CN108601243A - A kind of heavy copper method of pcb board - Google Patents
A kind of heavy copper method of pcb board Download PDFInfo
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- CN108601243A CN108601243A CN201810131825.5A CN201810131825A CN108601243A CN 108601243 A CN108601243 A CN 108601243A CN 201810131825 A CN201810131825 A CN 201810131825A CN 108601243 A CN108601243 A CN 108601243A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
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- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of heavy copper methods of pcb board, include the following steps：(1) alkalinity is deoiled：Configuration alkalinity removes fluid, and it is that 50 80 DEG C of alkalinity is gone in fluid, and soaks 5 7min of plate that pcb board, which is put into temperature, removes plate face greasy dirt, and hole wall is made to become positively charged lotus；(2) microetch：Micro-corrosion liquid is configured, pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soak 1 2min of plate, to be roughened copper coin face；(3) it activates：Activating solution is configured, pcb board is put into the activating solution that temperature is 20 40 DEG C, and soak 5 6min of plate；(4) electroless copper plating：The heavy copper liquid of configuration, pcb board is put into the heavy copper liquid that temperature is 25 35 DEG C, soaks 12 18min of plate, makes to deposit last layer chemical copper in hole wall.Pcb board provided by the invention sinks copper method, and last layer can be deposited in PCB aperture and completes uniform metallic copper, realizes that hole metallization reaches intercommunication between PCB layer.
Description
Technical field
The present invention relates to a kind of heavy copper methods of pcb board.
Background technology
Pcb board sinks copper, refers to the deposition last layer metallic copper in PCB aperture, realizes that hole metallization reaches intercommunication between PCB layer.
It is unreasonable due to each process design parameter in existing pcb board sinks process for copper, it has the following disadvantages：
(1) there is impurity to be stranded in plate face, be likely to result in circuit notch, the chemical copper of deposition is uneven；
(2) cleaning is not thorough, and remains oxide, and copper face roughness is inadequate；
(3) chemical copper reaction, covering are slow and uneven imperfect.
Invention content
Against the above deficiency, the purpose of the present invention is to provide a kind of heavy copper method of pcb board, upper one is deposited in PCB aperture
Layer completes uniform metallic copper, realizes that hole metallization reaches intercommunication between PCB layer.
Used technical solution is the present invention in order to achieve the above objectives：
A kind of heavy copper method of pcb board, includes the following steps：
(1) alkalinity is deoiled
(1.1) configuration alkalinity removes fluid
(1.1.1) is slowly added to slot allocation than the alkaline degreaser for 5-15% in cleaned oil removing groove；
(1.1.2) is added pure water and is uniformly mixed, and obtains alkalinity and removes fluid；
(1.2) pcb board is put into the alkalinity that temperature is 50-80 DEG C to go in fluid, and soaks plate 5-7min, removal plate face oil
Dirt, and hole wall is made to become positively charged lotus；
(2) microetch
(2.1) micro-corrosion liquid is configured
(2.1.1) is slowly added to the sulfuric acid of a concentration of 30-50ml/L, and the slot allocation ratio of sulfuric acid in cleaned microetch slot
For 35-45ml/L；
(2.1.2) is slowly added to the sodium peroxydisulfate of a concentration of 60-100G/L while stirring, and the slot allocation ratio of sulfuric acid is 75-
85G/L；
(2.1.3) plus pure water are uniformly mixed, and obtain micro-corrosion liquid；
(2.2) pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soaks plate 1-2min, to be roughened copper coin face；
(3) it activates
(3.1) activating solution is configured
Slot allocation is added than the pure water for 85-95% in (3.1.1) in cleaned activated bath；
(3.1.2) is slowly added to slot allocation than the palladium activator for 2-4% while stirring；
(3.1.3) is slowly added to slot allocation than the pre dip salt for 210-230g/L while stirring；
(3.1.4) is slowly added to slot allocation than the HCL for 4-6% while stirring；
(3.1.5) is uniformly mixed, and obtains activating solution；
(3.2) pcb board is put into the activating solution that temperature is 20-40 DEG C, and soaks plate 5-6min；
(4) electroless copper plating
(4.1) heavy copper liquid is configured
Slot allocation is added than the pure water for 70-80% in (4.1.1) in cleaned heavy copper slot；
The copper solution of a concentration of 1.5-2.5g/L of Cu2+ is added in (4.1.2), and its slot allocation ratio is 5-9%, opens air and stirs
Mixing makes liquid obtain slight stirring；
(4.1.3) is slowly added to the NaOH solution of a concentration of 8-13g/L, and its slot allocation ratio is 5- under slight stirring
9%, air stirring is uniformly mixed, and obtains heavy copper liquid；
(4.2) pcb board is put into the heavy copper liquid that temperature is 25-35 DEG C, soaks plate 12-18min, make to deposit upper one in hole wall
Layer chemical copper.
As a further improvement on the present invention, further include accelerating step between the step (3) and step (4)：
A) slot allocation is slowly added to than the accelerator for 8-12% in cleaned acceleration slot；
B) pcb board is put into the acceleration slot that temperature is room temperature, and soaks plate 3-5min.
As a further improvement on the present invention, before the step (3) further include preimpregnation step：
A, prepreg solution is configured
A.1 120-180L pure water, is added in cleaned pre- immersion trough；
A.2 it, is slowly added to the pre dip salt that slot allocation amount is 180-220g/L while stirring；
A.3 it, is slowly added to the AR hydrochloric acid that slot allocation amount is 4-6% while stirring；
A.4 it, is uniformly mixed, obtains prepreg solution；
B, pcb board is put into the prepreg solution that temperature is room temperature, and soaks plate 1-2min.
As a further improvement on the present invention, after the step (1), step (2), step (3) and step (4), respectively
Carry out double water-washing steps：Pcb board is put into water washing cylinder leaching plate 30s-1min, and opens inflating stirring, while on being swung left and right
Lower swing grillage, in favor of remaining liquid medicine in wash clean pcb board surface and hole.
As a further improvement on the present invention, the step (4.1) further includes heavy copper liquid activated carbon processing step：
A) heavy copper liquid is extracted into treatment trough, temperature is raised to 35-45 DEG C and kept；
B) hydrogen peroxide is added in the ratio of 4-6ml/L into solution under air stirring, covers treatment trough, is sufficiently stirred 2-
5h；
C) temperature is raised to 55-65 DEG C, continues to stir 2-3h, is then shut off heater；
D) active powdered carbon is added in the ratio of 4.5-5.5g/L into solution, covers treatment trough；
E) continue to stir 1.5-2.5h, be then shut off stirring, the activated carbon in solution is allowed to settle；
F) it waits for that activated carbon settles 8-10h, solution is withdrawn into heavy copper slot by double-filtration, first order filtering needs to add
The drainage powder of about 4-65kg is poured into tap water, is stirred evenly by drainage powder 4-6kg, clear to water quality with filter circulating filtration
Clear transparent, drainage powder is attracted on filtering cotton core.
Beneficial effects of the present invention are：
(1) it is deoiled process by alkalinity, has effectively removed plate face greasy dirt, and there is whole hole effect, hole wall is made to become positively charged lotus
To deposit one layer of uniform chemical copper；
(2) by microetch process, copper surface, removal plate face oxidation are fully and completely cleaned, and copper face is made to become more thick
It is rough, enhance heavy copper adhesive force；
(3) by activation procedure, so that hole wall and plate face is inhaled the catalyst that one layer of uniform Metal Palladium is reacted as chemical copper, carry
The speed of high electroless copper deposition, while completely uniformly being covered conducive to chemical copper；
(4) by electroless copper plating process, hole wall is made to deposit the uniform chemical copper of last layer, is conducive to plating and thickeies hole copper；
(5) increase between activation and electroless copper plating process and accelerate process, fast and effectively tin shell can be peeled away, made
Metal Palladium exposes, and has catalytic, so that chemical copper uniformly deposits；
(6) increase preimpregnation process before activation procedure, it can be ensured that hole wall is adjusted by uniform wet and charge, so as to more preferable
Absorption colloid palladium, prevent the pollution to active cylinder, active cylinder liquid medicine kept to stablize relatively；
(7) by heavy copper liquid activated carbon treatment process, thoroughly activated carbon processing can be carried out quickly to heavy copper liquid, so that heavy copper liquid
It keeps its performance not contaminated, ensures being normally carried out for heavy copper.
Above-mentioned is the general introduction of inventive technique scheme, and below in conjunction with specific implementation mode, the present invention will be further described.
Specific implementation mode
Further to illustrate the present invention to reach the technological means and effect that predetermined purpose is taken, below in conjunction with preferable
The specific implementation mode of the present invention is described in detail in embodiment.
Embodiment one：
The present embodiment provides a kind of heavy copper methods of pcb board, include the following steps：
(1) alkalinity is deoiled
(1.1) configuration alkalinity removes fluid
(1.1.1) is slowly added to slot allocation than the alkaline degreaser for 5% in cleaned oil removing groove；
(1.1.2) is added pure water and is uniformly mixed, and obtains alkalinity and removes fluid；
(1.2) pcb board is put into the alkalinity that temperature is 50 DEG C to go in fluid, and soaks plate 5min, remove plate face greasy dirt, and make
Hole wall becomes positively charged lotus；
(2) microetch
(2.1) micro-corrosion liquid is configured
(2.1.1) is slowly added to the sulfuric acid of a concentration of 30ml/L in cleaned microetch slot, and the slot allocation ratio of sulfuric acid is
35ml/L；
(2.1.2) is slowly added to the sodium peroxydisulfate of a concentration of 60G/L while stirring, and the slot allocation ratio of sulfuric acid is 75G/L；
(2.1.3) plus pure water are uniformly mixed, and obtain micro-corrosion liquid；
(2.2) pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soaks plate 1min, to be roughened copper coin face；
(3) it activates
(3.1) activating solution is configured
Slot allocation is added than the pure water for 85% in (3.1.1) in cleaned activated bath；
(3.1.2) is slowly added to slot allocation than the palladium activator for 2% while stirring；
(3.1.3) is slowly added to slot allocation than the pre dip salt for 210g/L while stirring；
(3.1.4) is slowly added to slot allocation than the HCL for 4% while stirring；
(3.1.5) is uniformly mixed, and obtains activating solution；
(3.2) pcb board is put into the activating solution that temperature is 20 DEG C, and soaks plate 5min；
(4) electroless copper plating
(4.1) heavy copper liquid is configured
Slot allocation is added than the pure water for 70% in (4.1.1) in cleaned heavy copper slot；
Cu is added in (4.1.2)2+The copper solution of a concentration of 1.5g/L, and its slot allocation ratio is 5%, opening air stirring makes liquid
Obtain slight stirring；
(4.1.3) is slowly added to the NaOH solution of a concentration of 8g/L, and its slot allocation ratio is 5% under slight stirring, empty
Gas agitating is uniformly mixed, and obtains heavy copper liquid；
(4.2) pcb board is put into the heavy copper liquid that temperature is 25 DEG C, soaks plate 12min, made in hole wall deposition last layer chemistry
Copper.
In the step (1), step (2), step (3) with after step (4), double water-washing steps are carried out respectively：Pcb board is put
To leaching plate 30s in water washing cylinder, and inflating stirring is opened, while being swung left and right and swinging up and down grillage, in favor of wash clean pcb board table
Face and remaining liquid medicine in hole.
Embodiment two：
The present embodiment provides a kind of heavy copper methods of pcb board, include the following steps：
(1) alkalinity is deoiled
(1.1) configuration alkalinity removes fluid
(1.1.1) is slowly added to slot allocation than the alkaline degreaser for 15% in cleaned oil removing groove；
(1.1.2) is added pure water and is uniformly mixed, and obtains alkalinity and removes fluid；
(1.2) pcb board is put into the alkalinity that temperature is 80 DEG C to go in fluid, and soaks plate 7min, remove plate face greasy dirt, and make
Hole wall becomes positively charged lotus；
(2) microetch
(2.1) micro-corrosion liquid is configured
(2.1.1) is slowly added to the sulfuric acid of a concentration of 50ml/L in cleaned microetch slot, and the slot allocation ratio of sulfuric acid is
45ml/L；
(2.1.2) is slowly added to the sodium peroxydisulfate of a concentration of 100G/L while stirring, and the slot allocation ratio of sulfuric acid is 85G/L；
(2.1.3) plus pure water are uniformly mixed, and obtain micro-corrosion liquid；
(2.2) pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soaks plate 2min, to be roughened copper coin face；
(3) it activates
(3.1) activating solution is configured
Slot allocation is added than the pure water for 95% in (3.1.1) in cleaned activated bath；
(3.1.2) is slowly added to slot allocation than the palladium activator for 4% while stirring；
(3.1.3) is slowly added to slot allocation than the pre dip salt for 230g/L while stirring；
(3.1.4) is slowly added to slot allocation than the HCL for 6% while stirring；
(3.1.5) is uniformly mixed, and obtains activating solution；
(3.2) pcb board is put into the activating solution that temperature is 40 DEG C, and soaks plate 6min；
(4) electroless copper plating
(4.1) heavy copper liquid is configured
Slot allocation is added than the pure water for 80% in (4.1.1) in cleaned heavy copper slot；
Cu is added in (4.1.2)2+The copper solution of a concentration of 2.5g/L, and its slot allocation ratio is 9%, opening air stirring makes liquid
Obtain slight stirring；
(4.1.3) is slowly added to the NaOH solution of a concentration of 13g/L, and its slot allocation ratio is 9% under slight stirring,
Air stirring is uniformly mixed, and obtains heavy copper liquid；
(4.2) pcb board is put into the heavy copper liquid that temperature is 35 DEG C, soaks plate 18min, made in hole wall deposition last layer chemistry
Copper.
