CN103338592A - Buried resistor and manufacture process thereof - Google Patents
Buried resistor and manufacture process thereof Download PDFInfo
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- CN103338592A CN103338592A CN201310221963XA CN201310221963A CN103338592A CN 103338592 A CN103338592 A CN 103338592A CN 201310221963X A CN201310221963X A CN 201310221963XA CN 201310221963 A CN201310221963 A CN 201310221963A CN 103338592 A CN103338592 A CN 103338592A
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Abstract
The invention relates to the buried resistor technical field, in particular to a buried resistor and a manufacture process thereof. The buried resistor includes a first copper foil layer, a second copper foil layer, a third copper foil layer, a first insulating PP layer, a second insulating PP layer, an insulating base layer and a resistance layer, wherein the third copper foil layer, the second insulating PP layer, the second copper foil layer, the first insulating PP layer, the resistance layer and the first copper foil layer are sequentially arranged on the insulating base layer from bottom to up, the resistance layer is arranged between the first copper foil layer and the first insulating PP layer, the second copper foil layer is arranged between the first insulating PP layer and the second insulating PP layer, and the third copper foil layer is arranged between the second copper foil layer and the insulating base layer. An ultrathin core board is machined through using a double-sided etching one-step lamination method so as to form a buried resistor structure, and therefore, production efficiency is greatly improved, and product quality can be ensured; and with the buried resistor applied to a PCB, the space of the PCB can be saved, and at the same time, the reliability of the PCB can be improved.
Description
Technical field
The present invention relates to the buried resistor technical field, particularly a kind of buried resistor and manufacture craft thereof.
Background technology
So-called buried resistor claims to bury resistance again, be that special resistance material is pressed together on the insulating substrate, then by technologies such as printing, etchings, form interior (outward) layer material of design resistance value, be pressed together on then in the pcb board (on), form a kind of technology of planar resistor layer.
The buried resistor material is used very extensive, nearly all multi-layer sheet can adopt, and still, mainly is to bury resistance also just to rest on the popularization stage now, the matched process technology and the equipment that temporarily do not adapt of PCB producer only is used in high-tech area so bury resistance in addition.
Summary of the invention
The objective of the invention is to defective and deficiency at prior art, a kind of buried resistor and manufacture craft thereof are provided.
For achieving the above object, the technical solution used in the present invention is:
A kind of buried resistor, comprise the ground floor copper foil layer, second layer copper foil layer, the 3rd layer of copper foil layer, ground floor insulation PP layer, second layer insulation PP layer, insulated substrate and resistive layer, described the 3rd layer of copper foil layer, second layer insulation PP layer, second layer copper foil layer, ground floor insulation PP layer, resistive layer, the ground floor copper foil layer is set in turn on the insulated substrate from the bottom to top, between ground floor copper foil layer and the ground floor insulation PP layer resistive layer is set, between ground floor insulation PP layer and the second layer insulation PP layer second layer copper foil layer is set, is provided with the 3rd layer of copper foil layer between second layer copper foil layer and the insulated substrate.
Further, described resistive layer is made by the nickel-phosphorus alloy material.
A kind of manufacture craft of buried resistor may further comprise the steps:
1) resistive layer between ground floor copper foil layer and the insulated substrate, ground floor insulation PP layer, second layer copper foil layer, second layer insulation PP layer, the 3rd layer of copper foil layer are made by multi-layer sheet printing mode, and resistive layer is done hand hay cutter erosion compensation;
2) with the surface of copper sulphate series erosion copper liquid medicine cleaning ground floor copper foil layer, second layer copper foil layer, the 3rd layer of copper foil layer and resistive layer;
3) internal layer resistive layer line pattern is made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 6～7 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 0.8～1.2%; Temperature is 28～32 ℃;
4) finish ground floor copper foil layer, second layer copper foil layer, the 3rd layer of copper foil layer, ground floor insulation PP layer, second layer insulation PP layer, insulated substrate and resistive layer cleaning surfaces are carried out lamination after handling, and cool off 120min naturally;
5) on Digit Control Machine Tool, each layer behind the lamination holed, and use 800# sand paper that product surface is carried out grinding process;
6) in the hole of boring, all deposit metallic copper;
7) the outer-layer circuit figure of ground floor copper foil layer and the 3rd layer of copper foil layer is made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 6～7 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 0.8～1.2%; Temperature is 28～32 ℃;
8) use copper sulphate series erosion copper liquid medicine resistive layer to be carried out etching, etching factor 〉=3.5;
9) use defective and the in addition test of in good repair and resistance sizes on the checkout equipment testing product function;
10) after product surface is coated layer protecting film, and by the ultraviolet photoetching making, ultraviolet light energy lattice are controlled in 9～11 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 1.0～1.3%, 28～34 ℃ of temperature;
11) utilizing the method for chemical replacement reaction to allow product be coated with last layer on the surface has anticorrosive, easily weld and the good metallic gold of adhesion, the speed of smearing is 2.6～3.0m/min, and concentration is 1.0～2.0%, operating temperature is controlled at 80～90 ℃, time 3～5min;
12) to the performance of product and outward appearance detect qualified after, get product.
