CN103108501A - Microwell plate chemical copper activating back scrubbing process and system thereof - Google Patents
Microwell plate chemical copper activating back scrubbing process and system thereof Download PDFInfo
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- CN103108501A CN103108501A CN 201310018549 CN201310018549A CN103108501A CN 103108501 A CN103108501 A CN 103108501A CN 201310018549 CN201310018549 CN 201310018549 CN 201310018549 A CN201310018549 A CN 201310018549A CN 103108501 A CN103108501 A CN 103108501A
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Abstract
The invention provides a microwell plate chemical copper activating back scrubbing process and a system of the microwell plate chemical copper activating back scrubbing process. The process includes the steps of microetching, first time wash, first time preimpregnation, activation, second time wash, copper deposition and second time preimpregnation. The microetching is used for increasing roughness of the surface of copper and ensuring combining force of a copper layer. The first time wash is used for washing remaining micro corrosion agent of a panel. The first time preimpregnation is used for activating the panel and hole wall. The activation is used for enabling the hole wall to adsorb a layer of metal which has catalytic ability and enabling the surface of the matrix to attach to a activation target. The second wash is used for washing remaining activation agent of the panel. The copper deposition is used for enabling non-conductive insulation hole to be transformed into an active conductive through hole under the action of copper ions in the activation of target reduction deposition on the hole wall. The second time preimpregnation is used for ensuring that the activation target is not solved. Due to the fact that the microwell plate chemical copper activating back scrubbing process and the system of the microwell plate chemical copper activating back scrubbing process are conducted, the activation target in a printed circuit board (PCB) is not solved, the risk of poor backlight is reduced, quality of products is improved, and production cost is reduced.
Description
Technical field
The present invention relates to a kind of pcb board technical field, relate in particular to a kind of microwell plate chemical copper activation back scrubbing technique and system thereof.
Background technology
PCB(Printed Circuit Board), Chinese is printed wiring board, is called for short printed board, is one of vitals of electronics industry.Every kind of electronic equipment almost littlely arrives greatly computer to electronic watch, calculator, communication electronic device, and military armament systems as long as the electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed board.
in the pcb board production and processing that through hole is arranged, it is exactly the hole metallization flow process that a key link is arranged, this process makes non-conductive insulated vias be converted into active conductive through hole, and the method for existing pcb board making hole conducting is PTH(electroless copper plating through hole) technique, its technological process is: copper → secondary countercurrent rinsing city's washing → blanking is washed → is sunk in material loading → bulk → secondary or three stage countercurrent rinsing → de-smears → recovery hot water wash → secondary countercurrent rinsing → neutralization/reduction → secondary countercurrent rinsing → whole hole/alkaline degreasing → secondary or the rinsing of three stage countercurrents → microetch alligatoring → secondary countercurrent rinsing → preimpregnation → activation → secondary countercurrent rinsing city washing → shortization → secondary countercurrent rinsing city.This complex process, production cycle is long, cost is high, and after overactivation, the activation target in the pcb board hole is easily dissolved in follow-up secondary countercurrent rinsing city's washing, causes pcb board bad problem backlight to occur, reduced the product yield of pcb board, for making the activation target not dissolved, activator concentration can increase, and the increase of activator concentration makes entreprise cost increase.
Chinese patent discloses a kind of application number: 201210332993.3, a kind of method and layer structure thereof that metal target layer is set in the conductive layer of printed circuit board (PCB), the steps include: at first insulated substrate to be covered copper, then carry out baking sheet, carry out afterwards Drilling operation, heavy copper operation, make circuit, the operating process of insulating barrier welding resistance obtains semi-finished product, at last the circuit pack of half-finished product plate body is sunk nickel successively, heavy target, the turmeric operation, when pcb board being sunk the copper operation, mainly to adopt chemical electroless plating copper mode to form the first coating after Drilling operation on Copper Foil, make both sides Copper Foil mutual conduction, to complete heavy copper operation, the heavy copper operating procedure of this kind adopts original heavy copper method, technique is simple, cost is high, and be unfavorable for the follow-up nickel that sinks, heavy target, the turmeric operation, the product defect rate is low.
Summary of the invention
The present invention is directed to problems of the prior art, be optimized on existing heavy process for copper basis, make the activation target in pcb board can not reduced bad risk backlight by water-soluble solution, improved product quality, reduced simultaneously production cost.
A kind of microwell plate chemical copper activation back scrubbing technique provided by the invention, order comprises the following steps:
Microetch: increase the roughness on copper surface, guarantee the adhesion of copper layer;
Once washing: the micro-etching agent that the clean plate face is residual;
A preimpregnation: activating plate face and hole wall;
Activation: make hole wall absorption one deck have the metal of catalytic capability, make the upper activation of the matrix surface absorption target through overactivation, described activator active ingredient is for containing Sn
2+, Pd
2+The solution of colloid ion;
Secondary washing: the activator that the clean plate face is residual;
Heavy copper: copper ion reduce deposition under the effect of activation target on hole wall, makes non-conductive insulated vias be converted into active conductive through hole;
Be provided with the not dissolved secondary preimpregnation step of protection activation target between described activation and secondary water-washing step, described secondary preimpregnation step adopts secondary presoak pre-impregnated sheet face, and described secondary presoak is similar to the activator composition.
As a kind of Optimization Technology, described secondary presoak acidity is 0.58 ~ 0.8N.
As a kind of Optimization Technology, the proportion of described secondary presoak is＞1.142.
Further optimize the technological parameter of secondary preimpregnation, described secondary presoak acidity is 0.65N.
Further optimize the technological parameter of secondary preimpregnation, the proportion of described secondary presoak is 2.
As a kind of Optimization Technology, described micro-etching speed is 20 ~ 40 Unich, and temperature is 25 ℃ ~ 30 ℃.
As a kind of Optimization Technology, a described preimpregnation acid content is 0.5 ~ 0.7N, and described activator proportion is 1.25 ~ 1.35g/cm3.
As a kind of Optimization Technology, the step before described microetch step is:
Expand: will bore dirty copper coin substrate resin and decompose effectively removal by expansion;
Whole hole/alkaline degreasing: remove the greasy dirt on hole wall and copper coin surface, make effective deposited copper.
Accordingly, the present invention also proposes a kind of microwell plate chemical copper activation back scrubbing system, it is characterized in that, comprising:
The microetch cylinder: pcb board enters in the microetch cylinder after expansion and whole hole/alkaline degreasing, and pcb board etches rough matsurface on the surface;
Water washing cylinder: the pcb board after microetch is entered in water washing cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder: the pcb board through a water washing cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes the upper activation of the matrix surface absorption target through overactivation;
Secondary preimpregnation cylinder: the pcb board after activated enters in secondary preimpregnation cylinder, and protection activation target is not by water-soluble solution in secondary preimpregnation cylinder;
The secondary water washing cylinder: pcb board is the residual activator of clear board face in the secondary water washing cylinder;
Heavy copper groove: for pcb board being sunk copper, make non-conductive insulated vias be converted into active conductive through hole.
Described microetch cylinder, a water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove connect successively.
Further, described microetch cylinder, water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, heavy copper groove top is provided with lifting appliance, and described lifting appliance stroke is the back scrubbing system length;
A described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity;
Described microetch cylinder is provided with for the temperature control meter of controlling temperature.
A kind of microwell plate chemical copper activation back scrubbing technique provided by the invention and system thereof, on original heavy process for copper, pcb board after activated is entered the secondary preimpregnation, make the activation target in the pcb board hole can dissolving in follow-up secondary washing, thereby reduced bad risk backlight, improved production panel products quality, improve greatly operating efficiency, reduced labour intensity, not soluble because of activation target in the hole simultaneously, can reduce the activator concentration in active cylinder, reduce production cost.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of microwell plate chemical copper activation back scrubbing process flow diagram provided by the invention;
Fig. 2 is a kind of microwell plate chemical copper activation back scrubbing system configuration schematic diagram provided by the invention.
Embodiment
The embodiment of the present invention is optimized on original heavy process for copper, make the pcb board preimpregnation again after overactivation, reduced bad risk backlight, improved production panel products quality, improve greatly operating efficiency, reduced labour intensity, not soluble because of activation target in the hole simultaneously, can reduce the activator concentration in active cylinder, reduce production cost.
Referring to Fig. 1, be a kind of microwell plate chemical copper activation back scrubbing process flow diagram provided by the invention.
A kind of microwell plate chemical copper activation back scrubbing technique that the present embodiment provides comprises:
Step 102, microetch: increase the roughness on copper surface, guarantee the adhesion of copper layer;
Step 106, the secondary preimpregnation: protection activation target is not dissolved;
Wherein, in step 102, controlling micro-etching speed is 20 ~ 40 Unich, and adopting temperature control meter temperature is 25 ℃ ~ 30 ℃;
Wherein, in step 104, a described preimpregnation acid content is 0.5 ~ 0.7N, and described activator proportion is 1.25 ~ 1.35g/cm3;
Wherein, in step 106, described secondary presoak acidity is 0.58 ~ 0.8N, and the proportion of described secondary presoak is＞1.142, and for reaching more desirable preimpregnation effect, the described secondary presoak acidity of stating is 0.65N, and the proportion of described secondary presoak is 2.
Further, in described step 104 and step 106, adopt the immersion type operation, with lifting appliance, pcb board all is immersed in preimpregnation cylinder and secondary preimpregnation cylinder, the described preimpregnation time is 2 ~ 3min, and the described secondary preimpregnation time is 4 ~ 5min.
Referring to Fig. 2, be a kind of microwell plate chemical copper activation back scrubbing system configuration schematic diagram provided by the invention, comprising:
Microetch cylinder 10:PCB plate enters in the microetch cylinder after expansion and whole hole/alkaline degreasing, and pcb board etches rough matsurface on the surface;
Water washing cylinder 11: the pcb board after microetch is entered in water washing cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder 12: the pcb board through a water washing cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder 13: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes the upper activation of the matrix surface absorption target through overactivation;
Secondary preimpregnation cylinder 14: the pcb board after activated enters in secondary preimpregnation cylinder, and protection activation target is not by water-soluble solution in secondary preimpregnation cylinder;
Secondary water washing cylinder 15:PCB plate residual activator of clear board face in the secondary water washing cylinder;
Heavy copper groove 16: for pcb board being sunk copper, make non-conductive insulated vias be converted into active conductive through hole.
Described microetch cylinder 10, a water washing cylinder 11, water washing cylinder 12, active cylinder 13, secondary preimpregnation cylinder 14, secondary water washing cylinder 15, a heavy copper groove 16 connect successively.
This back scrubbing system is provided with lifting appliance 17 simultaneously, be used for alleviating artificial intensity, adopt the automated machine complete operation, described lifting appliance 17 is arranged on described microetch cylinder 10, water washing cylinder 11, water washing cylinder 12, active cylinder 13, secondary preimpregnation cylinder 14, secondary water washing cylinder 15, heavy copper groove 16 tops, and described lifting appliance 17 strokes are consistent with described back scrubbing system length.
In order better to control technological parameter, a described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity, operating personnel can in time adjust according to the numerical value on the PH meter acidity of preimpregnation cylinder and secondary preimpregnation cylinder, described microetch cylinder is provided with for the temperature control meter of controlling temperature, makes the microetch temperature be controlled in rational parameter area.
It is as follows that microwell plate chemical copper provided by the invention activation back scrubbing technique and existing heavy process for copper are compared its each side experimental data:
One, production cost contrast
1, existing heavy process for copper production cost
2, microwell plate chemical copper activation back scrubbing explained hereafter cost calculation
3, cost contrast
Two, produce quality estimating:
1, adopt existing heavy process for copper production: test plate (panel) PR03588 model, 100 blocks of plates detect yield through having produced middle survey, and fraction defective is 76%, and major defect is Kong Wutong;
2, adopt microwell plate chemical copper activation back scrubbing explained hereafter: test plate (panel) PR03588 model, 100 blocks of plates detect yield through having produced middle survey, and fraction defective is 98%.
In summary, a kind of microwell plate chemical copper activation back scrubbing technique meets the requirements fully by its working condition on probation and quality result, and atresia is without quality abnormals such as copper.Adopt a kind of microwell plate chemical copper activation back scrubbing technology generations to save 0.229 yuan/FT2 for existing heavy process for copper production cost; Cost 21%, as with April output calculate, can save per month 52670 yuan.Through adopting different schemes to verify, adopt a kind of microwell plate chemical copper activation back scrubbing explained hereafter quality all can reach requirement.Therefore, adopt a kind of microwell plate chemical copper activation back scrubbing technology generations to save 0.229 yuan/FT2 for existing heavy process for copper production cost, and the production quality is improved.
