CN205755085U - The tool of ink in cleaning hole - Google Patents
The tool of ink in cleaning hole Download PDFInfo
- Publication number
- CN205755085U CN205755085U CN201620468507.4U CN201620468507U CN205755085U CN 205755085 U CN205755085 U CN 205755085U CN 201620468507 U CN201620468507 U CN 201620468507U CN 205755085 U CN205755085 U CN 205755085U
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- hole
- ink
- development
- wiring board
- tool
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Abstract
This utility model relates to a kind of tool of ink in cleaning hole, belongs to wiring board manufacture technology field.This tool includes protection board; which is provided with development hole; oil with the wiring board to be processed position of ink hole, the position in described development hole is corresponding, and for being exposed in ink hole and other plate face being covered protection, described ink hole is the hole in hole on wiring board to be processed with ink to be cleaned.Above-mentioned tool is used to prepare wiring board, both can guarantee that wiring board development liquid medicine when development fully reacted with ink in circuit plate hole, solve solder mask hand-hole problem, it was avoided that again the problem that development causes falling welding resistance bridge, make product yield effectively improve, also there is the feature that production operation is simple, practical.
Description
Technical field
This utility model relates to wiring board manufacture technology field, particularly relates to a kind of ink in cleaning hole
Tool.
Background technology
Along with PCB (Printed Circuit Board, printed circuit board) peace little to volume, lightweight, three-dimensional
Being filled with and the direction of high connecting reliability is developed, pcb board size is done less and less, and the market competition swashs the most by force
Strong.But, size diminishes, and function but can not subtract, and a lot of clients can select a wiring board number of plies when design
Increase, connect conducting by hole, thus reach to save the purpose of installing space.
Therefore, the wiring board number of plies increases, and thickness of slab thickens the most accordingly.Thickness of slab thickens and brings bigger difficulty to production,
Especially when welding resistance makes, the wiring board of thickness of slab >=more than 2.5mm, welding resistance makes and uses screen painting, oil
Ink is easily accessible in hole, sticks on hole wall.
For common line plate thickness of slab (＜ 2.5mm), in developing powder one timing, development liquid medicine (sodium carbonate)
Easily can react with ink in hole in through hole, finally make ink removal in hole, and with thickness of slab >=2.5mm
Above wiring board development, developing powder one timing, because thickness of slab is thicker, development liquid medicine cannot effective through hole
In, in causing hole, ink cannot effectively be removed.
At present, the major way solving ink hand-hole in industry is that developing powder subtracts by adjusting developing powder
Slowly, make plate elongated with the time of contact of development liquid medicine when development, so that development liquid medicine and ink in hole
Effecting reaction, reaches hole wall ink and fully develops clean purpose.
But, using the mode reducing developing powder to solve ink in hole has a following two defect:
1, in hole cannot being effectively ensured, ink is fully removed, and more especially for ink in hole, thickness of slab is thicker
Circuit board-type, reduce after developing powder or cannot effectively process clean, wiring board can only be reported after making
Give up or process of doing over again.
2, by adjusting developing powder, developing powder slows down, make wiring board when development with the connecing of liquid medicine of developing
The time of touching is elongated, so that development liquid medicine and ink effecting reaction in hole, reaches hole wall ink and fully develops dry
Clean purpose.But it is elongated to adjust developing time, wiring board contacts with development liquid medicine and is easily caused plate table more for a long time
Face ink is crossed development with development liquid medicine and is caused welding resistance bridge, and the method that wiring board falls welding resistance bridge post processing can only
It is to do over again to reform or scrap.
Summary of the invention
Based on this, it is necessary to for the problems referred to above, it is provided that a kind of tool of ink in cleaning hole, use
This tool, both can guarantee that wiring board development liquid medicine when development fully reacted with ink in circuit plate hole, had solved
The problem of solder mask hand-hole, was avoided that again development, caused falling welding resistance bridge problem.
A kind of tool of ink in cleaning hole, including protection board, which is provided with development hole, described development
Oil with the wiring board to be processed position of ink hole, the position in hole is corresponding, for ink hole is exposed and by other
Protection is covered in plate face, and described ink hole is the hole in hole on wiring board to be processed with ink to be cleaned.
Above-mentioned in cleaning hole the using method of the tool of ink as follows:
Using above-mentioned tool to prepare wiring board, wiring board develops at twice when development, the most first according to just
Often parameter normally makes, and second time uses this tool lid in the circuit board so that it is development hole and circuit to be processed
Plate oils ink hole alignment, enables development liquid medicine well in hole, lowers developing powder, make development liquid medicine
Fully reacting with the ink in hole, it is not necessary to the place of development has tool to block, welding resistance development liquid medicine cannot be with
Plate face contacts.