Further, pass through 120 ℃ of low-temperature spaces successively, 140 ℃ of middle warm areas, 180 ℃ of high-temperature regions during described step 4) lamination.
Further, described step 5) is bored the revolution control of cutter at 144～155krpm.
Further, most 70～85 ℃ of the etch temperature controls of described step 8), etching speed is 3m/min, the concentration of copper sulphate series erosion copper liquid medicine is 70～90%.
Compared with prior art, beneficial effect of the present invention is: process ultra-thin central layer by the method that adopts two-sided one step of etching lamination and make buried resistor structure, the assurance that has improved production efficiency and product quality greatly; The PCB embedded resistors has not only been saved the pcb board space of planes, has also reduced pcb board face SMT solder joint number simultaneously in a large number, has improved the reliability of pcb board spare.
Description of drawings
Fig. 1 is structural representation of the present invention;
Among the figure:
1, ground floor copper foil layer; 2, resistive layer; 3, ground floor insulation PP layer; 4, second layer copper foil layer;
5, second layer insulation PP layer; 6, the 3rd layer of copper foil layer.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing and specific embodiment.
Embodiment 1
As shown in Figure 1, a kind of buried resistor, comprise: ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6, ground floor insulation PP layer 3, second layer insulation PP layer 5, insulated substrate and resistive layer 2, described the 3rd layer of copper foil layer 6, second layer insulation PP layer 5, second layer copper foil layer 4, ground floor insulation PP layer 3, resistive layer 2, ground floor copper foil layer 1 is set in turn on the insulated substrate from the bottom to top, between ground floor copper foil layer 1 and the ground floor insulation PP layer 3 resistive layer 2 is set, between ground floor insulation PP layer 3 and the second layer insulation PP layer 5 second layer copper foil layer 4 is set, is provided with the 3rd layer of copper foil layer 6 between second layer copper foil layer 4 and the insulated substrate.
Further, described resistive layer 2 is made by the nickel-phosphorus alloy material.
A kind of manufacture craft of buried resistor may further comprise the steps:
1) resistive layer between ground floor copper foil layer 1 and the insulated substrate 2, ground floor insulation PP layer 3, second layer copper foil layer 4, second layer insulation PP layer 5, the 3rd layer of copper foil layer 6 are made by multi-layer sheet printing mode, and resistive layer 2 is done hand hay cutter erosion compensation; The monolateral compensation 0.025mm of whole resistive layer, resistance pattern designs monolateral compensation 0.05mm, to guarantee that the product resistance value is in management and control;
2) with the surface of copper sulphate series erosion copper liquid medicine cleaning ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6 and resistive layer 2;
3) internal layer resistive layer 2 line patterns are made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 6 lattice, and make development treatment, and developing powder is controlled at 2.8m/min, and concentration is 0.8%; Temperature is 28 ℃;
4) finish carrying out lamination after ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6, ground floor insulation PP layer 3, second layer insulation PP layer 5, insulated substrate and the processing of resistive layer 2 cleaning surfaces, and naturally the cooling 120min, pass through 120 ℃ of low-temperature spaces during lamination successively, 140 ℃ of middle warm areas, 180 ℃ of high-temperature regions;
5) on Digit Control Machine Tool, each layer behind the lamination holed, (0.1～0.15mm) is difficult to limit, management and control hole burr, uses 800# sand paper that product surface is carried out grinding process, bores the revolution control of cutter at 144krpm because boring aperture is less;
6) making in the hole of brill all with the method (CU+2-2e=Cu) of chemical reaction, deposition goes up metallic coppers;
7) the outer-layer circuit figure of ground floor copper foil layer 1 and the 3rd layer of copper foil layer 6 is made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 6 lattice, and make development treatment, and developing powder is controlled at 2.8m/min, and concentration is 0.8%; Temperature is 28 ℃;
8) use copper sulphate series erosion copper liquid medicine that resistive layer 2 is carried out etching, mainly be to use copper sulphate series erosion copper liquid medicine to carry out the chemical replacement reaction and to finish resistance etched, reaction equation: 2CU+2-2e=2Cu+; Ni+2e=2Ni+; Most 70 ℃ of etching factor 〉=3.5, etch temperature control, etching speed is 3m/min, the concentration of copper sulphate series erosion copper liquid medicine is 70%;
9) use defective and the in addition test of in good repair and resistance sizes on the checkout equipment testing product function;