In the step (1), step (2), step (3) with after step (4), double water-washing steps are carried out respectively：Pcb board is put
To leaching plate 1min in water washing cylinder, and inflating stirring is opened, while being swung left and right and swinging up and down grillage, in favor of wash clean pcb board
Surface and remaining liquid medicine in hole.
Embodiment three：
The present embodiment provides a kind of heavy copper methods of pcb board, include the following steps：
(1) alkalinity is deoiled
(1.1) configuration alkalinity removes fluid
(1.1.1) is slowly added to slot allocation than the alkaline degreaser for 10% in cleaned oil removing groove；
(1.1.2) is added pure water and is uniformly mixed, and obtains alkalinity and removes fluid；
(1.2) pcb board is put into the alkalinity that temperature is 65 DEG C to go in fluid, and soaks plate 6min, remove plate face greasy dirt, and make
Hole wall becomes positively charged lotus；
(2) microetch
(2.1) micro-corrosion liquid is configured
(2.1.1) is slowly added to the sulfuric acid of a concentration of 40ml/L in cleaned microetch slot, and the slot allocation ratio of sulfuric acid is
40ml/L；
(2.1.2) is slowly added to the sodium peroxydisulfate of a concentration of 80G/L while stirring, and the slot allocation ratio of sulfuric acid is 80G/L；
(2.1.3) plus pure water are uniformly mixed, and obtain micro-corrosion liquid；
(2.2) pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soaks plate 1.5min, to be roughened copper coin face；
(3) it activates
(3.1) activating solution is configured
Slot allocation is added than the pure water for 90% in (3.1.1) in cleaned activated bath；
(3.1.2) is slowly added to slot allocation than the palladium activator for 34% while stirring；
(3.1.3) is slowly added to slot allocation than the pre dip salt for 220/L while stirring；
(3.1.4) is slowly added to slot allocation than the HCL for 5% while stirring；
(3.1.5) is uniformly mixed, and obtains activating solution；
(3.2) pcb board is put into the activating solution that temperature is 30 DEG C, and soaks plate 5.5min；
(4) electroless copper plating
(4.1) heavy copper liquid is configured
Slot allocation is added than the pure water for 75% in (4.1.1) in cleaned heavy copper slot；
Cu is added in (4.1.2)2+The copper solution of a concentration of 2g/L, and its slot allocation ratio is 7%, opening air stirring makes liquid obtain
To slight stirring；
(4.1.3) is slowly added to the NaOH solution of a concentration of 10g/L, and its slot allocation ratio is 7% under slight stirring,
Air stirring is uniformly mixed, and obtains heavy copper liquid；
(4.2) pcb board is put into the heavy copper liquid that temperature is 30 DEG C, soaks plate 15min, made in hole wall deposition last layer chemistry
Copper.
In the step (1), step (2), step (3) with after step (4), double water-washing steps are carried out respectively：Pcb board is put
To leaching plate 45s in water washing cylinder, and inflating stirring is opened, while being swung left and right and swinging up and down grillage, in favor of wash clean pcb board table
Face and remaining liquid medicine in hole.
The heavy process for copper of pcb board provided by above-described embodiment one to embodiment three, passes through the parameters to each process
It is defined, improves feasibility, the practicability of entire technique, finally obtain high quality of products.
Deoiled process by alkalinity, effectively removed plate face greasy dirt, and there is whole hole effect, make hole wall become positively charged lotus so as to
Deposit one layer of uniform chemical copper.
By microetch process, copper surface, removal plate face oxidation are fully and completely cleaned, and copper face is made to become more coarse,
The heavy copper adhesive force of enhancing.
By activation procedure, hole wall and plate face is made to inhale the catalyst that one layer of uniform Metal Palladium is reacted as chemical copper, improved
The speed of electroless copper deposition, while completely uniformly being covered conducive to chemical copper.
By electroless copper plating process, hole wall is made to deposit the uniform chemical copper of last layer, is conducive to plating and thickeies hole copper.
Example IV：
The present embodiment and the main distinction of embodiment one to embodiment three are：
Further include accelerating step between the step (3) and step (4)：
A) slot allocation is slowly added to than the accelerator for 8% in cleaned acceleration slot；
B) pcb board is put into the acceleration slot that temperature is room temperature, and soaks plate 3min.
Embodiment five：
The main distinction of the present embodiment and example IV is：
Further include accelerating step between the step (3) and step (4)：
A) slot allocation is slowly added to than the accelerator for 12% in cleaned acceleration slot；
B) pcb board is put into the acceleration slot that temperature is room temperature, and soaks plate 5min.
Embodiment six：
The main distinction of the present embodiment and example IV is：
Further include accelerating step between the step (3) and step (4)：
A) slot allocation is slowly added to than the accelerator for 10% in cleaned acceleration slot；
B) pcb board is put into the acceleration slot that temperature is room temperature, and soaks plate 4min.
The acceleration technique provided by above-described embodiment four to embodiment six can fast and effectively peel away tin shell, make
Metal Palladium exposes, and has catalytic, so that chemical copper uniformly deposits.
Embodiment seven：
The present embodiment and the main distinction of embodiment one to embodiment six are：
Further include preimpregnation step before the step (3)：
A, prepreg solution is configured
A.1 120L pure water, is added in cleaned pre- immersion trough；
A.2 it, is slowly added to the pre dip salt that slot allocation amount is 180g/L while stirring；
A.3 it, is slowly added to the AR hydrochloric acid that slot allocation amount is 4% while stirring；
A.4 it, is uniformly mixed, obtains prepreg solution；
B, pcb board is put into the prepreg solution that temperature is room temperature, and soaks plate 1min.
Embodiment eight：
The present embodiment and the main distinction of embodiment seven are：
Further include preimpregnation step before the step (3)：
A, prepreg solution is configured
A.1 180L pure water, is added in cleaned pre- immersion trough；
A.2 it, is slowly added to the pre dip salt that slot allocation amount is 220g/L while stirring；
A.3 it, is slowly added to the AR hydrochloric acid that slot allocation amount is 6% while stirring；
A.4 it, is uniformly mixed, obtains prepreg solution；
B, pcb board is put into the prepreg solution that temperature is room temperature, and soaks plate 2min.
Embodiment nine：
The present embodiment and the main distinction of embodiment seven are：
Further include preimpregnation step before the step (3)：
A, prepreg solution is configured
A.1 150L pure water, is added in cleaned pre- immersion trough；
A.2 it, is slowly added to the pre dip salt that slot allocation amount is 200g/L while stirring；
A.3 it, is slowly added to the AR hydrochloric acid that slot allocation amount is 5% while stirring；
A.4 it, is uniformly mixed, obtains prepreg solution；
B, pcb board is put into the prepreg solution that temperature is room temperature, and soaks plate 1.5min.
The preimpregnated process provided to embodiment nine by above-described embodiment seven, it can be ensured that hole wall is by uniform wet and charge tune
It is whole, preferably to adsorb colloid palladium, the pollution to active cylinder is prevented, active cylinder liquid medicine is kept to stablize relatively.
Embodiment ten：
The present embodiment and the main distinction of embodiment one to embodiment nine are：
The step (4.1) further includes heavy copper liquid activated carbon processing step：
A) heavy copper liquid is extracted into treatment trough, temperature is raised to 35 DEG C and kept；
B) hydrogen peroxide is added in the ratio of 4ml/L into solution under air stirring, covers treatment trough, is sufficiently stirred 2h；
C) temperature is raised to 55 DEG C, continues to stir 2h, is then shut off heater；
D) active powdered carbon is added in the ratio of 4.5g/L into solution, covers treatment trough；
E) continue to stir 1.5h, be then shut off stirring, the activated carbon in solution is allowed to settle；
F) it waits for that activated carbon settles 8h, solution is withdrawn into heavy copper slot by double-filtration, first order filtering, which need to be added, to be helped
Powder 4kg is filtered, the drainage powder of about 4kg is poured into tap water, is stirred evenly, it is as clear as crystal to water quality with filter circulating filtration,
Drainage powder is attracted on filtering cotton core.
