CN114828451A - Method for reducing copper-free scrap of acid etching electroplating hole - Google Patents
Method for reducing copper-free scrap of acid etching electroplating hole Download PDFInfo
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- CN114828451A CN114828451A CN202210466056.0A CN202210466056A CN114828451A CN 114828451 A CN114828451 A CN 114828451A CN 202210466056 A CN202210466056 A CN 202210466056A CN 114828451 A CN114828451 A CN 114828451A
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- Prior art keywords
- copper
- hole
- reducing
- activation
- acid
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
Abstract
The invention relates to a method for reducing copper-free scrap of acid etching electroplated holes, which comprises horizontal PTH treatment, wherein the horizontal PTH treatment comprises the working procedures of neutralization, hole trimming, activation and reduction, and air suction baffles are respectively arranged at the four working procedures of neutralization, hole trimming, activation and reduction. The four processes of neutralization, hole finishing, activation and reduction are all provided with filter bags, the air suction baffle is arranged at the filter openings of the filter bags, and the shape of the air suction baffle is matched with that of the filter openings of the filter bags. The method for reducing the copper-free scrap of the acid etching electroplating hole has the advantages of no copper in the hole, high yield, high quality and the like.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing and processing, in particular to a method for reducing copper-free scrapping of acid etching electroplating holes.
Background
In the PCB manufacturing industry, the acid etching process comprises the procedures of neutralization, pore-forming, activation, reduction and copper deposition, bubbles are easy to appear during operation in the procedures of neutralization, pore-forming, activation and reduction, and the copper-free electroplating of the electroplating pores is common electroplating defects and can not be repaired, the electroplating pores are generally discarded, the reputation of a company product is seriously influenced by outflow, the competitiveness of an enterprise is greatly reduced, and therefore the reduction of the copper-free electroplating pores is of great significance to the development of the enterprise. In addition, the water washing process is arranged before the hole preparation, the reduction and the copper deposition, but the plate surface is dry after the water washing, and the subsequent liquid medicine hole filling difficulty is large.
Disclosure of Invention
The invention provides a method for reducing copper-free scrap of acid etching electroplating holes, which has the advantages of simplified process, high efficiency and low cost.
In order to achieve the above purpose, the following technical solutions are provided.
A method for reducing copper-free scrap of acid etching electroplated holes comprises horizontal PTH treatment, wherein the horizontal PTH treatment comprises the procedures of neutralization, hole trimming, activation and reduction, and air suction baffles are respectively arranged at the four procedures of neutralization, hole trimming, activation and reduction.
According to the method for reducing copper-free scrapping of the acid etching electroplating hole, the air suction baffles are respectively arranged at the four working procedures of neutralization, hole finishing, activation and reduction and are used for blocking external air, vortex of each working procedure is prevented from sucking air from the outside, bubbles in jet flow are reduced, the problem of the copper-free electroplating hole is effectively reduced, the product quality and the yield are improved, and scrapping is reduced.
Furthermore, the four working procedures of neutralization, hole finishing, activation and reduction are all provided with filter bags, the suction baffle is arranged at the filter openings of the filter bags, and the shape of the suction baffle is matched with that of the filter openings of the filter bags.
In the prior art, a vortex is formed at the position of a filter bag due to the fact that the liquid medicine is high in extraction speed, the vortex can absorb air to cause water jet flow containing bubbles, the bubbles are easy to enter holes to influence liquid medicine treatment in the holes, and the problem that the holes are free of copper occurs; the suction baffle is arranged at the position of the filter bag in each process, the shape of the suction baffle is matched with that of the filter opening of the filter bag, air is effectively prevented from entering the filter bag from the filter opening of the filter bag, bubbles in jet flow are effectively reduced, and the generation of non-porous copper is reduced or avoided.
Further, the suction baffle is attached to the filter opening of the filter bag. The suction baffle is attached to the filter opening of the filter bag in an attaching mode, and the operation is convenient and quick.
Further, the neutralization process adopts an acidic strong reducing agent as a neutralizing agent for removing excessive high-manganese acid salt remained on the board surface, in holes and/or at dead corners of hole walls, so that the board surface is kept clean.
And further, after neutralization, water washing and pore-forming are carried out, so that the plate surface and the pore wall with electronegativity are adjusted to be electropositive, and preparation is made for a subsequent activation process, wherein the water washing is used for washing away copper powder generated by grinding the plate, and the pore-forming is used for adjusting the plate surface and the pore wall to be electropositive, so that preparation is made for subsequent activation and adsorption of palladium ions to form a uniform copper precipitation layer.
The activation step is carried out in an activation tank, and a tank solution in the activation tank contains a negatively charged palladium colloid, which is adsorbed by the positively charged surface after pore conditioning in the pore conditioning step and is collected on the pore wall to serve as a catalyst in the subsequent copper deposition step.
Further, before the activation process, a pre-dipping process is further included, in which a pre-dipping process is performed to manufacture an environment the same as that of the activation tank, so as to take away impurities and water on the plate surface, in this embodiment, the pre-dipping residence time is controlled within 2min, so as to prevent palladium in the activation tank from being polluted, and at the same time, take away water on the plate surface, so as to prevent the palladium tank from being hydrolyzed when encountering water.
Furthermore, an ACC19 reducing agent is adopted in the reduction process, the ACC19 reducing agent is an HBF4 type accelerator, and the Sn4+ shell in the palladium colloid is stripped to expose the palladium in the colloid group, so that the subsequent reaction is facilitated, and the operation efficiency is improved.
And further, a copper deposition process is also included, wherein Cu2+ in the bath solution of the copper deposition process reacts with a reducing agent under the initiation and catalysis of palladium, and Cu2+ obtains electrons to be deposited on the hole wall to serve as a seed copper layer of subsequent copper electroplating.
Furthermore, wetting devices are respectively arranged before the hole-shaping, reducing and copper-depositing processes, in the embodiment, the wetting devices are spraying water-dripping devices, in the prior art, when the board enters the hole-shaping, reducing or copper-depositing processes after being washed, the board surface is dry after being washed, and the holes are wetted in advance by the wetting devices before the board enters the hole-shaping, reducing or copper-depositing processes due to the arrangement of the wetting devices, so that the problem that subsequent liquid medicine is difficult to fill the holes is effectively solved, and the liquid medicine can easily enter the holes to be treated.
Compared with the prior art, the method for reducing copper-free scrap of the acid etching electroplating hole has the following beneficial effects:
the suction baffle is arranged at the position of the filter bag in each process, the shape of the suction baffle is matched with that of the filter opening of the filter bag, air is effectively prevented from entering the filter bag from the filter opening of the filter bag, bubbles in jet flow are effectively reduced, and the generation of non-porous copper is reduced or avoided.
According to the invention, the arrangement of the wetting devices is respectively arranged before the hole-shaping, reducing and copper-depositing processes, so that the holes are wetted in advance by the wetting devices before the plate enters the hole-shaping, reducing or copper-depositing processes, the problem of difficulty in subsequent liquid medicine filling is effectively reduced, the liquid medicine can easily enter the holes for hole treatment, and the product quality is effectively improved.
Detailed Description
The method of reducing copper-free scrap for acid-etched plated holes of the present invention will be described in further detail with reference to specific examples.
In one non-limiting embodiment of the present invention, a method of reducing copper-free scrap in acid-etched plated holes includes horizontal PTH processing including board insertion → board grinding → water washing → ultrasonic water washing → puffing → water washing → desmearing → water washing → pre-neutralization → water washing → whole hole → water washing → micro-etching → water washing → pre-soaking → activation → water washing → copper deposition → drying → board removal. Wherein, four processes of neutralization, hole finishing, activation and reduction are respectively provided with a suction baffle. According to the method for reducing copper-free scrap of the acid etching electroplating hole, the air suction baffles are respectively arranged at the four working procedures of neutralization, hole finishing, activation and reduction and are used for blocking external air, vortex of each working procedure is prevented from sucking air from the outside, bubbles in jet flow are reduced, the problem of the copper-free hole is effectively reduced, and the quality and the yield of products are improved. The board grinding process is used for removing burrs and burrs formed in the drilling process; the water washing procedure is used for washing away copper powder generated by the grinding plate; the ultrasonic water washing procedure is to use ultrasonic waves to enhance the effect of water through the small holes and clean powdery impurities in the holes; the bulking procedure is used for drilling holes in the electroplating process, more colloid residues are remained in the drilled holes, and the bulking procedure achieves the purpose of loosening the colloid residues through a solvent; a step of removing the colloid residues, which is to remove the bulked colloid residues by using permanganate and avoid the colloid which influences the copper deposition effect remaining on the hole wall; and a pre-neutralization/neutralization process, wherein excessive permanganate remained in the board surface, the holes and dead corners is removed, so that the board surface is kept clean. A pore-forming step, in which the plate surface and the pore wall with electronegativity after the treatment are adjusted to be electropositive, so as to prepare for subsequent activation and adsorption of palladium ions to form a uniform copper deposition layer; and a microetching process, namely forming a micro-rough surface on the plate surface, enhancing the binding force of the copper precipitation layer and the copper base layer, and avoiding the separation of the copper layer in a high-temperature environment in the assembling process. The pre-dipping process is to manufacture an environment the same as that of the activation groove, take away other impurities on the plate surface, prevent the impurities from polluting the expensive activation palladium groove, and simultaneously take away water on the plate surface, so as to prevent the palladium groove from being hydrolyzed when meeting water; an activation procedure, wherein the bath solution contains electronegative palladium colloid which is adsorbed by the electropositive surface after pore preparation and is gathered on the pore wall to be used as a catalyst in the subsequent copper precipitation reaction; a reduction process, namely stripping the Sn4+ shell in the palladium colloid to expose the palladium in the colloid group so as to facilitate subsequent reaction; copper deposition: under the initiation and catalysis of palladium, Cu2+ in the bath solution reacts with a reducing agent, and Cu2+ obtains electrons to be deposited on the hole wall to be used as a seed copper layer for subsequent copper electroplating.
In one non-limiting embodiment of the invention, the four procedures of neutralization, hole finishing, activation and reduction are all provided with filter bags, the suction baffle is arranged at the filter openings of the filter bags, and the shape of the suction baffle is matched with that of the filter openings of the filter bags. In the prior art, a vortex is formed at the position of a filter bag due to the fact that the liquid medicine is high in extraction speed, the vortex can absorb air to cause water jet flow containing bubbles, the bubbles are easy to enter holes to influence liquid medicine treatment in the holes, and the problem that the holes are free of copper occurs; the suction baffle is arranged at the position of the filter bag in each process, the shape of the suction baffle is matched with that of the filter opening of the filter bag, air is effectively prevented from entering the filter bag from the filter opening of the filter bag, bubbles in jet flow are effectively reduced, and the generation of non-porous copper is reduced or avoided.
In a non-limiting embodiment of the invention, the suction baffle is attached to the filter bag at the mouth of the filter bag. The suction baffle is attached to the filter opening of the filter bag in an attaching mode, and the operation is convenient and quick.
In one non-limiting embodiment of the present invention, the neutralization step uses an acidic strong reducing agent as a neutralizing agent to remove excess high-manganese acid salt remaining on the board surface, in the holes and/or at the dead corners of the hole walls, so as to keep the board surface clean.
In a non-limiting embodiment of the present invention, after neutralization, water washing and pore-forming are performed to adjust the surface and the walls of the pores with electronegativity to electropositivity, so as to prepare for the subsequent activation process, wherein the water washing is used to wash away copper powder generated by grinding the plates, and the pore-forming is performed to adjust the surface and the walls of the pores to electropositivity, so as to prepare for the subsequent activation and adsorption of palladium ions to form a uniform copper deposition layer.
In one non-limiting embodiment of the present invention, the activation step is performed in an activation tank, and a tank solution in the activation tank contains an electronegative palladium colloid, which is adsorbed on an electropositive surface after pore conditioning in the pore conditioning step and is collected on a pore wall to serve as a catalyst in a subsequent copper deposition step.