10) after product surface is coated layer protecting film, and by the ultraviolet photoetching making, ultraviolet light energy lattice are controlled in 9 lattice, and make development treatment, and developing powder is controlled at 2.8m/min, and concentration is 1.0%, 28 ℃ of temperature;
11) utilize on the surface method of chemical replacement reaction allow product be coated with last layer have anticorrosive, easily welding and the good metallic gold of adhesion, the speed of smearing is 2.6m/min, concentration is 1.0%, operating temperature is controlled at 80 ℃, time 3min;
12) to the performance of product and outward appearance detect qualified after, get product.
Embodiment 2
As shown in Figure 1, a kind of buried resistor, comprise: ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6, ground floor insulation PP layer 3, second layer insulation PP layer 5, insulated substrate and resistive layer 2, described the 3rd layer of copper foil layer 6, second layer insulation PP layer 5, second layer copper foil layer 4, ground floor insulation PP layer 3, resistive layer 2, ground floor copper foil layer 1 is set in turn on the insulated substrate from the bottom to top, between ground floor copper foil layer 1 and the ground floor insulation PP layer 3 resistive layer 2 is set, between ground floor insulation PP layer 3 and the second layer insulation PP layer 5 second layer copper foil layer 4 is set, is provided with the 3rd layer of copper foil layer 6 between second layer copper foil layer 4 and the insulated substrate.
Further, described resistive layer 2 is made by the nickel-phosphorus alloy material.
A kind of manufacture craft of buried resistor may further comprise the steps:
1) resistive layer between ground floor copper foil layer 1 and the insulated substrate 2, ground floor insulation PP layer 3, second layer copper foil layer 4, second layer insulation PP layer 5, the 3rd layer of copper foil layer 6 are made by multi-layer sheet printing mode, and resistive layer 2 is done hand hay cutter erosion compensation; The monolateral compensation 0.025mm of whole resistive layer, resistance pattern designs monolateral compensation 0.05mm, to guarantee that the product resistance value is in management and control;
2) with the surface of copper sulphate series erosion copper liquid medicine cleaning ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6 and resistive layer 2;
3) internal layer resistive layer 2 line patterns are made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 7 lattice, and make development treatment, and developing powder is controlled at 3.0m/min, and concentration is 1.0%; Temperature is 30 ℃;
4) finish carrying out lamination after ground floor copper foil layer 1, second layer copper foil layer 4, the 3rd layer of copper foil layer 6, ground floor insulation PP layer 3, second layer insulation PP layer 5, insulated substrate and the processing of resistive layer 2 cleaning surfaces, and naturally the cooling 120min, pass through 120 ℃ of low-temperature spaces during lamination successively, 140 ℃ of middle warm areas, 180 ℃ of high-temperature regions;
5) on Digit Control Machine Tool, each layer behind the lamination holed, because boring aperture less (0.1-0.15mm) is difficult to limit, management and control hole burr, use 800# sand paper that product surface is carried out grinding process, bore the revolution control of cutter at 144krpm;
6) making in the hole of brill all with the method (CU+2-2e=Cu) of chemical reaction, deposition goes up metallic coppers;
7) the outer-layer circuit figure of ground floor copper foil layer 1 and the 3rd layer of copper foil layer 6 is made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 7 lattice, and make development treatment, and developing powder is controlled at 3.0m/min, and concentration is 1.0%; Temperature is 30 ℃;
8) use copper sulphate series erosion copper liquid medicine that resistive layer 2 is carried out etching, mainly be to use copper sulphate series erosion copper liquid medicine to carry out the chemical replacement reaction and to finish resistance etched, reaction equation: 2CU+2-2e=2Cu+; Ni+2e=2Ni+; Most 80 ℃ of etching factor 〉=3.5, etch temperature control, etching speed is 3m/min, the concentration of copper sulphate series erosion copper liquid medicine is 80%;
9) use defective and the in addition test of in good repair and resistance sizes on the checkout equipment testing product function;
10) after product surface is coated layer protecting film, and make by ultraviolet photoetching, the control of ultraviolet light energy lattice is in 11 lattice, and make development treatment, and developing powder is controlled at 3.0m/min, and concentration is 1.2%, 30 ℃ of temperature, to prolong product useful life better, improve the corrosion stability of product, and give the consumer different vision sight;
11) utilize on the surface method of chemical replacement reaction allow product be coated with last layer have anticorrosive, easily welding and the good metallic gold of adhesion, the speed of smearing is 3.0m/min, concentration is 1.5%, operating temperature is controlled at 85 ℃, time 5min;
12) to the performance of product and outward appearance detect qualified after, get product.
