CN203104980U - Microplate chemical copper activation back washing system - Google Patents
Microplate chemical copper activation back washing system Download PDFInfo
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- CN203104980U CN203104980U CN 201320026641 CN201320026641U CN203104980U CN 203104980 U CN203104980 U CN 203104980U CN 201320026641 CN201320026641 CN 201320026641 CN 201320026641 U CN201320026641 U CN 201320026641U CN 203104980 U CN203104980 U CN 203104980U
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- cylinder
- preimpregnation
- pcb board
- microetch
- water washing
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Abstract
The utility model provides a microplate chemical copper activation back washing system which comprises a micro etching cylinder, a first washing cylinder, a first preimpregnation cylinder, an activation cylinder and a second washing cylinder. A second preimpregnation cylinder is arranged between the activation cylinder and the second washing cylinder. The second washing cylinder is connected with a copper deposition trough. The micro etching cylinder, the first washing cylinder, the first preimpregnation cylinder, the activation cylinder, the second preimpregnation cylinder, the second washing cylinder and the copper deposition trough are sequentially connected. According to the utility model, an activation target in a PCB board is not dissolved by water; the risk of poor backlight is reduced; the product quality is improved; and the production cost is reduced.
Description
Technical field
The utility model relates to a kind of pcb board technical field, relates in particular to a kind of microwell plate chemical copper and activates the back scrubbing system.
Background technology
PCB(Printed Circuit Board), Chinese is a printed wiring board, is called for short printed board, is one of vitals of electronics industry.Every kind of electronic equipment almost arrives computer greatly for a short time to electronic watch, calculator, the communication electronic equipment, and military armament systems as long as electronic devices and components such as integrated circuit are arranged, for the electric interconnection between them, all will use printed board.
In the pcb board production and processing that through hole is arranged, it is exactly the hole metallization flow process that a key link is arranged, this process makes non-conductive insulated vias be converted into active conductive through hole, and the method for existing P CB plate making hole conducting is a PTH(electroless copper plating through hole) technology, its technological process is: material loading → bulk → secondary or three stage countercurrent rinsing → de-smears → recovery hot water wash → secondary countercurrent rinsing → neutralization/reduction → secondary countercurrent rinsing → whole hole/alkaline degreasing → secondary or three stage countercurrents rinsing → microetch alligatoring → secondary countercurrent rinsing → preimpregnation → activation → secondary countercurrent rinsing city washing → shortization → secondary countercurrent rinsing city washing → heavy copper → secondary countercurrent rinsing city's washing → blanking, pcb board is directly entering the washing of secondary countercurrent rinsing city behind overactivation, cause activation target dissolving in the pcb board hole, be unfavorable for follow-up heavy copper, especially in market demands, the client requires aspect ratio higher to HDI product (high density interconnected circuit plate), the activation target that how to solve in the pcb board hole is not dissolved, reduces pcb board fraction defective backlight and becomes the problem that PCB producer needs solution badly.
The utility model content
The utility model is optimized on existing heavy process for copper system-based at problems of the prior art, makes that the activation target in the pcb board can not separated by water-soluble, has reduced bad risk backlight, has improved product quality, has reduced production cost simultaneously.
A kind of microwell plate chemical copper that the utility model provides activates the back scrubbing system, comprising:
The microetch cylinder: pcb board enters in the microetch cylinder after reaching whole hole/alkaline degreasing through expanding, and etches rough matsurface on the pcb board surface;
Once wash cylinder: will the pcb board after microetch enter and once wash in the cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder: the pcb board through once washing the cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes through the matrix surface absorption of overactivation and goes up the activation target;
The secondary water washing cylinder: pcb board is the residual activator of clear board face in the secondary water washing cylinder;
Be provided with secondary preimpregnation cylinder between described active cylinder and the described secondary water washing cylinder, described secondary water washing cylinder is connected with heavy copper groove, described microetch cylinder, once wash cylinder, preimpregnation cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove connect successively.
As a kind of preferred version, described microetch cylinder, once to wash cylinder, preimpregnation cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, heavy copper groove top and be provided with lifting appliance, described lifting appliance stroke is the back scrubbing system length.
As a kind of preferred version, a described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity, and described microetch cylinder is provided with the temperature control meter that is used to control temperature.
A kind of microwell plate chemical copper that the utility model provides activates the back scrubbing system, on original heavy process for copper, pcb board after the activated cylinder activation is entered secondary preimpregnation cylinder, make the activation target in the pcb board hole can in follow-up secondary water washing cylinder, not dissolve, thereby reduced bad risk backlight, improved production panel products quality, improved operating efficiency greatly, reduced labour intensity, be difficult for dissolving because of activation target in the hole simultaneously, can reduce the activator concentration in the active cylinder, reduce production cost.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a kind of microwell plate chemical copper activation back scrubbing system configuration schematic diagram that the utility model provides;
Fig. 2 is existing heavy copper system and the microwell plate chemical copper activation back scrubbing system experimentation data contrast table that the utility model provides.
Embodiment
The utility model embodiment optimizes on original heavy process for copper, make through the pcb board preimpregnation once more after the active cylinder activation, reduced bad risk backlight, improved the pcb board product quality, improve operating efficiency greatly, reduced labour intensity, be difficult for dissolving because of activation target in the hole simultaneously, can reduce the activator concentration in the active cylinder, reduce production cost.
Referring to Fig. 1, a kind of microwell plate chemical copper that provides for the utility model activates back scrubbing system configuration schematic diagram.
As shown in the figure, the utility model comprises:
Microetch cylinder 10:PCB plate enters in the microetch cylinder after reaching whole hole/alkaline degreasing through expanding, and etches rough matsurface on the pcb board surface;
Once wash cylinder 11: will the pcb board after microetch enter and once wash in the cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder 12: the pcb board through once washing the cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder 13: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes through the matrix surface absorption of overactivation and goes up the activation target;
Secondary preimpregnation cylinder 14: the pcb board after activated enters in the secondary preimpregnation cylinder, and protection activation target is not separated by water-soluble in secondary preimpregnation cylinder;
Secondary water washing cylinder 15:PCB plate residual activator of clear board face in the secondary water washing cylinder;
Heavy copper groove 16: be used for pcb board sink copper, make non-conductive insulated vias be converted into the conductive through hole of activity.
Described microetch cylinder 10, once wash cylinder 11, preimpregnation cylinder 12, active cylinder 13, secondary preimpregnation cylinder 14, secondary water washing cylinder 15, a heavy copper groove 16 connect successively.
This back scrubbing system is provided with lifting appliance 17 simultaneously, be used to alleviate artificial intensity, adopt the automated machine complete operation, described lifting appliance 17 is arranged on described microetch cylinder 10, once washes cylinder 11, preimpregnation cylinder 12, active cylinder 13, secondary preimpregnation cylinder 14, secondary water washing cylinder 15, heavy copper groove 16 tops, and described lifting appliance 17 strokes are consistent with described back scrubbing system length.
For better control process parameters, a described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity, operating personnel can be according to the acidity of preimpregnation cylinder of timely adjustment of the numerical value on the PH meter and secondary preimpregnation cylinder, described microetch cylinder is provided with the temperature control meter that is used to control temperature, makes the microetch temperature be controlled in the reasonable parameter scope.