In a non-limiting embodiment of the present invention, before the activation process, a pre-dipping process is further included, where the pre-dipping process is to create an environment the same as that of the activation tank, and is used to take away impurities and water on the board surface, in this embodiment, the pre-dipping residence time is controlled within 2min, so as to prevent palladium in the activation tank from being contaminated, and at the same time, to take away water on the board surface, so as to prevent the palladium tank from being hydrolyzed when encountering water. When the plate loading machine or the plate loading manipulator or other equipment is abnormal in production, VCP running is suspended, thin copper deposited in plate holes of the pre-soaking tank is easily bitten by sulfuric acid solution, and a larger hole has no copper risk after more than two minutes. If the plate is not processed in time and the presoaking groove stays for more than two minutes, the plating plate is added at the back. The presoaking residence time is controlled within 2min, and the problem of adding the plating plate is effectively solved.
In a non-limiting embodiment of the present invention, the reducing step uses an ACC19 reducing agent, and the ACC19 reducing agent is an HBF4 type accelerator, to strip the Sn4+ shell from the palladium colloid, exposing the palladium in the colloid group, so as to facilitate the subsequent reaction and improve the operation efficiency.
In a non-limiting embodiment of the invention, the method further comprises a copper deposition process, wherein the Cu2+ in the bath solution of the copper deposition process reacts with a reducing agent under the initiation and catalysis of palladium, and Cu2+ obtains electrons to be deposited on the hole wall to serve as a seed copper layer of the subsequent copper electroplating.
According to a non-limiting embodiment of the invention, wetting devices are respectively arranged before the hole-shaping, reducing and copper-depositing processes, in the embodiment, the wetting devices are spray water dripping devices, in the prior art, when a board enters the hole-shaping, reducing or copper-depositing processes after being washed, the board surface is dry after being washed, and due to the arrangement of the wetting devices, the holes are pre-wetted by the wetting devices before the board enters the hole-shaping, reducing or copper-depositing processes, so that the problem of difficulty in subsequent liquid medicine hole filling is effectively reduced, and liquid medicine can easily enter the holes for hole treatment.
According to the method for reducing copper-free scrap of the acid etching electroplating holes, the suction baffle is arranged at the position of the filter bag in each process, the shape of the suction baffle is matched with that of the filter opening of the filter bag, air is effectively prevented from entering the filter bag from the filter opening of the filter bag, bubbles in jet flow are effectively reduced, and generation of copper without holes is reduced or avoided. According to the invention, the arrangement of the wetting devices is respectively arranged before the hole-shaping, reducing and copper-depositing processes, so that the holes are wetted in advance by the wetting devices before the plate enters the hole-shaping, reducing or copper-depositing processes, the problem of difficulty in subsequent liquid medicine filling is effectively reduced, the liquid medicine can easily enter the holes for hole treatment, and the product quality is effectively improved.
The method for reducing copper-free scrap of the acid etching electroplated hole has the advantages that the maintenance frequency of main procedures of the method is about once per week for replacing liquid medicines for whole hole, reduction, pre-immersion and neutralization, the cylinder is reversed every week for dissolving copper, the cylinder is reversed every 2 weeks for removing glue, and the liquid medicine for bulking glue removing procedure is replaced 1 time per month.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (10)
1. A method of reducing copper-free scrap for acid-etched plated holes comprising a horizontal PTH treatment comprising neutralization, hole conditioning, activation, and reduction processes, wherein: and the four working procedures of neutralization, hole finishing, activation and reduction are respectively provided with a gas suction baffle.
2. The method for reducing the copper-free scrap rate of the acid etching electroplated hole as claimed in claim 1, wherein a filter bag is arranged in each of the four procedures of neutralization, hole finishing, activation and reduction, and the suction baffle is arranged at the filter opening of the filter bag and the shape of the suction baffle is matched with the shape of the filter opening of the filter bag.
3. The method of reducing acid etch plated hole copper scrap according to claim 2 wherein said suction baffle is attached to the filter opening of the filter bag.
4. The method for reducing copper-free scrap of acid-etched electroplated holes as claimed in claim 2, wherein said neutralization step uses strong acid reducing agent as neutralizing agent for removing excess high-manganese acid salt remained on the surface of the plate, in the holes and/or at the dead corners of the hole walls.
5. The method for reducing copper-free scrap in acid-etched plated holes according to claim 3, wherein the plate surface and the hole wall with electronegativity are adjusted to electropositivity by water washing and hole finishing after neutralization in preparation for the subsequent activation process.
6. The method for reducing the copper-free scrap rate of the acid etching electroplated hole according to claim 4, wherein the activation process is carried out in an activation tank, and a tank solution of the activation tank contains electronegative palladium colloid which is adsorbed by the electropositive surface after the hole preparation process and is gathered on the hole wall to be used as a catalyst for the subsequent copper deposition process.
7. The method for reducing copper-free scrap of acid-etched electroplated holes as claimed in claim 5, wherein the activation step is preceded by a pre-dipping step, wherein the pre-dipping step is to create an environment similar to that of the activation tank for carrying away impurities and water on the surface of the plate and preventing palladium in the activation tank from being polluted.
8. The method for reducing the copper-free scrap rate of the acid etching electroplated hole according to claim 6, wherein the reducing process adopts an ACC19 reducing agent, the ACC19 reducing agent is an HBF4 type accelerator, and the Sn4+ shell in palladium colloid is stripped to expose the palladium in the colloid group.
9. The method for reducing the copper-free scrap rate of the acid etching electroplated hole as claimed in any one of claims 1 to 8, further comprising a copper deposition process, wherein Cu2+ in the bath solution of the copper deposition process reacts with a reducing agent under the initiation and catalysis of palladium, and Cu2+ obtains electrons to be deposited on the hole wall as a seed copper layer of the subsequent electroplated copper.
10. The method for reducing the copper-free scrap rate of the acid-etched electroplated hole according to claim 9, wherein a wetting device is respectively arranged before the steps of hole preparation, reduction and copper deposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466056.0A CN114828451A (en) | 2022-04-29 | 2022-04-29 | Method for reducing copper-free scrap of acid etching electroplating hole |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466056.0A CN114828451A (en) | 2022-04-29 | 2022-04-29 | Method for reducing copper-free scrap of acid etching electroplating hole |
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| Publication Number | Publication Date |
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| CN114828451A true CN114828451A (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210466056.0A Pending CN114828451A (en) | 2022-04-29 | 2022-04-29 | Method for reducing copper-free scrap of acid etching electroplating hole |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102196676A (en) * | 2010-03-08 | 2011-09-21 | 株式会社电装 | Manufacturing method of multilayer circuit substrate, conductive material filling device and use method thereof |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN105695964A (en) * | 2014-11-28 | 2016-06-22 | 重庆基石机械有限公司 | Copper deposition process |
| CN108697008A (en) * | 2018-07-27 | 2018-10-23 | 江西景旺精密电路有限公司 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
| CN110484900A (en) * | 2019-09-27 | 2019-11-22 | 广州皓悦新材料科技有限公司 | A kind of Novel horizontal electroless copper plating ionic palladium activating solution |
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN113784546A (en) * | 2021-09-30 | 2021-12-10 | 广州广合科技股份有限公司 | Manufacturing method of PCB and PCB |
-
2022
- 2022-04-29 CN CN202210466056.0A patent/CN114828451A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102196676A (en) * | 2010-03-08 | 2011-09-21 | 株式会社电装 | Manufacturing method of multilayer circuit substrate, conductive material filling device and use method thereof |
| CN104152875A (en) * | 2014-08-25 | 2014-11-19 | 志超科技（遂宁）有限公司 | PCB-PTH (Printed Circuit Board-Plated Through Hole) line hole conditioning and activation ultrasonic device and method |
| CN105695964A (en) * | 2014-11-28 | 2016-06-22 | 重庆基石机械有限公司 | Copper deposition process |
| CN108697008A (en) * | 2018-07-27 | 2018-10-23 | 江西景旺精密电路有限公司 | It is a kind of to prevent electro-plating method of the high aspect ratio PCB aperture without copper |
| CN109587968A (en) * | 2018-12-11 | 2019-04-05 | 深圳崇达多层线路板有限公司 | One kind preventing consent or the undesirable PCB production method of plated hole |
| CN110484900A (en) * | 2019-09-27 | 2019-11-22 | 广州皓悦新材料科技有限公司 | A kind of Novel horizontal electroless copper plating ionic palladium activating solution |
| CN111601461A (en) * | 2020-06-08 | 2020-08-28 | 大连崇达电路有限公司 | Improvement method for no copper of circuit board hole |
| CN113784546A (en) * | 2021-09-30 | 2021-12-10 | 广州广合科技股份有限公司 | Manufacturing method of PCB and PCB |
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