The above only is preferred embodiments of the present invention, so all equivalences of doing according to the described structure of patent claim of the present invention, feature and principle change or modify, is included in the patent claim of the present invention.
Claims (6)
1. buried resistor, it is characterized in that comprising: ground floor copper foil layer (1), second layer copper foil layer (4), the 3rd layer of copper foil layer (6), ground floor insulation PP layer (3), second layer insulation PP layer (5), insulated substrate and resistive layer (2), described the 3rd layer of copper foil layer (6), second layer insulation PP layer (5), second layer copper foil layer (4), ground floor insulation PP layer (3), resistive layer (2), ground floor copper foil layer (1) is set in turn on the insulated substrate from the bottom to top, between ground floor copper foil layer (1) and the ground floor insulation PP layer (3) resistive layer (2) is set, between ground floor insulation PP layer (3) and the second layer insulation PP layer (5) second layer copper foil layer (4) is set, is provided with the 3rd layer of copper foil layer (6) between second layer copper foil layer (4) and the insulated substrate.
2. buried resistor according to claim 1, it is characterized in that: described resistive layer (2) is made by the nickel-phosphorus alloy material.
3. the manufacture craft of a buried resistor is characterized in that may further comprise the steps:
1) resistive layer (2) between ground floor copper foil layer (1) and the insulated substrate, ground floor insulation PP layer (3), second layer copper foil layer (4), second layer insulation PP layer (5), the 3rd layer of copper foil layer (6) are made by multi-layer sheet printing mode, and resistive layer (2) is done hand hay cutter erosion compensation;
2) lose the surface that copper liquid medicine cleans ground floor copper foil layer (1), second layer copper foil layer (4), the 3rd layer of copper foil layer (6) and resistive layer (2) with copper sulphate series;
3) internal layer resistive layer (2) line pattern is made by ultraviolet photoetching, and ultraviolet light energy lattice are controlled in 6～7 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 0.8～1.2%; Temperature is 28～32 ℃;
4) finish and carry out lamination after ground floor copper foil layer (1), second layer copper foil layer (4), the 3rd layer of copper foil layer (6), ground floor insulation PP layer (3), second layer insulation PP layer (5), insulated substrate and resistive layer (2) cleaning surfaces handled, and cool off 120min naturally;
5) on Digit Control Machine Tool, each layer behind the lamination holed, and use 800# sand paper that product surface is carried out grinding process;
6) in the hole of boring, all deposit metallic copper;
7) ground floor copper foil layer (1) is made by ultraviolet photoetching with the outer-layer circuit figure of the 3rd layer of copper foil layer (6), and ultraviolet light energy lattice are controlled in 6～7 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 0.8～1.2%; Temperature is 28～32 ℃;
8) use copper sulphate series erosion copper liquid medicine resistive layer (2) to be carried out etching, etching factor 〉=3.5;
9) use defective and the in addition test of in good repair and resistance sizes on the checkout equipment testing product function;
10) after product surface is coated layer protecting film, and by the ultraviolet photoetching making, ultraviolet light energy lattice are controlled in 9～11 lattice, and make development treatment, and developing powder is controlled at 2.8～3.2m/min, and concentration is 1.0～1.3%, 28～34 ℃ of temperature;
11) utilizing the method for chemical replacement reaction to allow product be coated with last layer on the surface has anticorrosive, easily weld and the good metallic gold of adhesion, the speed of smearing is 2.6～3.0m/min, and concentration is 1.0～2.0%, operating temperature is controlled at 80～90 ℃, time 3～5min;
12) to the performance of product and outward appearance detect qualified after, get product.
