CN102321878B - Surface activation method for nonmetal material - Google Patents
Surface activation method for nonmetal material Download PDFInfo
- Publication number
- CN102321878B CN102321878B CN 201110251095 CN201110251095A CN102321878B CN 102321878 B CN102321878 B CN 102321878B CN 201110251095 CN201110251095 CN 201110251095 CN 201110251095 A CN201110251095 A CN 201110251095A CN 102321878 B CN102321878 B CN 102321878B
- Authority
- CN
- China
- Prior art keywords
- activation
- metallic substrate
- mixing solutions
- activation solution
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Chemically Coating (AREA)
Abstract
The present invention discloses a surface activation method for a nonmetal material. The method comprises the following steps: adding tin palladium colloid to a pre-immersion solution to obtain a mixed solution; immersing a nonmetal substrate in the mixed solution; immersing the processed nonmetal substrate in a first activation solution, and then immersing the nonmetal substrate in the mixed solution. According to the present invention, the nonmetal substrate processed by the first activation solution is immersed in the mixed solution, such that the first activation solution absorbed on the surface of the nonmetal substrate, in the inner holes of the nonmetal substrate, and in the skeleton gaps of the nonmetal substrate are taken out and can be completely released in the mixed solution so as to reduce the waste of the noble metal palladium; the nonmetal substrate is respectively subjected to the low concentration activation treatment, the high concentration activation treatment and the low concentration activation treatment so as to provide the three activation functions at different concentrations for the nonmetal substrate, to enable adsorption of the activator, and the completeness and the compactness of the plating coat, to reduce specific consumption of the noble metal palladium, and to ensure the activation effect of the nonmetal material.
Description
Technical field
The present invention relates to the surface active technical field, more particularly, relate to a kind of method for activating surface of non-metallic material.
Background technology
At present, along with the fast development of global electronic information technology and the communication technology, printed wiring (PCB) industry becomes the manufacturing maximum pillar of electronic component at world wide.The preparation printed circuit board mainly may further comprise the steps: the boring of multilayer non-metal board is removed the glue slag (Smear) that boring produces by the de-smear flow process, clean processing such as whole hole, microetch, preimpregnation, activation, speedization and electroless copper then, make the non-metallic material metallization in the printed circuit board hole wall, thus electrically conducting between the layer of realization printed circuit board and the layer.
Activation treatment is the important step of making in the printed circuit board process, its objective is at a certain amount of active center of non metallic substrate absorption, in order to bring out electroless plating, detailed process is: the non metallic substrate after the preimpregnation is immersed contain in the activation solution of tin palladium colloid, palladium concentration is 50～75ppm in this activation solution, make the non-metal base basal surface generate the precious metal tin palladium nano-particles that one deck has the discontinuity of catalytic reduction chemical copper ability, carry out smoothly at substrate surface thereby be conducive to electroless copper.Activation treatment not only determines the quality of chemical plating lining property, also is simultaneously the key factor that determines quality of coating, and for example close outstanding property, anti-repeatedly reflow ability and the cold-resistant thermal shocking ability etc. of activation treatment and coating are closely related.
In the surface metalation treating processes of non-metallic substrate, along with metal base from the mentioning of activation solution, the part activation solution can remain in non-metallic substrate surface or the hole and be taken out of activation solution.In order to reduce the waste of precious metal palladium, method commonly used at present is: when base material is mentioned by overhead traveling crane, with base material dropping liquid 15～20 seconds above activated bath, thereby make the activation drop that remains on the base material return activated bath, reduce the waste of activation solution.But, contain the activation solution that is immersed in the base material hole in a large number and be difficult to be recovered by the mode of dropping liquid, therefore, this method is effect and not obvious aspect the waste that reduces precious metal palladium.
In addition, along with the little hole number of 0.20～0.25mm in the printed wiring and the increase of base material thickness of slab, aperture and degree of depth aspect ratio improve in the base material, and the manufacturing process of printed circuit board is had higher requirement.Therefore, the waste that how reduces precious metal palladium in the activation performance that guarantees non-metallic substrate is current research focus.Publication number is to disclose a kind of colloidal pd activation solution and preparation method thereof and a kind of non-metallic surface activation method in the Chinese patent literature of CN101928937A, and this colloidal pd activation solution contains Palladous chloride, sodium-chlor, oxoethanoic acid, hydrochloric acid, tin protochloride and is used for stablizing the stablizer of tin protochloride.But, utilizing this activation solution non-metallic material to be carried out in the process of surface active, the consumption rate of activation solution is bigger, and especially the carry-over loss consumption of activation solution adsorbs consumption much larger than it, so the waste of precious metal palladium is comparatively serious.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is to provide a kind of method for activating surface of non-metallic material, and this method has reduced the waste of precious metal palladium in the activation effect that has guaranteed non-metallic material.
In order to solve above technical problem, the invention provides a kind of method for activating surface of non-metallic material, may further comprise the steps:
Step a) adds tin palladium colloid in presoak, obtain mixing solutions, and the palladium concentration of described mixing solutions is 7～15ppm;
Step b) is dipped in non-metallic substrate in the described mixing solutions;
Non-metallic substrate after step c) is handled described step b) is dipped in first activation solution, and the palladium concentration of described first activation solution is 20～40ppm;
Non-metallic substrate after step d) is handled described step c) is dipped in the described mixing solutions.
Preferably, the time that non-metallic substrate is dipped in the described mixing solutions in the step b) is 0.5～2 minute.
Preferably, also comprise after the step b): the non-metallic substrate after step b) is handled places the top dropping liquid 10～20 seconds of described mixing solutions.
Preferably, the palladium concentration of described first activation solution is 30～35ppm.
Preferably, the time that non-metallic substrate is dipped in first activation solution in the step c) is 3～7 minutes.
Preferably, also comprise after the step c): the non-metallic substrate after step c) is handled places the top dropping liquid 10～20 seconds of described first activation solution.
Preferably, the time that non-metallic substrate is dipped in the described mixing solutions in the step d) is 10～50 seconds.
Preferably, also comprise after the step d): the non-metallic substrate after step d) is handled places the top dropping liquid 5～15 seconds of described mixing solutions.
Preferably, described presoak comprises sodium-chlor, mineral acid, stablizer and antioxidant; Described first activation solution comprises Palladous chloride, tin protochloride, sodium-chlor, mineral acid, stablizer and antioxidant.
Preferably, described step a) is specially:
Add second activation solution that contains tin palladium colloid in presoak, obtain mixing solutions, the palladium concentration of described mixing solutions is 7～15ppm, and the volume ratio of described second activation solution and described presoak is (2～3): (7～8).
The invention provides a kind of method for activating surface of non-metallic material, may further comprise the steps: step a) adds tin palladium colloid in presoak, obtain mixing solutions, and the palladium concentration of described mixing solutions is 7～15ppm; Step b) is dipped in non-metallic substrate in the described mixing solutions; Non-metallic substrate after step c) is handled described step b) is dipped in first activation solution, and the palladium concentration of described first activation solution is 20～40ppm; Non-metallic substrate after step d) is handled described step c) is dipped in the described mixing solutions.Compared with prior art, because the present invention is dipped in the non-metallic substrate after first activation solution is handled in the mixing solutions, therefore, soaking first activation solution of taking out of in the surface of non-metallic substrate, the hole or in the frame gap can fully discharge in mixing solutions, has reduced the waste of precious metal palladium.Simultaneously, because the present invention carries out lower concentration activation, high density activation and lower concentration activation respectively with non-metallic substrate, realized three mobilizing functions of non-metallic substrate at different concns, compare with the once activation of conventional process flow, be conducive to the absorption of activator and the complete densification of coating, therefore the palladium of activated bath control concentration can be reduced to 20～40ppm by 50 traditional～75ppm, reach the purpose of the consumption rate that reduces precious metal palladium, and guaranteed the activation effect of non-metallic material.
Embodiment
Below the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
The invention discloses a kind of method for activating surface of non-metallic material, may further comprise the steps:
Step a) adds tin palladium colloid in presoak, obtain mixing solutions, and the palladium concentration of described mixing solutions is 7～15ppm;
Step b) is dipped in non-metallic substrate in the described mixing solutions;
Non-metallic substrate after step c) is handled described step b) is dipped in first activation solution, and the palladium concentration of described first activation solution is 20～40ppm;
Non-metallic substrate after step d) is handled described step c) is dipped in the described mixing solutions.
In the preparation process of printed circuit board, presoak is for sacrificing solution, it mainly act as the minimizing pollutent or cupric ion is brought into activated bath, in addition, the presoak that the non-metallic substrate surface is taken out of can be supplemented in the activation solution, guarantee base content (proportion) and acidity necessary in the activation solution, keep the stability of activation solution, avoid the hydrolysis of tin palladium colloid in the activation solution.Adopt presoak to prepare according to method well known to those skilled in the art among the present invention, preferred, described presoak comprises sodium-chlor, mineral acid, stablizer and antioxidant.The present invention at first adds tin palladium colloid in presoak, make the mixing solutions that obtains have certain palladium concentration when playing former presoak effect, thereby described non-metallic substrate is had certain activation.
The method for activating surface of non-metallic material provided by the invention is applicable to that manual type production line, semi-automatic production line, hoop formula (Basket Type) automatic production line and planer-type fly target (Panel Type or Fly-Bar Type) automatic production line etc.Because the surface treatment mode of non-metallic material provided by the invention is applicable to the recycle system, therefore, described mixing solutions can be prepared as follows: method one: the back of will repeatedly the circulating presoak of abandoning for waste keeps 1/3rd volumes, and the extraction groove keeps outward, after the newly-built bath 2/3rds of pre-immersion trough finished, the outer presoak of abandoning for waste that keeps of groove is injected pre-immersion trough mix, obtain mixing solutions, the palladium concentration of described mixing solutions is 7～15ppm; Method two: after the newly-built bath of pre-immersion trough, in pre-immersion trough, add second activation solution that contains tin palladium colloid, obtain mixing solutions, the palladium concentration of described mixing solutions is 7～15ppm, and the volume ratio of described second activation solution and described presoak is (2～3): (7～8).If palladium concentration deficiency in the mixing solutions of employing method two preparation can add tin palladium colloid activator in described pre-immersion trough.The present invention preferably adopts method two to prepare described mixing solutions, and it not only can set up the palladium intensity of pre-immersion trough, the pollutent of activated bath accumulation can be reduced again.
Mixing solutions of the present invention also preferably includes tin ion, and described tin ion content has the function of sensitization to non-metallic substrate, helps the absorption of tin palladium colloid activator.The adsorptive capacity of the tin palladium colloid activator of the non-metallic substrate that the process sensitization is handled will promote several times, thereby be conducive to produce the raising of yield.Compared with prior art, the present invention can extend to 8 interpolation cycles by 4 interpolation cycles (Turn-Over) with the life-span of pre-immersion trough, to prolong the work-ing life of pre-immersion trough palladium, still, soiling value accumulation for fear of activated bath is too much, and pre-immersion trough still must regular update.
Traditional technology is across and causes the broken or Kong Wutong in probability hole in the hole in order to reduce internal surface of hole tension force or the recycle system bubble of deriving, all can install vibrator or cylinder vibrations additional at activated bath, yet this vibration force is passed to by vibrating motor and flies target, be passed to framework by flying target again, finally just be passed to non-metallic substrate then; Wave the method for workpiece in addition because the steric barrier that the quantity of workpiece plug-in unit causes has also stopped the effect of liquid medicine exchange in the hole, therefore have the fraction defective of fixed proportion in the actual volume production process.The method for activating surface of non-metallic material proposed by the invention, non-metallic substrate is carried out lower concentration activation, high density activation and lower concentration activation respectively, realized three mobilizing functions of non-metallic substrate at different concns, can reduce in the non-metallic substrate hole and may cause the inefficacy factor of activation solution through-flow because surface tension or bubble are built bridge.In addition, when non-metallic substrate when the bubble of mixing solutions or activation solution absorption breaks when mentioning, non-metallic substrate after described step c) is handled is dipped in the process of described mixing solutions, the aperture that activated bath lost efficacy can be remedied the adsorption activation agent again, thereby effectively promote the production yield of aperture or micro blindness hole, promote technological ability.
In step b), the time that described non-metallic substrate is dipped in the described mixing solutions is preferably 0.5～2 minute, more preferably 0.5～1 minute, most preferably is 1 minute.Also preferably include after the step b): the non-metallic substrate after step b) is handled places the top dropping liquid 10～20 seconds of described mixing solutions, more preferably 10～15 seconds.By the non-metallic substrate after the step b) processing being placed the top dropping liquid of described mixing solutions, realize the recycling to described mixing solutions, avoided the waste of precious metal.
In the step c) of the present invention, described first activation solution preferably includes Palladous chloride, tin protochloride, sodium-chlor, mineral acid, stablizer and antioxidant, and its palladium concentration is preferably 30～35ppm, more preferably 32～35ppm.The time that described non-metallic substrate is dipped in first activation solution is preferably 3～7 minutes, more preferably 4～6 minutes, most preferably is 5 minutes.Also comprise after the step c): the non-metallic substrate after step c) is handled places the top dropping liquid 10～20 seconds of described first activation solution, more preferably 15～20 seconds.By the non-metallic substrate after the step b) processing being placed the top dropping liquid of described first activation solution, realize the recycling to described first activation solution, avoided the waste of precious metal.
In step d), the time that described non-metallic substrate is dipped in the described mixing solutions is preferably 10～50 seconds, more preferably 15～30 seconds.Be dipped in the described mixing solutions by the non-metallic substrate after described step c) is handled, the activation solution of impregnation in the surface of non-metallic substrate and the hole is discharged, the zone of oxidation that simultaneously the non-metallic substrate surface may be existed is removed, and helps the friction pull between base material copper face and chemical copper.Also comprise after the step d): the non-metallic substrate after step d) is handled places the top dropping liquid 5～15 seconds of described mixing solutions, more preferably 5～10 seconds.By the non-metallic substrate after the step c) processing being placed the top dropping liquid of described mixing solutions, realize the recycling to described mixing solutions.
Compared with prior art, because the present invention is dipped in the non-metallic substrate after first activation solution is handled in the mixing solutions, therefore, the non-metallic substrate surface with and aperture, micropore, micro blindness hole or frame gap in soak first activation solution taken out of and can in mixing solutions, fully discharge, reduced the waste of precious metal palladium.Simultaneously, the present invention carries out lower concentration activation, high density activation and lower concentration activation respectively with non-metallic substrate, realized three mobilizing functions of non-metallic substrate at different concns, compare with the once activation of conventional process flow, help the complete densification of absorption of activator, therefore the palladium of activated bath control concentration can be reduced to 20～40ppm by 50 traditional～75ppm, reaches the purpose of the consumption rate that reduces precious metal palladium, and has guaranteed the activation effect of non-metallic material.
In order to further specify technical scheme of the present invention, be described below in conjunction with the preferred embodiment of the invention of embodiment, but should be appreciated that these describe just to further specifying the features and advantages of the present invention, rather than to the restriction of claim of the present invention.
The chemical reagent that adopts in the embodiment of the invention and the comparative example is commercial.
The embodiment of the invention all adopts with comparative example carries out vertical hanging on the overhead traveling crane production line yield test panel in the mode of soaking, wherein, and the FR-4 substrate that this yield test panel is thickness of slab 2.0mm, drilling hole amount is 140,000, aperture 0.25mm, the aperture aspect ratio is 8: 1.In addition, the consumption rate of activator is to compare with one month result of actual production line volume production, all can obtain similar result at different apparatus for production line.
Embodiment 1
The tin palladium colloid activator that present embodiment adopts is that the model that Shenzhen news Applied Materials Inc produces is the tin palladium colloid activator of CA-230.
The stoste that with palladium concentration is 1650ppm is joined groove with 2%, the palladium concentration that activated bath is joined groove is 33ppm, build collocation 200g/L composition when bathing and be the pre-preserved material B that the pre-preserved material A of sodium-chlor and 70ml/L contain sulfuric acid, stablizer, antioxidant and build bath, and by the palladium concentration of the extremely pre-immersion trough of the activation solution of activated bath transferase 12 0% with the initial stage of setting up, obtain mixing solutions;
Press the experiment parameter shown in the table 1 and adjust production line overhead traveling crane program time, the soaking the time of putting and dropping liquid time etc. of each operation slot;
The processing parameter that table 1 embodiment 1 adopts
Test with the yield test panel, implement to test 20 altogether in 20 days, all test panels all carry out with the processing parameter that above-mentioned table 1 is set, and after plated-through-hole flow process plating chemical copper, test panel is detected in the mode backlight of cutting into slices at microscopically, be 9～10 grades, follow-up all test panels are behind plate plating and graphic plating, detect porose conduction status in the electrical measurement mode, the phenomenon that the equal atresia of all test panels is broken, percent of pass is 100%.The test panel of finishing plating is carried out six times the tin that floats, do not find the phenomenon that hole wall bubbles or floats off.
The activated bath stability observing:
By the observation of production line through one month, the hydrolysis phenomenon of color change and gonorrhoea because the instability of colloid causes unusual minimizing, does not take place simultaneously in the palladium concentration of activated bath.
Can obtain according to statistics, the consumption rate of CA-230 is 0.7 milliliter/square feet, and total fraction defective is 70ppm.
Comparative example 1
The tin palladium colloid activator that this comparative example adopts is that the model that Shenzhen news Applied Materials Inc produces is the tin palladium colloid activator of CA-230.
The stoste that with palladium concentration is 1650ppm is joined groove with 3%, and the palladium concentration that activated bath is joined groove is 50ppm, builds collocation 200g/L composition when bathing and is the pre-preserved material B that the pre-preserved material A of sodium-chlor and 70ml/L contain sulfuric acid, stablizer, antioxidant and build bath, obtains presoak;
Press the processing parameter shown in the table 2 and adjust production line overhead traveling crane program time, the soaking the time of putting and dropping liquid time etc. of each operation slot;
The processing parameter that table 2 comparative example 1 adopts
Test with the yield test panel, implement to test 20 altogether in 20 days, all test panels all processing parameter shown in the employing table 2 carry out, and after plated-through-hole flow process plating chemical copper, test panel is detected in the mode backlight of cutting into slices at microscopically, be 9～10 grades, follow-up all test panels are behind plate plating and graphic plating, detect porose conduction status in the electrical measurement mode, the phenomenon that the equal atresia of all test panels is broken, percent of pass is 100%.The test panel of finishing plating is carried out six times the tin that floats, do not find the phenomenon that hole wall bubbles or floats off.
Can obtain according to statistics, the consumption rate of CA-230 is 1.05 milliliters/square feet, and total fraction defective is 300ppm.
From above-described embodiment 1 and comparative example 1 as can be seen, the consumption rate of the tin palladium colloid activator that the present invention adopts reduces about 30～35%, thereby proved that the present invention when reducing tin palladium colloid activator consumption, has guaranteed the production yield of yield test panel.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. the method for activating surface of non-metallic material may further comprise the steps:
Step a) adds tin palladium colloid in presoak, obtain mixing solutions, and the palladium concentration of described mixing solutions is 7～15ppm;
Step b) is dipped in non-metallic substrate in the described mixing solutions;
Non-metallic substrate after step c) is handled described step b) is dipped in first activation solution, and the palladium concentration of described first activation solution is 20～40ppm;
Non-metallic substrate after step d) is handled described step c) is dipped in the described mixing solutions.
2. method for activating surface according to claim 1 is characterized in that, the non-metallic substrate time in the described mixing solutions that is dipped in is 0.5～2 minute in the step b).
3. method for activating surface according to claim 1 is characterized in that, also comprises after the step b): the non-metallic substrate after step b) is handled places the top dropping liquid 10～20 seconds of described mixing solutions.
4. method for activating surface according to claim 1 is characterized in that, the palladium concentration of described first activation solution is 30～35ppm.
5. method for activating surface according to claim 1 is characterized in that, the non-metallic substrate time in first activation solution that is dipped in is 3～7 minutes in the step c).
6. method for activating surface according to claim 1 is characterized in that, also comprises after the step c): the non-metallic substrate after step c) is handled places the top dropping liquid 10～20 seconds of described first activation solution.
7. method for activating surface according to claim 1 is characterized in that, the non-metallic substrate time in the described mixing solutions that is dipped in is 10～50 seconds in the step d).
8. method for activating surface according to claim 1 is characterized in that, also comprises after the step d): the non-metallic substrate after step d) is handled places the top dropping liquid 5～15 seconds of described mixing solutions.
9. method for activating surface according to claim 1 is characterized in that, described presoak comprises sodium-chlor, mineral acid, stablizer and antioxidant; Described first activation solution comprises Palladous chloride, tin protochloride, sodium-chlor, mineral acid, stablizer and antioxidant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110251095 CN102321878B (en) | 2011-08-29 | 2011-08-29 | Surface activation method for nonmetal material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110251095 CN102321878B (en) | 2011-08-29 | 2011-08-29 | Surface activation method for nonmetal material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102321878A CN102321878A (en) | 2012-01-18 |
| CN102321878B true CN102321878B (en) | 2013-07-10 |
Family
ID=45449706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110251095 Expired - Fee Related CN102321878B (en) | 2011-08-29 | 2011-08-29 | Surface activation method for nonmetal material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102321878B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102642025A (en) * | 2012-04-26 | 2012-08-22 | 上海交通大学 | Method for plating tungsten on surface of SiC particle |
| CN104113989B (en) * | 2013-04-17 | 2017-11-07 | 深南电路股份有限公司 | The method of heavy copper on pcb board |
| CN104152874B (en) * | 2014-07-20 | 2017-06-09 | 珠海伟华化工有限公司 | A kind of printed wiring board electroless copper activating solution |
| CN105112893A (en) * | 2015-08-04 | 2015-12-02 | 永利电子铜陵有限公司 | Highly-stable electroless copper plating process of PCB (Printed circuit board) |
| CN107245712A (en) * | 2017-06-08 | 2017-10-13 | 安徽江南机械有限责任公司 | A kind of cold black coslettising prepreg solution of stability and high efficiency |
| CN114449759A (en) * | 2020-11-04 | 2022-05-06 | 竞华电子(深圳)有限公司 | PTH process |
| CN113755912A (en) * | 2021-08-31 | 2021-12-07 | 广州广合科技股份有限公司 | Electroplating process capable of reducing loss of activated palladium |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101736335A (en) * | 2010-01-29 | 2010-06-16 | 南京工业大学 | Method for preparing palladium membrane on porous ceramic surface by chemical plating |
-
2011
- 2011-08-29 CN CN 201110251095 patent/CN102321878B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102321878A (en) | 2012-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102321878B (en) | Surface activation method for nonmetal material | |
| CN102677027B (en) | Activating solution composition for nonmetallic material electroless plating | |
| CN102248159A (en) | Preparation method of silver-coated aluminum powder | |
| JPS59104197A (en) | Machining method for clarifying hole of printed circuit board by using permanganate and caustic treating solution | |
| EP2604722B1 (en) | Stabilized silver catalysts and methods | |
| CN1473207A (en) | Method for electroless nickel plating | |
| CN102912329A (en) | Chemical nickel and palladium plating process used for circuit boards | |
| US20190203319A1 (en) | Tin stripping method | |
| CN102036509A (en) | Method for electroplating blind hole and through hole of circuit board | |
| CN107460459A (en) | A kind of Nanometer Copper activating solution and preparation method thereof | |
| CN102912395A (en) | Method for filling blind-buried holes through electro-coppering | |
| CN102787316A (en) | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution | |
| CN110557890A (en) | method for processing semi-metal blind hole with aspect ratio larger than one | |
| CN104080278B (en) | The production technology of wiring board conductive polymer fenestra technique and its collocation graphic plating | |
| CN105648426B (en) | Heavy copper combines liquid | |
| CN104744974B (en) | A kind of PCB generates the production technology of macromolecule conductive film with modified activating solution and in PCB through hole and blind hole | |
| CN211047455U (en) | PCB copper deposition device | |
| US20190075659A1 (en) | Catalyst for a catalytic ink and uses thereof | |
| CN103200791A (en) | High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material | |
| CN103572264B (en) | Circuit board surface treatment method | |
| JPH0149787B2 (en) | ||
| CN102191501B (en) | Palladium remover and preparation method thereof, and plastic surface activation method | |
| TW201741498A (en) | Method for electroless copper plating through-hole of printed circuit board and method for preparing a catalytic solution used in method thereof | |
| CN102330076B (en) | Device and method for preparing stannopailadinite colloid activating agent | |
| CN113416948B (en) | PCB copper deposition process and copper deposition frame thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 |