Referring to Fig. 2, the microwell plate chemical copper activation back scrubbing system that the utility model provides compares its each side experimental data with existing heavy copper system, as can be seen from Figure, a kind of microwell plate chemical copper activates the back scrubbing system and meets the requirements fully by its working condition on probation and quality result, and atresia does not have quality abnormals such as copper.Adopt the existing copper system production cost that sinks of a kind of microwell plate chemical copper activation back scrubbing system's replacement to save 0.229 yuan/FT2; Cost has reduced by 21%, as with output calculating in April, then can save 52670 yuan in every month.Through adopting different schemes to verify, adopt a kind of microwell plate chemical copper to activate back scrubbing system production quality and all can reach requirement.Therefore, adopt the existing copper system production cost that sinks of a kind of microwell plate chemical copper activation back scrubbing system's replacement to save 0.229 yuan/FT2, and the production quality is improved.
One of ordinary skill in the art will appreciate that all or part of flow process that realizes in the foregoing description method, be to instruct relevant hardware to finish by computer program, described program can be stored in the computer read/write memory medium, this program can comprise the flow process as the embodiment of above-mentioned each side method when carrying out.Wherein, described storage medium can be magnetic disc, CD, read-only storage memory body (Read-Only Memory, ROM) or at random store memory body (Random Access Memory, RAM) etc.
Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (3)
1. a microwell plate chemical copper activates the back scrubbing system, comprising:
The microetch cylinder: pcb board enters in the microetch cylinder after reaching whole hole/alkaline degreasing through expanding, and etches rough matsurface on the pcb board surface;
Once wash cylinder: will the pcb board after microetch enter and once wash in the cylinder, pcb board is carried out countercurrent rinsing;
A preimpregnation cylinder: the pcb board through once washing the cylinder rinsing enters preimpregnation cylinder, activating plate face and hole wall one time;
Active cylinder: the pcb board after a preimpregnation enters active cylinder, makes hole wall absorption one deck have the metal of catalytic capability in active cylinder, makes through the matrix surface absorption of overactivation and goes up the activation target;
The secondary water washing cylinder: pcb board is the residual activator of clear board face in the secondary water washing cylinder;
It is characterized in that, be provided with secondary preimpregnation cylinder between described active cylinder and the described secondary water washing cylinder, described secondary water washing cylinder is connected with heavy copper groove, described microetch cylinder, once wash cylinder, preimpregnation cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, a heavy copper groove connect successively.
2. a kind of microwell plate chemical copper according to claim 1 activates the back scrubbing system, it is characterized in that, described microetch cylinder, once wash cylinder, preimpregnation cylinder, active cylinder, secondary preimpregnation cylinder, secondary water washing cylinder, heavy copper groove top and be provided with lifting appliance, described lifting appliance stroke is the back scrubbing system length.
3. a kind of microwell plate chemical copper according to claim 1 activates the back scrubbing system, it is characterized in that, a described preimpregnation cylinder and secondary preimpregnation cylinder are provided with the PH meter of measuring acidity, and described microetch cylinder is provided with the temperature control meter that is used to control temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201320026641 CN203104980U (en) | 2013-01-18 | 2013-01-18 | Microplate chemical copper activation back washing system |
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CN 201320026641 CN203104980U (en) | 2013-01-18 | 2013-01-18 | Microplate chemical copper activation back washing system |
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CN203104980U true CN203104980U (en) | 2013-07-31 |
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CN 201320026641 Expired - Lifetime CN203104980U (en) | 2013-01-18 | 2013-01-18 | Microplate chemical copper activation back washing system |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103108501B (en) * | 2013-01-18 | 2016-12-28 | 金悦通电子(翁源)有限公司 | A kind of microwell plate chemical copper activation back scrubbing technique and system thereof |
CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路(惠州)有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
-
2013
- 2013-01-18 CN CN 201320026641 patent/CN203104980U/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103108501B (en) * | 2013-01-18 | 2016-12-28 | 金悦通电子(翁源)有限公司 | A kind of microwell plate chemical copper activation back scrubbing technique and system thereof |
CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
CN106413289A (en) * | 2016-11-21 | 2017-02-15 | 奥士康精密电路(惠州)有限公司 | Copper deposition method for preventing occurrence of copper-free hole |
CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
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