Aforesaid way, both can guarantee that wiring board development liquid medicine when development fully reacted with ink in circuit plate hole,
Solve solder mask hand-hole problem, be avoided that again that development caused falling the problem of welding resistance bridge, and made product yield obtain
To being effectively improved, also there is the feature that production operation is simple, practical.
Wherein in an embodiment, described protection board is the protection board that glass fibre is made.It should be understood that
Described protection board may be used without other material sheet materials such as plastics and prepares, but, use glass mat, have
It is difficult to the corrosion of developed liquid medicine, the convenient and advantage of low cost.
Wherein in an embodiment, described development hole is circular port.It should be understood that described development hole is also
Can be the other shapes of holes such as ellipse, it is only necessary to expose ink hole, but, circular port and circuit-board drilling
Hole shape is consistent, it is possible to well expose ink hole, and the advantage with easily processing.
Wherein in an embodiment, the aperture in described development hole, more corresponding with this development hole than on wiring board
The big 1.0mm-4.0mm in aperture in ink hole.By above-mentioned setting, it is possible to make development liquid medicine well into ink
In hole, reach the purpose of ink in thorough cleaning hole.
Wherein in an embodiment, the thickness of described protection board is 0.02mm-0.08mm.
Wherein in an embodiment, the size of described protection board and the plate face size of wiring board to be processed
Match.
Compared with prior art, this utility model has the advantages that
A kind of tool of ink in cleaning hole of the present utility model, by protection board and development hole thereon,
With development hole, the ink hole in circuit plate hole with ink to be cleaned is exposed, and other plate face is covered protection,
Can develop at twice, the most first normally make according to normal parameter, second time uses this tool lid online
On the plate of road so that it is the development hole ink hole that oils with wiring board to be processed is directed at, enable development liquid medicine well into
In hole, lower developing powder, make development liquid medicine fully react with the ink in hole, it is not necessary to the place of development
Having tool to block, welding resistance development liquid medicine cannot contact with plate face.Thus both can guarantee that wiring board was aobvious when development
Shadow liquid medicine fully reacts with ink in circuit plate hole, solves solder mask hand-hole problem, was avoided that again development
The problem causing falling welding resistance bridge.Can effectively solve solder mask hand-hole problem, the manufacturing scrap of wiring board is big
Big reduction, effectively reduces welding resistance and does over again, returns the rate of washing, also improve production efficiency, and product yield, system
Decline to a great extent as cost, make product reliability high.
Further, above-mentioned tool has the simple feature of making, uses circuit board conventional material to make, and
To same model wiring board can Reusability, cyclic utilization rate is high, makes and puts into relatively low, tells on.
Accompanying drawing explanation
Fig. 1 is jig structure schematic diagram in embodiment；
Fig. 2 is the front light panel material schematic diagram of tool processing in embodiment.
Wherein: 100. protection boards；110. development holes.
Detailed description of the invention
For the ease of understanding this utility model, below with reference to relevant drawings, this utility model is carried out more comprehensively
Description.Accompanying drawing gives preferred embodiment of the present utility model.But, this utility model can be to be permitted
The most different forms realizes, however it is not limited to embodiment described herein.On the contrary, provide these to implement
The purpose of example is to make the understanding to disclosure of the present utility model more thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology with belong to of the present utility model
The implication that those skilled in the art are generally understood that is identical.Institute in description of the present utility model herein
The term used is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting this utility model.
Embodiment
A kind of tool of ink in cleaning hole, as it is shown in figure 1, include protection board 100, which is provided with aobvious
Shadow hole 110, oil with the wiring board to be processed position of ink hole, the position in described development hole is corresponding, for by oil
Ink hole is exposed and other plate face is covered protection, and described ink hole is to have in hole on wiring board to be processed to treat clearly
The hole of oil removing ink.
In the present embodiment, the protection board that described protection board 100 is made for glass fibre.It should be understood that
This tool prepared by the sheet material that may be used without other material, but, use glass mat, have and be difficult to be shown
Shadow liquid medicine corrodes, the convenient and advantage of low cost.
In the present embodiment, described development hole 110 is circular port.And the aperture in described development hole, compare circuit
The big 1.0mm-4.0mm in aperture in ink hole corresponding with this development hole on plate.By above-mentioned setting, it is possible to make
Development liquid medicine well in ink hole, reaches the purpose of ink in thorough cleaning hole.