One of ordinary skill in the art will appreciate that all or part of flow process that realizes in above-described embodiment method, to come the relevant hardware of instruction to complete by computer program, described program can be stored in a computer read/write memory medium, this program can comprise the flow process as the embodiment of above-mentioned each side method when carrying out.Wherein, described storage medium can be magnetic disc, CD, read-only store-memory body (Read-Only Memory, ROM) or random store-memory body (Random Access Memory, RAM) etc.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a microwell plate chemical copper activates back scrubbing technique, and order comprises the following steps:
Microetch: increase the roughness on copper surface, guarantee the adhesion of copper layer;
Once washing: the micro-etching agent that the clean plate face is residual;
A preimpregnation: activating plate face and hole wall;
Activation: make hole wall absorption one deck have the metal of catalytic capability, make the upper activation of the matrix surface absorption target through overactivation, described activator active ingredient is for containing Sn
2+, Pd
2+The solution of colloid ion;
Secondary washing: the activator that the clean plate face is residual;
Heavy copper: copper ion reduce deposition under the effect of activation target on hole wall, makes non-conductive insulated vias be converted into active conductive through hole;
It is characterized in that, be provided with the not dissolved secondary preimpregnation step of protection activation target between described activation and secondary water-washing step, described secondary preimpregnation step adopts secondary presoak pre-impregnated sheet face, and described secondary presoak is similar to the activator composition.
2. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 1, is characterized in that, described secondary presoak acidity is 0.58 ~ 0.8N.
3. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 2, is characterized in that, the proportion of described secondary presoak is＞1.142.
4. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 3, is characterized in that, described secondary presoak acidity is 0.65N.
5. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 4, is characterized in that, the proportion of described secondary presoak is 2.
6. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 1, is characterized in that, described micro-etching speed is 20 ~ 40Unich, and temperature is 25 ℃ ~ 30 ℃.
7. a kind of microwell plate chemical copper activation back scrubbing technique according to claim 1, is characterized in that, a described preimpregnation acid content is 0.5 ~ 0.7N, and described activator proportion is 1.25 ~ 1.35g/cm
3
8. the described a kind of microwell plate chemical copper activation back scrubbing technique of according to claim 1-7 any one, is characterized in that, the step before described microetch step is:
Expand: will bore dirty copper coin substrate resin and decompose effectively removal by expansion;
Whole hole/alkaline degreasing: remove the greasy dirt on hole wall and copper coin surface, make effective deposited copper.
9. microwell plate chemical copper activation back scrubbing system, is characterized in that, comprising:
The microetch cylinder: pcb board enters in the microetch cylinder after expansion and whole hole/alkaline degreasing, and pcb board etches rough matsurface on the surface;
Water washing cylinder: the pcb board after microetch is entered in water washing cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder: the pcb board through a water washing cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes the upper activation of the matrix surface absorption target through overactivation;
Secondary preimpregnation cylinder: the pcb board after activated enters in secondary preimpregnation cylinder, and protection activation target is not by water-soluble solution in secondary preimpregnation cylinder;
The secondary water washing cylinder: pcb board is the residual activator of clear board face in the secondary water washing cylinder;
Heavy copper groove: for pcb board being sunk copper, make non-conductive insulated vias be converted into active conductive through hole;
Described microetch cylinder, a water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove connect successively.
10. a kind of microwell plate chemical copper activation back scrubbing according to claim 9 system, it is characterized in that, described microetch cylinder, water washing cylinder, water washing cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, heavy copper groove top is provided with lifting appliance, and described lifting appliance stroke is the back scrubbing system length;
A described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity;
Described microetch cylinder is provided with for the temperature control meter of controlling temperature.
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| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN105208798A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Double-face circuit board conduction film plating technology |
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
| CN115369390A (en) * | 2021-12-16 | 2022-11-22 | 广东硕成科技股份有限公司 | Activation process for electroless copper plating and application thereof |
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| CN101979709B (en) * | 2010-11-15 | 2012-11-21 | 深圳市成功科技有限公司 | Novel chemical copper plating method |
| CN103205735B (en) * | 2012-01-17 | 2015-01-28 | 江苏华神电子有限公司 | Chemical copper deposition return type process flow for printed wiring board |
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| CN104378930A (en) * | 2013-08-14 | 2015-02-25 | 四川海英电子科技有限公司 | Electric manufacturing method for two-sided copper deposition plate of PCB |
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| CN104703411A (en) * | 2015-04-01 | 2015-06-10 | 竞陆电子(昆山)有限公司 | Horizontal plated-through hole production line pH monitoring device |
| CN105208798A (en) * | 2015-08-18 | 2015-12-30 | 四川海英电子科技有限公司 | Double-face circuit board conduction film plating technology |
| CN105208798B (en) * | 2015-08-18 | 2018-07-06 | 四川海英电子科技有限公司 | Double-sided PCB conductive film plating technology |
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN108601243A (en) * | 2018-02-09 | 2018-09-28 | 深圳市赛孚科技有限公司 | A kind of heavy copper method of pcb board |
| CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
| CN115369390A (en) * | 2021-12-16 | 2022-11-22 | 广东硕成科技股份有限公司 | Activation process for electroless copper plating and application thereof |
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