4. the manufacture craft of buried resistor according to claim 2 is characterized in that: pass through 120 ℃ of low-temperature spaces successively, 140 ℃ of middle warm areas, 180 ℃ of high-temperature regions during described step 4) lamination.
5. the manufacture craft of buried resistor according to claim 2 is characterized in that: described step 5) is bored the revolution control of cutter at 144～155krpm.
6. the manufacture craft of buried resistor according to claim 2 is characterized in that: most 70～85 ℃ of the etch temperature controls of described step 8), and etching speed is 3m/min, the concentration of copper sulphate series erosion copper liquid medicine is 70～90%.
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| CN201310221963.XA CN103338592B (en) | 2013-06-06 | 2013-06-06 | A kind of buried resistor and processing technology thereof |
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| CN103338592B CN103338592B (en) | 2016-07-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142362A (en) * | 2015-08-26 | 2015-12-09 | 昆山苏杭电路板有限公司 | Method for processing four-layer embedded element printed board |
| CN107333393A (en) * | 2017-07-19 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of preparation method for burying baffle-wall material |
| CN108575049A (en) * | 2017-03-08 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
| CN108684153A (en) * | 2018-06-13 | 2018-10-19 | 深圳崇达多层线路板有限公司 | A kind of engraving method burying resistance copper foil based on nickel-phosphorus alloy |
| CN110622017A (en) * | 2017-05-08 | 2019-12-27 | 罗伯特·博世有限公司 | Shunt resistor for state recognition of an electrical energy storage unit |
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| US4297670A (en) * | 1977-06-03 | 1981-10-27 | Angstrohm Precision, Inc. | Metal foil resistor |
| JPH07283543A (en) * | 1994-04-04 | 1995-10-27 | Omron Corp | Hybrid circuit substrate |
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| CN101227800A (en) * | 2008-02-03 | 2008-07-23 | 深圳华为通信技术有限公司 | Apparatus and method for implementing high-precision buried resistance |
| CN202750338U (en) * | 2012-08-24 | 2013-02-20 | 苏州市三生电子有限公司 | Resistor-burying circuit board |
| CN202773184U (en) * | 2012-08-24 | 2013-03-06 | 苏州市三生电子有限公司 | Embedded capacitor and embedded resistor circuit board |
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| US4297670A (en) * | 1977-06-03 | 1981-10-27 | Angstrohm Precision, Inc. | Metal foil resistor |
| JPH07283543A (en) * | 1994-04-04 | 1995-10-27 | Omron Corp | Hybrid circuit substrate |
| CN101048037A (en) * | 2006-03-29 | 2007-10-03 | 古河电路铜箔株式会社 | Conductive base material with thin film resistance layer, method of production of conductive base material with thin film resistance layer, and circuit board with thin film resistance layer |
| CN101227800A (en) * | 2008-02-03 | 2008-07-23 | 深圳华为通信技术有限公司 | Apparatus and method for implementing high-precision buried resistance |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142362A (en) * | 2015-08-26 | 2015-12-09 | 昆山苏杭电路板有限公司 | Method for processing four-layer embedded element printed board |
| CN108575049A (en) * | 2017-03-08 | 2018-09-25 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
| CN108575049B (en) * | 2017-03-08 | 2021-03-23 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN110622017A (en) * | 2017-05-08 | 2019-12-27 | 罗伯特·博世有限公司 | Shunt resistor for state recognition of an electrical energy storage unit |
| US11422157B2 (en) | 2017-05-08 | 2022-08-23 | Robert Bosch Gmbh | Shunt resistor for detecting the status of an electrical energy storage unit |
| CN107333393A (en) * | 2017-07-19 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of preparation method for burying baffle-wall material |
| CN108684153A (en) * | 2018-06-13 | 2018-10-19 | 深圳崇达多层线路板有限公司 | A kind of engraving method burying resistance copper foil based on nickel-phosphorus alloy |
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| CN103338592B (en) | 2016-07-06 |
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