The thickness of described protection board is 0.02mm-0.08mm, and the size of this protection board and line to be processed
The plate face size of road plate matches.
The tool of the present embodiment is prepared by the following method and obtains:
1, selection.
Choose common FR4 (glass mat) tabula rasa, between thickness of slab 0.02-0.08mm, as shown in Figure 2.
2, data make.
Hole count, size and distribution situation according to wiring board to be processed make drilling.
3, tool is made.
Utilize drilling machine, use ready-made data to hole on FR4 tabula rasa, the aperture in the development hole that boring obtains,
The ratio big 1.0-4.0mm in aperture in ink hole corresponding with this development hole on wiring board, after development hole drill is good, tool
Complete, obtain the tool of ink in cleaning hole, as shown in Figure 1.
The tool using the present embodiment prepares wiring board, when carrying out developing procedure, carries out as follows:
When using above-mentioned tool to prepare wiring board, wiring board develops at twice when development, for the first time first according to
Normal parameter normally makes, and second time uses this tool lid in the circuit board so that it is development hole and line to be processed
Road plate oils ink hole alignment, enables development liquid medicine well in hole, lowers developing powder, make developer
Water fully reacts with the ink in hole, it is not necessary to the place of development has tool to block, and welding resistance development liquid medicine cannot
Contact with plate face.
In the present embodiment, second development speed is slower than normal speed, in liquid medicine normal concentration range (as
The sodium carbonate of 6-12%), speed is positively retained at 0.5-1.5m/min, has preferable effect.And develop for the first time
Time be normal development, line length is short, chemical concentration uniform velocity differs, but do not affects according to producing for its developing powder
Use developing powder during this tool second development.
By said method, both can guarantee that wiring board development liquid medicine when development was abundant with ink in circuit plate hole
Reaction, solves solder mask hand-hole problem, was avoided that again the problem that development causes falling welding resistance bridge.Product is good
Rate effectively improves, and has the advantages that production operation is simple, practical.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed several embodiments of the present utility model, its describe more concrete and
In detail, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that, it is right
For those of ordinary skill in the art, without departing from the concept of the premise utility, it is also possible to do
Going out some deformation and improvement, these broadly fall into protection domain of the present utility model.Therefore, this utility model is special
The protection domain of profit should be as the criterion with claims.
Claims (6)
1. the tool of ink in cleaning hole, it is characterised in that include protection board, which is provided with aobvious
Shadow hole, oil with the wiring board to be processed position of ink hole, the position in described development hole is corresponding, for by ink
Hole is exposed and other plate face is covered protection, described ink hole be have in hole on wiring board to be processed to be cleaned
The hole of ink.
The tool of ink in cleaning hole the most according to claim 1, it is characterised in that described guarantor
Backplate is the protection board that glass fibre is made.
The tool of ink in cleaning hole the most according to claim 1, it is characterised in that described aobvious
Shadow hole is circular port.
The tool of ink in cleaning hole the most according to claim 3, it is characterised in that described aobvious
The aperture in shadow hole, than the big 1.0mm-4.0mm in aperture in ink hole corresponding with this development hole on wiring board.
The tool of ink in cleaning hole the most according to claim 1, it is characterised in that described guarantor
The thickness of backplate is 0.02mm-0.08mm.
The tool of ink in cleaning hole the most according to claim 1, it is characterised in that described guarantor
The size of backplate matches with the plate face size of wiring board to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620468507.4U CN205755085U (en) | 2016-05-19 | 2016-05-19 | The tool of ink in cleaning hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620468507.4U CN205755085U (en) | 2016-05-19 | 2016-05-19 | The tool of ink in cleaning hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755085U true CN205755085U (en) | 2016-11-30 |
Family
ID=57361656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620468507.4U Expired - Fee Related CN205755085U (en) | 2016-05-19 | 2016-05-19 | The tool of ink in cleaning hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755085U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111586991A (en) * | 2020-05-27 | 2020-08-25 | 生益电子股份有限公司 | Circuit board developing processing system and method |
-
2016
- 2016-05-19 CN CN201620468507.4U patent/CN205755085U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111586991A (en) * | 2020-05-27 | 2020-08-25 | 生益电子股份有限公司 | Circuit board developing processing system and method |
| CN111586991B (en) * | 2020-05-27 | 2021-08-20 | 生益电子股份有限公司 | Circuit board developing processing system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 Termination date: 20200519 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |