S1, fluffy processing is carried out to pcb board using leavening agent, the leavening agent is given birth to using Hua Xun Applied Materials Inc
The alcohol ethers leavening agent SW-11 of production, mass concentration 5% contain NaOH in the leavening agent, and the NaOH's is a concentration of
15g/L。
S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution, the de-smear solution includes
The KMnO of a concentration of 55g/L4, a concentration of 30g/L NaOH, in de-smear processing procedure, removing glue rate is 0.12mg/cm2。
S3, preneutralization, ultrasonic wave neutralize, first use Hua Xun Applied Materials Inc production neutralizer NU-121 into
Then row preneutralization, the neutralizer acid equivalent that preneutralization uses use neutralizer NU-121 to carry out ultrasonic wave neutralization, institute for 0.5N
It states ultrasonic wave and neutralizes the neutralizer acid equivalent that uses as 1.9N, ultrasonic power 28KZ, voltage is not less than in ultrasonic procedure
7mv。
S4, ultrasonic wave water washing, during ultrasonic wave water washing, hydraulic pressure 0.2kg/cm2, ultrasonic power 28KHz, voltage
It is 8mv in the present embodiment not less than 5mv.
S5, whole hole processing is carried out to the pcb board after washing using conditioner, the conditioner is conventional conditioner, or is adopted
With the conditioner of model CD-210/211, alkali equivalent 0.19N.
After S6, pickling using micro-corrosion liquid to pcb board carry out microetch processing, the pickling specifically, use volumetric concentration for
2% H2SO4Solution cleans pcb board, and micro-corrosion liquid is then used to carry out microetch processing, and the micro-corrosion liquid includes that volumetric concentration is 2%
H2SO4The H that solution and volumetric concentration are 2.5%2O2Solution, in the present embodiment, microetch amount is 0.3 μm.
S7, pcb board preimpregnation post activation is handled using prepreg solution, the prepreg solution includes pre dip salt and equivalent concentration is
The H of 0.58N2SO4Solution, the pre dip salt are the PD-221A/B of Hua Xun Applied Materials Inc production, the activation process
Process is to be handled the plank after preimpregnation using activator, and the mass concentration of the activator is 60%, to change news application
The CA-230 activators of Materials Co., Ltd's production.
S8, the pcb board after activation is handled using fast agent, the speed agent is Hua Xun Applied Materials Inc
The fast agent of the AL-242A/B models of production, mass concentration 0.4%.
S9, heavy copper, using heavy copper liquid, to fast agent, treated that pcb board carries out copper-coating, contains in the heavy copper liquid
The Cu of a concentration of 1.8g/L2+, a concentration of 9g/L NaOH and a concentration of 5g/L HCHO, further include for balancing heavy copper liquid medicine
Complexing agent, the molar concentration 0.055M of the complexing agent, deposition rate are 0.38 μm/17min.
S10, anti-oxidant treatment impregnate the commercially available oxidation resistance liquid of the plate after heavy copper, the model of the oxidation resistance liquid
A0-260 deposits one layer of anti-oxidant film layer in plate surface, during the anti-oxidant treatment, keeps plank to be not less than
The frequency of 20mm/s is vibrated.
Embodiment 2
S1, fluffy processing is carried out to pcb board using leavening agent, the leavening agent is given birth to using Hua Xun Applied Materials Inc
The alcohol ethers leavening agent SW-11 of production, mass concentration 15% contain NaOH in the leavening agent, and the NaOH's is a concentration of
25g/L。
S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution, the de-smear solution includes
The KMnO of a concentration of 65g/L4, a concentration of 40g/L NaOH, in de-smear processing procedure, removing glue rate is 0.3mg/cm2。
S3, preneutralization, ultrasonic wave neutralize, first use Hua Xun Applied Materials Inc production neutralizer NU-121 into
Then row preneutralization, the neutralizer acid equivalent that preneutralization uses use neutralizer NU-121 to carry out ultrasonic wave neutralization, institute for 1.5N
It states ultrasonic wave and neutralizes the neutralizer acid equivalent that uses as 2.2N, ultrasonic power 28KZ, voltage is not less than in ultrasonic procedure
6mv。
S4, ultrasonic wave water washing, during ultrasonic wave water washing, hydraulic pressure 0.8kg/cm2, ultrasonic power 28KHz, voltage
It is 8mv in the present embodiment not less than 5mv.
S5, whole hole processing is carried out to the pcb board after washing using conditioner, the conditioner is conventional conditioner, or is adopted
With the conditioner of model CD-210/211, alkali equivalent 0.27N.
After S6, pickling using micro-corrosion liquid to pcb board carry out microetch processing, the pickling specifically, use volumetric concentration for
4% H2SO4Solution cleans pcb board, and micro-corrosion liquid is then used to carry out microetch processing, and the micro-corrosion liquid includes that volumetric concentration is 2%
H2SO4The H that solution and volumetric concentration are 4.5%2O2Solution, in the present embodiment, microetch amount is 1.3 μm.
S7, pcb board preimpregnation post activation is handled using prepreg solution, the prepreg solution includes pre dip salt and equivalent concentration is
The H of 0.78N2SO4Solution, the pre dip salt are the PD-221A/B of Hua Xun Applied Materials Inc production, the activation process
Process is to be handled the plank after preimpregnation using activator, and the mass concentration of the activator is 100%, to change news application
The CA-230 activators of Materials Co., Ltd's production.
S8, the pcb board after activation is handled using fast agent, the speed agent is Hua Xun Applied Materials Inc
The fast agent of the AL-242A/B models of production, mass concentration 0.6%.
S9, heavy copper, using heavy copper liquid, to fast agent, treated that pcb board carries out copper-coating, contains in the heavy copper liquid
The Cu of a concentration of 2.2g/L2+, a concentration of 11g/L NaOH and a concentration of 7g/L HCHO, further include for balancing heavy copper liquid medicine
Complexing agent, the molar concentration 0.075M of the complexing agent, deposition rate be 0.5 μm/17min.
S10, anti-oxidant treatment impregnate the commercially available oxidation resistance liquid of the plate after heavy copper, the model of the oxidation resistance liquid
A0-260 deposits one layer of anti-oxidant film layer in plate surface, during the anti-oxidant treatment, keeps plank to be not less than
The frequency of 20mm/s is vibrated.
Embodiment 3
S1, fluffy processing is carried out to pcb board using leavening agent, the leavening agent is given birth to using Hua Xun Applied Materials Inc
The alcohol ethers leavening agent SW-11 of production, mass concentration 10% contain NaOH in the leavening agent, and the NaOH's is a concentration of
20g/L。
S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution, the de-smear solution includes
The KMnO of a concentration of 60g/L4, a concentration of 35g/L NaOH, in de-smear processing procedure, removing glue rate is 0.22mg/cm2。
S3, preneutralization, ultrasonic wave neutralize, first use Hua Xun Applied Materials Inc production neutralizer NU-121 into
Row preneutralization, then the neutralizer acid equivalent that preneutralization uses uses neutralizer NU-121 to carry out ultrasonic wave neutralization for 1N, described
The neutralizer acid equivalent that ultrasonic wave neutralization uses is 2N, ultrasonic power 28KZ, and voltage is not less than 8mv in ultrasonic procedure.
S4, ultrasonic wave water washing, during ultrasonic wave water washing, hydraulic pressure 0.5kg/cm2, ultrasonic power 28KHz, voltage
It is 6mv in the present embodiment not less than 5mv.
S5, whole hole processing is carried out to the pcb board after washing using conditioner, the conditioner is conventional conditioner, or is adopted
With the conditioner of model CD-210/211, alkali equivalent 0.24N.
After S6, pickling using micro-corrosion liquid to pcb board carry out microetch processing, the pickling specifically, use volumetric concentration for
2% H2SO4Solution cleans pcb board, and micro-corrosion liquid is then used to carry out microetch processing, and the micro-corrosion liquid includes that volumetric concentration is 3%
H2SO4The H that solution and volumetric concentration are 3.5%2O2Solution, in the present embodiment, microetch amount is 0.7 μm.