Embodiment 11：
The present embodiment and the main distinction of embodiment ten are：
The step (4.1) further includes heavy copper liquid activated carbon processing step：
A) heavy copper liquid is extracted into treatment trough, temperature is raised to 45 DEG C and kept；
B) hydrogen peroxide is added in the ratio of 6ml/L into solution under air stirring, covers treatment trough, is sufficiently stirred 5h；
C) temperature is raised to 65 DEG C, continues to stir 3h, is then shut off heater；
D) active powdered carbon is added in the ratio of 5.5g/L into solution, covers treatment trough；
E) continue to stir 2.5h, be then shut off stirring, the activated carbon in solution is allowed to settle；
F) it waits for that activated carbon settles 10h, solution is withdrawn into heavy copper slot by double-filtration, first order filtering, which need to be added, to be helped
Powder 6kg is filtered, the drainage powder of about 6kg is poured into tap water, is stirred evenly, it is as clear as crystal to water quality with filter circulating filtration,
Drainage powder is attracted on filtering cotton core.
Embodiment 12：
The present embodiment and the main distinction of embodiment ten are：
The step (4.1) further includes heavy copper liquid activated carbon processing step：
A) heavy copper liquid is extracted into treatment trough, temperature is raised to 40 DEG C and kept；
B) hydrogen peroxide is added in the ratio of 5ml/L into solution under air stirring, covers treatment trough, is sufficiently stirred
3.5h；
C) temperature is raised to 60 DEG C, continues to stir 2.5h, is then shut off heater；
D) active powdered carbon is added in the ratio of 5.0g/L into solution, covers treatment trough；
E) continue to stir 2h, be then shut off stirring, the activated carbon in solution is allowed to settle；
F) it waits for that activated carbon settles 9h, solution is withdrawn into heavy copper slot by double-filtration, first order filtering, which need to be added, to be helped
Powder 5kg is filtered, the drainage powder of about 5kg is poured into tap water, is stirred evenly, it is as clear as crystal to water quality with filter circulating filtration,
Drainage powder is attracted on filtering cotton core.
By above-described embodiment ten to embodiment 12, thoroughly activated carbon processing is carried out quickly to heavy copper liquid, so that heavy copper liquid
It keeps its performance not contaminated, ensures being normally carried out for heavy copper.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore identical as the above embodiment of the present invention or approximate technical characteristic is used, and obtained other structures, the guarantor in the present invention
Within the scope of shield.
Claims (5)
1. a kind of pcb board sinks copper method, which is characterized in that include the following steps：
(1) alkalinity is deoiled
(1.1) configuration alkalinity removes fluid
(1.1.1) is slowly added to slot allocation than the alkaline degreaser for 5-15% in cleaned oil removing groove；
(1.1.2) is added pure water and is uniformly mixed, and obtains alkalinity and removes fluid；
(1.2) pcb board is put into the alkalinity that temperature is 50-80 DEG C to go in fluid, and soaks plate 5-7min, remove plate face greasy dirt, and
Hole wall is set to become positively charged lotus；
(2) microetch
(2.1) micro-corrosion liquid is configured
(2.1.1) is slowly added to the sulfuric acid of a concentration of 30-50ml/L in cleaned microetch slot, and the slot allocation ratio of sulfuric acid is
35-45ml/L；
(2.1.2) is slowly added to the sodium peroxydisulfate of a concentration of 60-100G/L while stirring, and the slot allocation ratio of sulfuric acid is 75-85G/
L；
(2.1.3) plus pure water are uniformly mixed, and obtain micro-corrosion liquid；
(2.2) pcb board is put into the micro-corrosion liquid that temperature is room temperature, and soaks plate 1-2min, to be roughened copper coin face；
(3) it activates
(3.1) activating solution is configured
Slot allocation is added than the pure water for 85-95% in (3.1.1) in cleaned activated bath；
(3.1.2) is slowly added to slot allocation than the palladium activator for 2-4% while stirring；
(3.1.3) is slowly added to slot allocation than the pre dip salt for 210-230g/L while stirring；
(3.1.4) is slowly added to slot allocation than the HCL for 4-6% while stirring；
(3.1.5) is uniformly mixed, and obtains activating solution；
(3.2) pcb board is put into the activating solution that temperature is 20-40 DEG C, and soaks plate 5-6min；
(4) electroless copper plating
(4.1) heavy copper liquid is configured
Slot allocation is added than the pure water for 70-80% in (4.1.1) in cleaned heavy copper slot；
Cu is added in (4.1.2)2+The copper solution of a concentration of 1.5-2.5g/L, and its slot allocation ratio is 5-9%, opening air stirring makes medicine
Liquid obtains slight stirring；
(4.1.3) is slowly added to the NaOH solution of a concentration of 8-13g/L, and its slot allocation ratio is 5-9% under slight stirring,
Air stirring is uniformly mixed, and obtains heavy copper liquid；
(4.2) pcb board is put into the heavy copper liquid that temperature is 25-35 DEG C, soaks plate 12-18min, make to deposit last layer in hole wall
Learn copper.