S7, pcb board preimpregnation post activation is handled using prepreg solution, the prepreg solution includes pre dip salt and equivalent concentration is
The H of 0.65N2SO4Solution, the pre dip salt are the PD-221A/B of Hua Xun Applied Materials Inc production, the activation process
Process is to be handled the plank after preimpregnation using activator, and the mass concentration of the activator is 80%, to change news application
The CA-230 activators of Materials Co., Ltd's production.
S8, the pcb board after activation is handled using fast agent, the speed agent is Hua Xun Applied Materials Inc
The fast agent of the AL-242A/B models of production, mass concentration 0.5%.
S9, heavy copper, using heavy copper liquid, to fast agent, treated that pcb board carries out copper-coating, contains in the heavy copper liquid
The Cu of a concentration of 2g/L2+, a concentration of 10g/L NaOH and a concentration of 6g/L HCHO, further include for balancing heavy copper liquid medicine
Complexing agent, the molar concentration 0.065M of the complexing agent, deposition rate are 0.42 μm/17min.
S10, anti-oxidant treatment impregnate the commercially available oxidation resistance liquid of the plate after heavy copper, the model of the oxidation resistance liquid
A0-260 deposits one layer of anti-oxidant film layer in plate surface, during the anti-oxidant treatment, keeps plank to be not less than
The frequency of 20mm/s is vibrated.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of preventing electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that include the following steps:
S1, fluffy processing is carried out to pcb board using leavening agent;
S2, removing glue Slag treatment is carried out to fluffy treated pcb board using de-smear solution;
S3, preneutralization, ultrasonic wave neutralize;
S4, ultrasonic wave water washing;
S5, whole hole processing is carried out to the pcb board after washing using conditioner;
Microetch processing is carried out to pcb board using micro-corrosion liquid after S6, pickling;
S7, pcb board preimpregnation post activation is handled using prepreg solution;
S8, the pcb board after activation is handled using fast agent;
S9, heavy copper;
S10, anti-oxidant treatment.
2. according to claim 1 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
Anti-oxidant treatment process described in S10 is to impregnate the plank after heavy copper with oxidation resistance liquid, and one layer of antioxygen is deposited in plate surface
Change film, plank vibration, the speed of vibration is kept to be not less than 20mm/s during anti-oxidant treatment.
3. according to claim 2 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the heavy copper
Heavy copper liquid is used in the process, and the Cu of a concentration of 1.8-2.2g/L is contained in the heavy copper liquid2+, a concentration of 9-11g/L NaOH, dense
Degree is the HCHO of 5-7g/L, and deposition rate is 0.38-0.5 μm/17min.
4. according to claim 3 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that described bulk
The mass concentration of agent is 5-15%, and the leavening agent includes NaOH, a concentration of 15-25g/L of the NaOH.
5. according to claim 4 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
De-smear solution described in S2 includes the KMnO of a concentration of 55-65g/L4, a concentration of 30-40g/L NaOH, de-smear process
In, removing glue rate is 0.12-0.3mg/cm2。
6. according to claim 5 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
In S3 pre-neutralization process, for 0.5-1.5N, the ultrasonic wave neutralizes the neutralizer acid used and works as the acid equivalent of the neutralizer used
Amount is 1.9-2.2N, and ultrasonic power 28KHz, voltage is not less than 7mv;In the step S4, water during ultrasonic wave water washing
Pressure is 0.2-0.8kg/cm2, ultrasonic power 28KHz, voltage is not less than 5mv.
7. according to claim 6 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
In S5, the alkali equivalent of the conditioner is 0.19-0.27N;In the step S6, the mordant used in acid cleaning process is concentration
The H of 1-3%2SO4Solution.
8. according to claim 7 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
In S6, the micro-corrosion liquid includes the H of a concentration of 2-4%2SO4The H of solution, a concentration of 2.5-4.5%2O2Solution, during microetch
Microetch amount be 0.3-1.3 μm.
9. according to claim 8 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
In S7, the prepreg solution includes pre dip salt and H2SO4Solution, the H2SO4The equivalent concentration of solution is 0.58-0.78N;It is described
Activation process uses activator, and the mass concentration of the activator is 60-100%.
10. according to claim 9 prevent electro-plating method of the high aspect ratio PCB aperture without copper, which is characterized in that the step
In S8, the mass concentration of the speed agent is 0.4-0.6%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810842923.XA CN108697008A (en) | 2018-07-27 | 2018-07-27 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810842923.XA CN108697008A (en) | 2018-07-27 | 2018-07-27 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108697008A true CN108697008A (en) | 2018-10-23 |
Family
ID=63851842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810842923.XA Pending CN108697008A (en) | 2018-07-27 | 2018-07-27 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108697008A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN109661127A (en) * | 2018-12-25 | 2019-04-19 | 合肥中航天成电子科技有限公司 | A kind of blind holes of circuit board plating nickel on surface gold treatment process |
| CN110149768A (en) * | 2019-05-31 | 2019-08-20 | 湖北龙腾电子科技有限公司 | A kind of slot orifice plate exposure hole method |
| CN110868810A (en) * | 2019-10-23 | 2020-03-06 | 广州陶积电电子科技有限公司 | High-thickness-to-diameter ratio ceramic circuit board processing method and ceramic circuit board |
| CN111511116A (en) * | 2020-04-15 | 2020-08-07 | 苏州市杰煜电子有限公司 | High-precision FPC flexible circuit board manufacturing process |
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN113133225A (en) * | 2021-04-13 | 2021-07-16 | 广州皓悦新材料科技有限公司 | Horizontal copper deposition process for multilayer board and HDI board |
| CN113652677A (en) * | 2021-07-30 | 2021-11-16 | 江门市浩远电子科技有限公司 | Horizontal copper deposition and photoresist removal process for circuit board |
| CN113993289A (en) * | 2021-09-23 | 2022-01-28 | 四川省华兴宇电子科技有限公司 | Production method for copper-free open circuit in high-aspect-ratio plate hole and copper deposition hanging basket |
| CN114457326A (en) * | 2022-01-18 | 2022-05-10 | 广东利尔化学有限公司 | Copper-depositing double-microetching process applied to circuit board |
| CN114828451A (en) * | 2022-04-29 | 2022-07-29 | 奥士康精密电路（惠州）有限公司 | Method for reducing copper-free scrap of acid etching electroplating hole |
| CN116709658A (en) * | 2023-07-26 | 2023-09-05 | 清远市富盈电子有限公司 | Copper deposition method of embedded element PCB and PCB manufactured by copper deposition method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN104661448A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
| CN105722326A (en) * | 2016-03-25 | 2016-06-29 | 东莞美维电路有限公司 | PCB resin plugging technology |
| CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
| CN107529285A (en) * | 2017-09-05 | 2017-12-29 | 奥士康精密电路（惠州）有限公司 | A kind of bad PCB of backlight does over again technique |
-
2018
- 2018-07-27 CN CN201810842923.XA patent/CN108697008A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN104661448A (en) * | 2013-11-25 | 2015-05-27 | 深圳崇达多层线路板有限公司 | Chemical copper deposition method of PCB with small aperture and high aspect ratio |
| CN105722326A (en) * | 2016-03-25 | 2016-06-29 | 东莞美维电路有限公司 | PCB resin plugging technology |
| CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路（惠州）有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
| CN107529285A (en) * | 2017-09-05 | 2017-12-29 | 奥士康精密电路（惠州）有限公司 | A kind of bad PCB of backlight does over again technique |
Non-Patent Citations (1)
| Title |
|---|
| 刘仁志: "《印制板电镀》", 30 September 2008, 国防工业出版社 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109661127A (en) * | 2018-12-25 | 2019-04-19 | 合肥中航天成电子科技有限公司 | A kind of blind holes of circuit board plating nickel on surface gold treatment process |
| CN109640546A (en) * | 2018-12-29 | 2019-04-16 | 深圳万基隆电子科技有限公司 | A kind of thick copper sheet manufacture craft that can prevent having no copper in the holes |
| CN110149768A (en) * | 2019-05-31 | 2019-08-20 | 湖北龙腾电子科技有限公司 | A kind of slot orifice plate exposure hole method |
| CN110868810A (en) * | 2019-10-23 | 2020-03-06 | 广州陶积电电子科技有限公司 | High-thickness-to-diameter ratio ceramic circuit board processing method and ceramic circuit board |
| CN111511116B (en) * | 2020-04-15 | 2023-06-30 | 苏州市杰煜电子有限公司 | Manufacturing process of high-precision FPC (Flexible printed Circuit) |
| CN111511116A (en) * | 2020-04-15 | 2020-08-07 | 苏州市杰煜电子有限公司 | High-precision FPC flexible circuit board manufacturing process |
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN113133225A (en) * | 2021-04-13 | 2021-07-16 | 广州皓悦新材料科技有限公司 | Horizontal copper deposition process for multilayer board and HDI board |
| CN113652677A (en) * | 2021-07-30 | 2021-11-16 | 江门市浩远电子科技有限公司 | Horizontal copper deposition and photoresist removal process for circuit board |
| CN113993289A (en) * | 2021-09-23 | 2022-01-28 | 四川省华兴宇电子科技有限公司 | Production method for copper-free open circuit in high-aspect-ratio plate hole and copper deposition hanging basket |
| CN114457326A (en) * | 2022-01-18 | 2022-05-10 | 广东利尔化学有限公司 | Copper-depositing double-microetching process applied to circuit board |
| CN114828451A (en) * | 2022-04-29 | 2022-07-29 | 奥士康精密电路（惠州）有限公司 | Method for reducing copper-free scrap of acid etching electroplating hole |
| CN116709658A (en) * | 2023-07-26 | 2023-09-05 | 清远市富盈电子有限公司 | Copper deposition method of embedded element PCB and PCB manufactured by copper deposition method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108697008A (en) | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper | |
| US3011920A (en) | Method of electroless deposition on a substrate and catalyst solution therefor | |
| US3962494A (en) | Sensitized substrates for chemical metallization | |
| US3993799A (en) | Electroless plating process employing non-noble metal hydrous oxide catalyst | |
| JP4843164B2 (en) | Method for forming copper-resin composite material | |
| JP6307266B2 (en) | Formaldehyde-free electroless copper plating composition and method | |
| JPH06505770A (en) | Selective method for printed wiring circuit board manufacturing | |
| CN104419916A (en) | Manufacturing method of chemical nickel palladium gold plating plated with thick palladium | |
| TWI732045B (en) | Manufacturing method of printed wiring board | |
| EP2823084A1 (en) | Method for promoting adhesion between dielectric substrates and metal layers | |
| CN109862710A (en) | A kind of pcb board thickness uniformly sinks process for copper and its device | |
| CN106413289A (en) | Copper deposition method for preventing occurrence of copper-free hole | |
| TWI553152B (en) | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds | |
| CN109563623A (en) | The preparation method of the chemical plating pretreatment liquid and printed circuit board that are used simultaneously with reduction treatment | |
| DE3417563A1 (en) | METHOD FOR PRODUCING METAL PATTERNS ON INSULATING CARRIERS AND INSULATING CARRIERS WITH METAL PATTERN, IN PARTICULAR PRINTED CIRCUITS | |
| US3202529A (en) | Disposition of nickel-cobalt alloy on aluminum substrates | |
| CN106987830A (en) | Aluminium base printed wiring board chemistry NiPdAu technique | |
| US4035227A (en) | Method for treating plastic substrates prior to plating | |
| JPS63297573A (en) | Metallizing method of plastic imparting high bonding strength | |
| JP6184578B1 (en) | Method for electroless copper plating and method for producing catalyst solution for electroless copper plating | |
| CN104694909B (en) | Copper surface coarsening agent | |
| CN105695962A (en) | Solution for chemically plating nickel on surface of non-catalytic active material and plating process for solution | |
| CN101838802A (en) | Activating solution for chemical plating and non-metallic surface activation method | |
| KR101420915B1 (en) | Manufacturing method of electroconductive fabric for electromagnetic interference(EMI) shielding by using electroless | |
| US2947064A (en) | Method of interconnecting pathway patterns of printed circuit products by chemical deposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181023 |