2. pcb board according to claim 1 sinks copper method, which is characterized in that between the step (3) and step (4)
It further include accelerating step：
A) slot allocation is slowly added to than the accelerator for 8-12% in cleaned acceleration slot；
B) pcb board is put into the acceleration slot that temperature is room temperature, and soaks plate 3-5min.
3. pcb board according to claim 1 sinks copper method, which is characterized in that before the step (3) further include preimpregnation
Step：
A, prepreg solution is configured
A.1 120-180L pure water, is added in cleaned pre- immersion trough；
A.2 it, is slowly added to the pre dip salt that slot allocation amount is 180-220g/L while stirring；
A.3 it, is slowly added to the AR hydrochloric acid that slot allocation amount is 4-6% while stirring；
A.4 it, is uniformly mixed, obtains prepreg solution；
B, pcb board is put into the prepreg solution that temperature is room temperature, and soaks plate 1-2min.
4. pcb board according to claim 1 sinks copper method, which is characterized in that in the step (1), step (2), step
(3) with after step (4), double water-washing steps are carried out respectively：Pcb board is put into leaching plate 30s-1min in water washing cylinder, and opens and inflates
Stirring, while being swung left and right and swinging up and down grillage, in favor of remaining liquid medicine in wash clean pcb board surface and hole.
5. pcb board according to claim 1 sinks copper method, which is characterized in that the step (4.1) further includes that heavy copper liquid is lived
Property charcoal processing step：
A) heavy copper liquid is extracted into treatment trough, temperature is raised to 35-45 DEG C and kept；
B) hydrogen peroxide is added in the ratio of 4-6ml/L into solution under air stirring, covers treatment trough, is sufficiently stirred 2-5h；
C) temperature is raised to 55-65 DEG C, continues to stir 2-3h, is then shut off heater；
D) active powdered carbon is added in the ratio of 4.5-5.5g/L into solution, covers treatment trough；
E) continue to stir 1.5-2.5h, be then shut off stirring, the activated carbon in solution is allowed to settle；
F) it waits for that activated carbon settles 8-10h, solution is withdrawn into heavy copper slot by double-filtration, first order filtering need to add drainage
The drainage powder of about 4-6kg is poured into tap water, is stirred evenly by powder 4-6kg, limpid to water quality with filter circulating filtration
Bright, drainage powder is attracted on filtering cotton core.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862710A (en) * | 2019-04-08 | 2019-06-07 | 四川锐宏电子科技有限公司 | A kind of pcb board thickness uniformly sinks process for copper and its device |
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
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| CN104519676A (en) * | 2013-09-26 | 2015-04-15 | 北大方正集团有限公司 | Method for improving copper precipitating and copper plating quality of PCB |
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| CN107592755A (en) * | 2017-09-07 | 2018-01-16 | 信丰文峰电子科技有限公司 | A kind of heavy copper method of the pcb board of high aspect ratio |
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| CN101284692A (en) * | 2007-04-12 | 2008-10-15 | 陈荣贤 | Treating method of washes of copper deposition in production process of printed circuit board |
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| CN109862710A (en) * | 2019-04-08 | 2019-06-07 | 四川锐宏电子科技有限公司 | A kind of pcb board thickness uniformly sinks process for copper and its device |
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
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Application publication date: 20180928 |